Device for preventing plate lamination of immersion tin wire

By designing a low-friction contact detection device for roller conveyors and inspection rollers, the problem of potential damage to the board surface caused by existing PCB anti-stack mechanisms was solved, reducing equipment costs and improving product qualification rate.

CN223822560UActive Publication Date: 2026-01-23KAIPING ELEC & ELTEK CO LTD
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Patent Information

Application Number
CN202520191306.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-07
Publication Date
2026-01-23
Estimated Expiration
2035-02-07

AI Technical Summary

Technical Problem

Existing PCB anti-overlapping mechanisms may damage the board surface, and metal double-sheet sensors are costly; existing detection methods have shortcomings.

Method used

The device consists of a roller conveyor, support plate, electric push rod, narrow conveyor, detection roller, displacement sensor and photoelectric sensor. It detects the layers of PCB board by using detection roller and displacement sensor, reduces friction damage by using low friction material and buffer pad, and identifies surface defects by combining CCD camera, thereby reducing costs.

Benefits of technology

It achieves PCB board separation and efficient inspection with low friction damage, reduces equipment costs, and improves product qualification rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a device for placing and stacking a plate, in particular to a device for preventing the plate from being stacked by a submerged tin wire. The device comprises a roller conveyor, a supporting plate, an electric push rod, a fixing frame, a narrow conveyor, a mounting seat, a detection roller, a sliding block, a displacement sensor, a control panel and the like, an adjusting mechanism is arranged at the top of the roller conveyor, the bottom of the adjusting mechanism is connected with a mounting seat, a rectangular hole is formed in the mounting seat, a sliding groove is formed in the rectangular hole, a sliding block is slidably connected in the sliding groove, and a displacement sensor is fixedly connected in the sliding groove. According to the utility model, the design of the detection roller, the slide block and the displacement sensor realizes the contact-type multilayer PCB detection with small friction, and the displacement sensor can trigger a detection mechanism as long as generating enough displacement without depending on an expensive high-precision displacement sensor and an existing metal double-sheet sensor, so that the cost is effectively controlled.
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Description

Technical Field

[0001] This utility model relates to a device for preventing stacking of plates, and more particularly to a device for preventing stacking of plates for immersion solder lines. Background Technology

[0002] Immersion tinning is a process and equipment used in PCB manufacturing to deposit a layer of tin or tin alloy onto the surface of copper foil. This process aims to protect the copper foil from oxidation and provide good solderability for subsequent soldering. To ensure the quality and reliability of the immersion tinning process and to prevent defective products from being shipped out due to stacking issues, anti-stacking devices are generally required before entering the immersion tinning line.

[0003] A search of existing published literature revealed a patent announcement (CN215624554U) that discloses a conveying mechanism for detecting whether PCB boards overlap. The mechanism includes a fixed frame with multiple evenly distributed first conveying rollers. Above two adjacent first conveying rollers, a second conveying roller rotates in the opposite direction to the first conveying rollers. The second conveying rollers can move vertically up and down. A discharge assembly is provided at the discharge end of the fixed frame. In this invention, the distance between the first and second conveying rollers is pre-set according to the PCB board's dimensions. The PCB board is conveyed via the first conveying rollers. When the PCB board is a single-layer board, the bottom of the second conveying roller does not contact the PCB board, allowing normal conveying and discharge from the discharge assembly. When the PCB board is a double-layer board, the second conveying roller provides a reverse frictional force to the upper PCB, causing the two overlapping PCB boards to separate under the action of the first and second conveying rollers, thus separating the PCB boards. However, this mechanism still has the following drawbacks:

[0004] Although the mechanism can separate two overlapping boards, the friction can easily damage the PCB board surface when the second conveyor roller provides reverse friction to the PCB board above. Furthermore, existing detection of overlapping PCB boards is generally done through a metal double-sheet sensor, which is expensive. Utility Model Content

[0005] In order to overcome the shortcomings of existing PCB anti-overlapping mechanisms, which can separate overlapping PCBs but may damage the board surface due to the reverse friction of the second conveyor roller, and the high cost of commonly used metal double-sheet sensors, this utility model can provide a device for anti-overlapping of immersion solder lines.

[0006] Technical Solution: A device for preventing stacking of immersion solder lines, comprising a roller conveyor, a support plate, an electric push rod, a fixed frame, a narrow conveyor, a mounting base, a detection roller, a slider, a displacement sensor, a control panel, an alarm, a photoelectric sensor, and an adjustment mechanism. The roller conveyor has an adjustment mechanism at its top, and the mounting base is connected to the bottom of the adjustment mechanism. A rectangular hole is opened in the mounting base, and a groove is opened in the rectangular hole. A slider is slidably connected in the groove, and a displacement sensor is fixedly connected in the groove. The measuring end of the displacement sensor is connected to the top of the slider. A detection roller is located on the front side of the slider. The distance between the bottom of the detection roller and the roller on the roller conveyor is slightly greater than the thickness of a PCB board. A support plate is provided inside the left side of the roller conveyor, and two electric push rods are provided on the top of the support plate. The top of the telescopic rods of the two electric push rods are connected to a fixed frame. A narrow conveyor is provided on the fixed frame. The narrow conveyor rotates counterclockwise. A photoelectric sensor is provided inside the front side of the roller conveyor. A control panel and an alarm are provided on the front side of the roller conveyor. The roller conveyor, electric push rods, narrow conveyor, displacement sensor, photoelectric sensor and alarm are all electrically connected to the control panel.

[0007] Furthermore, it is particularly preferred that the adjusting mechanism includes a hollow frame and a threaded rod, with the hollow frame located on the top of the roller conveyor and outside the mounting base. A threaded rod is threadedly connected to the middle of the hollow frame and the threaded rod is connected to the top of the mounting base.

[0008] Furthermore, it is particularly preferred that the detection roller is made of polyurethane.

[0009] In addition, it is particularly preferred that the slider also includes guide rollers, with several guide rollers provided on the front side of the slider, all of which are located to the right of the detection roller.

[0010] Furthermore, it is particularly preferred that a CCD camera is also included, with the CCD camera located on the top of the roller conveyor and situated on the left side of the hollow frame.

[0011] In addition, it is particularly preferred that a buffer pad is included, which is provided on the inner wall of the rear side of the roller conveyor.

[0012] The design of the detection roller, slider, and displacement sensor in this invention enables contact-based detection of multilayer PCBs with low friction. Furthermore, the displacement sensor can trigger the detection mechanism as long as it generates sufficient displacement, without relying on expensive high-precision displacement sensors or existing metal double-sheet sensors, thus effectively controlling costs. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2This is a schematic diagram of the structure of the electric push rod and narrow conveyor of this utility model.

[0015] Figure 3 This is a structural schematic diagram of the mounting base, detection roller, and guide roller of this utility model.

[0016] Figure 4 This is a cross-sectional view of the mounting base of this utility model.

[0017] Figure 5 This is a schematic diagram of the structure of the CCD camera and buffer pad of this utility model.

[0018] Figure 6 This is a structural diagram of the back of the present invention.

[0019] The above-mentioned attached drawings include the following reference numerals: 1. Roller conveyor; 2. Support plate; 201. Electric push rod; 202. Fixed frame; 203. Narrow conveyor; 3. Mounting base; 301. Slide rail; 4. Detection roller; 401. Slider; 402. Displacement sensor; 5. Guide roller; 6. Control panel; 7. Alarm; 8. CCD camera; 9. Buffer pad; 10. Hollow frame; 11. Threaded rod; 12. Photoelectric sensor. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0021] A device for preventing stacking of immersion solder wires, such as Figures 1-6As shown, the system includes a roller conveyor 1, a support plate 2, an electric push rod 201, a fixed frame 202, a narrow conveyor 203, a mounting base 3, a detection roller 4, a slider 401, a displacement sensor 402, a control panel 6, an alarm 7, a photoelectric sensor 12, and an adjustment mechanism. The roller conveyor 1 has an adjustment mechanism at its top, and the mounting base 3 is connected to its bottom. The mounting base 3 has a rectangular hole with a groove 301 inside. A slider 401 is slidably connected to the groove 301, and a displacement sensor 402 is fixedly connected to it. The measuring end of the displacement sensor 402 is connected to the top of the slider 401. A detection roller 4 is located on the front side of the slider 401. The detection roller 4 is made of polyurethane, a material with a low coefficient of friction, which reduces friction between the detection roller 4 and the PCB board. The friction of the PCB board is measured by detecting the distance between the bottom of the roller 4 and the roller on the roller conveyor 1, which is slightly greater than the thickness of one PCB board. The roller conveyor 1 has a support plate 2 inside on the left side, and two electric push rods 201 are located on the top of the support plate 2. The top of the telescopic rods of the two electric push rods 201 are connected to the fixed frame 202. The fixed frame 202 is equipped with a narrow conveyor 203. The two narrow conveyors 203 are located on both sides of the second roller from the left to the right of the roller conveyor 1. The narrow conveyors 203 rotate counterclockwise. The roller conveyor 1 has a photoelectric sensor 12 inside the front side. The roller conveyor 1 has a control panel 6 and an alarm 7. The roller conveyor 1, electric push rods 201, narrow conveyors 203, displacement sensor 402, photoelectric sensor 12 and alarm 7 are all electrically connected to the control panel 6.

[0022] like Figure 5 As shown, the adjustment mechanism includes a hollow frame 10 and a threaded rod 11. The hollow frame 10 is located on the top of the roller conveyor 1 and is located outside the mounting base 3. The threaded rod 11 is threadedly connected to the middle of the hollow frame 10 and is connected to the top of the mounting base 3. Guide rods for guidance are provided on the left and right sides of the top of the mounting base 3. By rotating the threaded rod 11, the height of the mounting base 3 and the detection roller 4 can be adjusted to adapt to PCB boards of different thicknesses, thereby improving the flexibility of the device.

[0023] like Figure 3 As shown, it also includes guide rollers 5. Several guide rollers 5 are provided on the front side of the slider 401. The guide rollers 5 are all located to the right of the detection roller 4. The guide rollers 5 can cooperate with the rollers on the roller conveyor 1 to make the PCB board move in a straight line and reduce the possibility of the PCB board deviating during the conveying process.

[0024] like Figure 6As shown, it also includes a CCD camera 8. The top of the roller conveyor 1 is equipped with a CCD camera 8, which is located on the left side of the hollow frame 10. The CCD camera 8 can capture high-resolution images and use image processing software to analyze the surface condition of the PCB board, automatically identify surface defects such as scratches, dents, and solder joint defects, and remind employees to remove the unqualified PCB boards through the control panel 6 and the alarm 7, thereby further reducing the product defect rate.

[0025] like Figure 6 As shown, it also includes a buffer pad 9. The inner wall of the roller conveyor 1 is provided with a buffer pad 9. The buffer pad 9 can provide a soft contact surface. If the PCB board is accidentally deviated, the buffer pad 9 can reduce the impact and damage that may occur when the PCB board collides with the inner wall of the roller conveyor 1 during the transmission process.

[0026] The roller conveyor 1 is started via control panel 6. The PCB board processed by the UV machine is conveyed to the left side of roller conveyor 1. When the PCB board passes photoelectric sensor 12, photoelectric sensor 12 detects the presence of the PCB board. Photoelectric sensor 12 starts narrow conveyor 203 and two electric push rods 201 via control panel 6. The two electric push rods 201 extend their telescopic rods to drive narrow conveyor 203 upward a preset distance. Narrow conveyor 203 lifts the PCB board and rotates counterclockwise to convey the PCB board to the inner wall of the rear side of roller conveyor 1. Control panel 6 controls electric push rods 201 to retract their telescopic rods, and the PCB board will continue to move to the right along the inner wall of the rear side of roller conveyor 1. When the PCB board moves to the bottom of the detection roller 4; if the PCB board is a single-layer board, the detection roller 4 and the PCB board do not contact each other at this time. The PCB board continues to move to the right side of the roller conveyor 1 and is transported to the immersion solder line. If the PCB board is a multi-layer board, the multi-layer PCB board will squeeze the detection roller 4, causing the detection roller 4 to rotate and the slider 401 to rise. The measuring end of the displacement sensor 402 retracts, the measured value of the displacement sensor 402 changes, and then sends an electrical signal to the control panel 6. The control panel 6 controls the alarm 7 to sound an alarm and controls the roller conveyor 1 to shut down. Employees promptly check and remove the stacked PCB boards from the roller conveyor 1 to prevent defective products from leaking out.

[0027] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Therefore, all equivalent changes made based on the content described in the claims of the present utility model should be included within the scope of the claims of the present utility model.

Claims

1. A device for preventing stacking of immersion solder wires, comprising a roller conveyor (1) and a support plate (2), wherein the support plate (2) is provided inside the left side of the roller conveyor (1), characterized in that, It also includes an electric push rod (201), a fixed frame (202), a narrow conveyor (203), a mounting base (3), a detection roller (4), a slider (401), a displacement sensor (402), a control panel (6), an alarm (7), a photoelectric sensor (12), and an adjustment mechanism. The roller conveyor (1) is equipped with an adjustment mechanism at the top, and the mounting base (3) is connected to the bottom of the adjustment mechanism. A rectangular hole is opened in the mounting base (3), and a slide groove (301) is opened in the rectangular hole. A slider (401) is slidably connected in the slide groove (301), and a displacement sensor (402) is fixedly connected in the slide groove (301). The measuring end of the displacement sensor (402) is connected to the top of the slider (401). A detection roller (4) is provided on the front side of the slider (401). The distance between the bottom of the measuring roller (4) and the roller on the roller conveyor (1) is slightly greater than the thickness of a PCB board. The top of the support plate (2) is provided with two electric push rods (201). The top of the telescopic rods of the two electric push rods (201) are connected to a fixed frame (202). A narrow conveyor (203) is provided on the fixed frame (202). The narrow conveyor (203) rotates counterclockwise. A photoelectric sensor (12) is provided inside the front side of the roller conveyor (1). A control panel (6) and an alarm (7) are provided on the front side of the roller conveyor (1). The roller conveyor (1), electric push rod (201), narrow conveyor (203), displacement sensor (402), photoelectric sensor (12) and alarm (7) are all electrically connected to the control panel (6).

2. The device for preventing tin wire stacking according to claim 1, characterized in that, The adjustment mechanism includes a hollow frame (10) and a threaded rod (11). The top of the roller conveyor (1) is provided with a hollow frame (10). The hollow frame (10) is located outside the mounting base (3). The hollow frame (10) is threadedly connected to the middle of the threaded rod (11). The threaded rod (11) is connected to the top of the mounting base (3).

3. The device for preventing tin wire stacking according to claim 2, characterized in that, The detection roller (4) is made of polyurethane.

4. A device for preventing immersion solder wire stacking according to claim 3, characterized in that, It also includes guide rollers (5), and several guide rollers (5) are provided on the front side of the slider (401). The guide rollers (5) are all located to the right of the detection roller (4).

5. A device for preventing immersion solder wire stacking according to claim 4, characterized in that, It also includes a CCD camera (8), which is located on the top of the roller conveyor (1) and is situated on the left side of the hollow frame (10).

6. A device for preventing tin wire stacking according to claim 5, characterized in that, It also includes a buffer pad (9), and the inner wall of the roller conveyor (1) is provided with a buffer pad (9).