Anode plate bubble detecting and removing device, electroplating cavity and wafer electroplating equipment
By installing a bubble detection and removal device in the electroplating equipment, and using optical signals to monitor and acoustic waves to remove bubbles, the problem of blockage of the flow channels caused by bubble removal on the high-resistivity anode surface is solved, thereby improving the stability of the electroplating process and product quality.
Patent Information
- Application Number
- CN202520335875.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-02-27
AI Technical Summary
In existing technologies, removing air bubbles by tapping the surface of a high-resistivity anode can easily lead to blockage of the flow channels, resulting in a thinner copper film at the center of the wafer and causing wafer defects.
A bubble detection and removal device is used, including a bubble monitoring component and a bubble elimination component. It monitors bubble generation information through optical signals and emits sound waves to remove bubbles when the guide hole is blocked, thus avoiding deformation of the guide hole.
It effectively prevents the flow channels from becoming clogged, ensures smooth flow of electroplating solution, reduces wafer defects, and improves product yield.
Smart Images
Figure CN223823725U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to an anode plate bubble detection and removal device, an electroplating cavity and a wafer electroplating equipment. BACKGROUND
[0002] Copper electroplating is an electrochemical process that connects circuits by depositing a layer of copper metal on a conductive substrate. In semiconductor manufacturing, copper electroplating technology is widely used to manufacture high-precision circuit wires. The basic principle is to use electrolysis in an electrolyte containing copper ions. Through the action of electric current, copper ions are reduced to metal copper and deposited on the cathode (i.e., the wafer).
[0003] In the electroplating loop of the copper electroplating process, the center and edge of the wafer will have different film thickness due to the resistance of the copper film on the wafer surface. To solve the above problem, a high-impedance anode module is usually added to the electroplating loop to increase the resistance of the entire electroplating loop, thereby reducing the resistance of the copper film on the wafer surface and making the copper film grow more uniformly everywhere on the wafer.
[0004] Please refer to Figure 1 , Figure 1 is a structural diagram of a wafer electroplating equipment in the prior art. As can be seen from Figure 1 , the wafer electroplating equipment includes an electroplating cavity 10, a copper anode 11 is provided in the electroplating cavity 10, a high-impedance anode 12 is additionally provided above the copper anode 11, and a wafer 13 is located above the high-impedance anode 12. When electroplating is performed using the wafer electroplating equipment, by injecting electroplating solution into the electroplating cavity 10, under the action of electric current, copper on the copper anode 11 dissolves into copper ions which enter the electroplating solution, and these copper ions are reduced to metal copper and deposited on the wafer 13.
[0005] However, if there are bubbles remaining on the surface of the high-impedance anode 12, the corresponding position of the wafer 13 cannot form a closed loop, which will hinder the transfer of electric charge, thereby preventing copper ions from being deposited on the surface of the wafer 13. To solve this problem, equipment engineers usually remove bubbles by knocking the surface of the high-impedance anode 12 before machine maintenance and machine recovery. However, as the use time increases and the number of knocks increases, this bubble removal method will cause the flow guide holes 121 on the surface of the high-impedance anode 12 (especially the center position) to deform to varying degrees, which can easily cause the flow guide holes 121 to be blocked, thereby reducing the amount of electroplating solution passing through the flow guide holes 121, making the copper film thickness at the center position of the wafer 13 thinner during electroplating, and further causing wafer defects. UTILITY MODEL CONTENTS
[0006] The purpose of this invention is to provide an anode plate bubble detection and removal device, an electroplating chamber, and a wafer electroplating equipment to solve one or more problems in the prior art, such as the easy blockage of the flow channel holes and the resulting wafer defects caused by removing bubbles by tapping the surface of a high-resistivity anode.
[0007] To achieve the above objectives, this utility model provides the following technical solution: an anode plate bubble detection and removal device, wherein the anode plate is installed in an electroplating chamber; the bubble detection and removal device includes a bubble monitoring component and a bubble elimination component disposed inside the electroplating chamber, and an information acquisition component disposed outside the electroplating chamber; the bubble monitoring component is configured to monitor bubble generation information on the top surface of the anode plate; the information acquisition component is connected to the bubble monitoring component and is configured to: obtain whether the guide hole of the anode plate is blocked based on the bubble generation information monitored by the bubble monitoring component and a preset bubble blockage condition; the bubble elimination component is disposed below the anode plate and is configured to: open when the guide hole of the anode plate is blocked to emit sound waves to the anode plate.
[0008] Optionally, the bubble monitoring component includes a light source and a light signal receiver, the light signal receiver being connected to the information acquisition component; the light source is used to emit light to the top surface of the anode plate; the light signal receiver is configured to receive the light signal refracted from the top surface of the anode plate and transmit the received light signal to the information acquisition component.
[0009] Optionally, the light source and the light signal receiver are disposed opposite to each other on the inner wall of the electroplating cavity, and both the light source and the light signal receiver are located above the anode plate.
[0010] Optionally, the light source and the light signal receiver are symmetrically installed on the inner wall of the electroplating cavity with the straight line containing the central axis of the electroplating cavity as the axis of symmetry.
[0011] Optionally, the information acquisition component includes a first process monitoring component, which is configured to: receive the bubble generation information detected by the bubble monitoring component, and issue an alarm when the bubble generation information meets the preset bubble blockage condition to warn that the guide hole of the anode plate is blocked.
[0012] Optionally, the information acquisition component includes a second process monitoring component, which is connected to the bubble elimination component. The second process monitoring component is configured to receive bubble generation information detected by the bubble monitoring component, and to trigger the bubble elimination component to start when the bubble generation information meets the preset bubble blockage condition.
[0013] Optionally, the bubble elimination component includes an acoustic oscillator.
[0014] Optionally, the outer surfaces of both the bubble monitoring component and the bubble elimination component are made of acid- and corrosion-resistant materials.
[0015] To achieve the above objectives, this utility model also provides an electroplating chamber, wherein the electroplating chamber is equipped with the anode plate bubble detection and removal device described in any of the above claims.
[0016] To achieve the above objectives, this utility model also provides a wafer electroplating equipment, which includes an electroplating chamber and is equipped with the anode plate bubble detection and removal device described in any of the above claims.
[0017] Compared with the prior art, the anode plate bubble detection and removal device, electroplating chamber, and wafer electroplating equipment provided by this utility model have the following beneficial effects:
[0018] The present invention provides an anode plate bubble detection and removal device, wherein the anode plate is installed in an electroplating chamber. The bubble detection and removal device includes a bubble monitoring component and a bubble elimination component disposed inside the electroplating chamber, and an information acquisition component disposed outside the electroplating chamber. The bubble monitoring component is configured to monitor bubble generation information on the top surface of the anode plate. The information acquisition component is connected to the bubble monitoring component and is configured to: determine whether the guide hole of the anode plate is blocked based on the bubble generation information monitored by the bubble monitoring component and a preset bubble blockage condition. The bubble elimination component is disposed below the anode plate and is configured to: activate when the guide hole of the anode plate is blocked to emit sound waves to the anode plate. Therefore, the anode plate bubble detection and removal device provided by the present invention can monitor bubble generation information on the top surface of the anode plate in the electroplating chamber through the bubble monitoring component, laying a good foundation for determining whether the guide hole of the anode plate is blocked. By connecting the information acquisition component to the bubble monitoring component, the information acquisition component can promptly determine whether the guide holes of the anode plate are blocked based on the bubble generation information detected by the bubble monitoring component and preset bubble blockage conditions. Furthermore, when blockage is detected in the guide holes of the anode plate, the bubble elimination component below the anode plate emits sound waves towards the anode plate. The sound wave vibration generates shear force and pressure changes in the electroplating solution, reducing the interfacial tension between the gas inside the bubble and the liquid outside, thus accelerating the removal of bubbles from the anode plate. Compared to traditional methods of bubble removal by tapping, using the anode plate bubble detection and removal device provided by this invention to remove bubbles from the anode plate prevents deformation of the guide holes on the top surface of the anode plate, allowing the electroplating solution to flow smoothly through the anode plate, thereby reducing wafer defects and improving product yield.
[0019] Furthermore, the information acquisition component includes a first process monitoring component, which is configured to: receive bubble generation information detected by the bubble monitoring component, and issue an alarm when the bubble generation information meets the preset bubble blockage condition to warn of blockage in the guide holes of the anode plate. Thus, the anode plate bubble detection and removal device provided by this utility model receives bubble generation information detected by the bubble monitoring component through the first process monitoring component, and issues an alarm when the detected bubble generation information meets the preset bubble blockage condition, enabling staff to promptly detect blockage in the guide holes of the anode plate and laying a good foundation for timely activation of the bubble removal component.
[0020] Since the electroplating chamber and the wafer electroplating equipment provided by this utility model belong to the same inventive concept as the anode plate bubble detection and removal device provided by this utility model, the electroplating chamber and the wafer electroplating equipment provided by this utility model have at least all the advantages of the anode plate bubble detection and removal device provided by this utility model. For the advantages of the electroplating chamber and the wafer electroplating equipment provided by this utility model, please refer to the relevant description of the beneficial effects of the anode plate bubble detection and removal device provided by this utility model, which will not be repeated here. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of a wafer electroplating device in the prior art;
[0022] Figure 2 This is a specific example of an anode plate bubble detection and removal device installed in an electroplating chamber according to Embodiment 1 of this utility model;
[0023] Figure 3 Another specific example of an anode plate bubble detection and removal device installed in an electroplating chamber, as provided in Embodiment 1 of this utility model;
[0024] The annotations in the attached figures are explained as follows:
[0025] 10-Electroplating chamber, 11-Copper anode, 12-High impedance anode, 121-Flow guide hole, 13-Wafer, 20-Anode plate, 201-Flow guide hole, 21-Bubble monitoring component, 211-Light source, 212-Optical signal receiver, 22-Bubble elimination component, 23-First process monitoring component, 24-Second process monitoring component. Detailed Implementation
[0026] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed account of the anode plate bubble detection and removal device, electroplating chamber, and wafer electroplating equipment proposed in this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, used only to facilitate and clarify the purpose of illustrating the embodiments of this utility model. Please refer to the drawings to make the purpose, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only used to complement the content disclosed in the specification, for those skilled in the art to understand and read, and are not intended to limit the implementation conditions of this utility model. Any modifications to the structure, changes in proportions, or adjustments to the size, provided that the effects and purposes achieved by this utility model are the same or similar, should still fall within the scope of the technical content disclosed in this utility model. Specific design features of this utility model disclosed herein, including, for example, specific dimensions, orientations, positions, and shapes, will be determined in part by the specific application and usage environment. Furthermore, in the embodiments described below, the same reference numerals are sometimes used in different figures to denote the same parts or parts with the same function, and repeated descriptions are omitted.
[0027] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0028] Example 1
[0029] This embodiment provides an anode plate bubble detection and removal device. For details, please refer to... Figure 2 , Figure 2 This is a specific example diagram showing the anode plate bubble detection and removal device provided in this embodiment installed in an electroplating chamber. From... Figure 2As can be seen, the anode plate 20 is installed inside the electroplating chamber 10; the bubble detection and removal device includes a bubble monitoring component 21 and a bubble elimination component 22 disposed inside the electroplating chamber 10, and an information acquisition component (exemplarily, including but not limited to a first process monitoring component 23) disposed outside the electroplating chamber 10; the bubble monitoring component 21 is configured to monitor bubble generation information on the top surface of the anode plate 20; the information acquisition component is connected to the bubble monitoring component 21, and is configured to: obtain whether the guide hole 201 of the anode plate 20 is blocked based on the bubble generation information monitored by the bubble monitoring component 21 and a preset bubble blockage condition; the bubble elimination component 22 is disposed below the anode plate 20, and is configured to: open when the guide hole 201 of the anode plate 20 is blocked, so as to emit sound waves to the anode plate 20.
[0030] Therefore, the anode plate bubble detection and removal device provided in this embodiment can monitor the bubble generation information on the top surface of the anode plate 20 in the electroplating chamber 10 through the bubble monitoring component 21, laying a good foundation for obtaining whether the guide hole 201 of the anode plate 20 is blocked. By connecting the information acquisition component to the bubble monitoring component 21, the information acquisition component can promptly obtain whether the guide hole 201 of the anode plate 20 is blocked based on the bubble generation information monitored by the bubble monitoring component 21 and the preset bubble blockage conditions. Furthermore, when it is found that the guide hole 201 of the anode plate 20 is blocked, the bubble elimination component 22 below the anode plate 20 can emit sound waves to the anode plate 20, and the sound wave vibration generates shear force and pressure changes in the electroplating solution, which reduces the interfacial tension between the gas inside the bubble and the liquid outside the bubble, which is beneficial to accelerating the removal of bubbles on the anode plate 20. Compared with the traditional method of removing bubbles by tapping, the anode plate bubble detection and removal device provided in this embodiment can remove bubbles on the anode plate 20, which can prevent the guide hole 201 on the top surface of the anode plate 20 from deforming, thereby allowing the electroplating solution to pass smoothly through the anode plate 20, thereby reducing wafer defects and improving product yield.
[0031] It should be noted that, as those skilled in the art will understand, the anode plate 20 may include, but is not limited to, a high-resistance anode plate.
[0032] Please continue reading Figure 2Exemplary embodiments, in some of these exemplary implementations, include a bubble monitoring component 21 comprising a light source 211 and a light signal receiver 212 connected to the information acquisition component. The light source 211 emits light to the top surface of the anode plate 20. The light signal receiver 212 is configured to receive light signals refracted from the top surface of the anode plate 20 and transmit the received light signals to the information acquisition component. Thus, by emitting light to the top surface of the anode plate 20 through the light source 211, when bubbles are present on the top surface of the anode plate 20, the principle of light refraction in different media is utilized. Specifically, when the light emitted by the light source 211 enters the bubble from the electroplating solution, the angle of incidence is less than the angle of refraction; when the light inside the bubble enters the electroplating solution outside the bubble, the angle of incidence is greater than the angle of refraction. Based on the degree of change in the light signal received by the light signal receiver 212, information about bubble formation on the top surface of the anode plate 20 can be monitored.
[0033] Preferably, the light source 211 and the light signal receiver 212 are disposed opposite to each other on the inner wall of the electroplating chamber 10, and both the light source 211 and the light signal receiver 212 are located above the anode plate 20. Thus, by distributing the light source 211 and the light signal receiver 212 opposite to each other on the inner wall of the electroplating chamber 10 and above the anode plate 20, the light emitted by the light source 211 can be incident on the top surface of the anode plate 20, while the light signal receiver 212 can receive the light signal refracted from the top surface of the anode plate 20, thereby enabling the monitoring of bubble generation information on the top surface of the anode plate 20.
[0034] Furthermore, the light source 211 and the light signal receiver 212 are symmetrically mounted on the inner wall of the electroplating chamber 10 with the central axis of the chamber as the axis of symmetry. Thus, by symmetrically mounting the light source 211 and the light signal receiver 212, the light signal receiver 212 can more accurately receive the light signal refracted from the top surface of the anode plate 20, thereby enabling more accurate monitoring of bubble generation information on the top surface of the anode plate 20.
[0035] It should be noted that the present invention does not impose too many limitations on the specific form of the bubble generation information, which includes, but is not limited to, whether bubbles are generated, the size of the generated bubbles, and the number of generated bubbles.
[0036] For the preferred options, please continue reading. Figure 2 ,like Figure 2As shown, the information acquisition component includes a first process monitoring component 23, which is configured to: receive bubble generation information monitored by the bubble monitoring component 21, and issue an alarm when the bubble generation information meets the preset bubble blockage condition to warn that the guide hole 201 of the anode plate 20 is blocked. Thus, by receiving the bubble generation information monitored by the bubble monitoring component 21 through the first process monitoring component 23, and issuing an alarm when the monitored bubble generation information meets the preset bubble blockage condition, the staff can promptly detect the blockage of the guide hole 201 of the anode plate 20, laying a good foundation for timely activation of the bubble elimination component 22.
[0037] It should be noted that, as those skilled in the art will understand, the above is merely an exemplary description of the information acquisition component and not a limitation thereof.
[0038] For example, please see Figure 3 , Figure 3 This is another specific example diagram showing the anode plate bubble detection and removal device provided in this embodiment installed in an electroplating chamber. From Figure 3 As can be seen, in some other embodiments, the information acquisition component may also include a second process monitoring component 24, which is connected to the bubble elimination component 22. The second process monitoring component 24 is configured to receive the bubble generation information monitored by the bubble monitoring component 21, and trigger the bubble elimination component 22 to open when the bubble generation information meets the preset bubble blockage condition. Thus, the second process monitoring component 24 can receive the bubble generation information monitored by the bubble monitoring component 21; by connecting the second process monitoring component 24 to the bubble elimination component 22, when the monitored bubble generation information meets the preset bubble blockage condition, the bubble elimination component 22 can be directly triggered to open, thereby quickly and promptly removing bubbles from the anode plate 20.
[0039] It should be noted that the present invention does not impose excessive limitations on the specific setting requirements of the preset bubble blockage conditions. The preset bubble blockage conditions include, but are not limited to, the diameter of the bubbles generated on the top surface of the anode plate 20 being not less than a first preset value, and / or the number of bubbles generated on the top surface of the anode plate 20 being not less than a second preset value. It should also be noted that, as those skilled in the art will understand, the present invention does not impose excessive limitations on the range of the first and second preset values. For example, in some embodiments, the first preset value may be the same as the diameter of the guide hole 201 of the anode plate 20, and the second preset value may be the same as the number of guide holes 201 of the anode plate 20; in other embodiments, the first preset value may also be half the diameter of the guide hole 201 of the anode plate 20, and the second preset value may also be half the number of guide holes 201 of the anode plate 20.
[0040] Preferably, the bubble removal component 22 includes an acoustic oscillator. Thus, the acoustic oscillator emits sound waves, thereby achieving the purpose of removing bubbles.
[0041] Furthermore, the outer surfaces of both the bubble monitoring component 21 and the bubble elimination component 22 are made of acid- and corrosion-resistant materials. Therefore, by using acid- and corrosion-resistant materials for the outer surfaces of the bubble monitoring component 21 and the bubble elimination component 22, corrosion by the electroplating solution can be avoided, thus preventing the bubble detection and removal device from affecting its operation.
[0042] Example 2
[0043] This embodiment provides an electroplating chamber, which is equipped with the anode plate bubble detection and removal device described in any of the above embodiments.
[0044] Since the electroplating chamber provided in this embodiment belongs to the same inventive concept as the anode plate bubble detection and removal device provided in any of the above embodiments, the electroplating chamber provided in this embodiment has at least all the advantages of the anode plate bubble detection and removal device provided in the above embodiments. For the advantages of the electroplating chamber provided in this embodiment, please refer to the relevant description of the beneficial effects of the anode plate bubble detection and removal device provided in the above embodiments, which will not be repeated here.
[0045] Example 3
[0046] This embodiment provides a wafer electroplating device, which includes an electroplating chamber and is equipped with the anode plate bubble detection and removal device described in any of the above embodiments.
[0047] Since the wafer electroplating equipment provided in this embodiment belongs to the same inventive concept as the anode plate bubble detection and removal device provided in any of the above embodiments, the wafer electroplating equipment provided in this embodiment has at least all the advantages of the anode plate bubble detection and removal device provided in the above embodiments. For the advantages of the wafer electroplating equipment provided in this embodiment, please refer to the relevant description of the beneficial effects of the anode plate bubble detection and removal device provided in the above embodiments, which will not be repeated here.
[0048] In summary, the anode plate bubble detection and removal device, electroplating chamber, and wafer electroplating equipment provided by this utility model have the following advantages: The anode plate is installed inside the electroplating chamber in the anode plate bubble detection and removal device. The device includes a bubble monitoring component and a bubble elimination component disposed inside the electroplating chamber, and an information acquisition component disposed outside the electroplating chamber. The bubble monitoring component is configured to monitor bubble generation information on the top surface of the anode plate. The information acquisition component is connected to the bubble monitoring component and is configured to: determine whether the guide hole of the anode plate is blocked based on the bubble generation information monitored by the bubble monitoring component and a preset bubble blockage condition. The bubble elimination component is disposed below the anode plate and is configured to: activate when the guide hole of the anode plate is blocked to emit sound waves towards the anode plate. Therefore, the anode plate bubble detection and removal device provided by this utility model can monitor bubble generation information on the top surface of the anode plate inside the electroplating chamber through the bubble monitoring component, laying a good foundation for determining whether the guide hole of the anode plate is blocked. By connecting the information acquisition component to the bubble monitoring component, the information acquisition component can promptly determine whether the guide holes of the anode plate are blocked based on the bubble generation information detected by the bubble monitoring component and preset bubble blockage conditions. Furthermore, when blockage is detected in the guide holes of the anode plate, the bubble elimination component below the anode plate emits sound waves towards the anode plate. The sound wave vibration generates shear force and pressure changes in the electroplating solution, reducing the interfacial tension between the gas inside the bubble and the liquid outside, thus accelerating the removal of bubbles from the anode plate. Compared to traditional methods of bubble removal by tapping, using the anode plate bubble detection and removal device provided by this invention to remove bubbles from the anode plate prevents deformation of the guide holes on the top surface of the anode plate, allowing the electroplating solution to flow smoothly through the anode plate, thereby reducing wafer defects and improving product yield.
[0049] Furthermore, the information acquisition component includes a first process monitoring component, which is configured to: receive bubble generation information detected by the bubble monitoring component, and issue an alarm when the bubble generation information meets the preset bubble blockage condition to warn of blockage in the guide holes of the anode plate. Thus, the anode plate bubble detection and removal device provided by this utility model receives bubble generation information detected by the bubble monitoring component through the first process monitoring component, and issues an alarm when the detected bubble generation information meets the preset bubble blockage condition, enabling staff to promptly detect blockage in the guide holes of the anode plate and laying a good foundation for timely activation of the bubble removal component.
[0050] Since the electroplating chamber and the wafer electroplating equipment provided by this utility model belong to the same inventive concept as the anode plate bubble detection and removal device provided by this utility model, the electroplating chamber and the wafer electroplating equipment provided by this utility model have at least all the advantages of the anode plate bubble detection and removal device provided by this utility model. For the advantages of the electroplating chamber and the wafer electroplating equipment provided by this utility model, please refer to the relevant description of the beneficial effects of the anode plate bubble detection and removal device provided by this utility model, which will not be repeated here.
[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model.
Claims
1. A device for detecting and removing bubbles on an anode plate, characterized in that, The anode plate is installed inside the electroplating chamber; the bubble detection and removal device includes a bubble monitoring component and a bubble elimination component disposed inside the electroplating chamber, and an information acquisition component disposed outside the electroplating chamber; The bubble monitoring component is configured to monitor bubble generation information on the top surface of the anode plate; The information acquisition component is connected to the bubble monitoring component. The information acquisition component is configured to: obtain whether the flow guide hole of the anode plate is blocked based on the bubble generation information detected by the bubble monitoring component and the preset bubble blockage conditions. The bubble elimination component is disposed below the anode plate and is configured to activate when the flow guide hole of the anode plate becomes blocked, so as to emit sound waves toward the anode plate.
2. The anode plate bubble detection and removal device as described in claim 1, characterized in that, The bubble monitoring component includes a light source and a light signal receiver, and the light signal receiver is connected to the information acquisition component. The light source is used to emit light to the top surface of the anode plate; The optical signal receiver is configured to receive an optical signal refracted from the top surface of the anode plate and transmit the received optical signal to the information acquisition component.
3. The anode plate bubble detection and removal device as described in claim 2, characterized in that, The light source and the light signal receiver are disposed opposite each other on the inner wall of the electroplating cavity, and both the light source and the light signal receiver are located above the anode plate.
4. The anode plate bubble detection and removal device as described in claim 3, characterized in that, The light source and the light signal receiver are symmetrically installed on the inner wall of the electroplating cavity with the straight line containing the central axis of the electroplating cavity as the axis of symmetry.
5. The anode plate bubble detection and removal device as described in claim 1, characterized in that, The information acquisition component includes a first process monitoring component, which is configured to: receive bubble generation information detected by the bubble monitoring component, and issue an alarm when the bubble generation information meets the preset bubble blockage condition to warn that the guide hole of the anode plate is blocked.
6. The anode plate bubble detection and removal device as described in claim 1, characterized in that, The information acquisition component includes a second process monitoring component, which is connected to the bubble elimination component. The second process monitoring component is configured to receive bubble generation information detected by the bubble monitoring component, and to trigger the bubble elimination component to start when the bubble generation information meets the preset bubble blockage condition.
7. The anode plate bubble detection and removal device as described in claim 1, characterized in that, The bubble elimination component includes an acoustic oscillator.
8. The anode plate bubble detection and removal device as described in claim 1, characterized in that, The outer surfaces of both the bubble monitoring component and the bubble elimination component are made of acid- and corrosion-resistant materials.
9. An electroplating cavity, characterized in that, The electroplating chamber is equipped with an anode plate bubble detection and removal device as described in any one of claims 1 to 8.
10. A wafer electroplating equipment, characterized in that, The wafer electroplating equipment includes an electroplating chamber, and the electroplating chamber is equipped with an anode plate bubble detection and removal device as described in any one of claims 1 to 8.