Multi-channel vibration monitoring device for pump station main unit

Abstract

The utility model relates to a multichannel vibration monitoring device for a pump station main unit, which comprises a case, an IO board, a CPU board and a radiator, and is characterized in that the case comprises a base and a cover plate, and the base is detachably connected with the cover plate; the IO board is installed on the base, the IO board is provided with a plurality of rotating speed channels and a plurality of vibration channels, and the rotating speed channels and the vibration channels are configured to be capable of being connected with various types of sensors; the CPU board is mounted above the IO board, is electrically connected with the IO board and is used for processing an input signal of the IO board to obtain operation monitoring data of the pump station main unit; the CPU board is provided with a communication interface, and the communication interface is used for sending operation monitoring data of the pump station main unit to an external system; and the radiator is attached to the CPU on the CPU board.

Description

Technical Field

[0001] This utility model belongs to the field of vibration monitoring, specifically relating to a multi-channel vibration monitoring device for pump station main units. Background Technology

[0002] Pumping station main units in the water conservancy industry are mainly classified into three types: vertical, horizontal, and inclined.

[0003] 1) Each type of spindle speed monitoring point can have a maximum of 2 points;

[0004] 2) Vibration monitoring points: a maximum of 22 for vertical units, a maximum of 20 for horizontal units, and a maximum of 20 for inclined units;

[0005] 3) There are a maximum of 4 swing monitoring points for each type of unit.

[0006] Currently, there is no independent multi-channel vibration monitor in the world that can monitor all speeds and vibration monitoring points of all types of pump station main units, and provide vibration monitoring measurement data and waveform data to the host computer software through an open communication protocol. Summary of the Invention

[0007] The purpose of this invention is to provide a multi-channel vibration monitoring device for pump station main units to solve the above-mentioned problems. Therefore, the technical solution adopted by this invention is as follows:

[0008] A multi-channel vibration monitoring device for a pump station main unit may include:

[0009] A chassis, the chassis including a base and a cover plate, the base and the cover plate being detachably connected;

[0010] An I / O board is mounted on the base. The I / O board has multiple rotational speed channels and multiple vibration channels, and the rotational speed channels and the vibration channels are configured to connect to various types of sensors.

[0011] A CPU board, mounted above and electrically connected to the I / O board, is used to process the input signals from the I / O board to obtain the operation monitoring data of the pump station main unit; the CPU board has a communication interface for sending the operation monitoring data of the pump station main unit to an external system; and

[0012] A heat sink, which is attached to the CPU on the CPU board.

[0013] In one embodiment, the number of rotation speed channels is 4, and the number of vibration channels is 24.

[0014] In one embodiment, 18 of the vibration channels are located on one side of the chassis, and the other 6 vibration channels and 4 rotation speed channels are located on the other side of the chassis.

[0015] In one embodiment, the IO board further includes six DI channels and two relay channels. Preferably, the two relay channels and the four speed channels are located on the same side of the chassis.

[0016] In one embodiment, each vibration channel includes 5 terminals, each speed channel includes 4 terminals, each DI channel includes 3 terminals, and each relay channel includes 2 terminals, wherein the sensors are connected to the corresponding terminals according to their type.

[0017] In one embodiment, the terminals of the plurality of vibration channels are integrated on a plurality of terminal blocks, all the terminals of the speed channel are integrated on a single terminal block, all the terminals of the DI channel are integrated on a single terminal block, and all the terminals of the relay channel are integrated on a single terminal block. Preferably, a locking handle is provided on both sides of each terminal block.

[0018] In one embodiment, the sensor includes an ICP / IEPE or non-ICP / IEPE acceleration / velocity sensor, an eddy current sensor, a proximity switch sensor, a magnetoresistive probe speed sensor, a voltage-type process quantity sensor, or a microphone sensor.

[0019] In one embodiment, the chassis is provided with a grounding screw.

[0020] In one embodiment, a pair of DIN rail clips are detachably mounted on the base.

[0021] In one embodiment, the cover plate is provided with multiple indicator lights, which are electrically connected to the CPU board and are used to indicate the working status of the multi-channel vibration monitoring device.

[0022] In one embodiment, the CPU board is provided with multiple indicator lights, which are displayed on the cover plate through light guide columns to indicate the working status of the multi-channel vibration monitoring device.

[0023] This invention is easy to install; a single device can monitor all speed and vibration monitoring points of the pump station main unit and provide vibration monitoring data to third-party systems. Attached Figure Description

[0024] Figure 1 This is a front view of a multi-channel vibration monitoring device for a pump station main unit according to an embodiment of the present utility model;

[0025] Figure 2 yes Figure 1 The diagram shown is an exploded perspective view of a multi-channel vibration monitoring device for a pump station main unit.

[0026] Figure 3 yes Figure 1 The diagram shows the wiring diagram of the ICP / IEPE accelerometer sensor for a multi-channel vibration monitoring device used in a pump station main unit.

[0027] Figure 4 yes Figure 1 The diagram shows the wiring diagram of the non-ICP / IEPE accelerometer for a multi-channel vibration monitoring device used in a pump station main unit.

[0028] Figure 5 yes Figure 1 The diagram shows the wiring diagram of the eddy current displacement sensor for the multi-channel vibration monitoring device used in the main pump station unit.

[0029] Figure 6 yes Figure 1 The diagram shows the wiring diagram of the 0-10V voltage signal sensor for the multi-channel vibration monitoring device used in the main unit of the pump station.

[0030] Figure 7 yes Figure 1 The diagram shows the wiring diagram of the negative power supply eddy current speed sensor for the multi-channel vibration monitoring device used in the pump station main unit. Detailed Implementation

[0031] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0032] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0033] Unless the context requires otherwise, throughout the specification and claims, the word “comprising” and its variations, such as “including” and “having”, shall be understood to have an open, inclusive meaning, that is, to be interpreted as “including, but not limited to”.

[0034] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0035] The singular forms “a” and “the” used in this specification and the appended claims include plural references unless otherwise expressly stated herein. It should be noted that the term “or” is generally used to mean “and / or” unless otherwise expressly stated herein.

[0036] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0037] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] Reference Figure 1-2This invention describes a multi-channel vibration monitoring device for a pump station main unit. The device includes a chassis 10, an I / O board 20, a CPU board 30, and a heat sink 40. The chassis 10 includes a base 101 and a cover plate 102, which are detachably connected to form a box-shaped chassis. The I / O board 20 is mounted on the base 101. Specifically, multiple first spacer posts 103 with screw holes are fixed to the base 101, and the I / O board 20 is fixed to the spacer posts by screws. The I / O board 20 has multiple speed channels and multiple vibration channels, both configured to accept various types of sensors to improve the applicability of the device. The CPU board 30 is mounted above and electrically connected to the I / O board 20, and is used to process the signals from each channel of the I / O board 20 to obtain the operation monitoring data of the pump station main unit. The I / O board 20 and the CPU board 30 are separated by multiple second spacer posts 104, and the CPU board 30 is fixed to the second spacer posts 104. The CPU board 30 has a communication interface for sending operational monitoring data of the pump station main unit to an external system (third-party system) to achieve data sharing. The heat sink 40 is attached to the CPU on the CPU board to transfer the heat generated by the CPU to the external environment, preventing the CPU from overheating and being damaged. Preferably, a thermal pad 401 or thermal adhesive is provided between the heat sink 40 and the CPU to improve heat dissipation efficiency.

[0040] This invention is easy to install; a single device can monitor all speed and vibration monitoring points of the pump station main unit and provide vibration monitoring data to third-party systems.

[0041] In one specific embodiment, the chassis 10 has dimensions of 298mm × 198mm × 48mm. The base 101 and cover 102 are typically made of sheet metal such as aluminum, iron, stainless steel, or their alloys. The base 101 and cover 102 can be fixed together with screws. The base 101 and cover 102 are coated with a protective paint. In this embodiment, the upper side plate of the base 101 is stepped, meaning the upper half is narrower than the lower half. The upper half has an opening for receiving the terminal block of the I / O board 20; the lower half has an opening for receiving the communication interface 31 of the CPU board 30 and ventilation holes for heat dissipation of the heat sink 4. It should be understood that the upper side plate of the base can also be a flat surface. Similarly, the lower side plate of the cover 102 also has an opening for receiving the terminal block of the I / O board 20.

[0042] The back of the base 101 is equipped with a pair of DIN rail clips 50 for detachable mounting, allowing the multi-channel vibration monitoring device to be easily installed on the DIN rail of the monitoring box. Additionally, the housing 10 can be wall-mounted to the mounting surface of the monitoring box by screws engaging with the screw holes on the back of the base 101.

[0043] In addition, a grounding screw 105 is provided on the left side of the chassis 10, and the grounding wire can be fixed to the chassis 10 by the grounding screw 105, which is very convenient.

[0044] In one specific embodiment, the IO board 20 has four speed channels (numbered KPH1 to KPH4) and 24 vibration channels (numbered CH1 to CH24). Eighteen vibration channels (numbered CH1 to CH18) are located on one side (i.e., the upper side) of the chassis 10, while the other six vibration channels (numbered CH19 to CH24) and four speed channels are located on the other side (i.e., the lower side) of the chassis 10. It should be understood that the arrangement of the speed channels and vibration channels is not limited to the illustrated embodiment. The speed channels can be used to measure the rotational speed of the pump station main unit (e.g., the spindle speed), and the vibration channels can be used to measure the vibration of the pump station main unit. In this embodiment, both the speed channels and vibration channels are configured to connect to various types of sensors. Specifically, the four speed channels can be arbitrarily configured as magnetoresistive speed channels, eddy current speed channels, proximity switch speed channels, and process quantity acquisition channels. The initial configuration of the speed channel is completed by selecting the channel type of the corresponding connected sensor. For example, when configured as a magnetoresistive speed channel, a magnetoresistive speed sensor can be connected; when configured as an eddy current speed channel, an eddy current speed sensor (positive or negative power supply) can be connected; when configured as a proximity switch speed channel, a proximity switch speed sensor can be connected; and when configured as a process quantity acquisition channel, DC voltage sensors such as temperature and pressure can be connected. Furthermore, the speed channels can also be configured as vibration channels. Similarly, the 24 vibration channels can be arbitrarily configured as non-ICP / IEPE acceleration / velocity channels, process quantity acquisition channels, radial vibration channels, thrust channels, and ICP / IEPE acceleration / velocity channels. For example, when an ICP / IEPE acceleration sensor is externally connected to a vibration channel, an ICP / IEPE acceleration channel can be selected; when a non-ICP / IEPE acceleration sensor is externally connected, a non-ICP / IEPE acceleration channel can be selected; when a DC voltage sensor such as temperature or pressure is externally connected, a process quantity channel can be selected; and when an eddy current sensor (positive or negative power supply) is externally connected, a radial vibration channel or a thrust channel can be selected.

[0045] In addition, the IO board 20 also has 6 DI channels (numbered DI1 to DI6) and 2 relay channels (numbered RLY1 and RLY2), which are located on the same side of the chassis 10 as the 4 speed channels. The 6 DI channels correspond to 2 general-purpose digital inputs (DI1 and DI2), configuration latch (DI3), bypass module (DI4), alarm reset (DI5), and trip setpoint doubling (DI6), respectively. The 2 relay channels are passive dry contacts (220VAC / 3A) and can be independently used by programmable logic to control alarm outputs or implement protection functions. It should be understood that the arrangement of the DI channels and relay channels is not limited to the embodiment shown.

[0046] In the illustrated embodiment, each vibration channel includes 5 terminals (as shown in Table 1), each speed channel includes 4 terminals (as shown in Table 2), each DI channel includes 3 terminals (as shown in Table 3), and each relay channel includes 2 terminals, wherein the sensor is connected to the corresponding terminals according to its type. Figures 3 to 7 Wiring diagrams for various sensors are shown. Specifically, for ICP / IEPE accelerometer / velocity sensors, this device supports constant current source power supply to the sensors. The sensor wiring diagram is shown below. Figure 3 As shown. At this time, sensor A wire is connected to terminal 1 of the vibration channel, sensor B wire is connected to terminal 4 of the vibration channel, and sensor shield wire is connected to terminal 4 of the vibration channel. For non-ICP / IEPE accelerometers / velocities, the sensor wiring is as follows: Figure 4 As shown, taking ±12V power supply as an example, the brown wire is +12V, the blue wire is -12V, the black wire is ground, and the yellow wire is output. The shielding wire is visible after peeling off the white heat-shrink tubing. The brown wire connects to the +12V external power supply, the blue wire to -12V, the black wire to the COM terminal and terminal 4 of the vibration channel, and the yellow wire to terminal 3 of the vibration channel. The shielding wire connects to the external power supply COM. The two external power supplies, 1 and 2, are connected in series. The negative terminal of 1 is -12V, and the positive terminal of 2 is +12V. The connection point is the actual COM terminal. For eddy current displacement sensors, the sensor requires external power, usually a negative power supply, but a positive power supply sensor can also be used. Taking a negative power supply as an example, the wiring is as follows... Figure 5 As shown, the red wire connects to the external power supply -24V, the COM wire connects to the power supply COM, the power supply COM connects to terminal 4 of the vibration channel, the SIG wire connects to terminal 3 of the vibration channel, and the shield wire connects to terminal 4 of the vibration channel. For process quantity sensors or microphone sensors (0-10V voltage signal), when a 0-10V process quantity signal is input, the vibration channel is used as the process quantity channel. Taking a three-wire pressure pulsation sensor as an example, the sensor power supply "+" is connected to the 24V+ of the external power supply, the sensor signal "+" is connected to terminal 2 of the vibration channel, and the sensor signal "-" is connected to the external power supply "-" and then to terminal 4 of the vibration channel. Figure 6 As shown. For a negative power supply eddy current sensor, the speed channel supplies -24VDC power to the sensor, and the wiring is as follows. Figure 7 As shown, the red wire is connected to terminal 1 of the speed channel, the SIG signal wire is connected to terminal 2 of the speed channel, the COM wire is connected to terminal 3 of the speed channel, and the shield wire is connected to terminal 3 of the speed channel.

[0047] Table 1

[0048]

[0049] Table 2

[0050]

[0051]

[0052] Table 3

[0053]

[0054] In the illustrated embodiment, the terminals of multiple vibration channels are integrated onto multiple terminal blocks. Specifically, the terminals of vibration channels numbered CH1-CH8, CH9-CH16, CH17-CH18, and CH19-CH24 are each integrated onto one terminal block. All terminals of the speed channel are integrated onto one terminal block. All terminals of the DI channel are integrated onto one terminal block. All terminals of the relay channel are integrated onto one terminal block. Each terminal block has a locking handle 60 on both sides. This locking handle 60 prevents the sensor terminals from detaching from the terminal block, ensuring stable and reliable monitoring signals.

[0055] In the illustrated embodiment, the communication interfaces on the CPU board 30 include two RJ45 network interfaces and one RS485 serial port interface. The RJ45 network interfaces support OPC_UA and Modbus TCP communication, allowing monitoring data to be sent to third-party systems via the open and standard OPC_UA communication protocol, significantly reducing the computational load on the host computer platform. The RS485 serial port interface supports master / slave Modbus communication, and the baud rate can be set to 9600, 19200, 38400, 57600, or 10105200.

[0056] In the illustrated embodiment, the CPU board 30 is provided with multiple indicator lights (not shown), which are displayed on the cover plate 102 via light guide pillars 70 to indicate the working status of this multi-channel vibration monitoring device. The names and status definitions of each indicator light are shown in Table 4. It should be understood that the indicator lights can also be directly mounted on the cover plate and then connected to the corresponding output terminals of the CPU board 30 via connecting wires. A film 80 is covered on the cover plate 102, on which the channel number and the name of the indicator light are printed. It should be understood that the channel number and the name of the indicator light can also be directly printed on the cover plate 102.

[0057] Table 4

[0058]

[0059]

[0060] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A multi-channel vibration monitoring device for a pump station main unit, characterized in that, include: A chassis, the chassis including a base and a cover plate, the base and the cover plate being detachably connected; An I / O board is mounted on the base. The I / O board has multiple rotational speed channels and multiple vibration channels, and the rotational speed channels and the vibration channels are configured to connect to various types of sensors. A CPU board is mounted above and electrically connected to the I / O board. It is used to process the input signals of the I / O board to obtain the operation monitoring data of the pump station main unit. The CPU board has a communication interface for sending the operation monitoring data of the pump station main unit to an external system. as well as A heat sink, which is attached to the CPU on the CPU board.

2. The multi-channel vibration monitoring device for pump station main unit as described in claim 1, characterized in that, The number of rotation speed channels is 4, and the number of vibration channels is 24.

3. The multi-channel vibration monitoring device for pump station main unit as described in claim 2, characterized in that, Eighteen of the vibration channels are located on one side of the chassis, and another six vibration channels and four rotation speed channels are located on the other side of the chassis.

4. The multi-channel vibration monitoring device for pump station main unit as described in claim 1, characterized in that, The IO board also has 6 DI channels and 2 relay channels.

5. The multi-channel vibration monitoring device for pump station main unit as described in claim 4, characterized in that, Each vibration channel includes 5 terminals, each speed channel includes 4 terminals, each DI channel includes 3 terminals, and each relay channel includes 2 terminals, wherein the sensors are connected to the corresponding terminals according to their type.

6. The multi-channel vibration monitoring device for pump station main unit as described in claim 5, characterized in that, The terminals of the multiple vibration channels are integrated on multiple terminal blocks, all the terminals of the speed channel are integrated on one terminal block, all the terminals of the DI channel are integrated on one terminal block, and all the terminals of the relay channel are integrated on one terminal block.

7. The multi-channel vibration monitoring device for pump station main unit as described in claim 1, characterized in that, The sensors include ICP / IEPE or non-ICP / IEPE acceleration / velocity sensors, eddy current sensors, proximity switch sensors, magnetoresistive probe speed sensors, voltage-type process quantity sensors, or microphone sensors.

8. The multi-channel vibration monitoring device for pump station main unit as described in claim 1, characterized in that, The chassis is equipped with a grounding screw.

9. The multi-channel vibration monitoring device for pump station main unit as described in claim 1, characterized in that, A pair of DIN rail clips are detachably mounted on the base.

10. The multi-channel vibration monitoring device for a pump station main unit as described in claim 1, characterized in that, The CPU board is equipped with multiple indicator lights, which are displayed on the cover plate through light guide columns to indicate the working status of the multi-channel vibration monitoring device.

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