Cooking equipment

Abstract

The embodiment of the utility model provides cooking equipment, which comprises an equipment main body, a heating device and a control device, the equipment main body comprises a cooking panel and an equipment cavity arranged on one side of the cooking panel, and a cooking device is arranged in the equipment cavity; the heat dissipation assembly is connected with the cooking panel, a heat dissipation cavity is formed in the heat dissipation assembly, and the heat dissipation cavity is communicated with the equipment cavity; wherein at least part of the heat dissipation assembly protrudes out of the cooking panel, and heat dissipation holes are formed in at least two wall faces of the heat dissipation assembly in the direction perpendicular to the plane where the cooking panel is located. According to the technical scheme, under the action of the heat dissipation assembly, heat generated in the equipment cavity can be directly discharged to the upper side of the cooking panel through the heat dissipation assembly, the temperature in the equipment is reduced, and internal components are protected against high temperature influences.

Description

Technical Field

[0001] This utility model relates to the field of cooking equipment technology, and more specifically, to a cooking device. Background Technology

[0002] Currently, such as Figure 1 As shown, the built-in induction cooker 100' usually generates a lot of heat during use. In related technologies, the heat is dissipated by the heat dissipation channel of the induction cooker itself. However, due to the characteristics of being built-in, the heat will continue to accumulate inside the cabinet. On the one hand, prolonged high temperature will cause deformation of the cabinet. On the other hand, the induction cooker itself is also affected by the temperature, reducing its working efficiency. Utility Model Content

[0003] The present invention aims to at least solve the technical problem of poor heat dissipation capacity of embedded induction cookers in the prior art or related technologies.

[0004] In view of this, an embodiment of the present invention provides a cooking device.

[0005] To achieve the above objectives, an embodiment of the present invention provides a cooking device, comprising: a device body, the device body including a cooking panel and a device cavity disposed on one side of the cooking panel, the device cavity being provided with a cooking device; a heat dissipation component connected to the cooking panel, the heat dissipation component forming a heat dissipation cavity, the heat dissipation cavity being connected to the device cavity; wherein, at least a portion of the heat dissipation component protrudes from the cooking panel, and at least two walls of the heat dissipation component are provided with heat dissipation holes in a direction perpendicular to the plane of the cooking panel.

[0006] The cooking device proposed in this utility model solves the problem of insufficient heat dissipation capacity in built-in cooktops. Specifically, the cooking device includes a main body and a heat dissipation component. The heat dissipation component is integrated inside the main body, and heat dissipation chambers and holes are reasonably arranged to ensure effective heat dissipation under high-temperature cooking conditions, avoiding overheating of components and equipment failure, while improving the user experience.

[0007] The main body of the device serves as the framework for the entire cooking equipment, including the cooking panel and the equipment cavity, providing overall support and housing space. The equipment cavity houses the cooking components and is effectively connected to the heat dissipation components, heat dissipation chamber, and external airflow path, ensuring smooth airflow during heat dissipation.

[0008] The cooking panel is the part that the user directly contacts, primarily used to support the cooking device. The device cavity is a closed space inside the main body of the device, housing the cooking device and its related accessories (such as heating elements, circuit boards, etc.). The device cavity is connected to the heat dissipation assembly. Through this connection, heat inside the cavity can flow to the heat dissipation assembly and ultimately be released to the outside air through the heat dissipation holes. The high temperature inside the device cavity can directly affect the heat dissipation effect through its connection with the heat dissipation assembly, preventing damage to the internal components due to high temperatures.

[0009] It is important to emphasize that this solution adds a heat dissipation component to the traditional cooking appliance, which can guide heat from inside the appliance cavity and dissipate it quickly. The heat dissipation component is connected to the cooking panel and protrudes from the outer side of the panel. With this design, part of the heat generated inside the appliance cavity can be directly discharged to the upper side of the cooking panel through the heat dissipation component, while the other part of the heat is transferred to the cabinet and then to the heat dissipation cavity through the ventilation holes, reducing the temperature inside the appliance and protecting the internal components from high temperatures.

[0010] It should be added that the heat dissipation cavity is connected to the equipment cavity, allowing hot air to flow from the equipment cavity into the heat dissipation component. After being processed by the heat dissipation component, the air is released through the heat dissipation holes. Multiple heat dissipation holes are provided on the outer wall of the heat dissipation component to quickly expel hot air from the equipment, preventing heat buildup inside. The heat dissipation component is designed to protrude at least partially from the cooking panel, allowing air to be released through this protruding portion, enabling the heat dissipation component to exchange heat more effectively with the external environment.

[0011] The outer wall of the protruding part of the heat dissipation component is provided with heat dissipation holes to ensure that the heat inside the equipment cavity can be transferred to the protruding heat dissipation cavity, and then discharged to the outside of the entire cooking equipment through the heat dissipation holes. This reduces the possibility of heat dissipation in the cabinet where the equipment is installed and improves the heat dissipation effect of the cooking equipment during normal use after being installed in a built-in manner.

[0012] In some technical solutions, optionally, the heat dissipation hole includes a first hole, and the heat dissipation component specifically includes: a detachably connected upper cover structure and a lower cover structure, the lower cover structure being connected to the cooking panel, and the upper cover structure having a first hole, through which air in the heat dissipation cavity flows outward.

[0013] In this technical solution, the heat dissipation component includes a detachably connected upper cover structure and a lower cover structure. A first hole for heat dissipation is provided in the upper cover structure, enabling the heat dissipation component to not only ensure effective heat dissipation but also facilitate cleaning, maintenance, and optimization of the heat dissipation path. Specifically, the upper cover structure acts as a channel connecting to the outside environment. By providing the first hole, the upper cover structure directly participates in the heat dissipation process, guiding hot air from the heat dissipation cavity to escape.

[0014] During equipment use, dust, oil, and other impurities may enter the heat dissipation component through the first hole. The removable top cover allows users to easily remove the top cover to clean the inside of the heat dissipation cavity, including cleaning any dirt that may be present on the bottom cover and any blockages around the first hole.

[0015] The lower cover structure is connected to the cooking panel, serving to connect the heat dissipation components to the main body of the device. The lower cover structure and the upper cover structure together form a heat dissipation cavity, providing a relatively enclosed space for the flow of hot air, ensuring that the hot air can flow along a predetermined path, that is, from the device cavity into the heat dissipation cavity, and then out through the first hole of the upper cover structure.

[0016] The detachable connection between the upper and lower cover structures facilitates user maintenance and cleaning of the heat dissipation components. After prolonged use, dust, oil, and other impurities may accumulate inside the heat dissipation components. The detachable connection allows users to easily remove the upper cover structure to clean the inside of the heat dissipation cavity, including removing any dirt that may be present on the lower cover structure and any blockages around the first opening.

[0017] In some technical solutions, the heat dissipation hole may optionally include a second hole, which is located on the lower cover structure; wherein, a heat dissipation component is provided inside the equipment cavity, and a heat dissipation port is provided on one side of the equipment cavity. When the heat dissipation component is in operation, some air flows out of the cooking equipment through the heat dissipation port, and some air flowing out of the cooking equipment flows into the heat dissipation cavity through the second hole.

[0018] In this technical solution, a second hole is set in the lower cover structure, and combined with the design of heat dissipation components and heat dissipation vents in the equipment cavity, a more efficient heat dissipation circulation path is constructed, which further improves the heat dissipation capacity of the cooking equipment and ensures that the equipment can effectively dissipate heat under different operating conditions, thereby improving the stability, reliability and service life of the equipment.

[0019] Specifically, the second hole serves as a heat dissipation channel on the lower cover structure, providing a pathway for airflow. Air within the heat dissipation cavity can either flow directly into the equipment cavity or flow inward through the second hole, thus improving heat dissipation efficiency. The second hole optimizes the airflow path within the heat dissipation cavity, increasing the amount of air exchanged.

[0020] It is important to emphasize that the second hole is located on the lower cover structure. The space where the lower cover structure and the cooking device are located is generally a cabinet, and there is a connection between them. Under the action of the heat dissipation component, the heat in the device cavity will flow into the cabinet. The heat in the cabinet can flow into the heat dissipation cavity through the second hole, thereby achieving a more effective heat dissipation path. By introducing air from the cabinet, it helps to improve the ability to absorb heat from the device cavity, further enhancing the overall heat dissipation performance of the device.

[0021] When the heat dissipation components inside the appliance cavity are in operation, some air flows out of the cooking appliance through the heat dissipation vents, driven by the heat dissipation components. Due to the temperature and pressure difference between the outside of the appliance and the heat dissipation cavity, this outflowing air flows into the heat dissipation cavity through the second hole in the lower cover structure, thereby carrying away the heat from both the appliance cavity and the heat dissipation cavity and preventing heat from accumulating inside the appliance.

[0022] In some technical solutions, optionally, a water-retaining rib is also included, disposed on the lower cover structure, and the water-retaining rib is disposed around at least part of the second hole.

[0023] In this technical solution, by setting water-blocking ribs on the lower cover structure corresponding to the second hole, specifically setting them around at least part of the second hole, while ensuring heat dissipation efficiency, it effectively prevents external liquid from entering the heat dissipation cavity, protects the internal structure, improves the stability and safety of the equipment, and extends the service life of the equipment.

[0024] In some technical solutions, optionally, the first hole is located in the first region of the upper cover structure, and the second hole is located in the second region of the lower cover structure, such that the projection of at least part of the first region and the projection of at least part of the second region do not overlap on the plane where the cooking panel is located.

[0025] In this technical solution, a first area for heat dissipation is provided within the upper cover structure, and a first hole is provided within the first area. A second area for heat dissipation is provided within the lower cover structure, and a second hole is provided within the second area. By preventing the projections of the first and second areas from overlapping, and ensuring that the projections of the first area of ​​the upper cover structure containing the first hole and the second area of ​​the lower cover structure containing the second hole do not overlap, a smoother flow path can be formed for the air flowing into the heat dissipation cavity from the second hole and the air flowing out of the heat dissipation cavity from the first hole. It is understandable that if the projections overlap, the paths for the inflowing and outflowing air are shorter, resulting in poor airflow and affecting heat dissipation efficiency.

[0026] Optionally, some technical solutions also include: a drain hole, provided on the upper cover structure, the drain hole being located outside the second area, and the distance between the drain hole and the plane where the cooking panel is located being less than the distance between the first hole and the plane where the cooking panel is located.

[0027] In this technical solution, by placing the drain hole on the upper cover structure, liquids (such as water, soup, etc.) that may enter the heat dissipation components can be drained. In a kitchen environment, a small amount of liquid may still enter the heat dissipation components through the first hole; the drain hole provides a dedicated drainage channel for these liquids.

[0028] Because the drain hole is located outside the second area, it avoids interference with the function of the heat dissipation hole (second hole), ensuring that normal airflow is not affected while draining water. The drain hole effectively removes liquid from the heat dissipation component, preventing liquid buildup. Accumulated liquid may corrode internal structures, affect heat dissipation performance, or cause electrical malfunctions. By promptly draining liquid, the drain hole maintains a dry environment inside the heat dissipation component, ensuring its normal operation.

[0029] It is important to emphasize that the distance between the drain hole and the surface of the cooking panel is less than the distance between the first hole and the surface of the cooking panel. This makes the drain hole lower, allowing liquid splashed during cooking to reach a lower position more easily, which is beneficial for the liquid to flow into the drain hole and be discharged more quickly under the action of gravity.

[0030] In some technical solutions, the heat dissipation component is optionally located on one side of the cooking panel, and the drain hole is located on the side wall of the top cover structure away from the cooking panel.

[0031] In this technical solution, placing the heat dissipation component on one side of the cooking panel fully utilizes the space on the side of the cooking equipment, avoiding excessive space occupation above the cooking panel or other critical operating areas. This ensures that cooking operations are not affected and also provides greater flexibility for the layout of other internal components. The cooking panel generates heat during cooking, and placing the heat dissipation component on one side facilitates heat conduction and dissipation. Heat can be transferred from the cooking panel to the heat dissipation component, and then dissipated through structures such as heat dissipation chambers and holes within the component, preventing heat accumulation near the cooking panel that could affect equipment performance or create safety hazards.

[0032] In some technical solutions, optionally, the cooking device is an electromagnetic heating device, and the cooking device also includes: a power cord connected to the electromagnetic heating device, the power cord passing through the cavity wall of the device cavity, or the power cord passing outward through the device cavity and the heat dissipation cavity.

[0033] In this technical solution, an electromagnetic heating device is selected as the cooking appliance, providing an efficient and precise heating method for cooking. However, due to the difference between its cooking method and that of a gas stove, the electromagnetic heating device needs to be connected to mains power. Therefore, a space needs to be provided for the power cord to be routed out. Specifically, the power cord can pass through the cavity wall of the appliance or through the appliance cavity and heat dissipation cavity to the outside. This versatility in routing the power cord takes into account different installation environments and user needs. When there is a suitable power interface near the appliance installation location, the power cord can be directly routed through the cavity wall of the appliance to connect to the power source. However, when the appliance installation location is more special, such as when the space inside a cabinet is limited and the power cord cannot be directly routed through the cavity wall, the route through the appliance cavity and heat dissipation cavity provides a solution, allowing the appliance to be successfully connected to the power source under various installation conditions.

[0034] In some technical solutions, optionally, the solution further includes: a first wiring structure located on the upper cover structure; and a second wiring structure located on the lower cover structure; wherein the upper cover structure and the lower cover structure are connected, and the first wiring structure and the second wiring structure form a channel for the power cable to be led out from the heat dissipation cavity.

[0035] In this technical solution, by setting a first wire-passing structure and a second wire-passing structure in the upper cover structure and the lower cover structure respectively, a dedicated channel can be provided for the power cord to be led out from the heat dissipation cavity. This design not only ensures the safe and orderly lead-out of the power cord, but also helps to optimize the structural integrity of the heat dissipation components, improve the safety and reliability of the equipment, and facilitate the assembly, maintenance and use of the equipment.

[0036] It is important to emphasize that during the actual installation of cooking equipment, the user may not have installed a socket at the bottom of the cabinet during the plumbing and electrical renovation process. As a result, the power cord of the electromagnetic heating device can only be run through the surface of the countertop to the socket on the wall. This solution utilizes the space of the heat dissipation component. When running the power cord through the countertop, it can be passed through the heat dissipation cavity. On the one hand, this reduces the possibility of the power cord being pressed under the cooking panel, which may easily lead to failure. On the other hand, it also ensures that the power cord can be passed out of the heat dissipation cavity in the predetermined direction and position, avoiding the power cord being randomly arranged in the heat dissipation cavity, thereby preventing the power cord from interfering with or rubbing against other components inside the heat dissipation component.

[0037] In some technical solutions, the main body of the device may optionally include: a bottom shell, which is located on one side of the cooking panel, and the bottom shell is connected to the cooking panel to form a device cavity.

[0038] In this technical solution, the bottom shell is connected to the cooking panel to form the equipment cavity. This structure constructs the core internal space of the cooking equipment, providing space for the installation and protection of components such as the cooking device and heat dissipation components. It also has an important impact on the stability, safety and overall performance of the equipment.

[0039] The bottom shell is connected to the cooking panel, together forming the equipment cavity. This enclosed space provides a place for cooking devices (such as electromagnetic heating devices), power cords, and other related electronic components and circuits, allowing these components to be installed in an orderly manner inside the equipment and avoiding interference from external factors (such as dust, moisture, etc.).

[0040] Additional aspects and advantages of this invention will become apparent in the description that follows, or may be learned by practice of this invention. Attached Figure Description

[0041] Figure 1 A schematic diagram of the structure of an embedded induction cooker in the related technology is shown;

[0042] Figure 2 An exploded view of a cooking apparatus according to an embodiment of the present invention is shown.

[0043] Figure 3 A schematic diagram of the structure of a cooking device according to an embodiment of the present invention is shown;

[0044] Figure 4 A schematic diagram of the lower cover structure according to an embodiment of the present invention is shown;

[0045] Figure 5 A schematic diagram of the structure of the cover according to an embodiment of the present invention is shown;

[0046] Figure 6 A cross-sectional structural schematic diagram of a cooking device according to an embodiment of the present invention is shown;

[0047] Figure 7 A cross-sectional structural schematic diagram of a cooking device according to an embodiment of the present invention is shown;

[0048] Figure 8 A schematic diagram of the structure of a cooking device according to an embodiment of the present invention is shown;

[0049] Figure 9 A schematic diagram of a heat dissipation assembly according to an embodiment of the present invention is shown;

[0050] Figure 10 A cross-sectional structural schematic diagram of a cooking device according to an embodiment of the present invention is shown.

[0051] in, Figures 1 to 10 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0052] 100: Cooking equipment; 102: Equipment body; 1022: Cooking panel; 1024: Equipment cavity; 1026: Heat sink; 1028: Heat sink; 104: Cooking device; 106: Heat sink assembly; 1062: Heat sink cavity; 1072: Upper cover structure; 1073: First area; 1074: Lower cover structure; 1075: Second area; 108: Heat sink hole; 1082: First hole; 1084: Second hole; 110: Water baffle; 112: Drain hole; 114: Power cord; 1162: First cable routing structure; 1164: Second cable routing structure; 118: Bottom shell;

[0053] 100': Built-in induction cooker. Detailed Implementation

[0054] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this utility model, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0055] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0056] The following reference Figures 2 to 10 Some embodiments of the present invention are described below.

[0057] like Figure 2 , Figure 3 and Figure 8 As shown, the cooking device 100 proposed in this embodiment solves the problem of insufficient heat dissipation capacity of built-in stoves. Specifically, the cooking device 100 includes a device body 102 and a heat dissipation component 106. The heat dissipation component 106 is integrated inside the device body 102, and the heat dissipation cavity 1062 and heat dissipation holes 108 are reasonably arranged to ensure that the device can effectively dissipate heat under high-temperature cooking conditions, avoid overheating of components and equipment failure, and improve the user experience.

[0058] The main body 102 serves as the frame of the entire cooking device 100, including the cooking panel 1022 and the device cavity 1024, providing overall support and housing space for the device. The device cavity 1024 houses the cooking device 104 and is effectively connected to the heat dissipation component 106, the heat dissipation cavity 1062, and the external air circulation path to ensure smooth airflow during heat dissipation.

[0059] The cooking panel 1022 is the part that the user directly contacts, mainly used to support the cooking device 104. The device cavity 1024 is a closed space inside the main body 102 of the device, housing the cooking device 104 and its related accessories (such as heating elements, circuit boards, etc.). The device cavity 1024 is connected to the heat dissipation assembly 106. Through this connection, heat inside the cavity can flow to the heat dissipation assembly 106 through the heat dissipation cavity 1062, and finally be released to the outside air through the heat dissipation holes 108. The high temperature inside the device cavity 1024 can directly affect the heat dissipation effect through its connection with the heat dissipation assembly 106, thus preventing damage to the internal components of the device from high temperatures.

[0060] It is important to emphasize that this solution adds a heat dissipation component 106 to the traditional cooking device 104, which can guide heat from the device cavity 1024 and dissipate it quickly. The heat dissipation component 106 is connected to the cooking panel 1022 and protrudes from the outer side of the panel. With this design, the heat generated in the device cavity 1024 can be directly discharged to the upper side of the cooking panel 1022 through the heat dissipation component 106, reducing the temperature inside the device and protecting the internal components from high temperatures.

[0061] It should be added that the heat dissipation cavity 1062 is connected to the device cavity 1024, allowing hot air to flow from the device cavity 1024 into the heat dissipation assembly 106. After being processed by the heat dissipation assembly 106, the air is released through the heat dissipation holes 108. Multiple heat dissipation holes 108 are provided on the outer wall of the heat dissipation assembly 106 to quickly expel hot air from the device, preventing heat accumulation inside the device. The heat dissipation assembly 106 is designed to protrude at least partially from the cooking panel 1022, allowing air to be released through the protruding portion, enabling the heat dissipation assembly 106 to exchange heat more effectively with the external environment.

[0062] The outer wall of the protruding part of the heat dissipation component 106 is provided with heat dissipation holes 108 to ensure that the heat in the device cavity 1024 can be transferred to the protruding heat dissipation cavity 1062, and then discharged to the outside of the entire cooking device 100 through the heat dissipation holes 108, reducing the possibility of heat dissipation in the cabinet where the device is installed, and improving the heat dissipation effect of the cooking device 100 during normal use after being embedded.

[0063] In some embodiments, the heat dissipation assembly 106 optionally includes a detachably connected upper cover structure 1072 and a lower cover structure 1074, and a first hole 1082 for heat dissipation is provided in the upper cover structure 1072, so that the heat dissipation assembly 106 can not only ensure effective heat dissipation, but also facilitate cleaning, maintenance and optimization of the heat dissipation path. Specifically, the upper cover structure 1072 serves as a channel connecting to the outside. By providing the first hole 1082, the upper cover structure 1072 directly participates in the heat dissipation process, guiding the hot air in the heat dissipation cavity 1062 to be discharged.

[0064] During equipment use, dust, oil and other impurities may enter the heat dissipation assembly 106 through the first hole 1082. The removable upper cover structure 1072 allows users to easily remove the upper cover structure 1072 to clean the inside of the heat dissipation cavity 1062, including cleaning any dirt that may be present on the lower cover structure 1074 and any blockages around the first hole 1082.

[0065] The lower cover structure 1074 is connected to the cooking panel 1022, serving to connect the heat dissipation component 106 to the main body of the device 102. The lower cover structure 1074 and the upper cover structure 1072 together form the heat dissipation cavity 1062, providing a relatively enclosed space for the flow of hot air, ensuring that the hot air can flow along a predetermined path, that is, from the device cavity 1024 into the heat dissipation cavity 1062, and then out through the first hole 1082 of the upper cover structure 1072.

[0066] The detachable connection between the upper cover structure 1072 and the lower cover structure 1074 facilitates maintenance and cleaning of the heat dissipation assembly 106. After prolonged use, dust, oil, and other impurities may accumulate inside the heat dissipation assembly 106. The detachable connection allows users to easily remove the upper cover structure 1072 to clean the inside of the heat dissipation cavity 1062, including cleaning any dirt that may be present on the lower cover structure 1074 and any blockages around the first hole 1082.

[0067] Furthermore, it should be noted that the connection between the lower cover structure 1074 and the cooking panel 1022 ensures the connection between the heat dissipation component 106 and the main body 102 of the device. Since the lower cover structure 1074 is connected to the cooking panel 1022, the installation of the heat dissipation component 106 is more convenient during assembly. This allows the cooking device 104 to continuously generate heat during cooking, which is then dissipated into the device cavity 1024, transferred to the heat dissipation cavity 1062, and finally discharged through the first hole 1082 of the upper cover structure 1072.

[0068] In some embodiments, a second hole 1084 is optionally provided in the lower cover structure 1074, and combined with the design of the heat dissipation component 1026 and heat dissipation port 1028 in the device cavity 1024, a more efficient heat dissipation circulation path is constructed, which further improves the heat dissipation capacity of the cooking device 100, ensuring that the device can effectively dissipate heat under different working conditions, thereby improving the stability, reliability and service life of the device.

[0069] Specifically, the second hole 1084 serves as a heat dissipation channel on the lower cover structure 1074, providing a flow path for air. Air in the heat dissipation cavity 1062 can selectively flow directly from the equipment cavity 1024 or flow inward through the second hole 1084, which helps improve heat dissipation efficiency. The second hole 1084 optimizes the airflow path within the heat dissipation cavity 1062, increasing the amount of air exchanged.

[0070] It should be emphasized that the second hole 1084 is located on the lower cover structure 1074. The space where the lower cover structure 1074 and the cooking device 104 are located is generally a cabinet and is also connected. Under the action of the heat dissipation component 1026, the heat in the device cavity 1024 will flow into the cabinet. The heat in the cabinet can flow into the heat dissipation cavity 1062 through the second hole 1084, thereby achieving a more effective heat dissipation path. By introducing air from the cabinet, it helps to improve the ability to absorb heat from the device cavity 1024 and further enhance the overall heat dissipation performance of the device.

[0071] The heat sink 1026 is a component within the device cavity 1024 that actively generates heat dissipation. Through its own operation (e.g., fan rotation, heat sink conduction, etc.), it promotes airflow within the device cavity 1024, transferring the heat generated during cooking to the air. The operation of the heat sink 1026 actively guides the high-temperature air within the device cavity 1024 to the heat dissipation vent 1028. This active heat dissipation effectively reduces the temperature within the device cavity 1024, protecting other components within the device cavity 1024 (such as the cooking device 104, electronic components, etc.) from high temperatures and ensuring the normal operation of the device.

[0072] The heat dissipation vent 1028 serves as a connection channel between the equipment cavity 1024 and the external environment (generally an embedded cabinet). It provides an outlet for the high-temperature air driven by the heat sink 1026 within the equipment cavity 1024, ensuring that the high-temperature air can be discharged in a timely manner and maintaining the temperature balance within the equipment cavity 1024. Through its synergistic effect with the heat sink 1026, it achieves effective air circulation within the equipment cavity 1024, improving the equipment's heat dissipation efficiency.

[0073] When the heat sink 1026 inside the device cavity 1024 is running, some air flows out of the cooking device 100 through the heat sink 1028, driven by the heat sink 1026. Due to the temperature and pressure difference between the outside of the device and the heat sink 1062, this outflowing air flows into the heat sink 1062 through the second hole 1084 of the lower cover structure 1074, thereby carrying away heat from the device cavity 1024 and the heat sink 1062, preventing heat accumulation inside the device. Simultaneously, the air flowing into the heat sink 1062 can further exchange heat with the heat sink 1062, and then exit through the first hole 1082 of the upper cover structure 1072, forming a continuous heat dissipation process.

[0074] In one specific embodiment, optionally, such as Figure 4As shown, a water-blocking rib 110 corresponding to the second hole 1084 is provided on the lower cover structure 1074. Specifically, it is arranged around at least part of the second hole 1084. While ensuring heat dissipation efficiency, it effectively prevents external liquid from entering the heat dissipation cavity 1062, protects the internal structure, improves the stability and safety of the equipment, and extends the service life of the equipment.

[0075] The water-blocking rib 110 is arranged around at least part of the second hole 1084. The water-blocking rib 110 acts as a physical barrier, changing the flow path of the liquid and preventing it from flowing directly into the cabinet through the second hole 1084.

[0076] It is understandable that the water-blocking rib 110 will not affect the normal heat dissipation function of the second hole 1084, but rather adds a waterproof function to the heat dissipation component 106 while ensuring normal air circulation.

[0077] Optionally, in some embodiments, a first region 1073 for heat dissipation is provided within the upper cover structure 1072, and a first hole 1082 is provided within the first region 1073. A second region 1075 for heat dissipation is provided within the lower cover structure 1074, and a second hole 1084 is provided within the second region 1075. By restricting the projections of the first region 1073 and the second region 1075 to not overlap, the projections of the first region 1073 of the upper cover structure 1072 containing the first hole 1082 and the second region 1075 of the lower cover structure 1074 containing the second hole 1084 do not overlap. This allows air flowing into the heat dissipation cavity 1062 from the second hole 1084 and air flowing out of the heat dissipation cavity 1062 from the first hole 1082 to form a smoother flow path. It is understood that if the projections overlap, the paths for the inflowing and outflowing air are shorter, resulting in poor airflow and affecting heat dissipation efficiency.

[0078] In some embodiments, optionally, such as Figure 5 As shown, a drain hole 112 is provided on the upper cover structure 1072 to drain liquids (such as water, soup, etc.) that may enter the heat dissipation component 106. In a kitchen environment, a small amount of liquid may still enter the heat dissipation component 106 through the first hole 1082. The drain hole 112 provides a dedicated drainage channel for these liquids.

[0079] Because the drain hole 112 is located outside the second area 1075, it avoids functional interference with the heat dissipation hole 108 (second hole 1084), ensuring that normal airflow is not affected while draining water. The drain hole 112 effectively drains liquid from the heat dissipation component 106, preventing liquid accumulation. Accumulated liquid may corrode internal structures, affect heat dissipation performance, or cause electrical malfunctions. By promptly draining liquid, the drain hole 112 maintains a dry environment inside the heat dissipation component 106, ensuring its normal operation.

[0080] It should be emphasized that the distance between the drain hole 112 and the plane of the cooking panel is less than the distance between the first hole 1082 and the plane of the cooking panel, so that the drain hole 112 is lower, and the liquid splashed during cooking can more easily reach a lower position, which is conducive to the liquid flowing into the drain hole 112 and being discharged more quickly under the action of gravity.

[0081] At the same time, this positional design also takes into account the relationship with the first hole 1082. While ensuring the drainage function, it does not affect the heat dissipation function of the first hole 1082, so that the upper cover structure 1072 achieves an optimized layout of drainage and heat dissipation functions within a limited space.

[0082] In some embodiments, the heat dissipation component 106 is optionally positioned on one side of the cooking panel 1022. This fully utilizes the space on the side of the cooking device 100, avoiding excessive space occupation above the cooking panel 1022 or other critical operating areas, thus ensuring that cooking operations are not affected. It also provides greater flexibility for the layout of other internal components. The cooking panel 1022 generates heat during cooking, and the heat dissipation component 106's location on one side facilitates heat conduction and dissipation. Heat can be transferred from the cooking panel 1022 to the heat dissipation component 106, and then dissipated through structures such as the heat dissipation cavity 1062 and heat dissipation holes 108 in the heat dissipation component 106, preventing heat accumulation near the cooking panel 1022, which could affect device performance or create safety hazards.

[0083] Based on this, by setting the drain hole 112 on the side wall of the upper cover structure 1072 away from the cooking panel 1022, when liquid enters the heat dissipation assembly 106, the liquid is more likely to flow away from the cooking panel 1022 under the action of gravity and be discharged through the drain hole 112. This can effectively prevent liquid from accumulating in the heat dissipation assembly 106 and flowing back to the cooking panel 1022 or other areas inside the device, avoiding damage to the device, such as corrosion of electronic components or affecting the normal operation of the circuit.

[0084] The drain hole 112 is positioned relatively independently from the heat dissipation hole 108 (such as the first hole 1082), and will not interfere with the normal heat dissipation function of the heat dissipation component 106. The heat dissipation hole 108 is mainly used for air circulation to dissipate heat, while the drain hole 112 is specifically used for draining liquid. The two perform their respective functions and do not affect each other, ensuring that the heat dissipation component 106 can dissipate heat normally while draining water.

[0085] In some embodiments, optionally, such as Figure 10As shown, the cooking device 104 is an electromagnetic heating device, providing an efficient and precise heating method for cooking. However, due to the difference between its cooking method and that of a gas stove, the electromagnetic heating device needs to be connected to mains power. Therefore, a space needs to be provided for the power cord 114 to be led out. Specifically, the power cord 114 can be passed through the cavity wall of the device cavity 1024, or it can be passed out through the device cavity 1024 and the heat dissipation cavity 1062. This variety of passing methods takes into account different installation environments and user needs. When there is a suitable power interface near the device installation location, the power cord 114 can be directly passed through the cavity wall of the device cavity 1024 to connect to the power supply; while when the device installation location is more special, such as when the space inside the cabinet is limited and the power cord 114 cannot be directly passed through the cavity wall of the device cavity 1024, the method of passing out through the device cavity 1024 and the heat dissipation cavity 1062 provides a solution, allowing the device to be successfully connected to the power supply under various installation conditions.

[0086] In some embodiments, optionally, such as Figure 9 As shown, a first wire-passing structure 1162 and a second wire-passing structure 1164 are respectively provided in the upper cover structure 1072 and the lower cover structure 1074, which can provide a dedicated channel for the power cord 114 to be led out from the heat dissipation cavity 1062. This design not only ensures the safe and orderly lead-out of the power cord 114, but also helps to optimize the structural integrity of the heat dissipation component 106, improve the safety and reliability of the equipment, and facilitate the assembly, maintenance and use of the equipment.

[0087] It should be emphasized that when actually assembling the cooking equipment 100, due to the fact that the user may not have installed a socket at the bottom of the cabinet during the water and electricity renovation, the power cord 114 of the electromagnetic heating device can only be run through the surface wire on the countertop to the socket on the wall. This solution utilizes the space of the heat dissipation component 106. When running the wire through the countertop, it can be passed through the heat dissipation cavity 1062. On the one hand, this reduces the possibility of the power cord 114 being pressed under the cooking panel 1022, which may easily cause malfunctions. On the other hand, it also ensures that the power cord 114 can pass through the heat dissipation cavity 1062 in the predetermined direction and position, avoiding the power cord 114 being randomly arranged in the heat dissipation cavity 1062, thereby preventing the power cord 114 from interfering with or rubbing against other components inside the heat dissipation component 106.

[0088] It is understandable that during the process of the power cord 114 passing through the upper cover structure 1072, the second wire-passing structure 1164 cooperates with the first wire-passing structure 1162 to jointly form a complete channel for the power cord 114 to be led out from the heat dissipation cavity 1062. The channel formed by the two provides the power cord 114 with a complete and continuous path from the inside of the heat dissipation cavity 1062 to the outside. This path ensures that the power cord 114 can safely and stably pass through the relatively enclosed space of the heat dissipation cavity 1062, avoiding obstruction of the hot air flow path during the heat dissipation process, thereby ensuring the normal heat dissipation function of the heat dissipation component 106.

[0089] Based on any of the above embodiments, optionally, the bottom shell 118 is connected to the cooking panel 1022 to form the device cavity 1024. This structure constructs the core internal space of the cooking device 100, providing space for the installation and protection of components such as the cooking device 104 and the heat dissipation component 106, and also has an important impact on the stability, safety and overall performance of the device.

[0090] The bottom shell 118 is connected to the cooking panel 1022, together forming the device cavity 1024. This enclosed space provides a place for the cooking device 104 (such as an electromagnetic heating device), the power cord 114, and other related electronic components and circuits, so that these components can be installed in an orderly manner inside the device and avoid interference from external factors (such as dust, moisture, etc.).

[0091] In one specific embodiment, an induction cooker is proposed that retains the traditional fan heat dissipation path and adds a heat dissipation component above the panel, so that the heat inside the casing or cabinet cavity can be dissipated through the heat dissipation component, thereby reducing the temperature of the internal components of the product.

[0092] The heat dissipation assembly consists of two parts: an upper cover and a lower cover (i.e., an upper cover structure and a lower cover structure). The lower cover has heat dissipation holes and waterproof ribs. There are two heat dissipation holes, corresponding to two heat dissipation paths.

[0093] The top cover has ventilation holes and drainage holes. During use and cleaning, some dirt and liquid may accumulate inside the heat dissipation components. You can open the top cover to clean it.

[0094] Heat dissipation principle: such as Figure 6As shown, in the traditional cooling model, heat inside the casing is sent to the air outlet and enters the cabinet cavity via path 2, resulting in a repetitive airflow cycle and low cooling efficiency. With the addition of a cooling component, airflow can enter the cavity and simultaneously follow paths 1 and 3 into the cooling component, then dissipate through the ventilation and drainage holes on the component's cover. Hot air is exhausted from the cabinet cavity in a single pass, without recirculation, significantly reducing the temperature of internal components. If the product's installation opening is small, such as... Figure 7 As shown, the cabinet may block some of the heat dissipation holes of the heat dissipation components, and heat dissipation path 3 will fail. At this time, heat dissipation paths 1 and 4 are still effective, but more important.

[0095] Some users' homes lack power outlets under cabinets, and power cords cannot be plugged into the countertop (as they would be pressed down by the product panel). This application also provides a solution, such as... Figure 10 As shown.

[0096] The table below compares the heat dissipation effects of adding heat dissipation components and using a traditional structure:

[0097]

[0098]

[0099] According to the cooking device provided by this utility model, under the action of the heat dissipation component, the heat generated in the device cavity can be directly discharged to the upper side of the cooking panel through the heat dissipation component, thereby reducing the temperature inside the device and protecting the internal components from high temperature.

[0100] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0101] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0102] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0103] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cooking device, characterized in that, include: The main body of the device includes a cooking panel and a device cavity located on one side of the cooking panel, wherein a cooking device is provided inside the device cavity; A heat dissipation component is connected to the cooking panel, and a heat dissipation cavity is formed inside the heat dissipation component, which is connected to the device cavity; At least a portion of the heat dissipation component protrudes from the cooking panel, and at least two walls of the heat dissipation component are provided with heat dissipation holes in a direction perpendicular to the plane of the cooking panel. The heat dissipation hole includes a first hole, and the heat dissipation component specifically includes: The upper cover structure and the lower cover structure are detachably connected. The lower cover structure is connected to the cooking panel. The upper cover structure is provided with the first hole, through which the air in the heat dissipation cavity flows outward.

2. The cooking apparatus according to claim 1, characterized in that, The heat dissipation hole includes a second hole, which is disposed on the lower cover structure; The device cavity is equipped with a heat dissipation component, and a heat dissipation vent is provided on one side of the device cavity. When the heat dissipation component is in operation, part of the air flows out of the cooking device through the heat dissipation vent, and part of the air flowing out of the cooking device flows into the heat dissipation cavity through the second hole.

3. The cooking apparatus according to claim 2, characterized in that, Also includes: A water-retaining rib is provided on the lower cover structure, and the water-retaining rib is arranged around at least a portion of the second hole.

4. The cooking apparatus according to claim 2, characterized in that, The first hole is located in a first region of the upper cover structure, and the second hole is located in a second region of the lower cover structure. On the plane where the cooking panel is located, at least a portion of the projection of the first region and at least a portion of the projection of the second region do not overlap.

5. The cooking apparatus according to claim 4, characterized in that, Also includes: A drain hole is provided on the upper cover structure. The drain hole is located outside the second area. The distance between the drain hole and the plane where the cooking panel is located is less than the distance between the first hole and the plane where the cooking panel is located.

6. The cooking apparatus according to claim 5, characterized in that, The heat dissipation component is located on one side of the cooking panel, and the drain hole is located on the side wall of the upper cover structure away from the cooking panel.

7. The cooking apparatus according to claim 1, characterized in that, The cooking device is an electromagnetic heating device, and the cooking equipment also includes: A power cord is connected to the electromagnetic heating device. The power cord passes through the cavity wall of the equipment cavity, or passes outward through the equipment cavity and the heat dissipation cavity.

8. The cooking apparatus according to claim 7, characterized in that, Also includes: The first wiring structure is provided on the upper cover structure; A second wiring structure is provided in the lower cover structure; The upper cover structure and the lower cover structure are connected, and the first wire-passing structure and the second wire-passing structure form a channel for the power line to be led out from the heat dissipation cavity.

9. The cooking apparatus according to any one of claims 1 to 8, characterized in that, The main body of the device includes: A bottom shell is located on one side of the cooking panel, and the bottom shell is connected to the cooking panel to form the device cavity.

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