Thermistor insulation packaging structure

Abstract

The utility model relates to the technical field of thermistors, in particular to a thermistor insulation packaging structure, which is used for being matched with insulation paste to package a thermistor body and a lead of the thermistor body in a temperature sensing head, and comprises a support frame arranged in the temperature sensing head, the two wire clamps are oppositely arranged on the supporting frame, and each wire clamp is provided with a clamping groove matched with the shape of the section of a lead wire. According to the utility model, through the arrangement of the support frame and the wire clamp, the lead can be fixed by using the wire clamp, the support frame is also provided with the first clamping component, and the first clamping component can be matched with the second clamping component in the temperature sensing head, so that the support frame is fixed in the temperature sensing head, and the lead is prevented from moving in the process of injecting insulating glue. Meanwhile, due to the adoption of the supporting frame, the tensile strength of the welding points between the leads and the pins is improved, the filling amount of the insulation paste can be effectively reduced, the curing time of the insulation paste is shortened, and the packaging efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of thermistor technology, and in particular to an insulating encapsulation structure for a thermistor. Background Technology

[0002] In existing technology, thermistors are generally encapsulated in the tip of a temperature sensing head. Two leads of the thermistor are led out from inside the temperature sensing head and connected to an external circuit. The inside of the temperature sensing head is usually filled with insulating glue. The current conventional installation method is to solder the leads to the thermistor pins and insert the leads into the temperature sensing probe to contact the insulating glue, so as to enhance heat conduction and protect the thermistor from vibration or moisture. However, most thermistors on the market have a shallow embedding depth of the leads in the insulating glue and lack a fixing structure, which makes the tensile strength of the leads poor. Utility Model Content

[0003] In view of this, the purpose of this utility model is to propose an insulating encapsulation structure for thermistors, so as to solve the technical problem that the tensile strength of the leads is poor due to the lack of fixation between the leads and the insulating adhesive in the existing thermistor encapsulation structure.

[0004] To achieve the above objectives, this utility model provides a thermistor insulating encapsulation structure for encapsulating the thermistor body and its leads inside a temperature sensing head with insulating adhesive, comprising:

[0005] The support frame is provided in the temperature sensing head;

[0006] Two wire clamps are disposed opposite each other on the support frame. Each wire clamp has a clamping groove adapted to the cross-sectional shape of the lead wire. The inner diameter of the clamping groove is smaller than the outer diameter of the lead wire so that the two are interference fit, thereby restricting the movement of the lead wire relative to the wire clamp.

[0007] A first engaging component is provided on the outside of the support frame, and the first engaging component cooperates with a second engaging component provided inside the temperature sensing head to restrict the movement of the support frame relative to the temperature sensing head.

[0008] As a preferred embodiment of this utility model, the first engaging component includes elastic plates symmetrically arranged at both ends of the support frame, and the elastic plates have protrusions on the side that fits against the inner wall of the temperature sensing head.

[0009] As a preferred embodiment of this utility model, the second engaging component is a groove provided on the inner wall of the temperature sensing head and adapted to the shape of the protrusion. The mutual engaging of the protrusion and the groove restricts the axial rotation and axial displacement of the support frame relative to the temperature sensing head.

[0010] As a preferred embodiment of this utility model, the support frame is hollow inside and has openings at the top and bottom to facilitate the injection and filling of insulating glue, and the wire clamp is disposed inside the support frame.

[0011] As a preferred technical solution of this utility model, the support frame is symmetrically provided with two inner lining plates inside. The two inner lining plates are fixedly connected to the wire clamp on the side that is far away from each other. The inner lining plates divide the inside of the support frame into two first glue injection chambers and one second glue injection chamber.

[0012] As a preferred technical solution of this utility model, the inner lining plate is an arc-shaped plate, and the two inner lining plates are provided with multiple extension plates on the side facing each other. The extension plates extend radially outward along the virtual center of the inner lining plate, thereby increasing the contact surface between the inner lining plate and the insulating adhesive. The inner lining plate is provided with multiple through holes for connecting the first adhesive injection chamber and the second adhesive injection chamber.

[0013] As a preferred embodiment of this utility model, one end of the wire clamp is open, and the width of the opening is smaller than the diameter of the lead wire. By applying pressure to the lead wire, it can pass through the opening and enter the clamping groove of the wire clamp.

[0014] As a preferred technical solution of this utility model, the support frame is adapted to the internal cross-sectional shape of the temperature sensing head, and the two sides of the support frame are cut to form planes. A gap for injecting insulating glue is formed between the planes and the inner wall of the temperature sensing head. The planes are provided with a through groove for connecting the first glue injection chamber.

[0015] The beneficial effects of this utility model are as follows: By setting up a support frame and wire clamps, this utility model can fix the lead wires using the wire clamps. At the same time, the support frame is also provided with a first engaging component, which can cooperate with a second engaging component inside the temperature sensor to fix the support frame inside the temperature sensor, preventing the lead wires from moving during the injection of insulating glue. In addition, the use of a support frame not only improves the tensile strength of the solder joint between the lead wires and pins, but also effectively reduces the amount of insulating glue filling, saves insulating glue, speeds up the curing time of the insulating glue, and improves the packaging efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the external structure of this utility model;

[0018] Figure 2This is a schematic diagram of the three-dimensional structure of the temperature sensor head of this utility model.

[0019] Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0020] Figure 4 This is a partial cross-sectional three-dimensional structural diagram of the bracket, inner lining plate, and wire clamp of this utility model.

[0021] The following are labeled in the diagram: 1. Temperature sensor; 2. Thermistor body; 3. Pin; 4. Lead wire; 5. Support frame; 6. Inner liner; 7. Wire clamp; 8. First injection chamber; 9. Second injection chamber; 10. Extension plate; 11. Elastic plate; 12. Protrusion; 13. Groove; 14. Through slot; 15. Through hole. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] like Figure 1 and Figure 2 As shown, a thermistor insulating encapsulation structure is used to encapsulate the thermistor body 2 and its lead wire 4 inside a temperature sensing head 1 with insulating adhesive. The structure includes: a support frame 5 disposed in the temperature sensing head 1; two wire clamps 7 disposed opposite to each other on the support frame 5, each wire clamp 7 having a clamping groove adapted to the cross-sectional shape of the lead wire 4, the inner diameter of the clamping groove being smaller than the outer diameter of the lead wire 4 to allow for an interference fit, thereby restricting the movement of the lead wire 4 relative to the wire clamp 7; and a first engaging component disposed on the outside of the support frame 5, which cooperates with a second engaging component disposed inside the temperature sensing head 1 to restrict the movement of the support frame 5 relative to the temperature sensing head 1.

[0025] The above technical solution can improve the tensile strength of the solder joint between the lead wire 4 and the pin 3. In use, the lead wire 4 at the lower end of the thermistor body 2 is connected to the clamp 7 to ensure stable contact between the lead wire 4 and the clamping groove of the clamp 7. The support frame 5 is fixed inside the temperature sensing head 1 by the cooperation of the first and second locking components. Then, an appropriate amount of insulating glue is injected into the temperature sensing head 1 to ensure that the insulating glue overflows the pin 3 and the lead wire 4, preventing short circuits between the pin 3 and the lead wire 4 or with external metal parts. The use of the support frame 5 can stably support the lead wire 4 and the thermistor body 2, preventing the lead wire 4 from moving during the injection of insulating glue. At the same time, the use of the support frame 5 makes the internal structure of the temperature sensing head 1 more compact, reduces the open area, effectively reduces the amount of insulating glue filling, saves insulating glue, and indirectly speeds up the curing time of the insulating glue, thus improving the packaging efficiency.

[0026] like Figure 2 and Figure 3 As shown, in this embodiment, the first engaging component includes elastic plates 11 symmetrically arranged at both ends of the support frame 5, and the elastic plates 11 have a protrusion 12 on the side that fits against the inner wall of the temperature sensing head 1; the second engaging component is a groove 13 arranged on the inner wall of the temperature sensing head 1 and adapted to the shape of the protrusion 12. The axial rotation and axial displacement of the support frame 5 relative to the temperature sensing head 1 are restricted by the mutual engagement of the protrusion 12 and the groove 13.

[0027] The above technical solution can fix the support frame 5 inside the temperature sensing head 1. In use, the support frame 5 is placed into the corresponding position inside the temperature sensing head 1, ensuring that the protrusion 12 on the surface of the elastic plate 11 and the groove 13 on the inner wall of the temperature sensing head 1 engage with each other, thereby fixing the support frame 5 inside the temperature sensing head 1. At the same time, since two pairs of protrusions 12 and grooves 13 are provided, not only can the rotation of the support frame 5 along the axis of the temperature sensing head 1 be restricted, but also the lifting and lowering movement of the support frame 5 along the axis of the temperature sensing head 1 can be prevented.

[0028] like Figure 2 and Figure 4 As shown, in this embodiment, the support frame 5 is hollow inside and has openings at the top and bottom to facilitate the injection and filling of insulating glue, and the wire clamp 7 is located inside the support frame 5;

[0029] The above technical solution allows for easy injection of insulating adhesive through the opening of the support frame 5, ensuring that the insulating adhesive can fully fill the space between the support frame 5 and the temperature sensor 1, and preventing any dead zones where the insulating adhesive cannot penetrate.

[0030] like Figure 4 As shown, in this embodiment, two inner lining plates 6 are symmetrically arranged inside the support frame 5. The two inner lining plates 6 are fixedly connected to the wire clamp 7 on the side that is far away from each other. The inner lining plates 6 divide the inside of the support frame 5 into two first glue injection chambers 8 and one second glue injection chamber 9.

[0031] The above technical solution can ensure that the support frame 5 has sufficient structural strength. By setting the inner lining plate 6 inside the support frame 5, the support frame 5 can be supported internally, preventing the support frame 5 from being flattened due to external pressure.

[0032] like Figure 4 As shown, in this embodiment, the inner liner 6 is an arc-shaped plate. The two inner liner plates 6 are provided with a plurality of extension plates 10 on the side facing each other. The extension plates 10 extend radially outward along the virtual center of the inner liner plate 6, thereby increasing the contact surface between the inner liner plate 6 and the insulating adhesive. The inner liner plate 6 is provided with a plurality of through holes 15 for connecting the first adhesive injection chamber 8 and the second adhesive injection chamber 9.

[0033] The above technical solution can ensure that the insulating adhesive can fully contact the support frame 5. When in use, when the insulating adhesive enters the first injection chamber 8 and the second injection chamber 9, the extension plate 10 on the surface of the inner liner 6 can increase the contact area between the support frame 5 and the insulating adhesive, ensuring a stable connection between the support frame 5 and the insulating adhesive. At the same time, the through hole 15 on the surface of the inner liner 6 can ensure that the insulating adhesive between adjacent chambers can flow to each other, improving the sealant injection efficiency.

[0034] like Figure 4 As shown, in this embodiment, one end of the wire clamp 7 is open, and the width of the opening is smaller than the diameter of the lead wire 4. By applying pressure to the lead wire 4, it can pass through the opening and enter the clamping groove of the wire clamp 7.

[0035] The above technical solution allows for easy insertion of the lead wire 4 into the clamping slot of the wire clamp 7.

[0036] like Figure 2 and Figure 4 As shown, in this embodiment, the support frame 5 is adapted to the internal cross-sectional shape of the temperature sensing head 1. The two sides of the support frame 5 are cut to form planes, and a gap for injecting insulating glue is formed between the planes and the inner wall of the temperature sensing head 1. The planes are provided with a through groove 14 for connecting the first glue injection chamber 8.

[0037] The above technical solution facilitates stable contact between the support frame 5 and the inside of the temperature sensor 1. The through groove 14 allows the insulating glue in the first glue injection chamber 8 to enter the gap. At the same time, the through groove 14 also facilitates the insertion of the lead wire 4 into the wire clamp 7, making installation convenient.

[0038] Working principle: In use, the leads 4 at the lower end of the thermistor body 2 are connected to the clamp 7, and the protrusions 12 on the surface of the elastic plate 11 are engaged with the grooves 13 on the inner wall of the temperature sensing head 1, thereby fixing the support frame 5 inside the temperature sensing head 1. Then, an appropriate amount of insulating glue is injected into the temperature sensing head 1. The insulating glue enters the first glue injection chamber 8 and the second glue injection chamber 9 and gradually spreads to other areas. The extension plate 10 on the surface of the inner liner plate 6 can increase the contact area between the support frame 5 and the insulating glue, ensuring a stable connection between the support frame 5 and the insulating glue. At the same time, the through holes 15 on the surface of the inner liner plate 6 can ensure that adjacent chambers The insulating adhesive between the components can flow freely, improving the efficiency of sealant injection until it overflows the pins 3 and leads 4, preventing short circuits between pins 3 and leads 4 or with external metal components. The support frame 5 stably supports leads 4 and the thermistor body 2, increasing the tensile strength of the solder joint between leads 4 and pins 3, preventing leads 4 from moving during the injection of insulating adhesive, and making the internal structure of the temperature sensor 1 more compact with less open space. This effectively reduces the amount of insulating adhesive needed, saves insulating adhesive, and indirectly speeds up the curing time of the insulating adhesive, thus improving encapsulation efficiency.

[0039] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0040] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A thermistor insulating encapsulation structure, used to encapsulate the thermistor body (2) and its leads (4) inside a temperature sensing head (1) with insulating adhesive, characterized in that, include: A support frame (5) is provided in the temperature sensing head (1); Two wire clamps (7) are arranged opposite each other on the support frame (5). The wire clamps (7) have clamping grooves that are adapted to the cross-sectional shape of the lead wire (4). The inner diameter of the clamping groove is smaller than the outer diameter of the lead wire (4) so ​​that the two are interference fit, thereby restricting the movement of the lead wire (4) relative to the wire clamps (7). A first engaging component is provided on the outside of the support frame (5), and the first engaging component cooperates with a second engaging component provided inside the temperature sensing head (1) to restrict the movement of the support frame (5) relative to the temperature sensing head (1).

2. The thermistor insulating encapsulation structure according to claim 1, characterized in that, The first engaging component includes elastic plates (11) symmetrically arranged at both ends of the support frame (5), and the elastic plates (11) have protrusions (12) on the side that fits against the inner wall of the temperature sensing head (1).

3. The thermistor insulating encapsulation structure according to claim 2, characterized in that, The second engaging component is a groove (13) provided on the inner wall of the temperature sensing head (1) and adapted to the shape of the protrusion (12). The mutual engaging of the protrusion (12) and the groove (13) restricts the axial rotation and axial displacement of the support frame (5) relative to the temperature sensing head (1).

4. The thermistor insulating encapsulation structure according to claim 1, characterized in that, The support frame (5) is hollow inside and has openings at the top and bottom to facilitate the injection and filling of insulating glue. The wire clamp (7) is located inside the support frame (5).

5. The thermistor insulating encapsulation structure according to claim 4, characterized in that, The support frame (5) has two symmetrical inner lining plates (6) inside. The two inner lining plates (6) are fixedly connected to the wire clamp (7) on the side that is far away from each other. The inner lining plates (6) divide the inside of the support frame (5) into two first glue injection chambers (8) and one second glue injection chamber (9).

6. The thermistor insulating encapsulation structure according to claim 5, characterized in that, The inner lining plate (6) is an arc-shaped plate. The two inner lining plates (6) are provided with multiple extension plates (10) on the side facing each other. The extension plates (10) extend radially outward along the virtual center of the inner lining plate (6), thereby increasing the contact surface between the inner lining plate (6) and the insulating glue. The inner lining plate (6) is provided with multiple through holes (15) for connecting the first glue injection chamber (8) and the second glue injection chamber (9).

7. The thermistor insulating encapsulation structure according to claim 5, characterized in that, One end of the clamp (7) is open, and the width of the opening is smaller than the diameter of the lead wire (4). By applying pressure to the lead wire (4), it can pass through the opening and enter the clamping groove of the clamp (7).

8. The thermistor insulating encapsulation structure according to claim 6, characterized in that, The support frame (5) is adapted to the internal cross-sectional shape of the temperature sensing head (1). The two sides of the support frame (5) are cut to form a plane. A gap for injecting insulating glue is formed between the plane and the inner wall of the temperature sensing head (1). The plane is provided with a through groove (14) for connecting the first glue injection chamber (8).

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