Head-mounted display device

Abstract

The utility model provides a head-mounted display device. The head-mounted display device comprises a glasses frame and glasses legs extending outwards from the two ends of the glasses frame. The SIP module is arranged in the glasses legs, the SIP module comprises a substrate, a packaging device and an exposed device, and the packaging device and the exposed device are arranged on the surfaces of the two opposite sides of the substrate respectively; wherein the packaging device comprises at least one of a main chip, a storage chip, a power management chip and a power amplification chip, and the bare device comprises an IMU (Inertial Measurement Unit) device. According to the head-mounted display equipment, the SIP module is arranged in the glasses leg, so that the space utilization rate in the glasses leg is improved; the packaging device and the bare device are respectively arranged on two opposite side surfaces of the substrate; the stable arrangement of the packaging device is realized, and the measurement precision and accuracy of the bare device can be ensured.

Description

Technical Field

[0001] This application belongs to the field of wearable device technology, specifically, this application relates to a head-mounted display device. Background Technology

[0002] As smart glasses become more and more versatile, the experience of obtaining virtual and real images through smart glasses is receiving increasing attention.

[0003] In existing technologies, smart glasses struggle to achieve a balance between lightweight design and high integration. For example, they don't make full use of the limited space inside the temples. Furthermore, the diverse functions and high integration of smart glasses require space and integrated modules, which limits the functional expansion and use of smart glasses. Utility Model Content

[0004] One objective of this application is to provide a new technical solution for head-mounted display devices.

[0005] According to a first aspect of the present invention, a head-mounted display device is provided, the head-mounted display device including a frame and temples extending outward from both ends of the frame; the head-mounted display device further includes:

[0006] The SIP module is disposed inside the temple of the lens. The SIP module includes a substrate, a packaged device, and an exposed device. The packaged device and the exposed device are respectively disposed on opposite sides of the substrate.

[0007] The packaged device includes at least one of a main chip, a memory chip, a power management chip, and a power amplifier chip, and the exposed device includes an IMU device.

[0008] Optionally, the substrate has a first surface facing the inner shell of the temple, and the exposed device is disposed on the first surface.

[0009] Optionally, the first surface has a first groove, and at least a portion of the exposed device is disposed in the first groove.

[0010] Optionally, the exposed device further includes an radio frequency chip, and the packaged device includes a main chip.

[0011] Optionally, the substrate has a second surface facing the housing of the temple;

[0012] The encapsulation device is disposed on the second surface.

[0013] Optionally, the SIP module is disposed at the end of the temple facing the frame;

[0014] The packaged device includes a main chip located on the substrate near the lens frame.

[0015] Optionally, the packaged device includes a power management chip located in a region of the substrate away from the lens frame.

[0016] Optionally, it also includes a protective structure disposed on the second surface and used to protect the packaged device.

[0017] Optionally, the protective structure includes an encapsulation layer and a shielding layer, the encapsulation layer being disposed on the substrate and used to encapsulate the encapsulated device, and the shielding layer covering the encapsulation layer.

[0018] Optionally, the protective structure is fitted to the inner wall of the outer casing.

[0019] One technical advantage of this utility model is:

[0020] This application provides a head-mounted display device, which includes a frame and temples extending outward from both ends of the frame; and a SIP module disposed within the temples. The SIP module includes a substrate, a packaged device, and an exposed device, with the packaged device and the exposed device respectively disposed on opposite sides of the substrate. The packaged device includes at least one of a main chip, a memory chip, a power management chip, and a power amplifier chip, and the exposed device includes an IMU device. By placing the SIP module within the temples, this head-mounted display device improves the space utilization within the temples; and by disposing the packaged device and the exposed device on opposite sides of the substrate, it achieves stable placement of the packaged device while ensuring the measurement accuracy and precision of the exposed device.

[0021] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.

[0023] Figure 1 A schematic diagram of a head-mounted display device provided in one embodiment of this application. Figure 1 (The area within the dashed box indicates the area of ​​the picture frame);

[0024] Figure 2 A schematic diagram of a head-mounted display device provided in one embodiment of this application. Figure 2 (The area within the dashed box indicates the area of ​​the picture frame);

[0025] Figure 3 This is a schematic diagram of a SIP module for a head-mounted display device according to one embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the structure of a head-mounted display device provided in one embodiment of this application.

[0027] The components are: 1. Frame; 11. Display module; 2. Temple; 3. SIP module; 31. Substrate; 32. Electronic components; 321. Exposed components; 322. Encapsulated components; 33. Protective structure; 331. Encapsulation layer; 332. Shielding layer; 4. Optical engine; 5. Image module; 6. Battery. Detailed Implementation

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0029] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0034] The head-mounted display device provided in this application embodiment can be wearable glasses such as AR glasses, VR glasses, or MR glasses. The head-mounted display device improves the space utilization inside the temple by setting the SIP module inside the temple. Furthermore, the packaged device and the exposed device are respectively disposed on opposite sides of the substrate. The packaged device includes at least one of a main chip, a memory chip, a power management chip, and a power amplifier chip, and the exposed device includes an IMU device. This achieves both stable setting of the packaged device and ensures the measurement accuracy and precision of the exposed device.

[0035] Reference Figure 1 and Figure 4 This application provides a head-mounted display device, which includes:

[0036] The frame 1 and the temples 2 extending outwards from both ends of the frame 1; and,

[0037] SIP module 3 is disposed inside the temple 2. SIP module 3 includes substrate 31, encapsulation device 322 and exposed device 321. Encapsulation device 322 and exposed device 321 are respectively disposed on opposite sides of the substrate.

[0038] The packaged device 322 includes at least one of a main chip, a memory chip, a power management chip, and a power amplifier chip, and the exposed device 321 includes an IMU device.

[0039] In this embodiment, the frame 1 can serve as the display part of the head-mounted display device, so that the wearer can obtain virtual or real display images through the frame 1; the two temples 2 are respectively connected to the two ends of the frame 1 so that the head-mounted display device can be worn on the wearer's head.

[0040] In one embodiment, two temples 2 are fixedly connected to the two ends of the frame 1, and the temples 2 are elastic so that the head-mounted display device can match the wearing requirements of different wearers.

[0041] In another embodiment, the two temples 2 are rotatably connected to the two ends of the frame 1 respectively. By setting rotational damping between the temples 2 and the frame 1, it is convenient for the head-mounted display device to match the wearing requirements of different wearers, and it is also convenient for the head-mounted display device to be stored.

[0042] In this embodiment, see Figure 1 The packaged device 322 and the exposed device 321 constitute the electronic device 32. The SIP module 3 uses the SIP (System in Package) process to integrate at least two electronic devices 32 on opposite sides of the substrate 31. While maintaining the miniaturization and low power consumption of the module, it can realize the diversified functions of multi-device integration.

[0043] In this embodiment, the SIP module 3 is applied to the temple 2 of the head-mounted display device, which not only meets the wearer's needs for a compact, lightweight and high-performance head-mounted display device, but also improves the integration efficiency and structural compactness of the head-mounted display device.

[0044] In the above embodiments, the exposed device 321 can be a device that is not encapsulated on the substrate 31, that is, a device directly exposed on the substrate 31. It is worth noting that some devices can be self-encapsulated and then mounted onto the surface of the substrate 31 to form a separate device similar to an exposed device. This separate device also falls under the category of exposed devices as defined in the embodiments of this application.

[0045] In the above embodiments, the packaging device 322 can be a device packaged on the substrate 31, that is, a device that covers and protects the packaging device 322 through a packaging structure, so as to ensure the stability of the structural design and circuit configuration of the packaging device 322.

[0046] In the above embodiment, the main chip, as the core of the SIP module 3, can ensure the multi-functional operation of the SIP module 3, but it will also generate a lot of heat during operation. By placing the main chip on the outer shell side of the substrate 31 facing the temple 2, the heat generated by the main chip can be easily transferred to the outside of the head-mounted display device.

[0047] The memory chip is used to store data and programs, ensuring the read and write speed and accuracy of data in the SIP module 3. Placing the memory chip close to the main chip can shorten the data transmission path, reduce signal loss, and improve data transmission speed and stability.

[0048] The power management chip generates heat during operation. By placing the power management chip on the side of the substrate 31 facing the temple 2, the temple can be used as one of the heat dissipation channels. The heat can be dissipated more effectively through the temple, which helps to reduce the operating temperature of the power management chip and improve its stability and lifespan.

[0049] The power amplifier chip amplifies radio frequency signals to ensure sufficient power and strength during transmission. The housing of temple 2 can house antennas or other signal transmitting / receiving components. Placing the power amplifier chip close to the housing of temple 2 reduces signal loss during transmission, improving amplification efficiency and signal quality.

[0050] In this embodiment, the IMU device can measure motion parameters such as acceleration and angular velocity in real time. In head-mounted display devices, the high-precision measurement capability of the IMU device enables the device to more accurately perceive the user's head movements and posture changes. This helps improve the experience of augmented reality applications, allowing wearers to interact with virtual content more naturally, enhancing immersion and interactivity.

[0051] To avoid stress on the IMU device and cause measurement deviation, the IMU device can be set as an exposed device on the substrate 31 to ensure the measurement accuracy and precision of the IMU device.

[0052] In some embodiments, see Figure 2 and Figure 3 The substrate 31 has a first surface facing the inner shell of the temple 2, and the exposed device 321 is disposed on the first surface.

[0053] In the above embodiment, the inner shell of the temple 2 is the shell of the temple 2 closest to the wearer when the head-mounted display device is in the wearing state. The first surface of the substrate 31 faces the inner shell of the temple 2. On the one hand, it can make more effective use of the space inside the temple 2. On the other hand, it can facilitate the dissipation of heat from the exposed device 321 set on the first surface. The heat dissipated by the exposed device 321 can be transferred through the inner shell of the temple 2 to the tail of the temple 2 in the extension direction of the temple 2. The tail of the temple 2 is the part of the temple 2 away from the frame 1. That is, the heat can be transferred to the end of the temple 2 away from the frame 1, which facilitates the external heat dissipation of the temple 2 and ensures the stability of the exposed device 321.

[0054] In one embodiment, the first surface has a first groove, and at least part of the exposed device 321 is disposed in the first groove.

[0055] In this embodiment, the height of exposed devices 321 such as capacitors, resistors or chips will affect the thickness of the temple 2 in the direction perpendicular to its extension. By setting a recessed first groove on the first surface of the substrate 31 and placing the exposed device 321 in the first groove, the height of the exposed device 321 protruding from the first surface can be reduced, thereby reducing the overall thickness of the SIP module 3 and thus reducing the thickness of the temple 2 in the direction perpendicular to its extension.

[0056] Moreover, the first groove can provide physical protection for the exposed device 321, which helps to ensure the stability of the exposed device 321 and reduce the vibration and impact on the exposed device 321.

[0057] In some embodiments, see Figure 2 and Figure 3 The exposed device 321 also includes an RF chip, and the packaged device 322 includes a main chip.

[0058] In the above embodiments, the radio frequency chip can process radio frequency signals such as WIFI and Bluetooth to ensure the signal transmission function of the head-mounted display device, and it will also generate heat during operation. By placing the radio frequency chip on the first surface of the substrate 31 and the main chip on the second surface of the substrate 31, that is, placing the radio frequency chip and the main chip on the two sides of the substrate 31 respectively, the heat generated by the radio frequency chip and the main chip can be dispersed, which helps to improve the heat dissipation performance of the entire SIP module 3.

[0059] Meanwhile, the RF chip and the main chip are distributed on both sides of the substrate 31, which can reduce the electromagnetic interference between them and ensure the stability and transmission quality of the RF signal.

[0060] In some embodiments, see Figure 2 and Figure 3 The substrate 31 has a second surface facing the outer shell of the temple 2;

[0061] The packaged device 322 is disposed on the second surface.

[0062] In the above embodiment, the outer shell of the temple 2 is the shell on the side away from the wearer when the head-mounted display device is in the wearing state. The second surface of the substrate 31 faces the outer shell of the temple 2. On the one hand, it can make more effective use of the space inside the temple 2. On the other hand, it can facilitate the heat dissipation of the encapsulation device 322 disposed on the second surface to the outer shell of the temple 2, and then diffuse outward through the outer shell of the temple 2, avoiding the heat generated by the encapsulation device 322 from being transferred to the wearing space of the head-mounted display device. This wearing space is the space enclosed by the frame 1 and the temples 2 on both sides.

[0063] In some embodiments, see Figure 1 and Figure 2The SIP module 3 is located at the end of the temple 2 facing the frame 1;

[0064] The packaged device 322 includes a main chip located on the substrate near the lens frame.

[0065] In the above embodiment, the end of the temple 2 facing the frame 1 is the connection end between the temple 2 and the frame 1, that is, the head end of the temple 2, and the end of the temple 2 away from the frame 1 is the tail end of the temple 2. The connection end of the temple 2 can be connected to the frame 1 through a pivot or hinge to facilitate the unfolding and storage of the head-mounted display device. The SIP module 3 is located inside the temple 2 near the connection end, and the main chip is located in the area of ​​the substrate 31 near the frame 1. This allows the main chip to easily route signal lines to the frame 1, shortening the signal transmission distance, thereby reducing signal attenuation during transmission, improving signal quality and transmission efficiency, and ensuring the effectiveness and convenience of the connection between the main chip and components such as the display module in the frame 1.

[0066] In some embodiments, see Figure 2 and Figure 3 The packaged device 322 includes a power management chip located in a region of the substrate away from the frame.

[0067] In the above embodiments, the power management chip can be connected to the battery of the head-mounted display device to facilitate control operations such as charging and discharging, voltage regulation, and current regulation of the battery.

[0068] In the temple 2 equipped with the SIP module 3, the SIP module 3 is located at the end of the temple 2 closer to the frame 1, while the area of ​​the temple 2 away from the frame 1 can be used to house the battery; the power management chip is placed on the substrate 31 in the area away from the frame 1, which facilitates the connection between the power management chip and the battery, so as to facilitate the charging and discharging of the battery and increase the battery life of the head-mounted display device.

[0069] In some embodiments, see Figure 2 and Figure 3 The SIP module 3 also includes a protective structure 33, which is disposed on the second surface and is used to protect the packaged device 322.

[0070] In the above embodiments, the packaged devices 322, such as the main chip, memory chip, power management chip, and power amplifier chip, need to be stably set to ensure the stability of signal transmission and control on the chip. The protective structure 33 acts to package and protect the packaged devices 322. The protective structure 33 is tightly integrated with the substrate 31 and the packaged devices 322 to form a stable structure, which can prevent the packaged devices 322 from being damaged by the external environment and ensure the reliability and durability of the SIP module 3.

[0071] In some embodiments, see Figure 2 and Figure 3 The protective structure 33 includes an encapsulation layer 331 and a shielding layer 332. The encapsulation layer 331 is disposed on the substrate 31 and is used to encapsulate the encapsulated device 322. The shielding layer 332 is covered on the encapsulation layer 331.

[0072] In the above embodiments, the encapsulation layer 331 directly covers the encapsulation device 322 to provide physical protection for the encapsulation device 322 and ensure the stability of the encapsulation device 322; the shielding layer 332 is covered by the encapsulation layer 331, which can effectively block electromagnetic interference from the outside from interfering with the encapsulation device 322 and ensure the normal operation of the encapsulation device 322.

[0073] In one embodiment, the protective structure 33 is fitted to the inner wall of the housing.

[0074] In the above embodiment, the protective structure 33 has a surface on the side away from the substrate 31 that is parallel to the outer shell of the temple 2. When installing and fixing the SIP module 3, the shielding layer 332 can be set on the inner wall of the temple 2 by electroplating or deposition, and then the side of the encapsulation layer 331 away from the substrate 31 is connected to the shielding layer 332 to achieve the purpose of connecting the SIP module 3 to the inner wall of the temple 2.

[0075] In some embodiments, see Figure 1 and Figure 2 The head-mounted display device also includes an optical engine 4, which is located at the end of the lens frame 1. A display module 11 is mounted on the lens frame 1, and both the display module 11 and the optical engine 4 are electrically connected to the SIP module 3.

[0076] In the above embodiment, the end of the frame 1 can be the position of both ends of the frame 1 near the temple 2. The optical engine 4 can be set at the end of the frame 1, which means that the optical engine 4 is set at the corner of the frame 1 so that after the optical engine 4 converts the image information into light signals, the light is coupled into the waveguide lens in the frame 1 through the lens system, thus avoiding the occupation of the display area in the frame 1.

[0077] Display module 11 and optical engine 4 are both electrically connected to SIP module 3. SIP module 3 can efficiently process signals from display module 11 and optical engine 4, ensuring fast and accurate signal transmission between modules, thereby improving the overall performance and response speed of head-mounted display devices.

[0078] In one embodiment, the head-mounted display device is AR glasses. An MCU (Microcontroller Unit) chip is installed on the frame of the AR glasses. The MCU chip can receive signals from input modules such as sensors and camera modules, and process these signals according to preset program logic to improve the interactive experience and functionality of the AR glasses.

[0079] In some embodiments, see Figure 1 and Figure 2 The head-mounted display device also includes a camera module 5, which is located at the end of the frame 1 and electrically connected to the SIP module 3.

[0080] In the above embodiments, the head-mounted display device can be audio or camera glasses. These glasses include a processor chip to process image and video data, ensuring image clarity and smoothness. Two camera modules 5 are respectively disposed at both ends of the frame 1, enabling the camera modules 5 to capture images or videos of the actual environment surrounding the device, providing users with a more realistic and immersive augmented reality experience.

[0081] In the above embodiments, through the electrical connection between the camera module 5 and the SIP module 3, the camera module 5 can transmit data to the SIP module 3 in real time for processing and analysis, thereby realizing rapid response and feedback of environmental information.

[0082] In another embodiment, the camera module 5 is disposed in the middle of the frame 1 so as to capture images or videos of the actual environment around the device through a set of camera modules 5.

[0083] In some embodiments, see Figure 1 and Figure 2 The head-mounted display device also includes a battery 6, which is disposed inside the temple 2 and electrically connected to the SIP module 3;

[0084] The SIP module 3 is located near the front end of the temple 2, while the battery 6 is located on the side of the SIP module 3 away from the front end of the temple 2.

[0085] In the above embodiment, the front end of the temple 2 is the area where the temple 2 connects to the frame 1. Placing the battery 6 inside the temple 2, for example, placing the battery 6 in the rear end area of ​​the temple 2 instead of the front end, helps to optimize the weight distribution of the entire head-mounted display device, reduce the weight at the front end of the temple 2, and improve the wearer's comfort when wearing it.

[0086] In the above embodiments, the electrical connection between the battery 6 and the SIP module 3 enables the SIP module 3 to obtain a stable and continuous power supply through the battery 6.

[0087] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A head-mounted display device, characterized in that, The head-mounted display device includes a frame and temples extending outward from both ends of the frame; The head-mounted display device also includes: The SIP module is disposed inside the temple of the lens. The SIP module includes a substrate, a packaged device, and an exposed device. The packaged device and the exposed device are respectively disposed on opposite sides of the substrate. The packaged device includes at least one of a main chip, a memory chip, a power management chip, and a power amplifier chip, and the exposed device includes an IMU device.

2. The head-mounted display device according to claim 1, characterized in that, The substrate has a first surface facing the inner shell of the temple, and the exposed device is disposed on the first surface.

3. The head-mounted display device according to claim 2, characterized in that, The first surface has a first groove, and at least a portion of the exposed device is disposed in the first groove.

4. The head-mounted display device according to claim 3, characterized in that, The exposed device also includes an RF chip, and the packaged device includes a main chip.

5. The head-mounted display device according to claim 1, characterized in that, The substrate has a second surface facing the outer shell of the temple; The encapsulation device is disposed on the second surface.

6. The head-mounted display device according to claim 1, characterized in that, The SIP module is located at the end of the temple facing the frame; The packaged device includes a main chip located on the substrate near the lens frame.

7. The head-mounted display device according to claim 1, characterized in that, The packaged device includes a power management chip located on the substrate in a region away from the lens frame.

8. The head-mounted display device according to claim 5, characterized in that, It also includes a protective structure disposed on the second surface and used to protect the packaged device.

9. The head-mounted display device according to claim 8, characterized in that, The protective structure includes an encapsulation layer and a shielding layer. The encapsulation layer is disposed on the substrate and is used to encapsulate the encapsulated device. The shielding layer covers the encapsulation layer.

10. The head-mounted display device according to claim 8, characterized in that, The protective structure is fitted to the inner wall of the outer shell.

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