Temperature control system of semiconductor chilling plate TEC of chip atomic clock
By directly contacting the semiconductor cooling element (TEC) with the housing and combining it with the temperature control motherboard, the problem of inaccurate temperature control of the atomic clock chip was solved, enabling operation at a stable temperature and improving frequency stability.
Patent Information
- Application Number
- CN202520253724.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-02-18
AI Technical Summary
Existing technologies make it difficult to control the temperature of a chip atomic clock to be equal to or lower than the ambient temperature, which affects its frequency stability.
The thermoelectric cooler (TEC) is directly in contact with the housing, and gapless contact is achieved by filling with thermal grease. The current direction of the TEC is controlled by the temperature control board to achieve heating or cooling, and closed-loop temperature control is performed by combining PID algorithm.
This enables the chip atomic clock to operate at a stable temperature, improving the accuracy of temperature control and frequency stability.
Smart Images
Figure CN223827963U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip atomic clocks, in particular to a temperature control system for a thermoelectric cooler (TEC) of a chip atomic clock. Background Art
[0002] Chip atomic clocks are currently the most accurate time-frequency standard devices; an important factor affecting the frequency stability index of atomic clocks is the temperature of the atomic clocks. Atomic clocks must be controlled within a certain temperature range during operation, and only in a suitable temperature environment can the reliability of their performance be ensured. In the past, the ordinary heating method could only achieve the situation where the target temperature is higher than the external temperature, and it is difficult to reach the method where the target temperature is equal to or lower than the external temperature. To solve the above problems, a temperature control system for a thermoelectric cooler (TEC) of a chip atomic clock is proposed. Content of the Utility Model
[0003] According to the above existing technical problems, the utility model provides a temperature control system for a thermoelectric cooler (TEC) of a chip atomic clock, which is characterized by including a fixed column, an upper fixing plate, a housing, a housing panel, a lower fixing plate, a heat preservation housing, a heat preservation housing cover, a转接板 (it should be noted that there may be a misspelling here, assuming it's a transfer board), a thermoelectric cooler (TEC), a CSAC atomic clock, and a temperature control main board. The heat preservation housing cover is arranged on the lower fixing plate, the transfer board is arranged on the heat preservation housing cover, the CSAC atomic clock is arranged on the transfer board, the heat preservation housing is arranged on the heat preservation housing cover, the fixed column is arranged on the lower fixing plate, the upper fixing plate is arranged on the fixed column, the temperature control main board is arranged on the upper fixing plate, the thermoelectric cooler (TEC) is arranged on the lower fixing plate, the housing is arranged on the lower fixing plate, and the housing panel is arranged on the lower fixing plate;
[0004] Further, there is a square slot in the middle of the lower fixing plate, the heat preservation housing cover is placed in the square slot in the middle of the lower fixing plate. The heat preservation housing cover is in an overall shape of a double-square (回字型), and there is also a square opening in the middle of the heat preservation housing cover. The thermoelectric cooler (TEC) is located in the square opening in the middle of the heat preservation housing cover. Thermal grease is filled between the bottom of the thermoelectric cooler (TEC) and the lower fixing plate. There is a slot for placing the heat preservation housing on the outer circle at the upper end of the heat preservation housing cover, and the heat preservation housing is placed on the slot of the heat preservation housing cover;
[0005] Further, the transfer board is placed on the upper surface of the heat preservation housing cover, the CSAC atomic clock is placed on the upper end of the transfer board, and the CSAC atomic clock and the transfer board are located inside the heat preservation housing;
[0006] Furthermore, there are several fixed columns, the upper end of which is connected to the upper fixed plate and the lower end of which is connected to the lower fixed plate. The upper end of the lower fixed plate has several openings. The upper and lower fixed plates are connected by screws passing through the fixed columns. The upper end of the insulation shell abuts against the lower surface of the upper fixed plate. The upper surface of the upper fixed plate is fitted with a temperature control main board by bolts.
[0007] Furthermore, the outer shell covers the upper fixing plate and is connected to the upper fixing plate and the lower fixing plate by bolts; the outer shell panel is located on the side of the outer shell and is connected to the upper fixing plate and the lower fixing plate by bolts.
[0008] Furthermore, the adapter board is electrically connected to the pins of the CSAC atomic clock and to the temperature control main board via a cable, and the semiconductor refrigeration chip (TEC) is electrically connected to the temperature control main board.
[0009] Furthermore, the outer shell and outer shell panel are made of metal, while the thermal insulation shell and thermal insulation shell cover are made of thermal insulation material.
[0010] The beneficial effects of this utility model are:
[0011] This invention uses a heat sink that directly contacts the casing to maximize cooling efficiency. The thermoelectric cooler (TEC) is coated with thermal grease and then makes seamless contact with the bottom casing. Except for the TEC, other metal parts should not be in contact with the casing to avoid affecting the heating and cooling efficiency and results. A positive and negative power control chip is integrated on the temperature control motherboard to control the TEC to achieve heating or cooling functions, thereby stabilizing the ambient temperature at a certain expected set value. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the overall structure of the temperature control system of the semiconductor refrigeration chip TEC of a chip atomic clock according to the present invention.
[0013] Figure 2 This is a schematic diagram of the internal structure of the temperature control system of the semiconductor refrigeration chip TEC of the chip atomic clock according to this utility model;
[0014] Figure 3 This is an exploded structural diagram of the temperature control system of a semiconductor refrigeration chip (TEC) for a chip atomic clock according to this utility model.
[0015] Figure 4 This is a schematic diagram of the insulation shell cover structure of the temperature control system of the semiconductor refrigeration chip TEC of the chip atomic clock according to this utility model;
[0016] Figure 5 This is a schematic diagram of the lower fixing plate structure of the temperature control system of the semiconductor refrigeration chip TEC of the chip atomic clock according to this utility model;
[0017] Figure 6 This is a schematic diagram of the upper fixing plate structure of the temperature control system of the semiconductor refrigeration chip TEC of the chip atomic clock according to the present invention;
[0018] As shown in the figure: 1-Fixed column, 2-Upper fixing plate, 3-Outer shell, 4-Outer shell panel, 5-Lower fixing plate, 6-Insulation shell, 7-Insulation shell cover, 8-Adapter plate, 9-Semiconductor cooling chip (TEC), 10-CSAC atomic clock, 11-Temperature control mainboard. Detailed Implementation
[0019] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0022] Example 1
[0023] This utility model provides a temperature control system for a semiconductor cooling chip TEC (9) of a chip atomic clock, characterized in that it includes a fixed column (1), an upper fixed plate (2), a shell (3), a shell panel (4), a lower fixed plate (5), a heat insulation shell (6), a heat insulation shell cover (7), a transition plate (8), a semiconductor cooling chip TEC (9), a CSAC atomic clock (10), and a temperature control main board (11). The heat insulation shell cover (7) is provided on the lower fixed plate (5), the transition plate (8) is provided on the heat insulation shell cover (7), the CSAC atomic clock (10) is provided on the transition plate (8), the heat insulation shell (6) is provided on the heat insulation shell cover (7), the fixed column (1) is provided on the lower fixed plate (5), the upper fixed plate (2) is provided on the fixed column (1), the temperature control main board (11) is provided on the upper fixed plate (2), the semiconductor cooling chip TEC (9) is provided on the lower fixed plate (5), the shell (3) is provided on the lower fixed plate (5), and the shell panel (4) is provided on the lower fixed plate (5).
[0024] Furthermore, the lower fixing plate (5) has a square slot in the middle, and the heat insulation shell cover (7) is placed in the square slot in the middle of the lower fixing plate (5). The heat insulation shell cover (7) is shaped like a square, and there is also a square opening in the middle of the heat insulation shell cover (7). The semiconductor cooling chip TEC (9) is located in the square opening in the middle of the heat insulation shell cover (7). The bottom of the semiconductor cooling chip TEC (9) and the lower fixing plate (5) are filled with thermal conductive silicone grease. The outer ring of the upper end of the heat insulation shell cover (7) has a slot for the heat insulation shell (6) to be placed. The heat insulation shell (6) is placed on the slot of the heat insulation shell cover (7).
[0025] Furthermore, the adapter plate (8) is placed on the upper surface of the insulation shell cover (7), the CSAC atomic clock (10) is placed on the upper end of the adapter plate (8), and the CSAC atomic clock (10) and the adapter plate (8) are located inside the insulation shell (6).
[0026] Furthermore, there are several fixed columns (1). The upper end of the fixed column (1) is connected to the upper fixed plate (2), and the lower end is connected to the lower fixed plate (5). The upper end of the lower fixed plate (5) has several openings. The upper fixed plate (2) and the lower fixed plate (5) are connected by screws passing through the fixed column (1). The upper end of the heat insulation shell (6) abuts against the lower surface of the upper fixed plate (2). The upper surface of the upper fixed plate (2) is fitted with the temperature control main board (11) by bolts.
[0027] Furthermore, the outer shell (3) covers the upper fixing plate (2) and is connected to the upper fixing plate (2) and the lower fixing plate (5) by bolts. The outer shell panel (4) is located on the side of the outer shell (3) and is connected to the upper fixing plate (2) and the lower fixing plate (5) by bolts.
[0028] Furthermore, the adapter board (8) is electrically connected to the pins of the CSAC atomic clock (10) and connected to the temperature control main board (11) via a cable; the semiconductor cooling chip TEC (9) is electrically connected to the temperature control main board (11).
[0029] Furthermore, the outer shell (3) and outer shell panel (4) are made of metal, while the insulation shell (6) and insulation shell cover (7) are made of insulation material.
[0030] Example 2
[0031] In use, place the CSAC atomic clock (10) on the adapter plate (8) and place it together on the upper end of the insulation shell cover (7). Then place the insulation shell (6) on the slot of the insulation shell cover (7) so that the CSAC atomic clock (10) is wrapped with insulation material. Place the semiconductor cooling chip TEC (9) on the lower fixing plate (5) and fill the gap between them with thermal grease. There should be no gap in the middle to facilitate heat exchange. Place the insulation shell (6) and the CSAC atomic clock (10) together in the square opening in the middle of the lower fixing plate (5). The semiconductor cooling chip TEC (9) is stuck in the opening in the middle of the insulation shell cover (7). The upper end of the semiconductor cooling chip TEC (9) is attached to the bottom surface of the CSAC atomic clock (10). Place the upper fixing plate (2) on the lower fixing plate (5) through the fixing column (1) and fix it with M3 screws. The upper fixing plate (2) passes through the fixing column (1) to the lower fixing plate (5) and is threaded to support and connect the upper fixing plate (2) and the lower fixing plate (5). Four M2 screws are used to fix the temperature control main board (11) to the upper fixing plate (2) to support and connect. At the same time, the outer shell (3) is fixed to the upper fixing plate (2) and the lower fixing plate (5) with M3 screws to connect and support. The outer shell panel (4) is connected to the upper fixing plate (2) and the lower fixing plate (5) with M3 screws to support and connect. The opening position is the connector mounting hole position, which serves as an external information communication function. During the installation process, the pins of the CSAC atomic clock (10) are converted and led out, and connected to the temperature control main board (11) through a cable. The semiconductor cooling chip TEC (9) is electrically connected to the temperature control main board (11).
[0032] The semiconductor refrigeration chip TEC (9) has both cooling and heating functions. Based on the positive and negative voltages generated by the temperature control motherboard (11), the semiconductor refrigeration chip TEC (9) achieves the effect of cooling or heating. The temperature control motherboard (11) integrates the semiconductor refrigeration chip TEC (9) cooling function chip. The cooling chip can generate positive and negative voltages according to the program control, so that the semiconductor refrigeration chip TEC (9) produces the effect of cooling or heating, thereby realizing the function of making the CSAC atomic clock (10) work at a stable external temperature.
[0033] The heat sink is achieved by direct contact between the cooling fins and the casing to maximize the cooling effect;
[0034] After applying thermal grease to the semiconductor cooling chip TEC (9), it achieves seamless contact with the bottom shell. Except for the semiconductor cooling chip TEC (9), the other metal parts should not be in contact with the outer shell (3) to avoid affecting the heating and cooling efficiency and results.
[0035] A heat sink is a device whose temperature does not change with the amount of heat transferred to it; it can be an object such as the atmosphere or the earth. In electronic packaging, a heat sink typically refers to a heat sink, a device used to cool electronic chips.
[0036] The semiconductor refrigeration element TEC(9) is a semiconductor refrigeration device composed of PN junction electrical couples, and its working principle is the Peltier effect;
[0037] The temperature control motherboard (11) is the central hub of the control system, and the onboard negative temperature coefficient thermistor (NTC) is used as a sensor to sense the ambient temperature.
[0038] The temperature signal is acquired and converted by AD and sent to the main controller. The main controller uses the PID algorithm to calculate the control signal. The control signal is used to control the magnitude and direction of the current of the semiconductor cooling chip TEC(9) to achieve heating or cooling, so as to achieve the purpose of closed-loop automatic temperature control.
[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. The various components mentioned in this utility model are common technologies in the existing field. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A temperature control system for a semiconductor refrigeration device (TEC) in a chip atomic clock, characterized in that, The device includes a fixed column, an upper fixed plate, an outer shell, an outer shell panel, a lower fixed plate, an insulation shell, an insulation shell cover, an adapter plate, a thermoelectric cooler (TEC), a CSAC atomic clock, and a temperature control main board. The lower fixed plate has an insulation shell cover, the insulation shell cover has an adapter plate, the adapter plate has a CSAC atomic clock, the insulation shell cover has an insulation shell, the lower fixed plate has a fixed column, the fixed column has an upper fixed plate, the upper fixed plate has a temperature control main board, the lower fixed plate has a TEC, the lower fixed plate has an outer shell, and the lower fixed plate has an outer shell panel.
2. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 1, characterized in that, The lower fixing plate has a square slot in the middle. The insulation shell cover is placed in the square slot in the middle of the lower fixing plate. The insulation shell cover is generally U-shaped. The insulation shell cover also has a square opening in the middle. The thermoelectric cooler (TEC) is located in the square opening in the middle of the insulation shell cover. Thermal grease is filled between the bottom of the thermoelectric cooler (TEC) and the lower fixing plate. The outer ring of the upper end of the insulation shell cover has a slot for placing the insulation shell. The insulation shell is placed on the slot of the insulation shell cover.
3. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 2, characterized in that, The adapter plate is placed on the upper surface of the insulation shell cover, the CSAC atomic clock is placed on the upper end of the adapter plate, and the CSAC atomic clock and the adapter plate are located inside the insulation shell.
4. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 3, characterized in that, There are several fixed columns. The upper end of each fixed column is connected to the upper fixed plate, and the lower end is connected to the lower fixed plate. The upper end of the lower fixed plate has several openings. The upper and lower fixed plates are connected by screws passing through the fixed columns. The upper end of the insulation shell abuts against the lower surface of the upper fixed plate. The temperature control main board is mounted on the upper surface of the upper fixed plate by bolts.
5. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 4, characterized in that, The outer casing is covered by the upper fixing plate and is connected to the upper fixing plate and the lower fixing plate by bolts. The outer casing panel is located on the side of the outer casing and is connected to the upper fixing plate and the lower fixing plate by bolts.
6. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 5, characterized in that, The adapter board is electrically connected to the pins of the CSAC atomic clock and to the temperature control mainboard via a cable. The semiconductor refrigeration chip (TEC) is electrically connected to the temperature control mainboard.
7. The temperature control system for a semiconductor refrigeration chip (TEC) of a chip atomic clock according to claim 6, characterized in that, The outer shell and outer shell panel are made of metal, while the thermal insulation shell and thermal insulation shell cover are made of thermal insulation material.