Temperature control device for IDC data center server

Abstract

The utility model discloses a temperature control device for an IDC data center server, which comprises a bottom plate, one end of the top of the bottom plate is fixedly provided with a cavity side plate, the top of the cavity side plate is fixedly communicated with a connecting pipe, the outer wall of the cavity side plate is provided with a water cooling mechanism, and the bottom of the outer wall of the cavity side plate is provided with a mounting port. An air exhaust mechanism is mounted in the mounting opening; the air exhaust mechanism comprises a mounting rod, a through groove is formed in the mounting rod, a plurality of integrated fans are mounted in the through groove, the water cooling mechanism comprises a water pumping groove fixed to the bottom of the outer wall of the cavity side plate, a water storage groove is fixed to the top of the outer wall of the cavity side plate, and a plurality of water outlet pipes are evenly fixed to the bottom of the water storage groove. A water pump is fixed to the side wall of the cavity side plate. According to the utility model, the heat of the IDC data center server can be taken away by cold water, and the temperature is continuously taken away in a circulating manner, so that the temperature is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature control device technical field especially relates to a kind of for IDC data center server temperature control device. BACKGROUND

[0002] IDC data center server is a kind of server type specially designed for Internet Data Center, mainly provides server hosting, lease and related value-added services, IDC should meet the construction specification of telecom-grade computer room, have and meet computer room function, computer room building, computer room environment, power supply system, air conditioning system, wiring system, network system, KVM system, network management system, network security system, data storage backup system and other basic conditions.

[0003] And at present, for the heat dissipation of IDC data center server, on the one hand through air conditioning cooling, but due to the large amount of server, heat dissipation, air conditioning effect is poor, IDC data center server is generally equipped with cooling fan, but the effect of separate fan cooling is not good, heat is difficult to be taken out, there is room for improvement. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides a kind of for IDC data center server temperature control device.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] A kind of for IDC data center server temperature control device, including bottom plate, the top of the bottom plate one end is fixed with cavity side plate, the top of the cavity side plate is fixed with the communication of connecting pipe, the outer wall of the cavity side plate is installed with water cooling mechanism, and the outer wall bottom of cavity side plate is equipped with installation port, and the installation port is installed with suction mechanism;

[0007] The suction mechanism includes installation rod, the through slot is formed in the installation rod, and a plurality of integrated fans are installed in the through slot.

[0008] As a further scheme of the utility model, the water cooling mechanism includes the water pumping groove fixed on the outer wall bottom of cavity side plate, the outer wall top of the cavity side plate is fixed with the water storage tank, the bottom of the water storage tank is uniformly fixed with a plurality of water outlet pipes, and the side wall of the cavity side plate is fixed with water pump.

[0009] As a further scheme of the utility model, the water inlet port of the water pump is fixed with the first connecting pipe, and the bottom of the first connecting pipe is located in the water pumping groove, the water outlet end of the water pump is fixed with the second connecting pipe, and the second connecting pipe is communicated with the water storage tank.

[0010] As a further scheme of the utility model, the inner wall of the water storage tank is uniformly provided with a plurality of first installation grooves, the outer wall of the cavity side plate is provided with first installation grooves corresponding to the second installation grooves, and the first installation grooves and the second installation grooves corresponding to each other are fixed with the same semiconductor refrigerator.

[0011] As a further scheme of the utility model, the installation port is fixedly provided with a square grid plate, the installation rod is fixed in the square grid plate, and the installation port, the square grid plate and the air extraction mechanism are arranged, the air extraction mechanism comprises the installation rod, the through groove and the integrated fan, through the above design, the heat can be taken away under the action of the integrated fan.

[0012] As a further scheme of the utility model, the outer wall of the cavity side plate is provided with an electricity receiving seat, and the electricity receiving seat is electrically connected with the integrated fan and the water pump.

[0013] As a further scheme of the utility model, the installation rod and the integrated fan are inclined downward, which is favorable for the integrated fan to blow obliquely upward, so that the heat in the cavity side plate is discharged.

[0014] The utility model discloses the beneficial effects are:

[0015] The utility model discloses: through being provided with bottom plate, cavity side plate, water extraction tank, water storage tank, water pump and semiconductor refrigerator etc., IDC data center server is placed at the top of bottom plate, and the water pump works, can extract the water in water extraction tank, and the water in water storage tank is cooled by the semiconductor refrigerator of working, wherein the refrigeration surface of semiconductor refrigerator is located in water storage tank, and the heat dissipation surface is located in cavity side plate, and the cold water falls from the water outlet pipe on water storage tank, and the heat of IDC data center server is taken away by cold water, and the temperature is taken away constantly in the circulation mode, and the temperature is reduced.

[0016] The utility model discloses: being provided with installation port, square grid plate and air extraction mechanism, the air extraction mechanism comprises installation rod, through groove and integrated fan, through the above design, the heat can be taken away under the action of the integrated fan. ACCURACY

[0017] Figure 1 A three-dimensional structure schematic view of the IDC data center server temperature control device is provided for the utility model;

[0018] Figure 2 A three-dimensional structure schematic view of the IDC data center server temperature control device is provided for the utility model;

[0019] Figure 3 A three-dimensional structure schematic view of the IDC data center server temperature control device is provided for the utility model; Figure 2 ​

[0020] Figure 4 A kind of suction mechanism structural schematic diagram for IDC data center server temperature control device is proposed in the utility model.

[0021] In the drawing: 1, bottom plate;2, cavity side plate;201, first installation slot;3, connecting pipe;4, water pumping groove;5, water storage tank;501, second installation slot;6, water pump;7, first connecting pipe;8, second connecting pipe;9, water outlet pipe;10, semiconductor refrigerator;11, installation port;12, square grid plate;13, suction mechanism;131, mounting rod;132, through slot;133, integrated fan. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0023] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0024] Reference Figures 1-4 A kind of temperature control device for IDC data center server, including bottom plate 1, the top of bottom plate 1 one end is fixed with cavity side plate 2, the top of cavity side plate 2 is fixed with connecting pipe 3, water cooling mechanism is installed on the outer wall of cavity side plate 2, and the bottom of the outer wall of cavity side plate 2 is provided with installation port 11, and suction mechanism 13 is installed in installation port 11;

[0025] Suction mechanism 13 includes mounting rod 131, through slot 132 is set up on mounting rod 131, and several integrated fans 133 are installed in through slot 132.

[0026] In the embodiment, the water cooling mechanism includes the water pumping groove 4 fixed to the bottom of the outer wall of the cavity side plate 2, the water storage tank 5 is fixed to the top of the outer wall of the cavity side plate 2, the bottom of the water storage tank 5 is uniformly fixed with several water outlet pipes 9, and the sidewall of the cavity side plate 2 is fixed with the water pump 6.

[0027] In the embodiment, the first connecting pipe 7 is fixed to the water inlet port of the water pump 6, and the bottom of the first connecting pipe 7 is located in the water pumping groove 4, the second connecting pipe 8 is fixed to the water outlet port of the water pump 6, and the second connecting pipe 8 is communicated with the water storage tank 5.

[0028] In the embodiment, the inner wall of the water storage tank 5 is uniformly provided with several second installation slots 501, the outer wall of the cavity side plate 2 is provided with the first installation slot 201 corresponding to the second installation slot 501, and the same semiconductor refrigerator 10 is fixed in the mutually corresponding first installation slot 201 and second installation slot 501.

[0029] In the embodiment, the square grid plate 12 is fixed in the mounting port 11, the mounting rod 131 is fixed in the square grid plate 12, the mounting port 11, the square grid plate 12 and the air extraction mechanism 13 are arranged, and the air extraction mechanism 13 comprises the mounting rod 131, the through slot 132 and the integrated fan 133. Through the above design, the heat can be taken away under the action of the integrated fan 133.

[0030] In the embodiment, the power connection seat is arranged on the outer wall of the cavity side plate 2, and the power connection seat is electrically connected with the integrated fan 133 and the water pump 6.

[0031] In the embodiment, the mounting rod 131 and the integrated fan 133 are arranged in an inclined downward manner, which is conducive to the blowing of the integrated fan 133 in an inclined upward manner, so that the heat in the cavity side plate 2 is discharged.

[0032] Working principle: when in use, the IDC data center server is arranged on the top of the bottom plate 1, the connecting pipe 3 is connected with the pipeline, the pipeline is led to the outside, the water pump 6 works, the water in the water extraction groove 4 can be extracted, the water in the water storage groove 5 is cooled by the working semiconductor refrigerator 10, the refrigeration surface of the semiconductor refrigerator 10 is located in the water storage groove 5, the heat dissipation surface is located in the cavity side plate 2, the cold water falls from the water outlet pipe 9 on the water storage groove 5, which helps to take away the heat of the IDC data center server, and the temperature is continuously taken away in a circulating manner to reduce the temperature. The mounting port 11, the square grid plate 12 and the air extraction mechanism 13 are arranged, the air extraction mechanism 13 comprises the mounting rod 131, the through slot 132 and the integrated fan 133, and through the above design, the heat can be taken away under the action of the integrated fan 133.

[0033] For the convenience of description, spatial relative terms such as "above", "upper", "on", "top", etc. can be used herein to describe the spatial positional relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated by 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0034] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0035] It is to be understood that the terms "first", "second", and the like, used herein do not necessarily connote any order, quantity, composition, or importance, but are used to distinguish one element from another, and do not necessarily indicate a requirement or order. It is to be understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0036] The preferred embodiments of the present application have been described above with the specific embodiments. The application can be modified and changed by those skilled in the art without departing from the spirit and principle of the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A temperature control device for servers in an IDC data center, comprising a base plate (1), characterized in that, A cavity side plate (2) is fixed at one end of the top of the base plate (1). A pipe (3) is fixedly connected to the top of the cavity side plate (2). A water cooling mechanism is installed on the outer wall of the cavity side plate (2). An installation port (11) is opened at the bottom of the outer wall of the cavity side plate (2). An air extraction mechanism (13) is installed in the installation port (11). The air extraction mechanism (13) includes a mounting rod (131), on which a through groove (132) is provided, and a plurality of integrated fans (133) are installed in the through groove (132).

2. The temperature control device for IDC data center servers according to claim 1, characterized in that, The water cooling mechanism includes a water pumping tank (4) fixed to the bottom of the outer wall of the cavity side plate (2), a water storage tank (5) fixed to the top of the outer wall of the cavity side plate (2), a number of water outlet pipes (9) evenly fixed to the bottom of the water storage tank (5), and a water pump (6) fixed to the side wall of the cavity side plate (2).

3. A temperature control device for IDC data center servers according to claim 2, characterized in that, The water pump (6) has a first connecting pipe (7) fixed at its inlet port, and the bottom of the first connecting pipe (7) is located in the water tank (4). The water pump (6) has a second connecting pipe (8) fixed at its outlet, and the second connecting pipe (8) is connected to the water storage tank (5).

4. A temperature control device for IDC data center servers according to claim 3, characterized in that, The inner wall of the water storage tank (5) is evenly provided with a number of second mounting slots (501), and the outer wall of the cavity side plate (2) is provided with a first mounting slot (201) corresponding to the second mounting slots (501). The same semiconductor cooler (10) is fixed in the first mounting slot (201) and the second mounting slot (501) that correspond to each other.

5. A temperature control device for IDC data center servers according to claim 4, characterized in that, A square grid plate (12) is fixed inside the mounting port (11), and the mounting rod (131) is fixed inside the square grid plate (12).

6. A temperature control device for IDC data center servers according to claim 5, characterized in that, The outer wall of the cavity side plate (2) is equipped with an electrical connector, which is electrically connected to the integrated fan (133) and the water pump (6).

7. A temperature control device for IDC data center servers according to claim 5, characterized in that, The mounting rod (131) and the integrated fan (133) are tilted downwards.

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