Server with vertical power supply arrangement

Abstract

The utility model discloses a server with vertical power supply arrangement, which comprises a chip main board and a power supply board, the power supply board is arranged under the chip mainboard. According to the technical scheme provided by the utility model, the power supply requirement of a chip with higher power consumption of the server mainboard can be met, the layout space of the server mainboard is reduced, and an optimization space is provided for the design of the server mainboard.

Description

TECHNICAL FIELD

[0001] The utility model relates to server technical field especially relates to a server of vertical power supply setting. BACKGROUND

[0002] The chip power consumption of server is higher and higher, for example, CPU (Central Processing Unit, central processor) power consumption 350W or so, needs 8 phase power supply, when CPU power consumption reaches 500W, needs 10 phase power supply.

[0003] In the process of realizing the utility model, at least the following technical problems in the prior art are found:

[0004] The power supply design of server chip needs multi-phase power supply, occupies the chip mainboard space, the size of PCB (Printed Circuit Board, printed circuit board) is larger, the number of layers will also be more, the material requirement is higher, and then makes the cost increase. INVENTION CONTENTS

[0005] The utility model embodiment provides a server of vertical power supply setting to realize satisfying chip high power consumption demand, and improve power supply efficiency, reduce server PCB development cost.

[0006] The utility model embodiment provides a server of vertical power supply setting, including:

[0007] Chip mainboard and power supply board, the power supply board sets up in the right below of chip mainboard.

[0008] In an alternative embodiment, the power supply board includes a universal redundant power connector, a power conversion chip, and a power supply connector.

[0009] In an alternative embodiment, the relative position relationship of the universal redundant power connector, the power conversion chip, and the power supply connector in the power supply board is arranged to minimize the power supply path for the power supply board to supply power to the chips of the chip mainboard.

[0010] In an alternative embodiment, the power supply board further includes a heat sink.

[0011] In an alternative embodiment, the power supply board establishes a power supply connection with the chip mainboard through the power supply connector.

[0012] In an alternative embodiment, the power supply board establishes a power supply connection with the chip mainboard through the power supply copper bar.

[0013] In an alternative embodiment, the number of power conversion chips is multiple, and each power conversion chip is respectively connected with a corresponding power connector.

[0014] In the utility model, the power module of the original server chip mainboard is separated from the chip and arranged, and is split into two circuit boards of the chip mainboard and the power supply board, and the power supply board is arranged directly below the chip mainboard. The power supply path for the server chip is shortened, so that the power supply efficiency can be improved. At the same time, the area occupation of the power module and the related module on the chip mainboard is reduced, and the wiring control can be more sufficient, and the interference to the signal line is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A structure schematic view of the server with vertical power supply arrangement is provided for the utility model embodiment;

[0016] Figure 2 A structure schematic view of the power supply board in the server with vertical power supply arrangement is provided for the utility model embodiment;

[0017] Figure 3 A structure comparison schematic view of the chip mainboard in the server with different power supply arrangements is provided for the utility model embodiment. DETAILED DESCRIPTION

[0018] The utility model will be further explained in detail in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0019] The utility model embodiment provides the server with vertical power supply arrangement, comprising: chip mainboard and power supply board;The power supply board is arranged directly below the chip mainboard.

[0020] In an alternative embodiment, the power supply board can include a general redundant power connector, a power conversion chip and a power connector. Wherein, the redundant power connector (Common Redundant Power Supply connector, CRPS connector) is used to connect 220V mains power supply. 220V will be converted into 12V power supply, and 12V power supply can be used as the input power supply of the power conversion chip. The power conversion chip can output the power supply voltage used by the chip mainboard, that is, 12V is converted into 5V, 1.2V or 1.8V voltage intensity power supply required by the chip.

[0021] In an alternative embodiment, the number of power conversion chips is multiple, and each power conversion chip is respectively connected with a corresponding power connector.

[0022] In one alternative implementation, the relative positions of the chip motherboard and the power supply board can be combined to determine the relative positions of the universal redundant power connector, the power conversion chip, and the power supply connector on the power supply board. The layout result of the relative positions of the above three can be used to minimize the power path for the power supply board to supply power to the chips on the chip motherboard.

[0023] In one alternative implementation, the power supply board also includes a heat sink, and correspondingly, a power conversion chip can be included to convert the 12V power supply into the power supply voltage required by the heat sink, such as 5V.

[0024] In one alternative implementation, the power supply board can establish a power supply connection with the chip motherboard via a power supply connector.

[0025] In one alternative implementation, the power supply board establishes a power supply connection with the chip motherboard via a power supply copper busbar.

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0027] Figure 1 A schematic diagram of a server with a vertical power supply configuration provided for an embodiment of this utility model is shown below. Figure 1 As shown, the power supply board is vertically placed below the motherboard with chips and connected to it via a power connector or power busbar to supply power to the motherboard above. In this embodiment, the motherboard and the power supply board are electrically connected between pins via the power connector. The motherboard has a silicon chip mounted on it via a socket and an interposer. The chip can be either a CPU chip or a GPU chip.

[0028] Furthermore, a schematic diagram of the power supply board structure is shown in Figure 2. Figure 2 The system includes CRPS connectors, power conversion chips, and power supply connectors. The power supply board only contains power-related components and can support higher power consumption.

[0029] A schematic diagram of the server's chip motherboard structure can be seen as follows: Figure 3 As shown. Figure 3 The document provides a comparison of the chip motherboard and power module before and after separation.

[0030] exist Figure 3The left part of the middle figure is a schematic view of the chip mainboard and the power module on a PCB, and the right part of the middle figure is a schematic view of the chip mainboard without the power module after the power module is separated from the chip mainboard. The green block represents a high-speed signal connector, the yellow block represents a heat sink, and the heat sink with the label "the chip below" also has a chip below the blue block. The orange block represents a power conversion chip. Since the power board is separated from the chip mainboard, the power-related modules are arranged on the power board, and the power conversion chip for supplying power to the chip can not be arranged in the chip mainboard, so that more space is obtained.

[0031] Compared with the left part of the middle figure, in the right part of the middle figure, the depth of the heat sink can be increased to support a higher-power chip, the red power copper skin can be reduced to increase the space of the yellow high-speed wire around and reduce the interference on the yellow high-speed signal wire around, and the high-speed signal connector is arranged closer to the chip, the signal link loss is reduced, and the design cost is reduced.

[0032] It should be noted that the above are only preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and more other equivalent embodiments can be included without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A server with a vertical power supply configuration, characterized in that, include: A chip motherboard and a power supply board; the power supply board is located directly below the chip motherboard; the power supply board includes a universal redundant power connector, a power conversion chip, and a power supply connector; the layout of the relative positions of the universal redundant power connector, the power conversion chip, and the power supply connector in the power supply board is used to minimize the power path for the power supply board to supply power to the chips of the chip motherboard.

2. The server according to claim 1, characterized in that, The power supply board also includes a heat sink.

3. The server according to claim 1, characterized in that, The power supply board establishes a power supply connection with the chip motherboard through a power supply connector.

4. The server according to claim 1, characterized in that, The power supply board establishes a power supply connection with the chip motherboard through a power supply copper busbar.

5. The server according to claim 1, characterized in that, The power conversion chip is a plurality of chips, and each power conversion chip is connected to a corresponding power supply connector.

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