High-temperature-resistant multilayer circuit board

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a high-temperature-resistant multilayer circuit board which comprises a multilayer circuit board main body and a base, the upper surface of the base is provided with a mounting groove, and four corners of the inner bottom surface of the mounting groove are provided with matched mounting feet corresponding to the multilayer circuit board main body. The multi-layer circuit board main body is mounted in the mounting groove of the base through the mounting pins; according to the multi-layer circuit board, heat exchange can be carried out on entering gas to a certain extent through the heat exchange tubes, so that the heat dissipation effect on the multi-layer circuit board main body is improved to a certain extent; meanwhile, under the action of the refrigerator, the heat exchange tube can be actively cooled, so that heat exchange between the heat exchange tube and entering gas is greatly improved, namely, the heat dissipation effect on the multilayer circuit board main body is greatly improved, and compared with a traditional scheme, the scheme has the advantages that the use risk is reduced, and the service life of the multilayer circuit board main body is prolonged. And the heat dissipation capability of the circuit board can be effectively ensured, so that the circuit board is prevented from being damaged by accumulated heat.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a high-temperature resistant multilayer circuit board. Background Technology

[0002] Circuit boards generate heat during use, and multilayer circuit boards generate even more heat. Therefore, the heat dissipation effect of multilayer circuit boards needs special attention. Chinese patent application number 202322868294.7 discloses a high-temperature resistant multilayer circuit board, comprising a circuit board body and a reinforcing plate, with a heat dissipation assembly between the circuit board body and the reinforcing plate. The heat dissipation assembly includes two connecting shells located between the circuit board body and the reinforcing plate, and multiple infusion tubes fixedly connected between the two connecting shells. A first connecting pipe is fixedly connected to one side of one connecting shell, and a second connecting pipe is fixedly connected to one side of the other connecting shell. A delivery pump is fixedly connected to one end of the first connecting pipe, and a heat dissipation shell is fixedly provided on one side of the delivery pump. Two vertical pipes are fixedly connected inside the heat dissipation shell, and multiple heat dissipation tubes are fixedly connected between the two vertical pipes. The output end of the delivery pump is fixedly connected to one of the vertical pipes, and one end of the second connecting pipe is fixedly connected to the other vertical pipe.

[0003] The above-mentioned technology enhances the heat dissipation of multilayer circuit boards through water cooling, but there is a risk of leakage in actual use, which may lead to liquid ingress and damage to the circuit board, resulting in unnecessary losses. Therefore, in order to solve the problem of low safety in the use of the above-mentioned technology, we propose a high-temperature resistant multilayer circuit board. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-temperature resistant multilayer circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-temperature resistant multilayer circuit board includes a multilayer circuit board body and a base. The upper surface of the base is provided with a mounting groove. The four corners of the bottom surface of the mounting groove are provided with mounting feet corresponding to the multilayer circuit board body. The multilayer circuit board body is installed in the mounting groove of the base through the mounting feet. A mounting cylinder is connected to one side of the base through a connecting pipe. A fan is installed in the middle of the inside of the mounting cylinder. A rectangular hollow heat exchange tube is connected to the end of the mounting cylinder away from the connecting pipe. A cooler is provided on one side of the heat exchange tube. The inner wall of the base is provided with multiple air outlet slots corresponding to the connecting pipe. The upper end of the air outlet slots extends to the upper surface of the base and is respectively installed with a first air outlet pipe and a second air outlet pipe.

[0007] Preferably, the first air outlet duct has a rectangular cross-section, and the second air outlet duct has a circular cross-section.

[0008] Preferably, both the first and second air outlet pipes are insulated, and both the first and second air outlet pipes are provided with dust plugs at their ends.

[0009] Preferably, the bottom surface of the mounting groove is provided with a plurality of heat-conducting strips, the upper surface of which abuts against the lower surface of the multilayer circuit board body, and the heat-conducting strips are arranged in an alternating manner.

[0010] Preferably, the mounting cylinder and the heat exchange tube are provided with a magnetic suction plate on the side away from the connecting pipe, and the magnetic suction plate can be detached from the mounting cylinder and the heat exchange tube.

[0011] Preferably, a filter screen is provided at the end of the heat exchange tube away from the mounting cylinder, and the filter screen can be removed.

[0012] Preferably, the heat exchange tube has a plurality of heat exchange columns inside, which are arranged alternately.

[0013] The high-temperature resistant multilayer circuit board proposed in this utility model has the following advantages:

[0014] 1. In this utility model, the fan draws in external gas through the heat exchange tube and sends it into the mounting groove of the base through the connecting pipe. At this time, the gas flows along the surface of the multi-layer circuit board in the mounting groove and eventually sprays out from each air outlet. Through the heat exchange tube, the incoming gas can exchange heat to a certain extent, thereby improving the heat dissipation effect on the multi-layer circuit board. At the same time, under the action of the cooler, the heat exchange tube can be actively cooled, thereby greatly improving the heat exchange between the heat exchange tube and the incoming gas, that is, greatly improving the heat dissipation effect on the multi-layer circuit board. Thus, compared with the traditional solution, this solution can effectively ensure the heat dissipation capacity of the circuit board while reducing the use risk, thereby avoiding heat accumulation damage.

[0015] 2. The heat-conducting strips in this utility model provide support for the multi-layer circuit board body. In addition to the connections between the four corners and the base, the center of the multi-layer circuit board body is also supported by the heat-conducting strips. Furthermore, the heat-conducting strips guide and restrict airflow within the mounting groove, allowing air to fully contact all parts of the multi-layer circuit board body for comprehensive heat dissipation. The magnetic plate allows for easy connection of the mounting cylinder to external objects, facilitating its installation and removal. The heat exchange column allows the cooling energy generated by the cooler to easily exchange heat with the gas flowing through the heat exchange tube, thereby increasing the cooling capacity of the gas entering the base and enhancing the heat dissipation effect on the multi-layer circuit board body. Attached Figure Description

[0016] Figure 1This is an isometric view of a high-temperature resistant multilayer circuit board proposed in this utility model.

[0017] Figure 2 This is a schematic diagram of a base for a high-temperature resistant multilayer circuit board proposed in this utility model.

[0018] Figure 3 This is a cross-sectional schematic diagram of the base of a high-temperature resistant multilayer circuit board proposed in this utility model.

[0019] Figure 4 This is a schematic diagram of a mounting cylinder for a high-temperature resistant multilayer circuit board proposed in this utility model;

[0020] Figure 5 This is a schematic diagram of a heat exchange tube for a high-temperature resistant multilayer circuit board proposed in this utility model.

[0021] In the diagram: 1. Multilayer circuit board body; 2. Base; 3. Connecting pipe; 4. Mounting cylinder; 5. Fan; 6. Heat exchange tube; 7. Refrigerator; 8. First air outlet duct; 9. Second air outlet duct; 10. Heat conduction strip; 11. Magnetic suction plate; 12. Filter screen; 13. Heat exchange column. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Example 1

[0024] Reference Figures 1-5 A high-temperature resistant multilayer circuit board includes a multilayer circuit board body 1 and a base 2. The upper surface of the base 2 is provided with a mounting groove. The four corners of the bottom surface of the mounting groove are provided with corresponding mounting feet for the multilayer circuit board body 1. The multilayer circuit board body 1 is installed in the mounting groove of the base 2 through the mounting feet. A mounting cylinder 4 is connected to one side of the base 2 through a connecting pipe 3. A fan 5 is installed in the middle of the inside of the mounting cylinder 4. A rectangular hollow heat exchange tube 6 is connected to the end of the mounting cylinder 4 away from the connecting pipe 3. A cooler 7 is provided on one side of the heat exchange tube 6. Multiple air outlet slots are provided on the inner wall of the base 2 corresponding to the connecting pipe 3. The upper end of the air outlet slots extends to the upper surface of the base 2 and a first air outlet pipe 8 and a second air outlet pipe 9 are respectively installed thereon.

[0025] Example 2

[0026] Reference Figures 1-5 While all other parts are the same as in Example 1, the difference between this example and Example 1 is that:

[0027] The first air outlet duct 8 has a rectangular cross-section, and the second air outlet duct 9 has a circular cross-section. Both the first air outlet duct 8 and the second air outlet duct 9 are insulated, and dust plugs are provided at the ends of both the first air outlet duct 8 and the second air outlet duct 9. Several heat-conducting strips 10 are provided on the bottom surface of the mounting groove. The upper surface of the heat-conducting strips 10 abuts against the lower surface of the multilayer circuit board body 1. The heat-conducting strips 10 are staggered. Since the first air outlet duct 8 and the second air outlet duct 9 have different cross-sectional shapes, they can easily accommodate components with different properties. Moreover, since they are made of insulating material, they can prevent the staggered air outlet ducts from causing short circuits to the components. At the same time, the setting of the heat-conducting strips 10 can provide support for the multilayer circuit board body 1. In addition to the connection between the four corners of the multilayer circuit board body 1 and the base 2, the middle part of the multilayer circuit board body 1 is also supported by the heat-conducting strips 10. Furthermore, the heat-conducting strips 10 can also guide and restrict the airflow inside the mounting groove, so that the air can fully contact all parts of the multilayer circuit board body 1, thereby achieving comprehensive heat dissipation for the multilayer circuit board body 1.

[0028] A magnetic suction plate 11 is provided on the side of the mounting cylinder 4 and the heat exchange tube 6 away from the connecting pipe 3. The magnetic suction plate 11 is detachable from the mounting cylinder 4 and the heat exchange tube 6. A filter screen 12 is provided at the end of the heat exchange tube 6 away from the mounting cylinder 4. The filter screen 12 is detachable. Several heat exchange columns 13 are provided inside the heat exchange tube 6. The heat exchange columns 13 are arranged alternately. The magnetic suction plate 11 allows the mounting cylinder 4 to be easily connected to external objects, that is, to be easily installed and removed. The filter screen 12 filters the gas entering the heat exchange tube 6 to prevent excessive dust from entering the mounting cylinder 4 and damaging subsequent components. The heat exchange columns 13 allow the cooling energy generated by the cooler 7 to be easily exchanged with the gas flowing through the heat exchange tube 6, thereby increasing the cooling energy of the gas entering the base 2, that is, enhancing the heat dissipation effect on the multilayer circuit board body 1.

[0029] Operating principle and advantages: In use, the multilayer circuit board body 1 is installed in the mounting groove on the upper surface of the base 2 through the screw holes at the four corners. When the circuit board generates heat during operation, the fan 5 operates to draw in external gas through the heat exchange pipe 6 and send it into the mounting groove of the base 2 through the connecting pipe 3. At this time, the gas flows along the surface of the multilayer circuit board body 1 in the mounting groove and finally sprays out from each air outlet. Thus, this solution avoids the risk of leakage caused by water cooling in traditional solutions by using air cooling. Moreover, the heat exchange pipe 6 can exchange heat with the incoming gas to a certain extent, thereby improving the heat dissipation effect of the multilayer circuit board body 1. At the same time, under the action of the cooler 7, the heat exchange pipe 6 can be actively cooled, thereby greatly improving the heat exchange between the heat exchange pipe 6 and the incoming gas, that is, greatly improving the heat dissipation effect of the multilayer circuit board body 1. Therefore, compared with the traditional solution, this solution can effectively ensure the heat dissipation capacity of the circuit board while reducing the risk of use, thus avoiding heat accumulation damage.

[0030] It should be further explained that the heat-conducting strips 10 serve several purposes. First, they provide support for the multi-layer circuit board body 1. In addition to the connection between the four corners of the multi-layer circuit board body 1 and the base 2, the middle part of the multi-layer circuit board body 1 is also supported by the heat-conducting strips 10. Furthermore, the heat-conducting strips 10 can guide and restrict the airflow inside the mounting groove, allowing the air to fully contact all parts of the multi-layer circuit board body 1, thus providing comprehensive heat dissipation. Second, the magnetic suction plate 11 allows the mounting cylinder 4 to be easily connected to external objects, facilitating its installation and removal. Third, the filter screen 12 filters dust from the gas entering the heat exchange tube 6, preventing excessive dust from entering the mounting cylinder 4 and damaging subsequent components. Fourth, the heat exchange column 13 allows the cooling energy generated by the cooler 7 to easily exchange heat with the gas flowing through the heat exchange tube 6, thereby increasing the cooling energy of the gas entering the base 2 and enhancing the heat dissipation effect on the multi-layer circuit board body 1.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-temperature resistant multilayer circuit board, comprising a multilayer circuit board body (1) and a base (2), characterized in that, The base (2) has an installation groove on its upper surface. The four corners of the bottom surface of the installation groove are provided with matching mounting feet corresponding to the multi-layer circuit board body (1). The multi-layer circuit board body (1) is installed in the installation groove of the base (2) through the mounting feet. The base (2) is connected to an installation cylinder (4) through a connecting pipe (3) on one side. A fan (5) is installed in the middle of the installation cylinder (4). A rectangular hollow heat exchange tube (6) is connected to the end of the installation cylinder (4) away from the connecting pipe (3). A cooler (7) is provided on one side of the heat exchange tube (6). The inner wall of the base (2) is provided with multiple air outlet slots corresponding to the connecting pipe (3). The upper end of the air outlet slots extends to the upper surface of the base (2) and is respectively installed with a first air outlet pipe (8) and a second air outlet pipe (9).

2. The high-temperature resistant multilayer circuit board according to claim 1, characterized in that, The first air outlet pipe (8) has a rectangular cross-section, and the second air outlet pipe (9) has a circular cross-section.

3. The high-temperature resistant multilayer circuit board according to claim 2, characterized in that, Both the first air outlet pipe (8) and the second air outlet pipe (9) are insulated, and both the ends of the first air outlet pipe (8) and the second air outlet pipe (9) are provided with dust plugs.

4. The high-temperature resistant multilayer circuit board according to claim 1, characterized in that, The bottom surface of the mounting groove is provided with several heat-conducting strips (10), the upper surface of the heat-conducting strips (10) abuts against the lower surface of the multilayer circuit board body (1), and the heat-conducting strips (10) are arranged in an alternating manner.

5. The high-temperature resistant multilayer circuit board according to claim 1, characterized in that, The mounting cylinder (4) and the heat exchange tube (6) are provided with a magnetic suction plate (11) on the side away from the connecting pipe (3). The magnetic suction plate (11) can be detached from the mounting cylinder (4) and the heat exchange tube (6).

6. The high-temperature resistant multilayer circuit board according to claim 1, characterized in that, The heat exchange tube (6) has a filter screen (12) at one end away from the mounting cylinder (4), and the filter screen (12) can be disassembled.

7. The high-temperature resistant multilayer circuit board according to claim 1, characterized in that, The heat exchange tube (6) is provided with several heat exchange columns (13) inside, and the heat exchange columns (13) are arranged alternately.

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