Semi-finished product of light-emitting panel

Abstract

The utility model is suitable for the technical field of semiconductors, and provides a semi-finished product of a light-emitting panel. The semi-finished product of the light-emitting panel comprises a substrate, wherein a plurality of screen body areas arranged in an array are arranged on the surface of the substrate; the screen body area comprises a first sub-screen body area and a second sub-screen body area; the sub-screen body area comprises a binding area, a packaging area and a light-emitting area, the packaging area surrounds the light-emitting area, and the binding area is located on the side, away from the light-emitting area, of the packaging area; the binding area of the first sub-screen body area is adjacent to the binding area of the second sub-screen body area along a preset direction; the preset direction is the direction in which the light-emitting area points to the binding area in the first sub-screen body area; the light-emitting area is provided with a light-emitting structure. And the packaging sheet is attached to the substrate through packaging glue coated on the packaging area. According to the utility model, the arrangement mode of the sub-screen body areas in the screen body area array is adjusted, and the condition that the packaging glue overflows to the binding area of the adjacent sub-screen body area when the packaging area of each sub-screen body area is coated with the packaging glue is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor technology, specifically relating to a semi-finished product of a light-emitting panel. Background Technology

[0002] Moisture is one of the main factors affecting the lifespan of organic light-emitting display (OLED) devices. Preventing or delaying moisture from entering the OLED is the key to OLED encapsulation.

[0003] Currently, the common OLED encapsulation method involves coating a substrate with encapsulating adhesive and then using the adhesive and encapsulation sheets to encapsulate the OLED, preventing or delaying the entry of moisture into the OLED. The encapsulating adhesive is crucial to the reliability of the encapsulation. To improve moisture resistance, the amount of encapsulating adhesive used during encapsulation is increased; however, excessive encapsulating adhesive negatively impacts the structure and stability of the OLED panel. Utility Model Content

[0004] This utility model embodiment provides a semi-finished product of a light-emitting panel to solve the technical problem in related technologies where, when the encapsulating adhesive is applied to the screen area, it easily overflows into the bonding area of ​​adjacent screen areas.

[0005] In a first aspect, embodiments of the present invention provide a semi-finished product of a light-emitting panel, comprising:

[0006] A substrate has multiple screen areas arranged in an array on its surface. Each screen area includes a first sub-screen area and a second sub-screen area. Both the first and second sub-screen areas include a bonding area, an encapsulation area, and a light-emitting area. The encapsulation area surrounds the light-emitting area, and the bonding area is located on the side of the encapsulation area away from the light-emitting area. The bonding areas of the first and second sub-screen areas are adjacent to each other along a predetermined direction. The predetermined direction is the direction from the light-emitting area in the first sub-screen area to the bonding area. The light-emitting area has a light-emitting structure.

[0007] The encapsulation sheet is attached to the substrate by applying encapsulation adhesive to the encapsulation area.

[0008] Optionally, the encapsulation sheet includes a first overflow groove, which is disposed in a preset area of ​​the encapsulation sheet. The preset area is a region on the encapsulation sheet that corresponds to the side of the encapsulation area closer to the bonding area.

[0009] Optionally, the ratio of the width of the first overflow groove to the width of the preset area is less than or equal to 30%.

[0010] Optionally, the substrate further includes a second adhesive overflow groove, which is disposed on the side of the encapsulation area near the bonding area.

[0011] Optionally, the encapsulation sheet includes a first strip-shaped protrusion, which is disposed in a preset area of ​​the encapsulation sheet. The preset area is a region on the encapsulation sheet that corresponds to the side of the encapsulation area closer to the bonding area.

[0012] Optionally, the preset cross-section of the first strip-shaped protrusion is polygonal, and the preset cross-section is perpendicular to the intersection line of the encapsulation area and the bonding area.

[0013] Optionally, the substrate further includes a second strip-shaped protrusion disposed on the side of the encapsulation region near the bonding region.

[0014] Optionally, the light-emitting structure includes an anode, a light-emitting layer, and a cathode;

[0015] The anode is disposed on the surface of the substrate;

[0016] The light-emitting layer is disposed on the side of the anode away from the substrate;

[0017] The cathode is disposed on the side of the light-emitting layer away from the anode.

[0018] Optionally, the binding area is provided with a lead wire.

[0019] Optionally, the encapsulation sheet is provided with grooves for accommodating each light-emitting structure in the portion corresponding to each light-emitting structure.

[0020] The semi-finished product of the light-emitting panel provided in this application embodiment has multiple screen areas arranged in an array on the surface of the substrate. Each screen area includes a first sub-screen area and a second sub-screen area. The arrangement of the sub-screen areas in the screen area is as follows: the bonding area of ​​the first sub-screen area and the bonding area of ​​the second sub-screen area are adjacent to each other along a preset direction. The preset direction is the direction in which the light-emitting area in the first sub-screen area points to the bonding area. That is, among all the sub-screen areas provided on the substrate, the bonding areas of two sub-screen areas adjacent to each other along the preset direction are connected, or the encapsulation areas of two sub-screen areas adjacent to each other along the preset direction are connected. Therefore, when encapsulating glue is applied to the encapsulation area of ​​each sub-screen area, the encapsulating glue will not overflow into the bonding area of ​​the adjacent sub-screen area, ensuring that the bonding structure on the bonding area of ​​each sub-screen area is not affected by glue overflow.

[0021] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a structural diagram of a semi-finished OLED light-emitting panel;

[0024] Figure 2 yes Figure 1 A magnified view of part D shown;

[0025] Figure 3 This is a schematic diagram of the structure of a semi-finished light-emitting panel provided in one embodiment of this application;

[0026] Figure 4 yes Figure 3 A magnified view of part E shown;

[0027] Figure 5A This is a partially enlarged view of a semi-finished light-emitting panel provided in another embodiment of this application;

[0028] Figure 5B It is along Figure 5A Cross-sectional view of the mid-section line FF';

[0029] Figure 6A This is a partially enlarged view of a semi-finished light-emitting panel provided in another embodiment of this application;

[0030] Figure 6B It is along Figure 6A Cross-sectional view of the mid-section line GG';

[0031] Figure 7A This is a partially enlarged view of a semi-finished light-emitting panel provided in another embodiment of this application;

[0032] Figure 7B It is along Figure 7A Cross-sectional view of the mid-section line HH';

[0033] Figure 8A This is a partially enlarged view of a semi-finished light-emitting panel provided in another embodiment of this application;

[0034] Figure 8B It is along Figure 8A Cross-sectional view of section line II'. Detailed Implementation

[0035] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0036] In the description of this utility model, it should be noted that the terms "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "inner", and "outer" used to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the indicated position or component must have a specific orientation, specific structure, or specific operation. Therefore, they should not be construed as limitations on this utility model.

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.

[0038] Currently, in the manufacturing process of OLED light-emitting panels, the arrangement of each column of screen areas on the large substrate 00 is as follows: the encapsulation area and bonding area of ​​two adjacent screen areas are connected. For example, in the adjacent screen areas a1 and a2, the encapsulation area 102 of screen area a1 and the bonding area 101 of screen area a2 are connected. Figure 1 and Figure 2 As shown, where, Figure 1 A schematic diagram of the structure of a semi-finished OLED light-emitting panel is shown. Figure 2 yes Figure 1 The image shows a partial enlarged view of part D. Thus, when encapsulation adhesive is applied to the encapsulation area 102 of screen area a1, the adhesive can easily overflow into the bonding area 101 of screen area a2, causing abnormal bonding structures on the bonding area 101 of screen area a2.

[0039] In order to solve the above problems, this utility model improves the arrangement of the screen area on a large substrate.

[0040] Figure 3 This is a schematic diagram of the structure of a semi-finished light-emitting panel according to an embodiment of this application. Figure 4 yes Figure 3 A magnified view of part E shown. (As shown) Figure 3 and Figure 4 As shown, the semi-finished product of the light-emitting panel may include:

[0041] A substrate 00 has multiple screen regions 10 arranged in an array on its surface. Each screen region 10 includes a first sub-screen region 11 and a second sub-screen region 12. Both the first sub-screen region 11 and the second sub-screen region 12 include a bonding region 101, an encapsulation region 102, and a light-emitting region 103. The encapsulation region 102 surrounds the light-emitting region 103, and the bonding region 101 is located on the side of the encapsulation region 102 away from the light-emitting region 103. The bonding region 101 of the first sub-screen region 11 and the bonding region 101 of the second sub-screen region 12 are adjacent to each other along a preset direction. The preset direction is the direction in which the light-emitting region 103 in the first sub-screen region 11 points to the bonding region 101. The light-emitting region 103 is provided with a light-emitting structure.

[0042] The encapsulation sheet is attached to the substrate 00 by applying encapsulation adhesive to the encapsulation area 102.

[0043] In this embodiment, the substrate 00 is transparent and can be a flexible substrate. The material of the flexible substrate can be organic polymers such as PET, PEN and PI or ultra-thin glass. The substrate 00 can also be a rigid substrate, such as a glass substrate.

[0044] The substrate 00 has multiple screen areas 10 arranged in an array on its surface. Each screen area 10 includes a first sub-screen area 11 and a second sub-screen area 12. A lead wire is disposed within a bonding area 101 of each sub-screen area, and a light-emitting structure is disposed within a light-emitting area 103 of the sub-screen area. An encapsulation area 102 surrounds the light-emitting area 103. The bonding area 101 is located on the outer side of the encapsulation area 102 and can be connected to it, meaning the bonding area 101 is located on one side of the light-emitting area 103. The encapsulation area 102 separates the bonding area 101 from the light-emitting area 103, allowing the light-emitting structure to be electrically connected to an external circuit through the lead wire within the bonding area 101. The encapsulation area 102 of the sub-screen area is used to coat with encapsulating adhesive, which bonds the substrate 00 and the encapsulation sheet together to form a sealed shield, achieving a sealed encapsulation of the light-emitting structure and preventing or delaying the entry of moisture. The encapsulating adhesive can be UV adhesive, etc., and the encapsulation sheet can be made of glass, etc.

[0045] Here, the aforementioned large substrate + encapsulation sheet structure is the structure of an intermediate product in the manufacturing process of the light-emitting panel. Therefore, in this embodiment, the product with the aforementioned large substrate + encapsulation sheet structure is referred to as a semi-finished product of the light-emitting panel. The semi-finished product of the light-emitting panel needs to be cut to obtain multiple light-emitting panels. Specifically, when cutting the semi-finished product of the light-emitting panel, firstly, the areas on the encapsulation sheet corresponding to each bonding area 101 are cut, and the portions on the encapsulation sheet corresponding to each bonding area are removed. Thus, the areas on the encapsulation sheet corresponding to each bonding area 101 are hollowed-out areas. Then, the sub-screen areas on the substrate and the areas on the encapsulation sheet corresponding to each sub-screen area are cut to obtain multiple light-emitting panels.

[0046] In the screen area array, the sub-screen areas in each screen area 10 are arranged as follows: the binding area 101 of the first sub-screen area 11 and the binding area 101 of the second sub-screen area 12 are adjacent along a preset direction, wherein the preset direction is the direction in which the light-emitting area 103 in the first sub-screen area 11 points to the binding area 101. That is, along the preset direction, the binding area 101 of the first sub-screen area 11 and the binding area 101 of the second sub-screen area 12 are adjacent. All screen areas 10 are arranged in an array, thus, referring to... Figure 3 and Figure 4 The encapsulation area 102 of the second sub-screen area 12 in each screen area 10 is adjacent to the encapsulation area 102 of the first sub-screen area 11 in the screen area 10 adjacent along a preset direction.

[0047] In other words, among all the sub-screen areas arranged on the substrate 00, the arrangement of two adjacent sub-screen areas along the preset direction is such that the bonding area 101 of one sub-screen area is adjacent to the bonding area 101 of another sub-screen area, or the encapsulation area 102 of one sub-screen area is adjacent to the encapsulation area 102 of another sub-screen area, and there is no situation where the bonding area 101 of one sub-screen area is adjacent to the encapsulation area 102 of another sub-screen area. In this way, when encapsulating adhesive is applied to the encapsulation area 102 of one sub-screen area, the encapsulating adhesive will only overflow onto the encapsulation area 102 of the other sub-screen area along the prevention direction, thereby avoiding the situation in the related art where the encapsulating adhesive overflows into the bonding area 101 of the adjacent sub-screen area, and does not affect the bonding area 101 of the adjacent sub-screen area.

[0048] Thus, following the cutting method for the semi-finished product of the light-emitting panel in the foregoing embodiment, after cutting the semi-finished product of the light-emitting panel in this embodiment, multiple light-emitting panels with normal bonding structure can be obtained.

[0049] The semi-finished product of the light-emitting panel provided in this application embodiment has multiple screen areas arranged in an array on the surface of the substrate. Each screen area includes a first sub-screen area and a second sub-screen area. The arrangement of the sub-screen areas in the screen area is as follows: the bonding area of ​​the first sub-screen area and the bonding area of ​​the second sub-screen area are adjacent to each other along a preset direction. The preset direction is the direction in which the light-emitting area in the first sub-screen area points to the bonding area. That is, among all the sub-screen areas provided on the substrate, the bonding areas of two sub-screen areas adjacent to each other along the preset direction are connected, or the encapsulation areas of two sub-screen areas adjacent to each other along the preset direction are connected. Therefore, when encapsulating glue is applied to the encapsulation area of ​​each sub-screen area, the encapsulating glue will not overflow into the bonding area of ​​the adjacent sub-screen area, ensuring that the bonding structure on the bonding area of ​​each sub-screen area is not affected by glue overflow.

[0050] In some embodiments, the package sheet is provided with grooves for accommodating each light-emitting structure on the portion corresponding to each light-emitting structure. That is, grooves are provided on the surface of the package sheet near the substrate at the positions corresponding to each light-emitting structure, so that when the substrate and the package sheet are bonded as a whole, the grooves of the package sheet can accommodate the light-emitting structure and prevent the package sheet from being pressed against the light-emitting structure.

[0051] In addition, refer to Figure 2 In related technologies, when applying encapsulating adhesive to the encapsulation area of ​​each screen region, the adhesive's spread is difficult to control, and it can easily overflow onto the bonding area of ​​that screen region, affecting the bonding structure and causing abnormalities. Therefore, this embodiment can further improve the corresponding positions of the substrate or encapsulation sheet to reduce the impact of adhesive overflow on the bonding area of ​​the screen region itself.

[0052] In some embodiments, the encapsulation sheet 110 may include a first overflow groove 1111, which is disposed in a preset area 111 of the encapsulation sheet. The preset area 111 is the area on the encapsulation sheet 110 that corresponds to the side of the encapsulation area 102 near the bonding area 101.

[0053] Specifically, see Figure 5A and Figure 5B In this embodiment, the area on one side of the encapsulation area 102 that connects to the bonding area 101 is designated as the encapsulation sub-area 1021. The preset area 111 is the area on the encapsulation sheet 110 corresponding to the encapsulation sub-area 1021. Specifically, the preset area 111 of the encapsulation sheet 110 may have a strip-shaped first overflow groove 1111. This first overflow groove 1111 is located within the preset area 111 at the position where it connects to the area corresponding to the bonding area 101. Therefore, when encapsulation adhesive is applied to the encapsulation area 102 of the sub-screen area and the encapsulation sheet 110 is attached, the encapsulation adhesive overflowing from the encapsulation sub-area 1021 will overflow into the first overflow groove 1111, reducing or preventing the encapsulation adhesive from overflowing into the bonding area 101 of the sub-screen area, thus not affecting the bonding area 101 of the sub-screen area.

[0054] For example, since the substrate 00 includes multiple sub-screen areas, the encapsulation sheet 110 is provided with preset areas 111 corresponding to each sub-screen area, and each preset area 111 is provided with a first overflow groove 1111. Thus, in this embodiment, the overflow groove is only provided in the preset area 111 of the encapsulation sheet 110 to reduce the impact of encapsulation glue overflow on the bonding area 101 of the sub-screen area itself. As for the impact of encapsulation glue overflow on the bonding area 101 of adjacent sub-screen areas, this embodiment adopts the arrangement of sub-screen areas in the aforementioned embodiment to overcome this, reducing the number of overflow grooves, thereby increasing the effective expansion of the encapsulation glue, and also simplifying the production process.

[0055] Optionally, since a wider encapsulating adhesive results in a better blocking effect and a higher reliability of the final light-emitting panel, the ratio of the width of the first overflow groove 1111 to the width of the preset area 111 can be less than or equal to 30%. This effectively prevents the encapsulating adhesive from overflowing into the bonding area 101 of the sub-screen body while limiting the width of the first overflow groove 1111, ensuring that the setting of the first overflow groove 1111 does not significantly affect the effective widening of the encapsulating adhesive.

[0056] In some embodiments, the substrate 00 may further include a second overflow groove 1001, which is disposed on the side of the encapsulation region 102 near the bonding region 101.

[0057] See Figure 6A and Figure 6B A strip-shaped second overflow groove 1001 can be provided on the encapsulation sub-area 1021 of the sub-screen body area. Specifically, the second overflow groove 1001 is located at the junction of the encapsulation sub-area 1021 and the bonding area 101. Thus, when encapsulation adhesive is applied to the encapsulation sub-area 1021 of the sub-screen body area, the encapsulation adhesive overflowing from the encapsulation sub-area 1021 will overflow into the second overflow groove 1001, reducing or avoiding the situation where encapsulation adhesive overflows into the bonding area 101 of the sub-screen body area, and does not affect the bonding area 101 of the sub-screen body area.

[0058] Optionally, the ratio of the width of the second overflow groove 1001 to the width of the encapsulation sub-region 1021 can be less than or equal to 30%.

[0059] In some embodiments, the encapsulation sheet 110 may include a first strip-shaped protrusion 1112, which is disposed in a preset area 111 of the encapsulation sheet 110.

[0060] See Figure 7A and Figure 7B The preset area 111 of the encapsulation sheet 110 may be provided with a first strip-shaped protrusion 1112. Specifically, the first strip-shaped protrusion 1112 is located in the preset area 111 at a position that connects with the area corresponding to the bonding area 101. Thus, when encapsulating adhesive is applied to the encapsulation area 102 of the sub-screen area and the encapsulation sheet 110 is attached, the first strip-shaped protrusion 1112 on the encapsulation sheet 110 will prevent the encapsulating adhesive on the encapsulation sub-area 1021 from overflowing into the bonding area 101 of the sub-screen area. At the same time, since the first strip-shaped protrusion 1112 is located in the preset area 111 at a position that connects with the area corresponding to the bonding area 101, the first strip-shaped protrusion 1112 will push the encapsulating adhesive to move away from the bonding area 101 of the sub-screen area. A small amount of encapsulating adhesive overflowing into the light-emitting area 103 will not affect the function of the light-emitting structure in the light-emitting area 103, thereby ensuring that the encapsulating adhesive will not affect the bonding area 101 of the sub-screen area.

[0061] For example, since the substrate 00 includes multiple sub-screen areas, the package 110 is provided with each preset area 111 corresponding to each sub-screen area, and each preset area 111 is provided with a first strip-shaped protrusion 1112.

[0062] Optionally, the preset cross-section of the first strip-shaped protrusion 1112 can be a polygon, such as a triangle, trapezoid, or rectangle. The trapezoid can include regular trapezoids and inverted trapezoids. Here, the preset cross-section of the first strip-shaped protrusion 1112 is a cross-section perpendicular to the intersection line of the encapsulation area 102 and the bonding area 101. See, for example... Figure 7B The first strip-shaped protrusion 1112 has a pre-defined rectangular cross-section, meaning it is a cuboid. This allows the first strip-shaped protrusion 1112, with its polygonal pre-defined cross-section, to effectively push the encapsulating adhesive away from the bonding area 101 of the sub-screen area when encapsulating adhesive is applied to the encapsulation area 102 and the encapsulation sheet 110 is attached. This further ensures that the encapsulating adhesive does not overflow into the bonding area 101 of the sub-screen area. Furthermore, the pre-defined cross-section of the strip-shaped protrusion can be triangular, trapezoidal, or rectangular, making it relatively easy to implement in the manufacturing process.

[0063] In some embodiments, the substrate 00 may further include a second strip-shaped protrusion 1002, which is disposed on the side of the encapsulation region 102 near the bonding region 101.

[0064] See Figure 8A and Figure 8B A second strip-shaped protrusion 1002 may be provided on the encapsulation sub-area 1021 of the sub-screen body region. Specifically, the second strip-shaped protrusion 1002 is located at the junction of the encapsulation sub-area 1021 and the bonding area 101. Thus, when encapsulating adhesive is applied to the encapsulation sub-area 102 of the sub-screen body region, the second strip-shaped protrusion 1002 on the sub-screen body region will prevent the encapsulating adhesive on the encapsulation sub-area 1021 from overflowing into the bonding area 101 of the sub-screen body region. Simultaneously, because the second strip-shaped protrusion 1002 is located at the junction of the encapsulation sub-area 1021 and the bonding area 101, the second strip-shaped protrusion 1002 will push the encapsulating adhesive away from the bonding area 101 of the sub-screen body region. A small amount of encapsulating adhesive overflowing into the light-emitting area 103 will not affect the function of the light-emitting structure within the light-emitting area 103, thereby ensuring that the encapsulating adhesive does not affect the bonding area 101 of the sub-screen body region.

[0065] Optionally, the preset cross-section of the second strip-shaped protrusion 1002 can be a polygon, such as a triangle, trapezoid, or rectangle. The trapezoid can include regular trapezoids and inverted trapezoids. Here, the preset cross-section of the second strip-shaped protrusion 1002 is a cross-section perpendicular to the intersection line of the encapsulation area 102 and the bonding area 101. See, for example... Figure 8BThe second strip-shaped protrusion 1002 has a trapezoidal cross-section, meaning it is a trapezoidal body. Thus, when encapsulating adhesive is applied to the encapsulation area 102 of the sub-screen region, the second strip-shaped protrusion 1002, with its polygonal cross-section, can effectively push the encapsulating adhesive away from the bonding area 101 of the sub-screen region, thereby further ensuring that the encapsulating adhesive does not overflow into the bonding area 101 of the sub-screen region.

[0066] In this way, by setting a first overflow groove or a first strip-shaped protrusion in the preset area of ​​the encapsulation sheet, or by setting a second overflow groove or a second strip-shaped protrusion on the side of the encapsulation area near the bonding area on the substrate, the encapsulation adhesive can be effectively prevented from overflowing into the bonding area of ​​the sub-screen itself.

[0067] Optionally, to further ensure that the encapsulating adhesive does not overflow onto the bonding area of ​​the sub-screen itself, the encapsulating sheet may include a first adhesive overflow groove, while the substrate may include a second adhesive overflow groove. Alternatively, the encapsulating sheet may include a first adhesive overflow groove, while the substrate may include a second strip-shaped protrusion. Alternatively, the encapsulating sheet may include a first strip-shaped protrusion, while the substrate may include a second adhesive overflow groove.

[0068] In some embodiments, the light-emitting structure may include an anode, a light-emitting layer, and a cathode, wherein the anode is disposed on the surface of the substrate, the light-emitting layer is disposed on the side of the anode away from the substrate, and the cathode is disposed on the side of the light-emitting layer away from the anode.

[0069] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semi-finished product of a light-emitting panel, characterized in that, include: A substrate has multiple screen areas arranged in an array on its surface. Each screen area includes a first sub-screen area and a second sub-screen area. Both the first and second sub-screen areas include a bonding area, an encapsulation area, and a light-emitting area. The encapsulation area surrounds the light-emitting area, and the bonding area is located on the side of the encapsulation area away from the light-emitting area. The bonding areas of the first and second sub-screen areas are adjacent to each other along a predetermined direction. The predetermined direction is the direction from the light-emitting area in the first sub-screen area to the bonding area. The light-emitting area has a light-emitting structure. The encapsulation sheet is attached to the substrate by applying encapsulation adhesive to the encapsulation area.

2. The semi-finished product of the light-emitting panel according to claim 1, characterized in that, The encapsulation sheet includes a first overflow groove, which is disposed in a preset area of ​​the encapsulation sheet. The preset area is a region on the encapsulation sheet that corresponds to the side of the encapsulation area closer to the bonding area.

3. The semi-finished product of the light-emitting panel according to claim 2, characterized in that, The ratio of the width of the first overflow groove to the width of the preset area is less than or equal to 30%.

4. The semi-finished product of the light-emitting panel according to claim 1, characterized in that, The substrate further includes a second adhesive overflow groove, which is disposed on the side of the encapsulation area near the bonding area.

5. The semi-finished product of the light-emitting panel according to claim 1, characterized in that, The encapsulation sheet includes a first strip-shaped protrusion, which is disposed in a preset area of ​​the encapsulation sheet. The preset area is a region on the encapsulation sheet that corresponds to the side of the encapsulation area closer to the bonding area.

6. The semi-finished product of the light-emitting panel according to claim 5, characterized in that, The first strip-shaped protrusion has a preset cross-section that is polygonal, and the preset cross-section is perpendicular to the intersection line of the encapsulation area and the bonding area.

7. The semi-finished product of the light-emitting panel according to claim 1, characterized in that, The substrate further includes a second strip-shaped protrusion, which is disposed on the side of the encapsulation region near the bonding region.

8. A semi-finished product of a light-emitting panel according to any one of claims 1 to 7, characterized in that, The light-emitting structure includes an anode, a light-emitting layer, and a cathode; The anode is disposed on the surface of the substrate; The light-emitting layer is disposed on the side of the anode away from the substrate; The cathode is disposed on the side of the light-emitting layer away from the anode.

9. A semi-finished product of a light-emitting panel according to any one of claims 1 to 7, characterized in that, The binding area is equipped with a lead wire.

10. A semi-finished product of a light-emitting panel according to any one of claims 1 to 7, characterized in that, The encapsulation sheet has grooves for accommodating each light-emitting structure in the portion corresponding to each light-emitting structure.

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