Wafer bearing and detection triggering platform

Abstract

The utility model discloses a wafer bearing and detection triggering platform, and relates to the technical field of semiconductor wafer processing. The utility model solves the problems that the existing wafer detection equipment is long in detection time, low in detection efficiency, high in equipment price, and incapable of timely detecting results and finding problem reasons at the current process site. A detection table is installed in the center of the upper surface of a base, a film pressure sensor is installed on the upper surface of the detection table, a plurality of wafer limiting rods are evenly distributed on the periphery of the detection table in the circumferential direction, the wafer limiting rods are vertically installed on the upper surface of the base, and the upper portion of the inner side face of each wafer limiting rod is machined into a conical face. The conical surface is matched with the wafer, the industrial camera is arranged right above the detection table, the industrial camera is installed on the industrial camera support, and the industrial camera support is installed on the base. The wafer detection device provided by the utility model has the advantages of low price and high image acquisition speed, and can be applied to direct detection after any process.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer processing, and specifically relates to a wafer bearing and detection triggering platform. BACKGROUND

[0002] Wafer detection can identify and classify various defects that occur during manufacturing, including surface defects (such as scratches, contaminants) and internal defects (such as crystal defects, voids). These defects can affect chip performance and reliability, and early detection and repair can improve product yield. Modern wafer detection equipment can collect a large amount of data for production analysis. Through big data analysis, manufacturers can identify systemic problems in production, predict potential failure modes, and perform preventive maintenance. This data-driven improvement measure can significantly improve production efficiency and product quality. Wafer detection plays a key role in chip production. Through detection, process stability is ensured, yield is improved, cost is reduced, performance is guaranteed, data is collected for improvement, compliance requirements are met, and innovation is supported, making wafer detection an indispensable part of the chip production process. This not only directly affects production efficiency and product quality, but also relates to the market competitiveness and long-term development of the enterprise.

[0003] Wafer detection equipment is usually designed for high precision from the beginning, which results in slow detection and expensive equipment. The detection time of a wafer is usually more than 1 minute, but in many cases, defects such as scratches, large-area contamination, and uneven photoresist coating can be seen by ordinary industrial cameras or even the naked eye. In this case, using traditional detection methods will result in late detection of problems, and even the product cannot be detected until it reaches the next process station. This makes it difficult to locate and find the problem in the production process, causing loss to the company and increasing the workload of engineers.

[0004] Therefore, there is an urgent need for a wafer detection device that is low in price, triggers quickly, and can detect results and find problem causes in the current process station in a timely manner. UTILITY MODEL CONTENT

[0005] The utility model aims to solve the problem of long detection time, low detection efficiency, expensive equipment, and inability to detect results and find problem causes in the current process station in a timely manner of existing wafer detection equipment, and further provides a wafer bearing and detection triggering platform.

[0006] The technical solution of the utility model is:

[0007] A wafer bearing and detection trigger platform, it includes base 1, detection table 2, thin film pressure sensor 3, industrial camera 6, industrial camera support 7 and multiple wafer limiting rods 5, detection table 2 is installed on the upper surface center position of base 1, thin film pressure sensor 3 is installed on the upper surface of detection table 2, multiple wafer limiting rods 5 are evenly distributed in the circumferential direction around detection table 2, wafer limiting rod 5 is vertically installed on the upper surface of base 1, the upper part of the inner side of each wafer limiting rod 5 is processed into a conical surface, the conical surface is matched with wafer 4, industrial camera 6 is arranged directly above detection table 2, industrial camera 6 is installed on industrial camera support 7, and industrial camera support 7 is installed on base 1.

[0008] Further, the inner diameter of the circle formed by the upper ends of the conical surfaces of the three wafer limiting rods 5 is Φ1, the inner diameter of the circle formed by the lower ends of the conical surfaces of the three wafer limiting rods 5 is Φ2, and the outer diameter of the wafer is Φ3, and Φ2 < Φ3 < Φ1.

[0009] Further, the wafer limiting rod 5 is an arc-shaped plate structure, and the arc of the wafer limiting rod 5 is 20-40°.

[0010] Further, the arc of the wafer limiting rod 5 is 30°.

[0011] Further, the upper part of the inner side of the wafer limiting rod 5 is processed with a bottom groove, and the bottom groove and the lower end of the conical surface of the wafer limiting rod 5 are located on the same horizontal plane.

[0012] Further, the height of the bottom groove of the wafer limiting rod 5 is 2-5 mm lower than that of the detection table 2.

[0013] Further, the height of the bottom groove of the wafer limiting rod 5 is 3 mm lower than that of the detection table 2.

[0014] Further, the industrial camera support 7 is an inverted "n" shaped support, the two ends of the "n" shaped support are fixedly connected with the upper surface of the base 1, the industrial camera 6 is installed in the middle of the "n" shaped support, and the lens of the industrial camera 6 is arranged downward.

[0015] Compared with the prior art, the wafer bearing and detection trigger platform has the following effects:

[0016] 1. The existing detection table and wafer are generally vacuum adsorbed by the detection table, and the photographing is controlled by the adsorption pressure signal, and the vacuum adsorption needs a separate gas supply device and a gas driving device, which can increase the equipment cost. The wafer bearing and detection trigger platform of the utility model adopts a thin film pressure sensor, does not need a gas driving process, can take photographs faster, and is more inexpensive.

[0017] 2. Existing wafer positioning methods on wafer inspection stages typically involve vacuum pillars around the wafer to hold it in place. If the position is correct, the vacuum pressure is high; if there are gaps or the position is incorrect, the vacuum pressure is low. This invention, however, uses a 30° arc wafer positioning rod for positioning, significantly improving efficiency and reducing costs.

[0018] 3. Chip manufacturing processes include oxidation, photolithography, resist coating, development, doping, deposition, and etching. Each of these processes can potentially cause issues such as robotic arm scratches on the wafer surface, large-area contamination, and uneven coating. However, currently, few chip foundries immediately inspect for these problems after each process, by which time they are often too late. This new wafer carrier and inspection triggering platform is inexpensive, has a fast image acquisition speed, and can be used for direct inspection after any process. It can even be integrated into the internal systems of oxidation, photolithography, resist coating, development, doping, deposition, and etching equipment as part of the overall process flow. Attached Figure Description

[0019] Figure 1 This is an isometric view of the wafer carrier and detection triggering platform of this utility model;

[0020] Figure 2 This is a front view of the wafer carrier and detection triggering platform of this utility model;

[0021] Figure 3 This is an isometric view of the wafer limiting rod in the wafer carrying and detection triggering platform of this utility model;

[0022] Figure 4 This is a flowchart of the working process of the wafer carrier and detection triggering platform of this utility model.

[0023] In the diagram: 1. Base; 2. Testing stage; 3. Thin-film pressure sensor; 4. Wafer; 5. Wafer limiting rod; 6. Industrial camera; 7. Industrial camera bracket. Detailed Implementation

[0024] Specific implementation method one: Combining Figures 1 to 3The embodiment is illustrated, and the wafer carrying and detection trigger platform of the embodiment includes a base 1, a detection table 2, a thin film pressure sensor 3, an industrial camera 6, an industrial camera support 7, and a plurality of wafer limiting rods 5. The detection table 2 is installed at the center of the upper surface of the base 1. The thin film pressure sensor 3 is installed on the upper surface of the detection table 2. The plurality of wafer limiting rods 5 are uniformly distributed around the detection table 2 in the circumferential direction. The wafer limiting rods 5 are vertically installed on the upper surface of the base 1. The upper part of the inner side surface of each wafer limiting rod 5 is processed into a conical surface, which matches the wafer 4. The industrial camera 6 is arranged directly above the detection table 2. The industrial camera 6 is installed on the industrial camera support 7, and the industrial camera support 7 is installed on the base 1.

[0025] In the embodiment, the wafer carrying and detection trigger platform further includes a pressure display screen connected to the pressure sensor through a wire. The pressure display screen can help find the cause of the problem when the problem occurs by displaying the change in pressure.

[0026] Specific implementation method two: combined Figures 1 to 3 The embodiment is illustrated. The inner diameter of the circle formed by the upper end of the conical surface of the three wafer limiting rods 5 is Φ1, the inner diameter of the circle formed by the lower end of the conical surface of the three wafer limiting rods 5 is Φ2, and the outer diameter of the wafer is Φ3. Φ2 < Φ3 < Φ1. The other components and connection relationships are the same as those of the specific implementation method one.

[0027] Specific implementation method three: combined Figures 1 to 3 The embodiment is illustrated. The wafer limiting rod 5 of the embodiment is in the form of an arc-shaped plate, and the curvature of the wafer limiting rod 5 is 20-40°. In this way, the three wafer limiting rods 5 ensure that the wafer placement process will not produce tilting or excessive positional errors. The other components and connection relationships are the same as those of the specific implementation method one or two.

[0028] Specific implementation method four: combined Figures 1 to 3 The embodiment is illustrated. The curvature of the wafer limiting rod 5 of the embodiment is 30°. In this way, the radius of curvature of the wafer 4 is the same as that of the wafer limiting rod 5, and the wafer limiting rod is a 30° arc, which can prevent the wafer 4 from moving forward, backward, left, and right, and has a better limiting effect. The other components and connection relationships are the same as those of the specific implementation method one, two, or three.

[0029] Specific implementation method five: combined Figures 1 to 3 The embodiment is illustrated. The inner side surface of the wafer limiting rod 5 is processed with a bottom groove, and the bottom groove is located at the same horizontal plane as the lower end of the conical surface of the wafer limiting rod 5. The other components and connection relationships are the same as those of the specific implementation method one, two, three, or four.

[0030] Specific implementation method six: combined Figures 1 to 3In this embodiment, the bottom groove of the wafer limiting rod 5 is 2-5mm lower than the detection table 2. In this way, once the wafer 4 is tilted, the bottom groove of the wafer limiting rod 5 supports the wafer 4, preventing the wafer 4 from moving up and down. The other components and connection relationships are the same as those in the first, second, third, fourth, fifth or sixth embodiment.

[0031] Specific embodiment seven: in combination Figures 1 to 3 In this embodiment, the bottom groove of the wafer limiting rod 5 is 3mm lower than the detection table 2. In this way, the bottom groove of the three wafer limiting rods 5 is slightly lower than the thin film pressure sensor 3, so that the wafer 4 pressure is better on the thin film pressure sensor 3, and the camera switch is better triggered. The other components and connection relationships are the same as those in the first, second, third, fourth, fifth or sixth embodiment.

[0032] Specific embodiment eight: in combination Figures 1 to 3 In this embodiment, the industrial camera support 7 is an inverted "N" shaped support, the two ends of the "N" shaped support are fixedly connected with the upper surface of the base 1, and the industrial camera 6 is installed in the middle of the "N" shaped support, and the lens of the industrial camera 6 is arranged downward. The other components and connection relationships are the same as those in the first, second, third, fourth, fifth, sixth or seventh embodiment.

[0033] Working principle

[0034] In combination Figures 1 to 4 The working principle of the wafer bearing and detection triggering platform of the utility model is as follows: the mechanical hand vacuum adsorbs and grabs the circular wafer 4, and places it on the detection table 2. Under the action of the gravity of the wafer 4, the pressure is transmitted to the thin film pressure sensor 3, causing the resistance and voltage of the thin film pressure sensor 3 to change, and then the pressure value changes. The change of the voltage is transmitted to the industrial camera software, and the software sends a signal to control the shutter switch of the industrial camera, so that the photographing is quickly completed. The wafer bearing and detection triggering platform of the utility model is low in price and fast in triggering photographing, and can detect the results and find the problem causes in time at the current process site.

[0035] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A wafer carrier and detection triggering platform, characterized in that: It includes a base (1), a detection table (2), a thin-film pressure sensor (3), an industrial camera (6), an industrial camera bracket (7) and a plurality of wafer limiting rods (5). The detection table (2) is installed at the center position of the upper surface of the base (1). The thin-film pressure sensor (3) is installed on the upper surface of the detection table (2). The plurality of wafer limiting rods (5) are evenly distributed around the detection table (2) in the circumferential direction. The wafer limiting rods (5) are vertically installed on the upper surface of the base (1). The upper inner side surface of each wafer limiting rod (5) is processed into a conical surface, and the conical surface matches the wafer (4). The industrial camera (6) is arranged directly above the detection table (2). The industrial camera (6) is installed on the industrial camera bracket (7), and the industrial camera bracket (7) is installed on the base (1).

2. The wafer carrier and detection triggering platform according to claim 1, characterized in that: The inner diameter of the circle formed by the upper ends of the conical surfaces of the three wafer limiting rods (5) is Φ1, the inner diameter of the circle formed by the lower ends of the conical surfaces of the three wafer limiting rods (5) is Φ2, and the outer diameter of the wafer is Φ3, where Φ2 < Φ3 < Φ1.

3. A wafer carrier and detection triggering platform according to claim 1 or 2, characterized in that: The wafer limiting rod (5) is of an arc-shaped plate structure, and the radian of the wafer limiting rod (5) is 20 - 40°.

4. The wafer carrier and detection triggering platform according to claim 3, characterized in that: The radian of the wafer limiting rod (5) is 30°.

5. The wafer carrier and detection triggering platform according to claim 4, characterized in that: A bottom groove is processed on the upper part of the inner side surface of the wafer limiting rod (5), and the bottom groove and the lower end of the conical surface of the wafer limiting rod (5) are on the same horizontal plane.

6. The wafer carrier and detection triggering platform according to claim 5, characterized in that: The height of the bottom groove of the wafer limiting rod (5) is 2 - 5 mm lower than that of the detection table (2).

7. The wafer carrier and detection triggering platform according to claim 6, characterized in that: The height of the bottom groove of the wafer limiting rod (5) is 3 mm lower than that of the detection table (2).

8. The wafer carrier and detection triggering platform according to claim 7, characterized in that: The industrial camera bracket (7) is an inverted "凵"-shaped bracket. The two ends of the "凵"-shaped bracket are respectively fixedly connected to the upper surface of the base (1). The industrial camera (6) is installed in the middle of the "凵"-shaped bracket, and the lens of the industrial camera (6) is arranged downward.

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