Cleaning device and semiconductor production equipment

Abstract

The utility model provides a cleaning device and semiconductor production equipment, the cleaning device comprises a cleaning mechanism and a purifying mechanism, the cleaning mechanism comprises a gas inlet nozzle and a gas outlet nozzle, the gas inlet nozzle is used for injecting nitrogen into a wafer storage device, and the gas outlet nozzle is used for injecting gas into the wafer storage device; the exhaust nozzle is used for exhausting gas in the wafer storage device out of the wafer storage device when nitrogen is injected into the wafer storage device, and the purification mechanism communicates with the gas inlet nozzle through a first communication position and communicates with the exhaust nozzle through a second communication position. The purification mechanism is used for injecting cleaning gas with the duration being a preset time interval into the gas inlet nozzle through the first communication position and injecting cleaning gas with the duration being the preset time interval into the exhaust nozzle through the second communication position so as to remove particulate matter deposited in the gas inlet nozzle and the exhaust nozzle. Therefore, particulate matters deposited in the air inlet nozzle and the exhaust nozzle are prevented from entering the wafer storage device to pollute the wafer.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing equipment technology, and more specifically, relates to a cleaning device and semiconductor manufacturing equipment. Background Technology

[0002] In the semiconductor manufacturing industry, nitrogen purging has a wide range of applications, covering everything from equipment cleaning and gas pipeline maintenance to contamination prevention. Because semiconductor manufacturing demands extremely high levels of cleanliness and precision, even the smallest particles, moisture, or chemical residues can affect product quality and even lead to manufacturing failures. Therefore, nitrogen purging plays a crucial role in ensuring production efficiency, equipment performance, and product quality.

[0003] During the storage and transfer of wafers using a FOUP (Front Opening Unified Pod), nitrogen gas needs to be introduced into the FOUP through a cleaning device to clean the wafers inside and prevent particulate matter from contaminating them. The nitrogen also protects the wafers. When filling the FOUP with nitrogen, the nitrogen enters through an inlet nozzle, and the gas inside the FOUP exits through an exhaust nozzle.

[0004] The problem with the above technical solution is that when the cleaning device is idle, the air inlet and exhaust nozzles in the cleaning device are exposed, and dust and other particles in the environment where the cleaning device is located can easily fall into the air inlet and exhaust nozzles. In particular, the particles that fall into the air inlet nozzle can easily enter the FOUP and contaminate the wafer when nitrogen is injected into the next FOUP. Summary of the Invention

[0005] The purpose of this application is to provide a cleaning device and semiconductor manufacturing equipment to solve the technical problem that existing cleaning devices cannot clean the air intake nozzle and exhaust nozzle.

[0006] To achieve the above objectives, a first aspect of this application is to provide a cleaning device, comprising:

[0007] The cleaning mechanism includes an air inlet nozzle and an air outlet nozzle. The air inlet nozzle is used to inject nitrogen into the wafer storage device, and the air outlet nozzle is used to discharge the gas in the wafer storage device when nitrogen is injected into the wafer storage device.

[0008] The purification mechanism is connected to the air intake nozzle through a first connection and to the exhaust nozzle through a second connection.

[0009] When the cleaning mechanism stops, the purification mechanism is used to inject cleaning gas into the air intake nozzle for a preset time interval through the first connection and to inject cleaning gas into the exhaust nozzle for a preset time interval through the second connection, so as to remove the particulate matter deposited in the air intake nozzle and the exhaust nozzle.

[0010] Optionally, the purification mechanism includes:

[0011] Tank body;

[0012] The air outlet duct is connected to the tank body and has a first connection point and a second connection point;

[0013] Filter element, installed in the tank;

[0014] A blower assembly, installed inside the tank, is used to deliver cleaning gas into the air outlet pipe.

[0015] Optionally, the filter element is detachably connected to the tank body.

[0016] Optionally, the blower assembly includes:

[0017] The motor is installed inside the tank.

[0018] Fan blades are mounted on the shaft of the motor;

[0019] A timer switch, electrically connected to the motor, is used to control the motor to start at the preset time interval and to control the motor to shut down after the preset time interval.

[0020] Optionally, the air outlet duct includes:

[0021] The first sub-air outlet pipe is connected to the cavity inside the tank body;

[0022] The second sub-outlet duct includes the first connection point and is connected to the first sub-outlet duct.

[0023] The third sub-outlet duct includes the second connection point and is connected to the first sub-outlet duct.

[0024] Optionally, it also includes:

[0025] The support plate, wherein both the air intake nozzle and the air exhaust nozzle are connected to the support plate;

[0026] A pressure sensor, connected to the support plate and electrically connected to the purification mechanism, is used to send a first control signal to the purification mechanism when the wafer storage device is separated from the support plate.

[0027] The purification mechanism is activated according to the first control signal to inject purified gas into the air intake nozzle and the air exhaust nozzle for a duration equal to the preset time interval.

[0028] Optionally, the cleaning mechanism further includes:

[0029] A flow meter is installed on the pipe body connected to the air inlet nozzle;

[0030] A solenoid valve is installed on the pipe body and spaced apart from the flow meter. The solenoid valve is electrically connected to both the flow meter and the sensor.

[0031] When the wafer storage device is placed on the support plate and comes into contact with the pressure sensor, the pressure sensor generates a second control signal and transmits the second control signal to the solenoid valve. The solenoid valve receives the second control signal and opens according to the second control signal to conduct the connection tube.

[0032] After the flow rate of the cleaning gas flowing through the pipe reaches a preset value, the flow meter generates a third control signal and transmits the third control signal to the solenoid valve. The solenoid valve receives the third control signal and closes the pipe according to the third control signal.

[0033] Optionally, the cleaning mechanism further includes:

[0034] A filter, installed on the tube, is used to filter nitrogen gas.

[0035] Optionally, it also includes:

[0036] A protective cover is connected to the support plate, and the purification mechanism is located inside the protective cover.

[0037] The beneficial effects of the cleaning device provided in this application are as follows: Compared with the prior art, the cleaning device provided in this application includes a cleaning mechanism and a purification mechanism. The cleaning mechanism includes an air inlet nozzle and an exhaust nozzle. The air inlet nozzle is used to inject nitrogen into the wafer storage device, and the exhaust nozzle is used to discharge the gas in the wafer storage device when nitrogen is injected into the wafer storage device. The purification mechanism is connected to the air inlet nozzle through a first connection and to the exhaust nozzle through a second connection. When the cleaning mechanism is stopped, the purification mechanism is used to inject cleaning gas into the air inlet nozzle for a preset time interval through the first connection and to inject cleaning gas into the exhaust nozzle for a preset time interval through the second connection, so as to remove the particulate matter deposited in the air inlet nozzle and the exhaust nozzle, thereby preventing the particulate matter deposited in the air inlet nozzle and the exhaust nozzle from entering the wafer storage device and contaminating the wafer.

[0038] Secondly, this application provides a semiconductor manufacturing apparatus, comprising:

[0039] A cleaning device, wherein the cleaning device is any one of the cleaning devices described above.

[0040] The beneficial effects of the cleaning device provided in this application are as follows: Compared with the prior art, the semiconductor manufacturing equipment provided in this application includes the cleaning device provided by any of the above-mentioned methods. The cleaning device includes a cleaning mechanism and a purification mechanism. The cleaning mechanism includes an air inlet nozzle and an exhaust nozzle. The air inlet nozzle is used to inject nitrogen into the wafer storage device. The exhaust nozzle is used to discharge the gas in the wafer storage device when nitrogen is injected into the wafer storage device. The purification mechanism is connected to the air inlet nozzle through a first connection and to the exhaust nozzle through a second connection. When the cleaning mechanism is stopped, the purification mechanism is used to inject cleaning gas into the air inlet nozzle for a preset time interval through the first connection and to inject cleaning gas into the exhaust nozzle for a preset time interval through the second connection, so as to remove the particulate matter deposited in the air inlet nozzle and the exhaust nozzle, thereby preventing the particulate matter deposited in the air inlet nozzle and the exhaust nozzle from entering the wafer storage device and contaminating the wafer. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the cleaning mechanism provided in the embodiments of this application;

[0043] Figure 2 This is a schematic diagram of the cleaning mechanism provided in an embodiment of the present application from another perspective;

[0044] Figure 3 This is a schematic diagram of the main structure of the cleaning device provided in the embodiments of this application;

[0045] Figure 4 This is a schematic diagram of the purification mechanism provided in an embodiment of this application.

[0046] The following are the labeling elements in the figure:

[0047] 10. Cleaning mechanism; 11. Inlet nozzle; 12. Exhaust nozzle; 13. Support plate; 131. Guide plate; 132. Positioning component; 14. Pressure sensor; 15. Flow meter; 16. Solenoid valve; 17. Filter; 18. Pipe body; 20. Wafer storage device; 30. Purification mechanism; 31. Tank body; 32. Outlet duct body; 321. First sub-outlet duct; 322. Second sub-outlet duct; 3221. First connection point; 323. Third sub-outlet duct; 3231. Second connection point; 33. Filter element; 34. Blowing assembly; 341. Motor; 342. Fan blade; 343. Fixing frame; 40. Protective cover. Detailed Implementation

[0048] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0049] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0050] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] Please refer to the following: Figures 1 to 4 The cleaning device and semiconductor manufacturing equipment provided in the embodiments of this application will now be described.

[0053] To achieve the above objectives, a first aspect of this application is to provide a cleaning device, including a cleaning mechanism 10 and a purification mechanism 30.

[0054] Please see Figure 1 and Figure 2 The cleaning mechanism 10 includes an air inlet nozzle 11 and an exhaust nozzle 12. The air inlet nozzle 11 is connected to a nitrogen storage device for injecting nitrogen into the wafer storage device 20. The exhaust nozzle 12 is used to expel the gas in the wafer storage device 20 when nitrogen is injected into the wafer storage device 20, thereby cleaning the wafers in the wafer storage device 20 and protecting the wafers after the wafer storage device 20 is filled with nitrogen.

[0055] The exhaust nozzle 12 can be connected to an external gas storage device to facilitate the recovery of gas within the wafer storage device 20.

[0056] The wafer storage device 20 is equipped with an air inlet (not shown in the figure) and an exhaust port (not shown in the figure). When the cleaning mechanism 10 injects nitrogen into the wafer storage device 20 to clean the wafer, the air inlet is connected to the air inlet nozzle 11 and the exhaust port is connected to the exhaust nozzle 12. When the cleaning mechanism 10 is turned on, the nitrogen enters the wafer storage device 20 through the air inlet nozzle 11 and the air inlet in sequence, and the gas in the wafer storage device 20 is discharged from the wafer storage device 20 through the exhaust port and the exhaust nozzle 12 in sequence.

[0057] In some embodiments, the wafer storage device 20 is a FOUP (Front Opening Unified Pod).

[0058] In some embodiments, the wafer storage device 20 is a device capable of storing and transferring wafers.

[0059] Please see Figure 3 The purification mechanism 30 is connected to the air intake nozzle 11 through the first connection 3221 and to the exhaust nozzle 12 through the second connection 3231.

[0060] When the wafer storage device 20 is separated from the cleaning mechanism 10, the cleaning mechanism 10 stops. At this time, the air inlet nozzle 11 and the air outlet nozzle 12 in the cleaning mechanism 10 are separated from the air inlet interface and the air outlet interface, respectively. The air inlet nozzle 11 and the air outlet nozzle 12 are exposed. Dust or other particles in the production environment where the cleaning device is located can easily fall into the air passages on the air inlet nozzle 11 and the air outlet nozzle 12.

[0061] After the wafer storage device 20 is separated from the cleaning mechanism 10, the purification mechanism 30 injects cleaning gas into the inlet nozzle 11 for a preset time interval through the first connection 3221 and into the exhaust nozzle 12 for a preset time interval through the second connection 3231 to remove dust or particulate matter deposited in the inlet nozzle 11 and the exhaust nozzle 12. This prevents dust or particulate matter from entering the wafer storage device 20 through the inlet nozzle 11 and the exhaust nozzle 12, especially the inlet nozzle 11, when the cleaning mechanism 10 injects nitrogen into the next wafer rough storage device.

[0062] Compared with the prior art, the cleaning device provided in this application includes a cleaning mechanism 10 and a purification mechanism 30. The cleaning mechanism 10 includes an air inlet nozzle 11 and an air outlet nozzle 12. The air inlet nozzle 11 is used to inject nitrogen into the wafer storage device 20, and the air outlet nozzle 12 is used to discharge the gas in the wafer storage device 20 when nitrogen is injected into the wafer storage device 20. The purification mechanism 30 is connected to the air inlet nozzle 11 through a first connection 3221 and to the air outlet nozzle 12 through a second connection 3231. When the cleaning mechanism 10 is stopped, the purification mechanism 30 is used to inject cleaning gas into the air inlet nozzle 11 for a preset time interval through the first connection 3221 and to inject cleaning gas into the air outlet nozzle 12 for a preset time interval through the second connection 3231, so as to remove the particulate matter deposited in the air inlet nozzle 11 and the air outlet nozzle 12, thereby preventing the particulate matter deposited in the air inlet nozzle 11 and the air outlet nozzle 12 from entering the wafer storage device 20 and contaminating the wafer.

[0063] In this application, please refer to Figure 3 and Figure 4 The purification unit 30 includes a tank 31, an air outlet duct 32, a filter element 33, and a blower assembly 34.

[0064] Specifically, the air outlet duct 32 is connected to the tank 31 and has a first connection point 3221 and a second connection point 3231.

[0065] The filter element 33 is installed in the tank 31. The blower assembly 34 is installed inside the tank 31 and is used to deliver cleaning gas into the outlet duct 32.

[0066] The filter element 33 is disposed between the air blowing assembly 34 and the connection between the air outlet duct 32 and the tank 31, or the filter element 33 is disposed on the side of the air blowing assembly 34 away from the connection between the air outlet duct 32 and the tank 31.

[0067] The end of the tank 31 away from the air outlet duct 32 is open, or the end of the tank 31 away from the air outlet duct 32 is provided with an air inlet, so that gas can enter the interior of the tank 31.

[0068] When the blower assembly 34 is started, the cleaning gas is filtered by the filter element 33 to prevent impurities in the cleaning gas from entering the air outlet duct 32. Then, the gas enters the air nozzle 11 and the exhaust nozzle 12 through the first connection 3221 and the second connection 3231, respectively.

[0069] In one embodiment of this application, the filter element 33 is detachably connected to the tank body 31.

[0070] For details, please refer to Figure 4 In this embodiment, the filter element 33 is disposed on the side of the blower assembly 34 away from the connection between the air outlet duct 32 and the tank 31, such as being sleeved on the end of the tank 31 away from the air outlet duct 32, so as to facilitate the disassembly of the filter element 33, thereby facilitating the replacement of the filter element 33, or facilitating the cleaning of the impurities filtered on the filter element 33 after the filter element 33 is removed from the tank 31.

[0071] In this application, the blower assembly 34 includes a motor 341, a fan blade 342, and a timer switch (not shown in the figure).

[0072] For details, please refer to Figure 4 A mounting bracket 343 is installed inside the tank body 31, and the motor body 341 is mounted on the mounting bracket 343, thereby fixing the motor 341 inside the tank body 31. The fan blade 342 is mounted on the shaft of the motor 341.

[0073] The timer switch is electrically connected to the motor 341 and is used to control the motor 341 to start at a preset time interval and to control the motor 341 to turn off after the preset time interval.

[0074] When the wafer storage device 20 is separated from the cleaning mechanism 10 and the cleaning mechanism 10 is stopped, the timer switch controls the motor 341 to be powered on and rotated for a preset time interval, such as 10 seconds. At this time, the fan blade 342 delivers cleaning gas into the air outlet duct 32 through the cavity inside the outlet tank 31. The air outlet duct 32 then delivers part of the cleaning gas to the inlet nozzle 11 through the first connection 3221 and another part of the cleaning gas to the exhaust nozzle 12 through the second connection 3231, thereby cleaning the inlet nozzle 11 and the exhaust nozzle 12.

[0075] Ten seconds after the motor 341 starts, the timer switch disconnects the power supply to the motor 341 according to its internal control program, thereby stopping the motor 341 and stopping the delivery of cleaning gas into the air outlet duct 32.

[0076] In one embodiment of this application, please refer to Figure 3 The air outlet duct body 32 includes a first sub-air outlet duct 321, a second sub-air outlet duct 322 and a third sub-air outlet duct 323.

[0077] Specifically, in this embodiment, one end of the first sub-outlet pipe 321 is connected to the cavity inside the tank 31. The second sub-outlet pipe 322 includes a first connection point 3221, and the second outlet pipe is connected to the end of the first sub-outlet pipe 321 away from the tank 31. The third sub-outlet pipe 323 includes a third connection point, and the third sub-outlet pipe 323 is also connected to the end of the first sub-outlet pipe 321 away from the tank 31. The second sub-outlet pipe 322 and the third sub-outlet pipe 323 are also interconnected.

[0078] Optionally, the cleaning device also includes a support plate 13 and a pressure sensor 14.

[0079] Please see Figure 2 and Figure 3 The inlet nozzle 11 and the exhaust nozzle 12 of the support plate 13 are both connected to the support plate 13, and both the inlet nozzle 11 and the exhaust nozzle 12 extend from one side of the support plate 13 to the other side. When it is necessary to inject nitrogen into the wafer storage device 20 to clean the wafer, the wafer storage device 20 is placed on the support plate 13, and the wafer storage device 20 is provided with an inlet port and an exhaust port that are respectively connected to the inlet nozzle 11 and the exhaust nozzle 12.

[0080] Pressure sensor 14 is connected to the support plate 13 and electrically connected to the purification mechanism 30, and is used to send a first control signal to the purification mechanism 30 when the wafer storage device 20 is separated from the support plate 13. The purification mechanism 30 is activated according to the first control signal to inject purified gas into the intake nozzle 11 and the exhaust nozzle 12 for a preset time interval.

[0081] Specifically, in this application, the pressure sensor 14 is electrically connected to the timer switch in the purification mechanism 30. When the wafer storage device 20 is separated from the carrier plate 13, the wafer storage device 20 and the pressure sensor 14 separate and abut against each other, thereby causing the pressure sensor 14 to generate a first control signal. The timer switch receives the first control signal and controls the motor 341 to be connected to the power supply according to the first control signal, thereby causing the motor 341 to rotate to deliver clean gas into the air outlet duct 32.

[0082] In one embodiment of this application, please refer again. Figure 2 There are two intake nozzles 11 and two exhaust nozzles 12. The two intake nozzles 11 are spaced apart, such as along the width direction of the support plate 13. The two exhaust nozzles 12 are spaced apart from the two intake nozzles 11 along the length direction of the support plate 13, and the two exhaust nozzles 12 are spaced apart along the width direction of the support plate 13.

[0083] The two intake nozzles 11 are connected by a first connecting pipe (not shown in the figure), and the first connection point 3221 is connected to the first connecting pipe. The two exhaust nozzles 12 are connected by a second connecting pipe (not shown in the figure), and the second connection point 3231 is connected to the second connecting pipe.

[0084] The wafer carrier is equipped with two air inlet ports and two air outlet ports. The two air inlet ports correspond one-to-one with the two air inlet nozzles 11, and the two air outlet ports correspond one-to-one with the two air outlet ports.

[0085] Please refer again to this application. Figure 3 The cleaning mechanism 10 also includes a flow meter 15 and a solenoid valve 16.

[0086] A flow meter 15 is mounted on a pipe 18 connected to an inlet nozzle 11, and the inlet end of the pipe 18 is connected to a nitrogen storage device. A solenoid valve 16 is mounted on the pipe 18 and spaced apart from the flow meter 15. The solenoid valve 16 is electrically connected to both the flow meter 15 and the sensor.

[0087] When the wafer storage device 20 is placed on the support plate 13 and comes into contact with the pressure sensor 14, the pressure sensor 14 generates a second control signal and transmits the second control signal to the solenoid valve 16. The solenoid valve 16 receives the second control signal and opens according to the second control signal to conduct the connection tube, so that nitrogen gas enters the inlet nozzle 11 from the nitrogen storage device and then enters the wafer storage device 20.

[0088] After the flow rate of the cleaning gas flowing through the pipe 18 reaches a preset value, the flow meter 15 generates a third control signal and transmits the third control signal to the solenoid valve 16. The solenoid valve 16 receives the third control signal and closes the pipe 18 according to the third control signal to stop the injection of nitrogen into the circular storage device 20.

[0089] Please refer again to this application. Figure 3 The cleaning mechanism 10 also includes a filter 17.

[0090] The filter 17 is installed on the tube body 18. When the solenoid valve 16 is opened and the air inlet nozzle 11 injects nitrogen into the wafer storage device 20, the filter 17 is used to filter the nitrogen.

[0091] In this application, please refer to Figures 1 to 3 The cleaning device also includes a protective cover 40 connected to the support plate 13, and the purification mechanism 30 is located inside the protective cover 40.

[0092] In one embodiment of this application, a guide plate 131 is provided on the carrier plate 13 at an angle to the thickness direction of the carrier plate 13. The guide plate 131 is provided on two opposite ends along the length or width direction of the carrier plate 13. During the process of placing the wafer storage device 20 on the carrier plate 13, the guide plate 131 is used to guide the wafer storage device 20.

[0093] In one implementation of this application, please refer again. Figure 2 and Figure 3 The wafer storage device 20 has a positioning hole (not shown in the figure) on the carrier plate 13 and a positioning component 132 on the carrier plate 13. When the wafer storage device 20 is placed on the carrier plate 13, the positioning component 132 is inserted into the positioning hole to ensure that the positions of the two air inlet ports correspond one-to-one with the positions of the two air inlet nozzles 11, and the positions of the two exhaust ports correspond one-to-one with the positions of the two exhaust ports.

[0094] There are three positioning elements 132, and the lines connecting the three positioning elements 132 form a triangle. There are also three positioning holes, and the three positioning holes correspond one-to-one with the three positioning elements 132. Each positioning element 132 is adapted to its corresponding positioning hole.

[0095] Secondly, this application provides a semiconductor manufacturing apparatus, including a cleaning device, wherein the cleaning device is any of the cleaning devices provided above.

[0096] Compared with the prior art, the semiconductor manufacturing equipment provided in this application includes the cleaning device provided by any of the above-mentioned methods. The cleaning device includes a cleaning mechanism 10 and a purification mechanism 30. The cleaning mechanism 10 includes an inlet nozzle 11 and an exhaust nozzle 12. The inlet nozzle 11 is used to inject nitrogen into the wafer storage device 20, and the exhaust nozzle 12 is used to discharge the gas in the wafer storage device 20 when nitrogen is injected into the wafer storage device 20. The purification mechanism 30 is connected to the inlet nozzle 11 through a first connection 3221, so as to... The purification mechanism 30 is connected to the exhaust nozzle 12 through the second connection 3231. When the cleaning mechanism 10 is stopped, the purification mechanism 30 is used to inject cleaning gas into the intake nozzle 11 for a preset time interval through the first connection 3221 and to inject cleaning gas into the exhaust nozzle 12 for a preset time interval through the second connection 3231, so as to remove the particulate matter deposited in the intake nozzle 11 and the exhaust nozzle 12, thereby preventing the particulate matter deposited in the intake nozzle 11 and the exhaust nozzle 12 from entering the wafer storage device 20 and contaminating the wafer.

[0097] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cleaning device, characterized in that, include: The cleaning mechanism includes an air inlet nozzle and an air outlet nozzle. The air inlet nozzle is used to inject nitrogen into the wafer storage device, and the air outlet nozzle is used to discharge the gas in the wafer storage device when nitrogen is injected into the wafer storage device. The purification mechanism is connected to the air intake nozzle through a first connection and to the exhaust nozzle through a second connection. When the cleaning mechanism stops, the purification mechanism is used to inject cleaning gas into the air intake nozzle for a preset time interval through the first connection and to inject cleaning gas into the exhaust nozzle for a preset time interval through the second connection, so as to remove the particulate matter deposited in the air intake nozzle and the exhaust nozzle.

2. The cleaning device as described in claim 1, characterized in that, The purification mechanism includes: Tank body; The air outlet duct is connected to the tank body and has a first connection point and a second connection point; Filter element, installed in the tank; A blower assembly, installed inside the tank, is used to deliver cleaning gas into the air outlet pipe.

3. The cleaning device as described in claim 2, characterized in that, The filter element is detachably connected to the tank body.

4. The cleaning device as described in claim 3, characterized in that, The blowing assembly includes: The motor is installed inside the tank. Fan blades are mounted on the shaft of the motor; A timer switch, electrically connected to the motor, is used to control the motor to start at the preset time interval and to control the motor to shut down after the preset time interval.

5. The cleaning device as described in claim 4, characterized in that, The air outlet duct includes: The first sub-air outlet pipe is connected to the cavity inside the tank body; The second sub-outlet duct includes the first connection point and is connected to the first sub-outlet duct. The third sub-outlet duct includes the second connection point and is connected to the first sub-outlet duct.

6. The cleaning device as described in claim 1 or 5, characterized in that, Also includes: The support plate, wherein both the air intake nozzle and the air exhaust nozzle are connected to the support plate; A pressure sensor, connected to the support plate and electrically connected to the purification mechanism, is used to send a first control signal to the purification mechanism when the wafer storage device is separated from the support plate. The purification mechanism is activated according to the first control signal to inject purified gas into the air intake nozzle and the air exhaust nozzle for a duration equal to the preset time interval.

7. The cleaning device as described in claim 6, characterized in that, The cleaning mechanism also includes: A flow meter is installed on the pipe body connected to the air inlet nozzle; A solenoid valve is installed on the pipe body and spaced apart from the flow meter. The solenoid valve is electrically connected to both the flow meter and the sensor. When the wafer storage device is placed on the support plate and comes into contact with the pressure sensor, the pressure sensor generates a second control signal and transmits the second control signal to the solenoid valve. The solenoid valve receives the second control signal and opens according to the second control signal to conduct the connection tube. After the flow rate of the cleaning gas flowing through the pipe reaches a preset value, the flow meter generates a third control signal and transmits the third control signal to the solenoid valve. The solenoid valve receives the third control signal and closes the pipe according to the third control signal.

8. The cleaning device as described in claim 7, characterized in that, The cleaning mechanism also includes: A filter, installed on the tube, is used to filter nitrogen gas.

9. The cleaning device as described in claim 8, characterized in that, Also includes: A protective cover is connected to the support plate, and the purification mechanism is located inside the protective cover.

10. A semiconductor manufacturing apparatus, characterized in that, include: A cleaning device, wherein the cleaning device is the cleaning device according to any one of claims 1-9.

Images