Wet-in, wet-out and dry-out switching conveying system and wafer cleaning system

Abstract

The utility model provides a wet-in, wet-out and dry-out switching conveying system and a wafer cleaning system. A wafer wet-in subsystem and a wafer wet-out and dry-out subsystem are connected with a mode switching subsystem; the wafer wet-out and dry-out subsystem comprises a wafer wet-out module and a wafer dry-out module; the wafer wet-out module comprises a blanking wet-out groove, a blanking receiving mechanism and a blanking transfer mechanism; and the wafer dry-out module is arranged above the blanking wet-out groove and comprises a dry-out mechanism fixing plate and a dry-out mechanism cantilever. The use quantity of equipment is reduced, the occupied area of the equipment is reduced, the production cost is reduced, the operation time is shortened, the complexity is reduced, and the process efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field especially, relates to a kind of conveying system and wafer cleaning system of wet-in wet-out and dry-out switching. BACKGROUND

[0002] In semiconductor manufacturing process, wafer conveying and processing are crucial links. To meet different process requirements, sometimes wet-in / wet-out process is needed, and sometimes wet-in / dry-out process is needed. In the past, these two process modes were carried out on two sets of equipment systems, i.e., one set of equipment system for wet-in / wet-out, and another set of equipment system for wet-in / dry-out, each set of equipment system being controlled separately. In the wet-in / wet-out mode, the wafer is always in a wet environment during the conveying process. The wafer path is: Load Tank—process tank Tank--Unload tank wet-out mechanism—manual picking. The wafer is always in the Tank liquid, which is suitable for steps that need wet-out process. That is, the equipment system for wet-in / wet-out process includes loading-related equipment, process cleaning-related equipment, unloading-related equipment, and wafer transmission devices such as mechanical arms for wafer transmission in each device. In the wet-in / dry-out mode, the wafer needs to enter Dry to dry after completing the process tank cleaning. The wafer path is: Load Tank—process tank Tank—Dry drying—Unload dry-out mechanism—manual picking. It is suitable for steps that need dry-out process. That is, the equipment system for wet-in / dry-out process includes loading-related equipment, process cleaning-related equipment, drying-related equipment, unloading-related equipment, and wafer transmission devices such as mechanical arms for wafer transmission in each device. Two sets of equipment systems are used, and the operator responsible for taking out the wafer needs to specially go to the dry-out area to take out the wafer in dry-out, and to the wet-out mechanism to take out the wafer in wet-out. The operation is complex, or two operators are provided for dry-out and wet-out, which increases the labor cost.

[0003] It can be seen that the existing technology of wet-in / dry-out and wet-in / wet-out is carried out separately, which has the problems of complex operation, high cost, large floor area, etc., affecting the efficiency and quality of the process. UTILITY MODEL CONTENTS

[0004] Based on the above problems, the utility model provides a conveying system for switching between wet-in / wet-out and dry-out, aiming to solve the technical problems of high cost in the prior art of wet-in / wet-out and wet-in / dry-out process.

[0005] The utility model provides a conveying system for switching between wet-in / wet-out and dry-out, comprising a wafer wet-in subsystem, a wafer wet-out / dry-out subsystem, and a mode switching subsystem, wherein the wafer wet-in subsystem and the wafer wet-out / dry-out subsystem are connected to the mode switching subsystem.

[0006] The wafer wet-out and dry-out subsystem comprises a wafer wet-out module and a wafer dry-out module, and the wafer wet-out module comprises:

[0007] A wet-out slot for feeding, which contains liquid;

[0008] A feeding receiving mechanism, which receives a wafer box and immerses wafers in the wafer box in the liquid in the first area of the wet-out slot for feeding;

[0009] A feeding transfer mechanism, which moves the wafer box out of the first area of the wet-out slot for feeding, so that the wafers in the wafer box can be taken out;

[0010] The wafer dry-out module is arranged above the wet-out slot for feeding and comprises:

[0011] A dry-out mechanism fixed plate;

[0012] A dry-out mechanism cantilever, the upper end of which is connected with the dry-out mechanism fixed plate, and the lower end of which has a dry-out horizontal support structure for supporting the wafer box.

[0013] Further, the feeding receiving mechanism comprises a feeding cantilever and a feeding vertical pneumatic cylinder, which drives the feeding cantilever to move up and down;

[0014] The first end of the feeding cantilever is connected with the feeding vertical pneumatic cylinder, and the second end of the feeding cantilever is connected with a first horizontal support mechanism for supporting the wafer box;

[0015] The horizontal projection of the first horizontal support mechanism is located in the first area of the wet-out slot for feeding;

[0016] The feeding vertical pneumatic cylinder corresponds to the first side of the wet-out slot for feeding.

[0017] Further, the feeding transfer mechanism comprises a feeding horizontal moving screw module, a feeding jacking pneumatic cylinder and a feeding jacking arm beam, the feeding transfer mechanism corresponds to the second side of the wet-out slot for feeding, and the first side and the second side of the wet-out slot for feeding are opposite sides;

[0018] The first end of the feeding jacking arm beam is connected with the feeding jacking pneumatic cylinder, and the second end of the feeding jacking arm beam is connected with a second horizontal support mechanism for supporting the wafer box;

[0019] The horizontal projection of the second horizontal support mechanism is located in the wet-out slot for feeding;

[0020] The feeding jacking pneumatic cylinder drives the feeding jacking arm beam to move up and down;

[0021] The feeding horizontal moving screw module is connected with the feeding jacking pneumatic cylinder, and when the feeding horizontal moving screw module drives the feeding jacking pneumatic cylinder to move linearly in the transverse direction, the second horizontal support mechanism is driven to move in the transverse direction.

[0022] Further, the wafer dry-out module further comprises:

[0023] A dry-out horizontal moving cylinder is fixed on the dry-out mechanism fixing plate, the dry-out horizontal moving cylinder and the dry-out mechanism cantilever are connected, and the dry-out horizontal moving cylinder drives the dry-out mechanism cantilever to move horizontally and linearly.

[0024] Further, the wafer wet-in subsystem comprises:

[0025] A wet-out slot for feeding is provided, and the wet-out slot for feeding contains liquid;

[0026] A receiving mechanism for feeding is provided, and the receiving mechanism for feeding receives the wafer box and immerses the wafer in the wafer box in the liquid in the first area of the wet-out slot for feeding;

[0027] A transfer mechanism for feeding is provided, and the transfer mechanism for feeding moves the wafer box out of the first area of the wet-out slot for feeding, so that the wafer in the wafer box can be taken out.

[0028] Further, the receiving mechanism for feeding comprises a feeding cantilever and a vertical cylinder for feeding, and the vertical cylinder for feeding drives the feeding cantilever to move vertically;

[0029] The first end of the feeding cantilever is connected to the vertical cylinder for feeding, and the second end of the feeding cantilever is connected to a third horizontal support mechanism for supporting the wafer box;

[0030] The horizontal projection of the third horizontal support mechanism is located in the first area of the wet-out slot for feeding;

[0031] The vertical cylinder for feeding corresponds to the first side of the wet-out slot for feeding.

[0032] Further, the transfer mechanism for feeding comprises a horizontal moving screw module for feeding, a lifting cylinder for feeding, and a lifting arm beam for feeding, the transfer mechanism for feeding corresponds to the second side of the wet-out slot for feeding, and the first side and the second side of the wet-out slot for feeding are opposite sides;

[0033] The first end of the lifting arm beam for feeding is connected to the lifting cylinder for feeding, and the second end of the lifting arm beam for feeding is connected to a fourth horizontal support mechanism for supporting the wafer box;

[0034] The horizontal projection of the fourth horizontal support mechanism is located in the wet-out slot for feeding;

[0035] The lifting cylinder for feeding drives the lifting arm beam for feeding to move vertically;

[0036] The horizontal moving screw module for feeding is connected to the lifting cylinder for feeding, and when the horizontal moving screw module for feeding drives the lifting cylinder for feeding to move horizontally and linearly, the fourth horizontal support mechanism is driven to move horizontally.

[0037] Further, the wet-out slot for feeding further comprises a second area and a third area;

[0038] The second horizontal supporting mechanism with wafer boxes is driven by the unloading horizontal moving screw module to move laterally through the first area of the unloading wet-out slot, the second area and then the third area, and the wafer in the wafer box is taken out at the third area of the unloading wet-out slot.

[0039] Further, the loading wet-out slot further comprises a second area and a third area.

[0040] The fourth horizontal supporting mechanism with wafer boxes is driven by the loading horizontal moving screw module to move laterally through the first area of the loading wet-out slot, the second area and then the third area, and the wafer in the wafer box is taken out at the third area of the loading wet-out slot.

[0041] A wafer cleaning system comprises the wet-in wet-out and dry-out switching conveying system and a wafer cleaning process subsystem.

[0042] The wafer cleaning process subsystem comprises:

[0043] The wafer cleaning device and the drying device.

[0044] The beneficial technical effects of the utility model lie in: the utility model sets up the mode switching subsystem, uses the wet-in wet-out and wet-in dry-out mode switching for the same set of equipment, reduces the use quantity of equipment, reduces the floor area of equipment, reduces the production cost, reduces the operation time and complexity, and improves the process efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figures 1-2 It is a structure schematic view of the wafer wet-in subsystem of the wet-in wet-out and dry-out switching conveying system of the utility model;

[0046] Figures 3-4 It is a structure schematic view of the wafer wet-out dry-out subsystem of the wet-in wet-out and dry-out switching conveying system of the utility model.

[0047] Wherein,

[0048] 1-unloading wet-out slot; 1A-first area of unloading wet-out slot; 1B-second area of unloading wet-out slot; 1C-third area of unloading wet-out slot;

[0049] 2-dry-out mechanism fixed plate;

[0050] 3-dry-out mechanism cantilever; 3A-dry-out first area; 3B-dry-out second area; 4-dry-out horizontal moving air cylinder;

[0051] 5-unloading cantilever; 6-unloading vertical air cylinder; 7-unloading horizontal moving screw module; 8-unloading jacking air cylinder; 9-unloading jacking arm beam;

[0052] 10 - wet-in slot; 10A - first area in the wet-in slot; 10B - second area in the wet-in slot; 10C - third area in the wet-in slot;

[0053] 11 - wet-in cantilever; 12 - wet-in vertical cylinder; 13 - wet-in horizontal screw module; 14 - wet-in jacking cylinder; 15 - wet-in jacking arm beam;

[0054] 16 - wet-out profile support; 17 - wet-in profile support. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0056] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0057] The present application will be further described below with reference to the drawings and specific embodiments, but is not limited to the present application.

[0058] Referring to Figures 3-4 The present application provides a wet-in and wet-out / dry-out switching conveying system, which comprises a wafer wet-in subsystem, a wafer wet-out / dry-out subsystem and a mode switching subsystem, wherein the wafer wet-in subsystem and the wafer wet-out / dry-out subsystem are connected with the mode switching subsystem;

[0059] The wafer wet-out / dry-out subsystem comprises a wafer wet-out module and a wafer dry-out module, wherein the wafer wet-out module comprises:

[0060] The wet-out slot (1) is filled with liquid;

[0061] The wet-out receiving mechanism receives the wafer box and immerses the wafers in the wafer box in the liquid in the wet-out slot and in the first area (1A) of the wet-out slot (1);

[0062] The wet-out transfer mechanism moves the wafer box out of the first area (1A) of the wet-out slot (1) so that the wafers in the wafer box can be taken out;

[0063] The wafer dry-out module is arranged above the wet-out slot (1) and comprises:

[0064] The dry-out mechanism fixing plate (2);

[0065] The upper end of the cantilever (3) of the drying mechanism is connected to the fixing plate (2) of the drying mechanism, and the lower end has a horizontal support structure for supporting the wafer box.

[0066] When the mode switching subsystem switches the process mode to wet-in / wet-out mode, the conveying system will operate accordingly, and the parameters will be adjusted to those of wet-in / wet-out mode. For example, the unloading receiving mechanism and unloading transfer mechanism will be activated, while the relevant actions of the wafer dry-out module will be stopped to avoid any disruption. Conversely, when switching to wet-in / dry-out mode, the relevant actions of the wafer dry-out module will be activated, while the wafer wet-out module will be stopped to prevent any disruption.

[0067] In wet-in / wet-out mode, the wafer wet-in subsystem loads the wafers, the robotic arm removes the wafers from the wafer wet-in subsystem and transfers them to the cleaning process area. After the cleaning equipment in the cleaning process area cleans the wafers, the robotic arm clamps the wafers to the wafer wet-out / dry-out subsystem for wet-out. During the wet-out process, the robotic arm places the wafers in the unloading receiving mechanism, which immerses the wafers in liquid. Then, the unloading transfer mechanism transfers the wafers to the location where they are manually removed.

[0068] In the wet-in-dry-out mode, the wafer wet-in subsystem loads the wafer, the robotic arm takes the wafer from the wafer wet-in subsystem and transfers the wafer to the cleaning process area. After the cleaning equipment in the cleaning process area cleans the wafer, the robotic arm clamps the cleaned wafer to the drying equipment for drying. Then, the robotic arm clamps the wafer to the wafer wet-out-dry-out subsystem for drying. During the drying process, the robotic arm places the wafer on the drying horizontal support structure on the drying mechanism cantilever (3), and then the wafer is removed manually.

[0069] By integrating wet-in / wet-out and wet-in / dry-out equipment, the entire process of wet-in / wet-out and wet-in / dry-out shares the same wet-in equipment and cleaning equipment. Moreover, the dry-out equipment is located above the wet-out equipment, which reduces the number of equipment used, reduces the equipment floor space, lowers production costs, reduces operation time and complexity, and improves process efficiency.

[0070] Furthermore, the unloading receiving mechanism includes an unloading cantilever (5) and an unloading vertical cylinder (6), the unloading vertical cylinder (6) driving the unloading cantilever (5) to move up and down;

[0071] The first end of the unloading cantilever (5) is connected to the unloading vertical cylinder (6), and the second end of the unloading cantilever (5) is connected to the first horizontal support mechanism for supporting the wafer cassette.

[0072] The horizontal projection of the first horizontal support mechanism is located in the first region (1A) within the wet discharge trough (1);

[0073] The vertical discharge cylinder (6) corresponds to the first side of the wet discharge trough (1).

[0074] The vertical cylinder (6) drives the unloading cantilever (5) to move up and down. The unloading cantilever (5) moves upward to move out of the liquid surface of the unloading wet discharge tank (1) to facilitate the receiving of the wafer. The unloading cantilever (5) moves downward to immerse the wafer in the liquid and keep the wafer wet discharge.

[0075] Specifically, the unloading cantilever (5) is composed of a first unloading vertical section, a first unloading horizontal section, a second unloading vertical section, and a first horizontal support mechanism for supporting the wafer box connected in sequence; the lower end of the first unloading vertical section is connected to the unloading vertical cylinder (6).

[0076] Furthermore, the unloading transfer mechanism includes an unloading transverse screw module (7), an unloading lifting cylinder (8), and an unloading lifting arm beam (9). The unloading transfer mechanism corresponds to the second side of the unloading wet discharge trough (1), and the first side and the second side of the unloading wet discharge trough (1) are opposite sides.

[0077] The first end of the unloading lifting arm beam (9) is connected to the unloading lifting cylinder (8), and the second end of the unloading lifting arm beam (9) is connected to the second horizontal support mechanism for supporting the wafer cassette.

[0078] The horizontal projection of the second horizontal support mechanism is located within the wet discharge trough (1);

[0079] The unloading lifting cylinder (8) drives the unloading lifting arm beam (9) to move up and down;

[0080] The unloading transverse screw module (7) is connected to the unloading lifting cylinder (8). When the unloading transverse screw module (7) drives the unloading lifting cylinder (8) to move laterally in a straight line, it drives the second horizontal support mechanism to move laterally.

[0081] Furthermore, the wet discharge tank (1) also includes a second region (1B) and a third region (1C);

[0082] The unloading lateral movement screw module (7) drives the second horizontal support mechanism with wafer box to move laterally from the first area (1A) of the unloading wet discharge tank (1), through the second area (1B), and then to the third area (1C). The wafer is manually removed in the third area (1C) of the unloading wet discharge tank (1).

[0083] In the wet-in, wet-out mode, after the feeding cantilever (5) receives the wafer immersed in the first area (1A) of the feeding wet-out tank (1), the feeding lifting arm beam (9) will move upward in the first area (1A) of the feeding wet-out tank (1) under the drive of the feeding lifting cylinder (8). When the second horizontal support mechanism moves upward, it will push the wafer box upward, so that the wafer box will be separated from the first horizontal support mechanism of the feeding cantilever (5). Then the feeding transverse screw module (7) will move laterally, and the wafer box will move laterally with the feeding lifting arm beam (9), leaving the first area (1A) of the feeding wet-out tank (1) to realize the transfer of the wafer and enter the third area (1C) of the feeding wet-out tank (1). In the third area, it is convenient for the wafer to be manually removed.

[0084] The purpose of setting up the second area (1B) of the wet unloading tank (1) is to wait for the wafers to be removed manually on the one hand, and to allow the unloading cantilever (5) to receive the next batch of wafers on the other hand.

[0085] The first and second horizontal support mechanisms differ in structure to ensure that they can both successfully lift the wafer. For example, the first horizontal support mechanism can be a four-point support mechanism that supports the four corners of the wafer cassette, while the second horizontal support mechanism can be a central support platform that extends into the middle of the four points of the first horizontal support mechanism to lift the wafer cassette and detach it from the first horizontal support mechanism, facilitating further transfer of the wafer cassette.

[0086] Specifically, the unloading lifting arm beam (9) is composed of a first lifting vertical section, a first lifting horizontal section, and a second lifting vertical section connected in sequence. The lower end of the first lifting vertical section is connected to the unloading lifting cylinder (8), and the lower end of the second lifting vertical section is connected to the second horizontal support mechanism that supports the wafer box.

[0087] Specifically, it has a blanking profile bracket (16) and a blanking transverse screw module (7) placed on the blanking profile bracket (16).

[0088] The position of the wet discharge slot (1) may be relatively high. The discharge profile bracket (16) raises the position of the discharge transverse screw module (7) to ensure that the second horizontal support mechanism of the discharge lifting arm beam (9) is in the slot.

[0089] Furthermore, the wafer drying module also includes:

[0090] The lateral movement cylinder (4) is fixed on the fixing plate (2) of the lateral movement mechanism. The lateral movement cylinder (4) is connected to the cantilever (3) of the lateral movement mechanism. The lateral movement cylinder (41) drives the cantilever (3) of the lateral movement mechanism to move horizontally in a straight line.

[0091] Specifically, during the drying process, the robotic arm clamps the cleaned and dried wafers to the drying area. The first drying area (3A) is a waiting area, where the drying mechanism cantilever (3) waits. After detecting that the wafers clamped by the robotic arm (usually placed in a wafer cassette) are placed on the drying horizontal support structure, the drying lateral movement cylinder (4) drives the drying mechanism cantilever (3) to move laterally, so that the drying mechanism cantilever (3) moves to the second drying area (3B), where the wafers are manually removed. After detecting that the wafers have been removed, the drying lateral movement cylinder (4) drives the drying mechanism cantilever (3) to move laterally in the opposite direction, so that the drying mechanism cantilever (3) returns to the first area (3A) and waits for the next round of wafer drying and unloading.

[0092] See Figures 1-2 Furthermore, the wafer wet entry subsystem includes:

[0093] The wet discharge tank (10) contains liquid;

[0094] The feeding receiving mechanism receives the wafer cassette and immerses the wafer in the wafer cassette in the liquid of the feeding wet discharge tank (10) and is located in the first region (10A) of the feeding wet discharge tank (10);

[0095] The loading and transfer mechanism moves the wafer cassette out of the first area (10A) of the loading wet discharge tank (10) so that the wafer in the wafer cassette can be removed.

[0096] During the wet-in process, the feeding receiving mechanism receives the wafer from the outside and immerses it in the liquid. Then, when it's time for cleaning, the feeding transfer mechanism transfers the wafer to the position where the robotic arm removes it for the next cleaning process. If it's a wet-in / wet-out mode, the wafer is cleaned using cleaning equipment. If it's a wet-in / dry-out mode, the wafer is cleaned using cleaning equipment and then dried using drying equipment.

[0097] Furthermore, the feeding receiving mechanism includes a feeding cantilever (11) and a feeding vertical cylinder (12), the feeding vertical cylinder (12) driving the feeding cantilever (11) to move up and down;

[0098] The first end of the loading cantilever (11) is connected to the loading vertical cylinder (12), and the second end of the loading cantilever (11) is connected to the third horizontal support mechanism for supporting the wafer cassette.

[0099] The horizontal projection of the third horizontal support mechanism is located in the first region (10A) within the wet discharge trough (10);

[0100] The vertical cylinder for feeding (12) corresponds to the first side of the wet discharge tank (10).

[0101] The vertical cylinder (12) drives the loading arm (11) to move up and down. The loading arm (11) moves upward to move out of the liquid surface of the loading wet discharge tank (10) to facilitate the receiving of the wafer. The loading arm (11) moves downward to immerse the wafer in the liquid and keep the wafer wet.

[0102] The loading cantilever (11) is formed by sequentially connecting the first loading vertical section, the first loading horizontal section, the second loading vertical section, and the third horizontal support mechanism that supports the wafer box; the lower end of the first loading vertical section is connected to the loading vertical cylinder (12);

[0103] Furthermore, the feeding transfer mechanism includes a feeding transverse screw module (13), a feeding lifting cylinder (14), and a feeding lifting arm beam (15). The feeding transfer mechanism corresponds to the second side of the feeding wet discharge trough (10), and the first side and the second side of the feeding wet discharge trough (10) are opposite sides.

[0104] The first end of the loading lifting arm beam (15) is connected to the loading lifting cylinder (14), and the second end of the loading lifting arm beam (15) is connected to the fourth horizontal support mechanism for supporting the wafer cassette.

[0105] The horizontal projection of the fourth horizontal support mechanism is located within the wet discharge trough (10);

[0106] The loading lifting cylinder (14) drives the loading lifting arm beam (15) to move up and down;

[0107] The feeding transverse screw module (13) is connected to the feeding lifting cylinder (14). When the feeding transverse screw module (13) drives the feeding lifting cylinder (14) to move laterally in a straight line, it drives the fourth horizontal support mechanism to move laterally.

[0108] Furthermore, the wet discharge tank (10) also includes a second region (10B) and a third region (10C);

[0109] The loading transverse screw module (13) drives the fourth horizontal support mechanism with wafer box to move laterally from the first area (10A) of the loading wet discharge tank (10), through the second area (10B), and then to the third area (10C). In the third area (10C) of the loading wet discharge tank (10), the robotic arm takes away the wafer.

[0110] During the wet loading process, when the loading cantilever (11) receives the wafer immersed in the first area (10A) of the loading wet discharge tank (10), the loading lifting arm beam (15) will move upward in the first area (10A) of the loading wet discharge tank (10) under the drive of the loading lifting cylinder (14). When the fourth horizontal support mechanism moves upward, it will push the wafer box upward, so that the wafer box will be separated from the third horizontal support mechanism of the loading cantilever (11). Then the loading transverse screw module (13) moves laterally, and the wafer box moves laterally with the loading lifting arm beam (15), leaving the first area (10A) of the loading wet discharge tank (10), realizing the transfer of the wafer, and entering the third area (10C) of the loading wet discharge tank (10). In the third area, the robotic arm can easily take away the wafer, realizing the loading.

[0111] The purpose of setting up the second area (10B) of the loading wet discharge tank (10) is to wait for the robotic arm to take away the wafer on the one hand, and to allow the loading cantilever (11) to receive the next batch of wafers on the other hand.

[0112] The third and fourth level support mechanisms differ in structure to ensure that they can both successfully lift the wafer. For example, the third level support mechanism can be a four-point support mechanism that supports the four corners of the wafer cassette, while the fourth level support mechanism can be a central support platform that extends into the middle of the four points of the third level support mechanism to lift the wafer cassette and detach it from the third level support mechanism, facilitating further transfer of the wafer cassette.

[0113] Specifically, the loading lifting arm beam (15) is composed of a third lifting vertical section, a second lifting horizontal section and a fourth lifting vertical section connected in sequence. The lower end of the third lifting vertical section is connected to the loading lifting cylinder, and the lower end of the fourth lifting vertical section is connected to the fourth horizontal support mechanism that supports the wafer box.

[0114] Specifically, it has a feeding profile bracket (17) and a feeding transverse screw module (13) placed on the feeding profile bracket (17).

[0115] This utility model also provides a wafer cleaning system, including the aforementioned wet-in, wet-out and dry-out switching conveying system, and a wafer cleaning process subsystem, wherein the wafer cleaning process subsystem and the mode switching subsystem are connected.

[0116] The wafer cleaning process subsystem includes:

[0117] Wafer cleaning and drying equipment.

[0118] The wafer cleaning process subsystem also includes a robotic arm for wafer gripping and transfer.

[0119] The mode switching subsystem is used for switching between wet-in / wet-out and wet-in / dry-out modes. The subsystem includes a display device that shows a human-machine interface (HMI) where users can select and switch modes.

[0120] In wet-in / wet-out mode, the wafer remains in a humid environment throughout the transfer process, making it suitable for steps requiring wet evaporation. Users can select the wet-in / wet-out mode and set relevant process parameters, such as the humidity and temperature of the wafer cleaning equipment, through a human-machine interface.

[0121] In wet-in, dry-out mode, after the wafers are cleaned in the cleaning equipment, they need to enter the drying equipment to dry out the moisture and maintain a dry environment at the outlet. Users can select the wet-in, dry-out mode through the human-machine interface and set the corresponding process parameters, such as the drying parameters of the drying equipment, such as air speed and temperature.

[0122] The human-machine interface provides an intuitive mode switching button, allowing users to easily switch between wet-in / wet-out mode and dry-out mode.

[0123] When switching modes, the system automatically adjusts the relevant process parameters of the wafer cleaning system. For example, switching to wet-in / wet-out mode will adjust the process parameters accordingly, and vice versa. Furthermore, users can adjust the process parameters through the human-machine interface. Switching to wet-in / wet-out mode only requires activating the equipment related to the wet-in / wet-out process, such as disabling the drying equipment and drying mechanism; similarly, switching to wet-in / dry-out mode only requires activating the equipment related to the wet-in / dry-out process, such as disabling the wet-out mechanism, ensuring no interference between the two modes.

[0124] Monitoring devices are installed on key equipment components such as the wafer cleaning process subsystem, wafer transfer speed (e.g., robotic arm speed), and process parameters such as humidity and temperature. The monitoring data is transmitted in real-time to the display device of the mode switching subsystem for display. Users can understand the process progress through the displayed monitoring data and promptly identify potential problems. Furthermore, the mode switching subsystem generates a process report based on the monitoring data, recording the wafer transfer history and process parameters for easy data analysis and traceability.

[0125] As can be seen, this utility model integrates dry and wet exit mechanisms within a single compact frame, allowing for free switching between operating modes without mutual interference, adapting to different process requirements. It can share wet loading and process cleaning equipment, reducing equipment costs. Through an intuitive human-machine interface, users can easily switch between wet and dry wafer entry / exit, reducing operation time and complexity, and improving process efficiency. Furthermore, changing the switching from between two sets of equipment to switching within the same set helps ensure wafer quality during transport, reducing product defects caused by improper operation. Moreover, the dry exit mechanism is positioned above the wet exit mechanism, integrating the two mechanisms, saving equipment space, and requiring personnel to retrieve both dry and wet exit wafers from a single area, reducing operational complexity.

[0126] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A conveying system that switches between wet inlet / wet outlet and dry outlet, characterized in that, It includes a wafer wet entry subsystem, a wafer wet exit dry exit subsystem, and a mode switching subsystem, wherein the wafer wet entry subsystem and the wafer wet exit dry exit subsystem are both connected to the mode switching subsystem; The wafer wet / dry output subsystem includes a wafer wet output module and a wafer dry output module. The wafer wet output module includes: A wet discharge tank containing liquid; The unloading receiving mechanism receives a wafer cassette and immerses the wafers in the liquid of the unloading wet outlet tank and is located in the first area of ​​the unloading wet outlet tank; The unloading and transfer mechanism moves the wafer cassette out of the first area of ​​the unloading wet outlet tank so that the wafer in the wafer cassette can be removed. The wafer drying module is positioned above the wet discharge tank and includes: Drying mechanism fixing plate; The cantilever of the drying mechanism has its upper end connected to the drying mechanism fixing plate, and its lower end has a horizontal drying support structure that supports the wafer cassette.

2. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 1, characterized in that, The material receiving mechanism includes a material unloading cantilever and a material unloading vertical cylinder, and the material unloading vertical cylinder drives the material unloading cantilever to move up and down; The first end of the unloading cantilever is connected to the unloading vertical cylinder, and the second end of the unloading cantilever is connected to the first horizontal support mechanism for supporting the wafer cassette. The horizontal projection of the first horizontal support mechanism is located in the first area within the wet discharge trough; The vertical discharge cylinder corresponds to the first side of the wet discharge trough.

3. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 2, characterized in that, The material transfer mechanism includes a material transfer screw module, a material lifting cylinder and a material lifting arm beam. The material transfer mechanism corresponds to the second side of the material wet discharge trough, and the first side and the second side of the material wet discharge trough are opposite sides. The first end of the unloading lifting arm beam is connected to the unloading lifting cylinder, and the second end of the unloading lifting arm beam is connected to the second horizontal support mechanism for supporting the wafer cassette. The horizontal projection of the second horizontal support mechanism is located within the wet discharge trough; The unloading lifting cylinder drives the unloading lifting arm beam to move up and down; The unloading transverse lead screw module is connected to the unloading lifting cylinder. When the unloading transverse lead screw module drives the unloading lifting cylinder to move laterally in a straight line, it drives the second horizontal support mechanism to move laterally.

4. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 1, characterized in that, The wafer drying module also includes: A lateral movement cylinder is fixed to the drying mechanism mounting plate and connected to the drying mechanism cantilever. The lateral movement cylinder drives the drying mechanism cantilever to move horizontally in a straight line.

5. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 1, characterized in that, The wafer wet entry subsystem includes: A wet discharge tank for feeding, wherein the wet discharge tank for feeding contains liquid; A feeding receiving mechanism receives a wafer cassette and immerses the wafers in the liquid of the feeding wet discharge tank, and is located in the first region of the feeding wet discharge tank; The loading and transfer mechanism moves the wafer cassette out of the first area of ​​the loading wet outlet tank so that the wafer in the wafer cassette can be removed.

6. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 5, characterized in that, The feeding receiving mechanism includes a feeding cantilever and a feeding vertical cylinder, and the feeding vertical cylinder drives the feeding cantilever to move up and down; The first end of the feeding cantilever is connected to the feeding vertical cylinder, and the second end of the feeding cantilever is connected to the third horizontal support mechanism for supporting the wafer cassette. The horizontal projection of the third horizontal support mechanism is located in the first area within the feeding wet discharge tank; The vertical feeding cylinder corresponds to the first side of the wet discharge trough.

7. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 6, characterized in that, The feeding and transfer mechanism includes a feeding transverse screw module, a feeding lifting cylinder and a feeding lifting arm beam. The feeding and transfer mechanism corresponds to the second side of the feeding wet discharge trough, and the first side and the second side of the feeding wet discharge trough are opposite sides. The first end of the loading lifting arm beam is connected to the loading lifting cylinder, and the second end of the loading lifting arm beam is connected to the fourth horizontal support mechanism for supporting the wafer cassette. The horizontal projection of the fourth horizontal support mechanism is located within the feeding wet discharge trough; The loading lifting cylinder drives the loading lifting arm beam to move up and down; The feeding transverse lead screw module is connected to the feeding lifting cylinder. When the feeding transverse lead screw module drives the feeding lifting cylinder to move laterally in a straight line, it drives the fourth horizontal support mechanism to move laterally.

8. The conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 3, characterized in that, The wet discharge tank also includes a second area and a third area; The feeding transverse lead screw module drives the second horizontal support mechanism with the wafer box to move laterally from the first area of ​​the feeding wet discharge tank, through the second area, and then to the third area, where the wafer in the wafer box is taken out in the third area of ​​the feeding wet discharge tank.

9. A conveying system for switching between wet inlet / wet outlet and dry outlet as described in claim 7, characterized in that, The feeding wet discharge tank also includes a second region and a third region; The feeding transverse lead screw module drives the fourth horizontal support mechanism with the wafer box to move laterally from the first area of ​​the feeding wet discharge tank, through the second area, and then to the third area, where the wafer in the wafer box is taken out in the third area of ​​the feeding wet discharge tank.

10. A wafer cleaning system, characterized in that, Includes a wet-in, wet-out, and dry-out switching conveying system as described in any one of claims 1-9, and a wafer cleaning process subsystem, wherein the wafer cleaning process subsystem and the mode switching subsystem are connected; The wafer cleaning process subsystem includes: Wafer cleaning and drying equipment.

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