Packaging module

Abstract

A packaging module is mainly characterized in that a shielding layer is firstly formed on the upper surface of a packaging unit on which a packaging layer is formed, and then a plurality of conductive elements are arranged on the lower surface of the packaging unit, so that the problem that the manufacturing process is blocked due to insufficient suction force of a mechanical arm is solved.

Description

Technical Field

[0001] This application relates to a semiconductor packaging technology, and more particularly to a packaging module. Background Technology

[0002] With the evolution of semiconductor technology, in order to improve electrical quality, most semiconductor products have shielding functions to prevent electromagnetic interference (EMI).

[0003] like Figure 1 As shown, a conventional semiconductor package 1 places a semiconductor chip 11 on a packaging substrate 10, and then covers the semiconductor chip 11 with a packaging colloid 15. A metal layer 19 is formed on the outer surface of the packaging colloid 15 and the side surface of the packaging substrate 10 to protect the semiconductor chip 11 from external EMI through the metal layer 19.

[0004] However, since the existing semiconductor package 1 first sets solder balls 18 on the packaging substrate 10 and then forms the metal layer 19, when the size of the semiconductor package 1 is too large (for example, the size is greater than 7mm*7mm), the process is hindered due to insufficient suction force of the robotic arm.

[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides a packaging module disposed on a carrier plate having multiple openings, comprising: multiple packaging units, wherein each packaging unit is disposed on each of the openings and has opposing first and second surfaces and a side surface connecting the first and second surfaces; a shielding layer formed on the first surface and side surface of each packaging unit; and multiple conductive elements disposed on the second surface of each packaging unit and accommodated in the openings.

[0007] This application also provides a method for manufacturing a packaging module, comprising: providing a plurality of packaging units, wherein each packaging unit has a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface; forming a shielding layer on the first surface and the side surface of each packaging unit; and after forming the shielding layer, disposing a plurality of conductive elements on the second surface of each packaging unit.

[0008] In the aforementioned packaging module and its manufacturing method, the packaging unit includes a substrate, electronic components disposed on the substrate, and a packaging layer covering the electronic components. The substrate is a packaging substrate with a core layer and a circuit layer, or a circuit structure without a core layer. The electronic components are active components, passive components, or a combination of both. The shielding layer is a metal layer.

[0009] In the aforementioned packaging module and its manufacturing method, the manufacturing method of the plurality of packaging units includes: providing an electronic module, which includes a plurality of substrates and electronic components disposed on each of the substrates, and forming a packaging layer covering the electronic components on the substrates; and cutting along each of the substrates to form the plurality of packaging units.

[0010] The aforementioned packaging module and its manufacturing method further include placing the plurality of packaging units onto a carrier to form the shielding layer on the first surface and side surface of each packaging unit. The carrier is an adhesive temporary carrier.

[0011] The aforementioned packaging module and its manufacturing method further include removing the plurality of packaging units from the carrier and reconfiguring them on the carrier plate, so as to provide a plurality of conductive elements on the second surface of each packaging unit. The carrier plate has a plurality of openings, and each packaging unit is correspondingly disposed on each of the openings.

[0012] In the aforementioned packaging module and its manufacturing method, the shielding layer is formed by physical vapor deposition.

[0013] As can be seen from the above, the packaging module of this application mainly involves cutting multiple packaging units with packaging layers into individual pieces to control their size, forming a shielding layer on their upper surface, reconfiguring the multiple packaging units, and setting multiple conductive elements on their lower surface to avoid the problem of process obstruction caused by insufficient suction force of the robotic arm due to the excessive size of the existing packaging units. Attached Figure Description

[0014] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.

[0015] Figure 2 This is a flowchart illustrating the manufacturing process of the packaging module of this application.

[0016] Figures 3 to 7 This is a cross-sectional and planar schematic diagram of the packaging module and its manufacturing method according to this application.

[0017] Explanation of reference numerals in the attached figures

[0018] 1 Semiconductor package

[0019] 10 Packaging substrate

[0020] 11 Semiconductor chips

[0021] 15 Encapsulating colloid

[0022] 18 welding balls

[0023] 19 Metal Layers

[0024] 3 Packaging Unit

[0025] 3a First surface

[0026] 3b Second Surface

[0027] 3C side view

[0028] 30 substrate

[0029] 31 Electronic Components

[0030] 32 encapsulation layer

[0031] 40 load-bearing components

[0032] 51 Shielding layer

[0033] 60 bearing plate

[0034] 600 opening

[0035] 7 Packaging Module

[0036] 71 Conductive Components

[0037] Steps S21 to S25. Detailed Implementation

[0038] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0039] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0040] Please see Figure 2 This is a flowchart illustrating the manufacturing process of the packaging module in this application. Please also refer to... Figures 3 to 7 The diagram shows a cross-sectional and planar view of the packaging module and its manufacturing method as described in this application.

[0041] like Figure 2 and Figure 3 As shown, in step S21, the packaging and order cutting operations are performed.

[0042] In this embodiment, an electronic module is first provided. This electronic module is, for example, a wafer architecture, comprising multiple substrates 30 and electronic components 31 disposed on each substrate 30. The substrate 30 is, for example, a package substrate with a core layer and a circuit layer, or a coreless circuit structure, or other carrier unit suitable for carrying electronic components such as chips, such as a leadframe, without particular limitation. The electronic component 31 is, for example, an active component, a passive component, or a combination of both. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, capacitor, or inductor. Specifically, the electronic component 31 can be electrically connected to the substrate 30 by flip-chip bonding, wire bonding, or other methods.

[0043] Next, an encapsulation process is performed to form an encapsulation layer 32 on the substrate 30 to cover the electronic component. The encapsulation layer 32 is, for example, polyimide (PI), dry film, epoxy resin, etc.

[0044] Then, a cutting operation is performed, cutting along each substrate 30 to separate each substrate 30, thereby forming multiple packaging units 3, and effectively controlling the size of each packaging unit to avoid it being too large. Each packaging unit 3 has a first surface 3a and a second surface 3b opposite to each other and a side surface 3c connecting the first surface 3a and the second surface 3b.

[0045] like Figure 2 and Figure 4 As shown, in step S22, the plurality of packaging units 3 are attached to a carrier 40, such as a wafer architecture. The carrier 40 is an adhesive temporary carrier, such as tape.

[0046] like Figure 2 and Figure 5 As shown, in step S23, a plating operation is performed to form a shielding layer 51 on the outer surface of the plurality of packaging units 3.

[0047] In this embodiment, by means of physical vapor deposition (e.g. sputtering), inert gas (usually argon) ions with a higher specific gravity are accelerated by an electric field to bombard the target material (metal material) of the sputtering source material, thereby causing the target material to be deposited on the outer surface (first surface 3a and side surface 3c) of the packaging unit 3 to form a shielding layer 51 (metal layer).

[0048] like Figure 2 and Figure 6 As shown, in step S24, the plurality of encapsulation units 3 with the shielding layer 51 formed on the outer surface are removed from the carrier 40, and the plurality of encapsulation units 3 are reconfigured on a carrier plate 60.

[0049] In this embodiment, the carrier plate 60 has a plurality of openings 600, and each of the encapsulation units 3 is disposed on each of the openings 600.

[0050] like Figure 2 and Figure 7 As shown, in step S25, a ball-planting operation is performed to obtain the packaging module 7 of this application.

[0051] In this embodiment, a plurality of conductive elements 71, such as solder balls, are implanted on the second surface 3b of each packaging unit 3, and the plurality of conductive elements 71 are accommodated in the opening 600 so that the packaging unit 3 can be subsequently connected to an external device through the plurality of conductive elements 71.

[0052] The multiple encapsulation units 3 that have completed the ball planting can then be removed from the carrier plate 60 using a mobile device (e.g., a robotic arm).

[0053] Through the aforementioned manufacturing method, this application also discloses a packaging module 7 disposed on a carrier plate 60 having multiple openings 600, comprising: multiple packaging units 3, wherein each packaging unit 3 is disposed on each of the openings 600 and has opposing first surfaces 3a and second surfaces 3b and a side surface 3c connecting the first surfaces 3a and second surfaces 3b; a shielding layer 51 formed on the first surface 3a and side surface 3c of each packaging unit 3; and multiple conductive elements 71 disposed on the second surface 3b of each packaging unit 3 and accommodated in the openings 600.

[0054] The packaging unit 3 includes a substrate 30, an electronic component 31 disposed on the substrate 30, and a packaging layer 32 covering the electronic component 31. The substrate 30 is, for example, a packaging substrate with a core layer and a circuit layer, or a circuit structure without a core layer. The electronic component 31 is, for example, an active component, a passive component, or a combination of both. The shielding layer 51 is a metal layer.

[0055] In summary, the packaging module of this application mainly involves cutting multiple packaging units with packaging layers to control their size, forming a shielding layer on their upper surface, reconfiguring the multiple packaging units, and setting multiple conductive elements on their lower surface. This avoids the problem of excessively large packaging unit size and insufficient suction force of the robotic arm caused by setting multiple conductive elements first, cutting and forming the shielding layer in existing packaging units, which leads to process obstruction.

[0056] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A packaging module disposed on a carrier plate having multiple openings, characterized in that, include: Multiple packaging units, wherein each packaging unit is disposed on each opening and has opposing first and second surfaces and a side surface connecting the first and second surfaces; A shielding layer is formed on the first surface and side surface of each of the packaging units; and Multiple conductive elements are disposed on the second surface of each of the packaging units and housed in each of the openings.

2. The packaging module as described in claim 1, characterized in that, The packaging unit includes a substrate, electronic components disposed on the substrate, and a packaging layer covering the electronic components.

3. The packaging module as described in claim 2, characterized in that, The substrate is either a packaged substrate with a core layer and a circuit layer or a circuit structure without a core layer.

4. The packaging module as described in claim 2, characterized in that, The electronic component can be an active component, a passive component, or a combination of both.

5. The packaging module as described in claim 1, characterized in that, The shielding layer is a metal layer.

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