Bypass diode with high heat dissipation performance

Abstract

The utility model discloses a bypass diode with high heat dissipation performance, which relates to the technical field of bypass diodes, and specifically structurally comprises a first frame, a second frame, a third frame and a fourth frame, the second frame and the first frame are arranged at an interval, and a concave part is formed in one end, facing the convex part, of the second frame; a die mounted on the convex portion; one end of the jumper wire is connected with one side of the concave part, the other end is connected with the other side of the concave part, and the middle part of the jumper wire is connected with the upper surface of the crystal grain; the jumper wire is divided into two connecting parts which are respectively matched with the two side edges of the concave part; the fixing parts are arranged between the connecting parts, and the width of the fixing parts is larger than that of the connecting parts. According to the utility model, the technical problem of insufficient heat dissipation performance of the existing bypass diode is solved.

Description

Technical Field

[0001] This utility model relates to the field of bypass diode technology, and in particular to a bypass diode with high heat dissipation performance. Background Technology

[0002] Because bypass diodes are currently mainly used in solar photovoltaic panels, primarily outdoors, and outdoor temperatures are difficult to control, the diodes themselves require better heat dissipation.

[0003] Whether the electrical properties of a packaged diode can meet the customer's standards depends mainly on the die, copper area, solder, and porosity used. A balance needs to be found between these factors to achieve the optimal performance of the packaged material. One factor affecting the electrical properties after packaging is heat dissipation. Existing structures often neglect heat dissipation in their structural design in order to save costs. Utility Model Content

[0004] The purpose of this invention is to provide a bypass diode with high heat dissipation performance, which solves the technical problem of insufficient heat dissipation performance of existing bypass diodes.

[0005] This application discloses a bypass diode with high heat dissipation performance, comprising:

[0006] A first frame, one end of which is provided with a protrusion;

[0007] The second frame is spaced apart from the first frame, and the second frame has a recess at one end facing the protrusion;

[0008] The grains are mounted on the protrusion;

[0009] A jumper wire, one end of which is connected to one side of the recess and the other end of which is connected to the other side of the recess, and the middle part of the jumper wire is connected to the upper surface of the grain;

[0010] The jumper wires are divided into:

[0011] The two connecting parts respectively mate with the two sides of the recess;

[0012] A fixing part is disposed between the connecting parts, and the width of the fixing part is greater than the width of the connecting part.

[0013] This application designs the jumper not only by increasing its area, but also by designing the connection structure of the jumper, thereby improving the heat dissipation performance of the bypass diode.

[0014] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0015] Furthermore, the height of the connecting part is lower than the height of the fixing part. The advantage of this step is that it can better ensure the stability of the structure and also ensure the heat dissipation effect.

[0016] Furthermore, the two sides of the middle part of the fixing part are recessed inward. The advantage of this step is that the fixing part is designed in a way that can save materials while ensuring heat dissipation.

[0017] Furthermore, the end of the first frame away from the protrusion and the end of the second frame away from the concave are both rectangular. The beneficial effect of this step is to increase the heat dissipation area of ​​the first frame and the second frame, which can improve the heat dissipation effect.

[0018] Furthermore, polarity anti-misalignment grooves are provided on the sides of both the first and second frames. The advantage of this step is that it makes it easier to distinguish the polarity during assembly.

[0019] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0020] 1. This application improves the heat dissipation performance of the diode by increasing the area of ​​the frame and the area of ​​the jumper.

[0021] 2. This application designs jumpers, and through specific structural design, it can improve connection stability and heat dissipation. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a bypass diode with high heat dissipation performance according to a specific embodiment of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of the jumper wire structure;

[0025] Figure 3 for Figure 2 Main view of the jumper wire;

[0026] Figure label:

[0027] 1-First frame; 2-Protrusion; 3-Second frame; 4-Concave; 5-Grain; 6-Jumper wire; 7-Polarity error prevention groove;

[0028] 601 - Connecting part; 602 - Fixing part. Detailed Implementation

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0030] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] To better understand the above technical solutions, the following will provide a detailed description of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0033] Example:

[0034] like Figure 1-3 As shown in the figure, this application discloses a bypass diode with high heat dissipation performance. The frame is designed to increase the heat dissipation area, thereby improving the heat dissipation effect. At the same time, the jumper is designed to better transfer heat, thereby improving the heat dissipation effect.

[0035] like Figure 1 As shown, the specific structure of this application includes:

[0036] The first frame 1 has a protrusion 2 at one end, which is subsequently used to place the die. The protrusion design facilitates the assembly of the die.

[0037] The second frame 3 is spaced apart from the first frame 1, and the second frame 3 has a recess 4 at one end facing the protrusion 2. The recess 4 and the protrusion 2 cooperate with each other to complete the assembly of the grains well.

[0038] Grain 5 is mounted on the protrusion 2, and the grain is an existing grain.

[0039] Jumper 6 has one end connected to one side of the recess 4 and the other end connected to the other side of the recess 4. The middle part of jumper 6 is connected to the upper surface of the grain 5. In this application, jumper 6 spans both sides of the recess 4, which can increase the contact area and thus improve the heat dissipation effect.

[0040] To further improve heat dissipation performance, such as Figure 2 , 3 As shown, this application further designs the jumper, wherein the jumper 6 is a one-piece molded part and is divided into:

[0041] The two connecting parts 601 respectively mate with the two sides of the recess 4, and at the same time, the two connecting parts can provide better connectivity, stability and heat dissipation;

[0042] A fixing part 602 is disposed between the connecting parts 601, and the width of the fixing part 602 is greater than the width of the connecting part 601. Compared with existing jumpers, this jumper can better transfer heat and dissipate heat.

[0043] Specifically, the height of the connecting part 601 is lower than the height of the fixing part 602, and the middle part of the jumper is higher, which can better ensure the stability of the overall structure.

[0044] To improve heat dissipation, the two sides of the middle part of the fixing part 602 described in this application are recessed inward, which accelerates the heat dissipation to the surroundings and reduces the temperature of this application.

[0045] In this application, the end of the first frame 1 away from the protrusion 2 and the end of the second frame 3 away from the concave part 4 are both rectangular. Compared with the existing stepped shape, this application increases the copper area, thereby improving heat dissipation performance.

[0046] To avoid polarity errors during installation, this application provides polarity error prevention grooves 7 on the sides of both the first frame 1 and the second frame 3.

[0047] Further explanation is provided regarding this application:

[0048] This application redesigns the existing frame and jumper wires, and further improves heat dissipation performance by increasing the area and designing the jumper wire structure. For example, this application increases the area of ​​the welding foot region at the end of the original frame to improve heat dissipation performance. At the same time, this application also designs the jumper wires to improve heat dissipation performance while ensuring the stability of the structure. In order to facilitate subsequent assembly, this application also provides multiple positioning holes and positioning slots on the first frame and the second frame.

[0049] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A bypass diode with high heat dissipation performance, characterized in that, include: The first frame (1) has a protrusion (2) at one end; The second frame (3) is spaced apart from the first frame (1), and the second frame (3) has a recess (4) at one end facing the protrusion (2). The grain (5) is mounted on the protrusion (2); A jumper wire (6) is connected at one end to one side of the recess (4) and at the other end to the other side of the recess (4). The middle part of the jumper wire (6) is connected to the upper surface of the grain (5). The jumper (6) is divided into: The two connecting parts (601) respectively mate with the two sides of the recess (4); A fixing part (602) is disposed between the connecting parts (601), and the width of the fixing part (602) is greater than the width of the connecting part (601).

2. The bypass diode according to claim 1, characterized in that, The height of the connecting part (601) is lower than the height of the fixing part (602).

3. The bypass diode according to claim 1, characterized in that, The middle part (602) is recessed inward on both sides.

4. The bypass diode according to claim 1, characterized in that, The end of the first frame (1) away from the protrusion (2) and the end of the second frame (3) away from the concave part (4) are both rectangular.

5. The bypass diode according to claim 1, characterized in that, The first frame (1) and the second frame (3) are provided with polarity anti-misalignment grooves (7) on their sides.

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