Thin plate surface polishing device

Abstract

The utility model provides a thin plate surface polishing device, and belongs to the technical field of thin plate machining. The thin plate surface polishing device comprises a polishing assembly and a leveling assembly. In the conveying direction of the thin plate, the leveling assembly is arranged on the front side of the polishing assembly, so that the thin plate can be leveled through the leveling assembly before being polished, concave-convex parts on the surface of the thin plate are reduced or eliminated, the surface of the polished thin plate can be smoother, and the polishing efficiency is improved. Therefore, the problems that part of protruding parts are prone to being excessively polished and part of concave parts are not easy to polish or cannot be polished during polishing due to the fact that concave-convex parts exist on the surface of the thin plate are solved, and the polishing effect of the surface of the thin plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of thin plate processing technology, specifically to a thin plate surface polishing device. Background Technology

[0002] Thin sheets (such as thin steel sheets, thin aluminum sheets, etc.) are usually used as the outer shell or partition of products. They are easy to process and have a wide range of applications.

[0003] After thin plates are manufactured, their surfaces are easily contaminated and corroded due to the influence of external environmental factors. Therefore, before further processing, thin plates usually need to undergo surface polishing to improve the smoothness of their surfaces.

[0004] Existing devices for polishing thin plate surfaces include, for example, an automatic polishing device for thin steel plates of 5G communication enclosures disclosed in patent CN113798976A. This device has a first support frame and a second support frame on a base, and conveying rollers are installed on the first support frame and the second support frame to transport the thin steel plate to be polished. Meanwhile, a polishing box is provided between the first support frame and the second support frame. A polishing motor is provided on one side of the polishing box. A first gear is fixedly connected to the rotating shaft of the polishing motor. A second gear meshing with the first gear is provided at the upper end of the first gear. A third gear meshing with the first gear is provided at the lower end of the first gear. A first round shaft passing through the polishing box is fixedly connected to the second gear. A second polishing roller is fixedly connected to the outer surface of the first round shaft and located inside the polishing box. A third gear is fixedly connected to the second round shaft passing through the polishing box. A first polishing roller is fixedly connected to the outer surface of the second round shaft and located inside the polishing box. A feed port is provided on the side of the polishing box near the first support frame, and a discharge port is provided on the side of the polishing box near the second support frame. A thin steel plate is provided between the second polishing roller and the first polishing roller. In use, the polishing motor drives the first polishing roller and the second polishing roller to rotate, thereby polishing the thin steel plate between them. Although the above structure can achieve surface polishing of thin plates, it only uses two polishing rollers arranged opposite each other on the thin plate to perform polishing treatment, so that the polishing rollers and the thin plate are in linear contact. If the thin plate itself is not flat when unfolded, it will cause the raised parts of the thin plate surface to be over-polished, while the recessed parts cannot be polished or are not polished enough, affecting the polishing effect. Summary of the Invention

[0005] In view of the above-mentioned problems in the prior art, the present invention aims to provide a thin plate surface polishing device, which includes a leveling component and a polishing component. The leveling component is positioned at the front end of the polishing component along the conveying direction of the thin plate, so that the thin plate is first leveled by the leveling component, reducing or eliminating uneven parts on the surface of the thin plate, so that the subsequent polishing component can better polish its surface and improve the polishing effect.

[0006] The specific technical solution is as follows:

[0007] A thin plate surface polishing apparatus includes a polishing assembly, and further includes a leveling assembly located at the front end of the polishing assembly along the conveying direction of the thin plate.

[0008] Furthermore, the polishing assembly includes a polishing box, an upper polishing roller, a lower polishing roller, and a polishing driver. The upper and lower polishing rollers are rotatably mounted in the polishing box and are distributed in parallel layers. The polishing driver is mounted on the polishing box and is poweredly connected to both the upper and lower polishing rollers.

[0009] The leveling assembly includes a leveling frame, a detection rod, an upper pressure roller, a lower pressure roller, and a leveling driver. The upper and lower pressure rollers, arranged in parallel layers, are installed at one end of the leveling frame. The leveling driver is installed on the leveling frame and is poweredly connected to the upper pressure roller. The detection rod is arranged parallel to the lower pressure roller and installed at the other end of the leveling frame. Along the conveying direction of the sheet metal, the detection rod is positioned in front of the lower pressure roller. A trigger switch is installed on the leveling frame, and the detection rod selectively contacts the trigger switch. Furthermore, a lifting driver is installed between the upper pressure roller and the leveling frame.

[0010] In the aforementioned thin plate surface polishing device, both the polishing driver and the leveling driver are servo motors, and the lifting driver is an electric lifting cylinder.

[0011] The above-mentioned thin plate surface polishing device includes an upper polishing roller and a lower polishing roller, each of which includes a rotating shaft and a polishing cylinder. The rotating shaft is rotatably installed in the polishing box, and one end of each rotating shaft extends outside the polishing box. A polishing cylinder is sleeved on each rotating shaft and located inside the polishing box, and the polishing cylinder is keyed to the corresponding rotating shaft.

[0012] In the aforementioned thin plate surface polishing device, each rotating shaft has a driven gear installed at one end extending outside the polishing box, and a driving gear that meshes with each driven gear is installed on the drive shaft of the polishing driver.

[0013] The aforementioned thin plate surface polishing device includes a detection rod comprising a crossbar, a connecting rod, a slider, and a slide rail. The slide rail is installed vertically on the leveling frame, and a slider is slidably disposed on each slide rail. At the same time, a connecting rod is connected to each slider. The crossbar is placed horizontally between the two connecting rods and its two ends are respectively connected to the two connecting rods.

[0014] In the aforementioned thin plate surface polishing device, a trigger switch is disposed above a slide rail, and a limit block is disposed at the upper end of the slide rail. A trigger post is disposed at the top of the slider, and the trigger post selectively contacts the trigger switch.

[0015] In the aforementioned thin plate surface polishing device, the trigger post includes a telescopic sleeve and a spring. The telescopic sleeve includes an outer cylinder, a middle cylinder, and an inner cylinder. The lower end of the outer cylinder is fixed to the slider. The middle cylinder is coaxially sleeved in the outer cylinder. The inner cylinder is coaxially sleeved in the middle cylinder. The spring is disposed inside the telescopic sleeve, and the two ends of the spring abut against the slider and the inner cylinder, respectively.

[0016] In the aforementioned thin plate surface polishing device, the edges of the crossbar near the front side are arranged at an angle along the conveying direction of the thin plate.

[0017] In the aforementioned thin plate surface polishing device, a lifting driver is mounted on a leveling frame and arranged vertically downwards. The leveling frame is also provided with a guide rail arranged in the vertical direction. A sliding seat is slidably mounted on the guide rail. The sliding seat is connected to the drive shaft of the lifting driver. The upper pressure roller is rotatably mounted on the sliding seat. The leveling driver is mounted on the sliding seat and is poweredly connected to the upper pressure roller.

[0018] In the aforementioned thin plate surface polishing device, a cleaning component is also provided on the leveling frame and on the side of the detection rod away from the lower pressure roller. The cleaning component includes a cleaning frame and brushes. The cleaning frame is placed horizontally on the leveling frame, and the brushes are installed on the cleaning frame.

[0019] The positive effects of the above technical solution are:

[0020] The aforementioned thin plate surface polishing device, by setting up a leveling component and a polishing component, and installing the leveling component in front of the polishing component along the conveying direction of the thin plate, allows the thin plate to be leveled by the leveling component before polishing, reducing or eliminating uneven parts on the surface of the thin plate. This ensures that the surface of the thin plate can maintain its flatness before polishing, avoiding the problem that some raised parts are over-polished while some recessed parts are under-polished or not polished at all during polishing due to uneven parts on the surface of the thin plate, thus effectively ensuring the polishing effect of the thin plate surface. Attached Figure Description

[0021] Figure 1 This is a structural diagram of an embodiment of a thin plate surface polishing device according to the present invention;

[0022] Figure 2 This is a structural diagram from one perspective of a preferred embodiment of the present invention;

[0023] Figure 3 for Figure 2 Enlarged view of part A in the middle.

[0024] In the attached diagram: 1. Polishing assembly; 11. Polishing box; 12. Upper polishing roller; 13. Lower polishing roller; 2. Leveling assembly; 21. Leveling frame; 22. Detection rod; 23. Upper pressure roller; 24. Lower pressure roller; 25. Leveling driver; 26. Trigger switch; 27. Lifting driver; 28. Guide rail; 29. ​​Sliding seat; 221. Crossbar; 222. Connecting rod; 223. Slider; 224. Slide rail; 225. Limit block; 226. Trigger post; 2261. Telescopic sleeve; 2262. Spring; 3. Cleaning assembly; 31. Cleaning frame; 32. Brush bristles. Detailed Implementation

[0025] To make the technical means, creative features, objectives, and effects of this utility model easier to understand, the following embodiments are provided in conjunction with the appendix. Figure 1 To be continued Figure 3 The technical solution provided by this utility model is described in detail, but the following content is not intended to limit this utility model.

[0026] Figure 1 This is a structural diagram of an embodiment of a thin plate surface polishing device according to the present invention. Figure 1 As shown, the thin plate surface polishing device provided in this embodiment includes a polishing component 1 and a leveling component 2. Along the conveying direction of the thin plate, the leveling component 2 is located at the front end of the polishing component 1. That is, when the thin plate is conveyed, the thin plate is first leveled by the leveling component 2 to reduce or eliminate the uneven parts on the surface of the thin plate and improve the flatness of the surface of the thin plate. The leveled thin plate then enters the polishing component 1 for polishing, thereby eliminating the problem of the uneven parts on the surface of the thin plate affecting the polishing, avoiding the problem of local over-polishing due to protrusions and the problem of some areas not being polished or not polished enough due to depressions, and improving the polishing effect of the thin plate surface.

[0027] Specifically, the polishing assembly 1 includes a polishing box 11, an upper polishing roller 12, a lower polishing roller 13, and a polishing driver. During installation, both the upper polishing roller 12 and the lower polishing roller 13 are rotatably mounted in the polishing box 11. The upper polishing roller 12 and the lower polishing roller 13 are arranged in parallel layers, with a gap between them. The thin plate to be polished passes through the gap between them, so that when the thin plate moves relative to the upper polishing roller 12 and the lower polishing roller 13, the upper and lower surfaces of the thin plate can be polished by the upper polishing roller 12 and the lower polishing roller 13 respectively, meeting the surface polishing requirements of the thin plate. In addition, the polishing driver is mounted on the polishing box 11 and is poweredly connected to both the upper polishing roller 12 and the lower polishing roller 13, that is, the polishing driver provides driving force for the operation of the upper polishing roller 12 and the lower polishing roller 13.

[0028] Specifically, the leveling assembly 2 includes a leveling frame 21, a detection rod 22, an upper pressure roller 23, a lower pressure roller 24, and a leveling driver 25. During assembly, the upper pressure roller 23 and the lower pressure roller 24, arranged vertically and parallel to each other, are installed at one end of the leveling frame 21. The leveling frame 21 provides a mounting carrier for the upper pressure roller 23 and the lower pressure roller 24, ensuring they are parallel and arranged vertically. A gap is provided between the upper pressure roller 23 and the lower pressure roller 24 to allow thin plates to pass through. When the thin plate passes through this gap, it is rolled by the upper and lower pressure rollers, flattening any uneven areas on the surface. It is worth noting that since this device processes thin plates, rolling is a viable method for leveling. Furthermore, the leveling driver 25 is mounted on the leveling frame 21 and poweredly connected to the upper pressure roller 23. This means the leveling driver 25 can drive the upper pressure roller 23 to rotate, providing the driving force for the thin plate during the leveling process. Additionally, the detection rod 22 is arranged parallel to the lower pressure roller 24, ensuring that the rear detection rod 22 completely covers the surface of the thin plate, achieving omnidirectional detection. Moreover, the detection rod 22 is mounted at the other end of the leveling frame 21 and positioned in front of the lower pressure roller 24 along the conveying direction of the thin plate. This means that after the detection rod 22 completes its detection, the thin plate enters the gap between the upper pressure roller 23 and the lower pressure roller 24 for leveling. In addition, a trigger switch 26 is provided on the leveling frame 21, and the detection rod 22 selectively contacts the trigger switch 26. When the uneven part of the thin plate passes the detection rod 22, since the height of the platform used to support the thin plate on the leveling frame 21 remains unchanged, the total height of the thin plate after being placed on the leveling frame 21 will increase, causing the thin plate to contact the detection rod 22. At this time, the detection rod 22 will contact the trigger switch 26, realizing the leveling operation. If the thin plate does not contact the detection rod 22, the detection rod 22 will not contact the trigger switch 26, and no leveling operation is required, avoiding waste of resources. Furthermore, a lifting driver 27 is also provided between the upper pressure roller 23 and the leveling frame 21. That is, the lifting driver 27 can drive the upper pressure roller 23 to move, realizing the height adjustment of the upper pressure roller 23. This provides the conditions for the lifting driver 27 to drive the upper pressure roller 23 to move downward and squeeze the thin plate when the trigger switch 26 is triggered, thus providing the conditions for the leveling of the thin plate. It is worth noting that since the trigger switch 26 controls the lifting driver 27 to move downward when it is triggered, in this embodiment, the trigger switch 26 is not limited to being connected in series in the driving circuit of the lifting driver 27. That is, when the trigger switch 26 is triggered, the driving circuit of the lifting driver 27 is turned on, and the lifting driver 27 moves downward to realize the leveling operation of the thin plate. Since the circuit scheme of the trigger switch 26 controlling the movement of a component is a conventional scheme on the market, widely used, and common knowledge, its specific circuit will not be described in detail in this embodiment.

[0029] More specifically, the polishing drivers used to drive the upper polishing roller 12 and the lower polishing roller 13, as well as the leveling driver 25 used to drive the upper pressure roller 23, are all servo motors. These are technologically mature, easy to control, and can be purchased and used directly as needed, resulting in lower manufacturing costs. Similarly, the lifting driver 27 is an electric lifting cylinder, which is easy to control via circuitry when triggered by the trigger switch 26. This makes control more convenient, and it can also be purchased and installed directly, reducing manufacturing costs.

[0030] More specifically, both the upper polishing roller 12 and the lower polishing roller 13 in the polishing assembly 1 include a rotating shaft and a polishing cylinder. The rotating shaft is rotatably mounted in the polishing box 11, with one end of each rotating shaft extending outside the polishing box 11 to facilitate subsequent power connection between each shaft and the polishing driver. Furthermore, a polishing cylinder is fitted onto each rotating shaft and inside the polishing box 11. It is worth noting that the polishing material on the polishing cylinder can be any commercially available polishing material; this will not be elaborated upon in this embodiment. Additionally, the polishing cylinder is keyed to the corresponding rotating shaft, allowing the rotating shaft to drive the corresponding polishing cylinder to rotate, thus achieving polishing of the thin plate surface.

[0031] More specifically, a driven gear is installed on one end of each rotating shaft extending outside the polishing box 11. At the same time, a driving gear that meshes with each driven gear is installed on the drive shaft of the polishing driver. Preferably, the driving gear is positioned between the two driven gears, and a reversing gear is also provided between one of the driven gears and the driving gear, so that when the driving gear rotates, the two driven gears can be driven simultaneously, and the rotation directions of the two driven gears are opposite. This allows the thin plate to pass smoothly through the upper polishing roller 12 and the lower polishing roller 13 without jamming.

[0032] Figure 2 This is a structural diagram from one perspective of a preferred embodiment of the present invention; Figure 3 for Figure 2 An enlarged view of section A. (See image below.) Figures 1 to 3As shown, the detection rod 22, mounted on the leveling frame 21, includes a crossbar 221, a connecting rod 222, a slider 223, and a slide rail 224. During installation, the slide rail 224 is vertically mounted on the leveling frame 21, and a slider 223 is slidably mounted on each slide rail 224, allowing the slider 223 to slide vertically along the slide rail 224. Simultaneously, a connecting rod 222 is connected to each slider 223. The crossbar 221 is horizontally placed between the two connecting rods 222, with both ends connected to the two connecting rods 222 respectively. This allows both ends of the crossbar 221 to be connected to the two sliders 223 via the two connecting rods 222. When the protruding part of the thin plate contacts the crossbar 221, the crossbar 221 pushes the slider 223 upwards, thereby contacting the trigger switch 26 and allowing the thin plate to pass over the crossbar 221, preventing jamming.

[0033] More specifically, the trigger switch 26 is positioned above a slide rail 224, and a limit block 225 is provided at the upper end of the slide rail 224 to prevent the slider 223 from excessively moving upward and damaging the trigger switch 26. Additionally, a trigger post 226 is provided at the top of the slider 223. The trigger post 226 can pass past the limit block 225 from the side, meaning the limit block 225 only blocks the slider 223 and not the trigger post 226. This ensures triggering while preventing structural damage caused by excessive movement of the slider 223. In this case, the trigger post 226 selectively contacts the trigger switch 26; that is, after the slider 223 moves upward a predetermined distance, the trigger post 226 contacts the trigger switch 26 and triggers it. When the slider 223 does not move upward, the trigger switch 26 will not trigger.

[0034] More specifically, the trigger post 226 includes a telescopic sleeve 2261 and a spring 2262. The telescopic sleeve 2261 comprises an outer cylinder, a middle cylinder, and an inner cylinder. The lower end of the outer cylinder is fixed to the slider 223, thus installing the telescopic sleeve 2261 on the slider 223. Simultaneously, the middle cylinder is coaxially fitted into the outer cylinder, and the inner cylinder is coaxially fitted into the middle cylinder, achieving three-stage telescopic movement. Furthermore, the spring 2262 is placed inside the telescopic sleeve 2261, with both ends of the spring 2262 abutting against the slider 223 and the inner cylinder, respectively. In other words, the spring 2262 supports the telescopic sleeve 2261, representing the initial state. In the lower position, the telescopic sleeve 2261 is in an extended state under the action of the spring 2262. Subsequently, after contacting the trigger switch 26, if the slider 223 continues to move upward, it is achieved by the retraction of the telescopic sleeve 2261. At this time, the trigger switch 26 can still withstand the force of the trigger post 226 until the slider 223 contacts the limit block 225. After that, the trigger post 226 no longer deforms, and the force on the trigger switch 26 no longer increases, thus avoiding the trigger switch 26 being damaged by excessive pushing. In addition, the deformation of the trigger post 226 can also adapt to the changes in the stroke of the slider 223 caused by the allowable deformation of the thin plate, thus having better adaptability.

[0035] More specifically, along the conveying direction of the thin plate, the edge of the crossbar 221 near the front is arranged at an angle. That is, when the thin plate is conveyed, the first edge of the crossbar 221 that contacts the thin plate is arranged at an angle, forming a guide slope, which facilitates the thin plate to move smoothly to the bottom of the crossbar 221 and lift the crossbar 221. The structural design is more reasonable.

[0036] More specifically, the lifting drive 27 is mounted vertically downwards on the leveling frame 21. A vertically arranged guide rail 28 is also provided on the leveling frame 21, and a sliding seat 29 is slidably mounted on the guide rail 28, such that the sliding direction of the sliding seat 29 on the guide rail 28 is consistent with the direction of movement of the lifting drive 27. The sliding seat 29 is then connected to the drive shaft of the lifting drive 27, allowing the lifting drive 27 to drive the sliding seat 29 to move vertically, providing driving force for the lifting and lowering movement of the sliding seat 29. Furthermore, the upper pressure roller 23 is rotatably mounted on the sliding seat 29, and the leveling drive 25 is mounted on the sliding seat 29 and poweredly connected to the upper pressure roller 23. That is, both the leveling drive 25 and the upper pressure roller 23 are mounted entirely on the sliding seat 29, ensuring that the leveling drive 25 can always provide driving force to the upper pressure roller 23. In addition, it also enables the upper pressure roller 23 to be raised and lowered under the action of the lifting driver 27. That is, when leveling is required, the upper pressure roller 23 can be moved down by the lifting driver 27 to squeeze and level the thin plate, ensuring the leveling effect.

[0037] More specifically, a cleaning assembly 3 is also provided on the leveling frame 21, on the side of the detection rod 22 away from the lower pressure roller 24. The cleaning assembly 3 removes impurities and other debris from the thin plate in front of the detection rod 22. At this time, the cleaning assembly 3 includes a cleaning frame 31 and a brush 32. The cleaning frame 31 is placed horizontally on the leveling frame 21, and the brush 32 is installed on the cleaning frame 31. When the thin plate is conveyed on the leveling frame 21, the brush 32 removes impurities and other debris from the surface of the thin plate, preventing impurities and other debris from interfering with the detection of the detection rod 22. In addition, it also prevents impurities and other debris from pressing on the surface of the thin plate during leveling and causing damage to the thin plate. The structural design is more reasonable.

[0038] The thin plate surface polishing device provided in this embodiment includes a polishing component 1 and a leveling component 2. By setting the leveling component 2 in front of the polishing component 1 in the conveying direction of the thin plate, the thin plate can be leveled by the leveling component 2 before polishing, reducing or eliminating uneven parts on the surface of the thin plate, making the surface of the thin plate to be polished smoother. This avoids the problem that some protruding parts are easily over-polished while some recessed parts are difficult or impossible to polish during polishing due to uneven parts on the surface of the thin plate, thus improving the polishing effect of the thin plate surface.

[0039] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A thin plate surface polishing apparatus, comprising a polishing assembly, characterized in that, It also includes a leveling component, which is located at the front end of the polishing component along the conveying direction of the sheet metal. Furthermore, the polishing assembly includes a polishing box, an upper polishing roller, a lower polishing roller, and a polishing driver. The upper polishing roller and the lower polishing roller are rotatably mounted in the polishing box and are arranged in parallel layers. The polishing driver is mounted on the polishing box and is poweredly connected to both the upper polishing roller and the lower polishing roller. The leveling assembly includes a leveling frame, a detection rod, an upper pressure roller, a lower pressure roller, and a leveling driver. The upper and lower pressure rollers, arranged in parallel and layered configurations, are mounted at one end of the leveling frame. The leveling driver is mounted on the leveling frame and poweredly connected to the upper pressure roller. The detection rod is arranged parallel to the lower pressure roller and mounted at the other end of the leveling frame, positioned in front of the lower pressure roller along the conveying direction of the sheet metal. A trigger switch is provided on the leveling frame, and the detection rod selectively contacts the trigger switch. A lifting driver is provided between the upper pressure roller and the leveling frame.

2. The thin plate surface polishing apparatus according to claim 1, characterized in that, Both the polishing driver and the leveling driver are servo motors, and the lifting driver is an electric lifting cylinder.

3. The thin plate surface polishing apparatus according to claim 1, characterized in that, Both the upper polishing roller and the lower polishing roller include a rotating shaft and a polishing cylinder. The rotating shaft is rotatably mounted in the polishing box, and one end of each rotating shaft extends outside the polishing box. Each rotating shaft and the polishing cylinder is fitted inside the polishing box, and the polishing cylinder is keyed to the corresponding rotating shaft.

4. The thin plate surface polishing apparatus according to claim 3, characterized in that, Each of the rotating shafts is equipped with a driven gear at one end extending outside the polishing box, and a driving gear that meshes with each of the driven gears is mounted on the drive shaft of the polishing driver.

5. The thin plate surface polishing apparatus according to claim 1, characterized in that, The detection rod includes a crossbar, a connecting rod, a slider, and a slide rail. The slide rail is installed vertically on the leveling frame. A slider is slidably disposed on each slide rail. At the same time, a connecting rod is connected to each slider. The crossbar is placed horizontally between two connecting rods and its two ends are respectively connected to the two connecting rods.

6. The thin plate surface polishing apparatus according to claim 5, characterized in that, The trigger switch is positioned above the slide rail, and a limit block is provided at the upper end of the slide rail. A trigger post is provided at the top of the slider, and the trigger post selectively contacts the trigger switch.

7. The thin plate surface polishing apparatus according to claim 6, characterized in that, The trigger post includes a telescopic sleeve and a spring. The telescopic sleeve includes an outer cylinder, a middle cylinder, and an inner cylinder. The lower end of the outer cylinder is fixed to the slider. The middle cylinder is coaxially sleeved in the outer cylinder. The inner cylinder is coaxially sleeved in the middle cylinder. The spring is disposed inside the telescopic sleeve, and the two ends of the spring abut against the slider and the inner cylinder, respectively.

8. The thin plate surface polishing apparatus according to claim 5, characterized in that, Along the conveying direction of the thin plate, the edges of the crossbar near the front side are arranged at an angle.

9. The thin plate surface polishing apparatus according to claim 1, characterized in that, The lifting drive is mounted on the leveling frame and arranged vertically downwards. The leveling frame is also provided with a guide rail arranged in the vertical direction. A sliding seat is slidably mounted on the guide rail. The sliding seat is connected to the drive shaft of the lifting drive. The upper pressure roller is rotatably mounted on the sliding seat. The leveling drive is mounted on the sliding seat and is poweredly connected to the upper pressure roller.

10. The thin plate surface polishing apparatus according to claim 1, characterized in that, A cleaning assembly is also provided on the leveling frame and on the side of the detection rod away from the lower pressure roller. The cleaning assembly includes a cleaning frame and brushes. The cleaning frame is placed horizontally on the leveling frame, and the brushes are installed on the cleaning frame.

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