Cutting fluid circulating system applied to wire cutting machine
By introducing concentration detection and adjustment devices into the cutting fluid circulation system of the online cutting machine, the problem of excessive silicon powder concentration in the cutting fluid was solved, thereby improving cutting quality and production efficiency.
Patent Information
- Application Number
- CN202520119245.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-17
AI Technical Summary
The existing wire EDM cutting fluid circulation system cannot effectively monitor and control the silicon powder concentration, resulting in excessively high silicon powder concentration in the cutting fluid, which affects cutting quality and efficiency.
A cutting fluid circulation system consisting of a supply cylinder, a concentration detection device, and a concentration adjustment device is used to detect the cutting fluid concentration through the first inlet pipe and adjust the cutting fluid concentration in the supply cylinder through the second inlet pipe, thereby achieving real-time monitoring and adjustment of silicon powder concentration.
It improves the cutting quality of silicon materials by the cutting wire, reduces the obstruction of the cutting tool and the probability of the cutting wire breaking, and improves production efficiency.
Smart Images
Figure CN223834821U_ABST
Abstract
Description
Technical Field
[0001] This application relates to wire EDM cooling technology, and more particularly to a cutting fluid circulation system for use in wire EDM machines. Background Technology
[0002] Solar power generation technology is one of the fastest-growing and most dynamic research fields in recent years. Crystalline silicon cells are one of the important components of solar panels, and their quality is crucial. Typically, a slicing machine is used to slice a square rod to obtain silicon wafers, which are then diced into smaller wafers using a dicing machine to manufacture crystalline silicon cells.
[0003] Slicing machines utilize cutting wires for cutting and spray cutting fluid into the cutting area for cooling and to wash away silicon powder adhering to the cutting wires, thus reducing silicon powder on the silicon surface and improving surface quality. The cutting fluid containing silicon powder is filtered and recycled back into the cutting area. However, silicon powder cannot be completely filtered out, and the recycled cutting fluid still contains a certain amount. High concentrations of silicon powder can affect the cutting quality of the silicon material by the cutting wires. Therefore, meeting the required silicon powder concentration in the cutting fluid has a significant impact on cutting efficiency and product quality. However, current cutting fluid circulation systems cannot monitor and control the silicon powder concentration. Summary of the Invention
[0004] To address one of the aforementioned technical deficiencies, this application provides a cutting fluid circulation system for wire EDM machines.
[0005] According to a first aspect of the embodiments of this application, a cutting fluid circulation system for a wire EDM machine is provided, comprising:
[0006] Liquid supply cylinder; the liquid supply cylinder has a first liquid inlet pipe and a second liquid inlet pipe; the first liquid inlet pipe is used to receive the cutting fluid discharged from the wire cutting machine; the second liquid inlet pipe is used to connect to an external cutting fluid supply device;
[0007] A concentration detection device is installed on the first liquid inlet pipe to detect the concentration of the cutting fluid discharged from the wire cutting machine;
[0008] A concentration regulating device is installed on the second liquid inlet pipe to regulate the concentration of the cutting fluid in the liquid supply cylinder.
[0009] The technical solution provided in this application embodiment employs a liquid supply cylinder with a first liquid inlet pipe and a second liquid inlet pipe. The first liquid inlet pipe is used to receive the cutting fluid discharged from the wire cutting machine. The second liquid inlet pipe is used to connect to an external cutting fluid supply device. A concentration detection device is installed on the first liquid inlet pipe to detect the concentration of the cutting fluid discharged from the wire cutting machine. A concentration adjustment device is installed on the second liquid inlet pipe to adjust the concentration of the cutting fluid in the liquid supply cylinder. This solution can detect the silicon powder concentration of the cutting fluid discharged from the cutting chamber of the wire cutting machine and adjust it in time when the concentration is too high to reduce the concentration of silicon powder in the cutting fluid, thereby improving the cutting quality of silicon materials by the cutting wire, alleviating the obstruction of the cutting tool retraction, reducing the probability of wire breakage, and improving production efficiency. Attached Figure Description
[0010] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0011] Figure 1 This is a schematic diagram of the cutting fluid circulation system provided in an embodiment of this application;
[0012] Figure 2 This is a schematic diagram of another cutting fluid circulation system provided in an embodiment of this application;
[0013] Figure 3 The silicon powder adjustment curve of the cutting fluid circulation system provided in the embodiments of this application is shown.
[0014] Figure label:
[0015] 11-Liquid supply cylinder; 12-Cutting chamber; 13-Mass flow meter; 14-Solenoid valve. Detailed Implementation
[0016] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.
[0017] This embodiment provides a cutting fluid circulation system for a wire EDM machine. The system supplies cutting fluid to the machine to cool the cutting area during operation and filters out impurities from the discharged cutting fluid. Furthermore, the system can monitor and adjust the silicon powder concentration in the discharged cutting fluid to ensure the quality of the cutting fluid meets requirements.
[0018] The wire cutting machine can be a squaring machine or a slicing machine. This embodiment only uses the slicing machine as an example.
[0019] like Figure 1 As shown, the cutting fluid circulation system provided in this embodiment includes: a fluid supply cylinder 11, a mass flow meter 13, and a solenoid valve 14. The fluid supply cylinder 11 can be the original fluid supply cylinder 11 in the slicer, or it can be a separately configured fluid supply cylinder 11.
[0020] The liquid supply cylinder 11 has a first liquid inlet pipe and a second liquid inlet pipe. The first liquid inlet pipe is used to receive the cutting fluid discharged from the wire cutting machine. The slicing machine is provided with a cutting chamber 12. The silicon rod is cut by the cutting wire in the cutting chamber 12. The cutting fluid sprayed into the cutting chamber 12 flows downward and is collected by the cutting fluid collection device, and flows to the liquid supply cylinder through the first liquid inlet pipe.
[0021] The second inlet pipe is used to connect to an external cutting fluid supply device, which supplies pure cutting fluid (i.e., cutting fluid without silicon powder) to the supply cylinder through the second inlet pipe. The cutting fluid can be water or pure water.
[0022] A concentration detection device is installed on the first inlet pipe to detect the concentration of the cutting fluid discharged from the wire EDM machine, such as the concentration of silicon powder in the cutting fluid. The concentration detection device is electrically connected to the controller, sending the detected data to the controller for judgment and output of a control signal.
[0023] A concentration regulating device is installed on the second inlet pipe to adjust the concentration of the cutting fluid in the supply cylinder. Specifically, when the detected cutting fluid concentration does not meet the requirements, it is considered that the silicon powder concentration is too high. The controller then sends a control signal to increase the flow rate of pure cutting fluid input to the supply cylinder, thereby reducing the silicon powder concentration in the supply cylinder to meet production needs. Conversely, when the silicon powder concentration in the cutting fluid discharged from the slicing machine meets the requirements, the flow rate of pure cutting fluid input to the supply cylinder can be reduced, thus adjusting the silicon powder concentration in the cutting fluid to a suitable range.
[0024] The technical solution provided in this embodiment employs a liquid supply cylinder with a first liquid inlet pipe and a second liquid inlet pipe. The first liquid inlet pipe is used to receive the cutting fluid discharged from the wire cutting machine. The second liquid inlet pipe is used to connect to an external cutting fluid supply device. A concentration detection device is installed on the first liquid inlet pipe to detect the concentration of the cutting fluid discharged from the wire cutting machine. A concentration adjustment device is installed on the second liquid inlet pipe to adjust the concentration of the cutting fluid in the liquid supply cylinder. This solution can detect the silicon powder concentration of the cutting fluid discharged from the cutting chamber of the wire cutting machine and adjust it in time when the concentration is too high to reduce the concentration of silicon powder in the cutting fluid, thereby improving the cutting quality of silicon materials by the cutting wire. It can also alleviate the obstruction of the cutting tool retraction, reduce the probability of wire breakage, and improve production efficiency.
[0025] The concentration detection device mentioned above can be a mass flow meter, used to detect the mass flow rate of the cutting fluid, thereby calculating the concentration of silicon powder.
[0026] The aforementioned concentration regulating device can specifically be a solenoid valve, such as a proportional solenoid valve, connected to the output of the controller. The controller sends a control signal to the solenoid valve to adjust its opening. During the slicing process, different amounts of silicon powder are generated at different slicing depths. The functional relationship between different cutter positions and the amount of silicon powder generated is imported into the slicing machine's operating program. The corresponding controller can calculate the overflow rate by monitoring different cutter positions, and feed the signal back to the proportional valve to adjust the overflow rate. New cutting fluid is added according to process requirements to maintain a certain silicon powder concentration and ensure normal cutter retraction.
[0027] In the initial stage of cutting, silicon powder accumulates and no additional water is needed. As the cutting depth increases, the amount of silicon powder produced also increases, and the silicon powder concentration gradually increases. Based on experimental production, a predetermined value is set, maintaining a relatively constant ratio between cutting depth and silicon powder production. Different overflow rates are set according to different amounts of silicon powder to ensure a constant silicon powder concentration.
[0028] A mass flow meter is installed in the water inlet pipe (i.e., the second inlet pipe) of the liquid supply cylinder to detect the silicon powder concentration. The detected value is directly fed back to the water inlet program to adjust the water flow rate and ensure that the silicon powder concentration is consistent.
[0029] Using the above technical solution, the cutting fluid can circulate inside the slicer.
[0030] A dynamic overflow displacement process and apparatus are used to control silicon powder concentration, ensuring consistent concentration for continuous operation without production line shutdown. This application focuses on achieving consistent silicon powder concentration through an overflow process, enabling uninterrupted production and improved efficiency.
[0031] Example: If the system sets the silicon powder concentration to 2.5%, adjust the concentration as needed based on the cutting depth to maintain a constant concentration. See the table below for details. Figure 3 .
[0032]
[0033] The technical solution provided in this embodiment sets the overflow flow rate according to the feed position (cutting depth) and achieves constant silicon powder concentration cutting control through process preset. The silicon powder concentration control principle includes two schemes: First, based on the silicon rod length, kerf size, etc., the theoretical water replenishment amount is calculated, and the overflow flow rate is set in the slicing machine's CNC program formula, with different overflow flow rates corresponding to different cutting feed positions. Second, the silicon powder concentration is detected by a mass flow meter, and a feedback signal is sent based on the detection data. A feedback loop is set up, and a fine-tuning command for the clear liquid replenishment amount is issued to the corresponding control point (i.e., controlling the solenoid valve opening). The silicon powder concentration setting is adjusted according to actual working conditions, and the ratio of cutting depth to silicon powder production is relatively constant, adjusted as needed.
[0034] For the aforementioned cutting fluid circulation system, a raw fluid pool can also be installed, connected to the outlet pipe of the supply cylinder. The cutting fluid from the supply cylinder can be discharged into the raw fluid pool for sedimentation and filtration. This solution allows for simultaneous filtration of multiple slicing machines, with the filtered cutting fluid simultaneously circulated back to each slicing machine, achieving a large-scale circulation.
[0035] Furthermore, such as Figure 2 As shown, the cutting fluid circulation system also includes: a raw fluid tank, a filter press system, a mixing tank, and a finished product tank. Both the raw fluid tank and the mixing tank receive the cutting fluid discharged from the raw fluid pool. The cutting fluid discharged from the raw fluid pool can either enter the raw fluid tank or the mixing tank.
[0036] The pressure filtration system is located between the raw fluid tank and the mixing tank. The cutting fluid discharged from the raw fluid tank first enters the pressure filtration system, and after filtration, it enters the mixing tank. New cutting fluid can be added to the mixing tank to compensate for the loss of cutting fluid in the circulation, and acidic or alkaline substances can also be added to adjust parameters such as pH or conductivity of the cutting fluid.
[0037] The finished product tank receives the cutting fluid discharged from the mixing tank and feeds it into the wire EDM machine so that the cutting fluid can be recycled.
[0038] Based on the above scheme, the cutting fluid in the raw fluid pool can be monitored. If the quality is good enough to be directly returned to the slicing machine or only requires preliminary filtration, the cutting fluid in the raw fluid pool can be directly transported to the mixing tank, and then sent back to the slicing machine via the finished product tank. This shortens the flow path of the cutting fluid and improves circulation efficiency. However, when the quality of the cutting fluid in the raw fluid pool is poor, it can be filtered sequentially through the raw fluid tank, pressure filtration system, mixing tank, and finished product tank before being sent back to the slicing machine, ensuring that the cutting fluid returned to the slicing machine meets the usage requirements.
[0039] The above solution can flexibly control the flow path of the cutting fluid. When the quality of the cutting fluid discharged from the slicing machine is good, it can be quickly returned to the slicing machine for reuse, which improves circulation efficiency, reduces the time the cutting fluid stays in other tanks, reduces component material consumption, and thus reduces production costs.
[0040] Based on the above scheme, the mixing tank is connected to the raw material tank via pipeline, allowing the cutting fluid discharged from the raw material tank to directly enter the mixing tank. The cutting fluid in the raw material tank can be monitored; if the cutting fluid quality is high, it can bypass the pressure filtration system and directly enter the mixing tank, improving circulation efficiency.
[0041] Furthermore, the mixing tank can be directly connected to the wire EDM machine via pipeline to supply cutting fluid directly to it. The cutting fluid in the mixing tank can be monitored, and when the quality of the cutting fluid in the mixing tank is high, it can be sent directly to the slicing machine without passing through the finished product tank, further improving circulation efficiency.
[0042] The mass of the cutting fluid can be determined by the concentration of silicon powder in it. A high silicon powder concentration is considered low mass, while a concentration meeting requirements is considered high mass. The silicon powder concentration can be monitored using a density meter.
[0043] The above-mentioned cutting fluid circulation system can simultaneously provide circulating cutting fluid to multiple wire EDM machines. The cutting fluid discharged from multiple wire EDM machines does not pass through the machine's own supply tank, but enters the raw fluid pool through pipelines. The above-mentioned scheme is used to perform filtration, discharge, etc., and then circulates to each wire EDM machine to achieve large-scale circulation of cutting fluid.
[0044] When the silicon powder concentration of the cutting fluid meets the requirements and the conditions for direct supply are met, it can bypass the pressure filtration system and skip a certain liquid tank.
[0045] The above solution can improve the silicon powder concentration in the cutting fluid, thereby meeting the cutting needs of the wire EDM machine and improving production efficiency.
[0046] Furthermore, the performance parameters of the cutting fluid in the finished product tank can be obtained. If the performance parameters do not meet the requirements, the cutting fluid in the mixing tank can be directly supplied to the wire EDM machine. Performance parameters can include acidity / alkalinity, conductivity, etc. When these parameters are not met, the cutting fluid in the mixing tank can be directly supplied to the wire EDM machine to meet its needs. Isolating the finished product tank and then processing the cutting fluid there provides greater flexibility, adapts to various working conditions, reduces downtime, and improves production efficiency.
[0047] Furthermore, at least one of the acidity / alkalinity and conductivity of the cutting fluid in the raw solution pool can be obtained, and when production requirements are not met, the passage between the raw solution pool and the raw solution tank and the mixing tank can be closed, and the cutting fluid in the raw solution tank can be directly supplied to the wire cutting machine, which can also achieve the same technical effect as above.
[0048] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0051] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.
[0052] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. A cutting fluid circulation system for wire EDM machines, characterized in that, include: Liquid supply cylinder; The liquid supply cylinder has a first liquid inlet pipe and a second liquid inlet pipe; The first inlet pipe is used to receive the cutting fluid discharged from the wire cutting machine; The second inlet pipe is used to connect to the external cutting fluid supply equipment; A concentration detection device is installed on the first liquid inlet pipe to detect the concentration of the cutting fluid discharged from the wire cutting machine; A concentration regulating device is installed on the second liquid inlet pipe to regulate the concentration of the cutting fluid in the liquid supply cylinder.
2. The cutting fluid circulation system according to claim 1, characterized in that, The concentration detection device is a mass flow meter, used to detect the mass flow rate of the cutting fluid discharged from the wire EDM machine.
3. The cutting fluid circulation system according to claim 1, characterized in that, The concentration regulating device is a solenoid valve, used to regulate the flow rate of the cutting fluid supplied to the supply cylinder by the external cutting fluid supply equipment.
4. The cutting fluid circulation system according to claim 3, characterized in that, The solenoid valve is a proportional valve.
5. The cutting fluid circulation system according to claim 1 or 2, characterized in that, Also includes: The raw liquid pool is connected to the outlet pipeline of the supply cylinder.
6. The cutting fluid circulation system according to claim 5, characterized in that, Also includes: Raw material tank, filter press system, blending tank and finished product tank; Both the raw material tank and the mixing tank receive the cutting fluid discharged from the raw material pool; The pressure filtration system is located between the raw liquid tank and the mixing tank. The cutting fluid discharged from the raw liquid tank enters the mixing tank after passing through the pressure filtration system. The finished product tank receives the cutting fluid discharged from the mixing tank and feeds the cutting fluid into the wire EDM machine.
7. The cutting fluid circulation system according to claim 6, characterized in that, The mixing tank is connected to the stock solution tank, and the cutting fluid discharged from the stock solution tank can directly enter the mixing tank.
8. The cutting fluid circulation system according to claim 6, characterized in that, The mixing tank is directly connected to the wire EDM machine to supply cutting fluid directly to the machine.