Bonding copper wire surface nickel plating device

Abstract

The utility model discloses a bonding copper wire surface nickel plating device which comprises an electroplating pool, a feeding hole is formed in the inner wall of the electroplating pool in a penetrating mode, a discharging groove is formed in the inner wall of the electroplating pool in a penetrating mode, a bonding copper wire is pulled into a winding assembly to be fixed, and the winding assembly is started to pull and wind the copper wire. A copper wire is subjected to nickel plating work through electrolyte in an electroplating pool, a moving adjusting mechanism is started to adjust the winding position of the copper wire, the moving tension of the copper wire is detected through an adjusting wheel and a shaft penetrating type tension sensor, and a driving assembly is started to drive the copper wire to ascend and descend through a lifting mechanism, a connecting plate, a limiting frame, a fixing ring, the shaft penetrating type tension sensor and the adjusting wheel. The conveying tension of the copper wire can be adjusted by adjusting the conveying tension of the copper wire, the aim of automatically adjusting the conveying tension during nickel plating of the bonding copper wire is achieved, and the problems that the copper wire deviates and is bent due to the fact that the tension of the copper wire is changed during nickel plating conveying, and the nickel plating stability of the copper wire is greatly reduced are solved.

Description

Technical Field

[0001] This utility model relates to the field of bonding copper wire processing technology, and in particular to a device for nickel plating the surface of bonding copper wire. Background Technology

[0002] Bonding copper wire is a fine wire made primarily of metallic copper, typically processed from copper wire with a purity of 99.99%. It features high strength, high toughness, corrosion resistance, high temperature resistance, low cost, good electrical and thermal properties, and a low intermetallic compound growth rate. Furthermore, it offers advantages such as small pad size, good thermal conductivity, high hardness, good ductility, and excellent electrical conductivity.

[0003] During the production and processing of bonding copper wire, nickel plating is required according to the usage requirements. By plating the surface with nickel, the oxidation resistance and bonding stability of copper-based bonding wire can be significantly improved, while the welding performance is improved, making the solder balls easier to control and with excellent morphology.

[0004] When nickel plating equipment electroplats copper wires, it is usually necessary to use a traction device to pull the copper wires into the electroplating bath and perform electroplating on the copper wires during the movement. However, existing nickel plating equipment has difficulty adjusting the tension of the copper wires during the traction process. When the tension of the copper wires changes, it is easy to cause problems such as displacement and bending, which greatly reduces the stability of nickel plating on the copper wires. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a nickel plating device for bonding copper wires, which solves the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A nickel plating apparatus for bonding copper wire includes an electroplating tank with a feed hole and a discharge trough extending through its inner wall. A first auxiliary roller and a second auxiliary roller are rotatably connected to the inner wall of the electroplating tank. A limit frame is fixedly connected to the inner wall of the electroplating tank, and a connecting plate is slidably connected to the inner wall of the limit frame. A fixing ring is fixedly connected to the bottom surface of the connecting plate, and a through-shaft tension sensor is fixedly connected to the inner wall of the fixing ring. The inner wall of the through-shaft tension sensor rotates. The electroplating tank is equipped with an adjusting wheel and a lifting mechanism inside. The lifting mechanism consists of a threaded rod, a threaded sleeve, and a driven wheel. The threaded rod is rotatably connected to the inner wall of the electroplating tank and to the inner wall of the limiting frame. The threaded sleeve is fixedly connected to the surface of the connecting plate, and the inner wall of the threaded sleeve is threadedly connected to the surface of the threaded rod. The inner wall of the driven wheel is fixedly connected to the surface of the threaded rod. A driving assembly is provided on the top surface of the electroplating tank, a moving adjusting mechanism is provided on the left side of the electroplating tank, and a winding assembly is provided on the left side of the electroplating tank.

[0008] Preferably, the drive assembly consists of a fixed frame, a first servo motor, a drive wheel, and a transmission belt. The fixed frame is fixedly connected to the top surface of the electroplating tank, the first servo motor is fixedly connected to the inner wall of the fixed frame, the inner wall of the drive wheel is fixedly connected to the output end of the first servo motor, the transmission belt meshes with the inner wall of the drive wheel, and the transmission belt meshes with the inner wall of the driven wheel.

[0009] Preferably, the moving adjustment mechanism consists of a linear motor and a guide ring. The linear motor is fixedly connected to the left side of the electroplating tank, and the guide ring is fixedly connected to the moving end of the linear motor.

[0010] Preferably, the winding assembly consists of a fixed plate, a second servo motor, and a winding roller. The fixed plate is fixedly connected to the left side of the electroplating tank, the second servo motor is fixedly connected to the front side of the fixed plate, and the output end of the second servo motor is rotatably connected to the inner wall of the fixed plate. The winding roller is rotatably connected to the inner wall of the fixed plate, and the winding roller is fixedly connected to the output end of the second servo motor.

[0011] Preferably, there are multiple limiting frames, and all of the multiple limiting frames are located inside the electroplating tank.

[0012] Preferably, the connecting plate is rectangular and made of metal.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This nickel plating device for bonded copper wires draws the bonded copper wires into the winding assembly and fixes them inside. The winding assembly is then activated to wind the copper wires, and nickel plating is performed on the copper wires using the electrolyte inside the electroplating tank. The moving adjustment mechanism is activated to adjust the winding position of the copper wires. The tension of the moving copper wires is detected by the adjusting wheel and the through-shaft tension sensor. The drive assembly is activated to drive the copper wires to move up and down via the lifting mechanism, connecting plate, limit frame, fixing ring, through-shaft tension sensor, and adjusting wheel, thus adjusting the conveying tension of the copper wires. This achieves the goal of automatically adjusting the conveying tension of the bonded copper wires during nickel plating, avoiding the problem of copper wire deviation and bending caused by tension changes during nickel plating, which greatly reduces the stability of the nickel plating process. Attached Figure Description

[0014] Figure 1 This is an isometric drawing of the structure of this utility model;

[0015] Figure 2 This is an enlarged view of the structure at point A of this utility model;

[0016] Figure 3 This is an enlarged view of the structure at point B of this utility model;

[0017] Figure 4 This is a left sectional view of the structure of this utility model;

[0018] Figure 5 This is an enlarged view of the structure at point C of this utility model.

[0019] In the diagram: 1. Electroplating tank; 2. Feed hole; 3. Discharge trough; 4. First auxiliary roller; 5. Second auxiliary roller; 6. Limiting frame; 7. Connecting plate; 8. Fixing ring; 9. Through-shaft tension sensor; 10. Adjusting wheel; 11. Threaded rod; 12. Threaded sleeve; 13. Driven wheel; 14. Fixing frame; 15. First servo motor; 16. Driving wheel; 17. Transmission belt; 18. Linear motor; 19. Guide ring; 20. Fixing plate; 21. Second servo motor; 22. Take-up roller. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Reference Figure 1-5A nickel plating device for bonding copper wire includes an electroplating tank 1. An inlet hole 2 and an outlet groove 3 are perforated through the inner wall of the electroplating tank 1. A first auxiliary roller 4 and a second auxiliary roller 5 are rotatably connected to the inner wall of the electroplating tank 1. Multiple limit frames 6 are fixedly connected to the inner wall of the electroplating tank 1, all located inside the electroplating tank 1, and are used to limit the lifting stability of a connecting plate 7, improving the lifting stability of the connecting plate 7. The connecting plate 7 is slidably connected to the inner wall of the limit frame 6. The connecting plate 7 is rectangular and made of metal, which provides higher strength, makes it less prone to deformation and damage under stress, and more durable. A fixing ring 8 is fixedly connected to the bottom surface of the connecting plate 7. A through-shaft tension sensor 9 is fixedly connected to the inner wall of the fixing ring 8. An adjusting wheel 10 is rotatably connected to the inner wall of the through-shaft tension sensor 9. A lifting mechanism is provided inside the electroplating tank 1, consisting of a threaded rod 11, a threaded sleeve 12, and a driven wheel. The system consists of 13 components: a threaded rod 11 rotatably connected to the inner wall of the electroplating tank 1 and rotatably connected to the inner wall of the limiting frame 6; a threaded sleeve 12 fixedly connected to the surface of the connecting plate 7, with the inner wall of the threaded sleeve 12 threadedly connected to the surface of the threaded rod 11; and a driven wheel 13 fixedly connected to the surface of the threaded rod 11. These components are used to drive the copper wire to move up and down, facilitating the adjustment of the copper wire's conveying tension. A drive assembly is provided on the top surface of the electroplating tank 1, consisting of a fixed frame 14, a first servo motor 15, a drive wheel 16, and a transmission belt 17. The fixed frame 14 is fixedly connected to the top surface of the electroplating tank 1; the first servo motor 15 is fixedly connected to the inner wall of the fixed frame 14; the inner wall of the drive wheel 16 is fixedly connected to the output end of the first servo motor 15; and the transmission belt 17 meshes with the inner wall of the drive wheel 16 and the inner wall of the driven wheel 13, driving the lifting mechanism to rotate and facilitating lifting and transmission. A moving adjustment mechanism and a winding assembly are provided on the left side of the electroplating tank 1.

[0022] Specifically, the moving adjustment mechanism consists of a linear motor 18 and a guide ring 19. The linear motor 18 is fixedly connected to the left side of the electroplating tank 1, and the guide ring 19 is fixedly connected to the moving end of the linear motor 18. It is used to drive the copper wire to move longitudinally back and forth, so as to adjust the winding uniformity of the copper wire.

[0023] Specifically, the winding assembly consists of a fixed plate 20, a second servo motor 21, and a winding roller 22. The fixed plate 20 is fixedly connected to the left side of the electroplating tank 1, the second servo motor 21 is fixedly connected to the front side of the fixed plate 20, and the output end of the second servo motor 21 is rotatably connected to the inner wall of the fixed plate 20. The winding roller 22 is rotatably connected to the inner wall of the fixed plate 20, and the output end of the winding roller 22 is fixedly connected to the output end of the second servo motor 21. It is used to wind up copper wire, which facilitates the winding and traction of copper wire.

[0024] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0025] In use: First, the bonding copper wire is pulled along the inside of the feed hole 2, above the second auxiliary roller 5, below the first auxiliary roller 4, above the adjusting wheel 10, the inner wall of the discharge trough 3, and the inner wall of the guide ring 19 to the inner wall of the take-up roller 22 for fixation. The second servo motor 21 is started to drive the take-up roller 22 to rotate along the inner wall of the fixed plate 20 to pull and take up the copper wire. When the copper wire passes through the electrolyte inside the electroplating tank 1, nickel plating can be performed on the copper wire. At the same time, the linear motor 18 is started to drive the guide ring 19 and the copper wire to move longitudinally back and forth, so that the take-up position of the copper wire can be adjusted. The tension of the copper wire during movement is adjusted by adjusting the guide ring 19. The tension of the copper wire is transmitted to the through-shaft tension sensor 9 for detection. When the tension of the copper wire changes and needs to be adjusted, the first servo motor 15 is started to drive the drive wheel 16 and the transmission belt 17 to rotate. Through the meshing of the transmission belt 17 with the driven wheel 13, the threaded rod 11 is driven to rotate along the inner wall of the limit frame 6 and the inner wall of the electroplating tank 1. Through the threaded connection between the threaded rod 11 and the threaded sleeve 12, the connecting plate 7 is driven to move up and down along the inner wall of the limit frame 6. The movement of the connecting plate 7 drives the fixed ring 8, the through-shaft tension sensor 9, the adjusting wheel 10 and the copper wire to move up and down, thereby adjusting the conveying tension of the copper wire.

[0026] In summary, this nickel plating device for bonded copper wires draws the bonded copper wires into the winding assembly and fixes them there. The winding assembly is then activated to wind the copper wires, which are then nickel-plated using the electrolyte inside the electroplating tank 1. A moving adjustment mechanism is activated to adjust the winding position of the copper wires. The tension of the moving copper wires is detected by the adjusting wheel 10 and the through-shaft tension sensor 9. The drive assembly is activated to drive the copper wires to move up and down via the lifting mechanism, connecting plate 7, limit frame 6, fixing ring 8, through-shaft tension sensor 9, and adjusting wheel 10. This allows for the adjustment of the conveying tension of the copper wires, achieving the goal of automatically adjusting the conveying tension during nickel plating of the bonded copper wires. This avoids the problem of copper wire deviation and bending caused by tension changes during nickel plating, which greatly reduces the stability of the nickel plating process. This device addresses the problems mentioned in the background art.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A nickel plating apparatus for bonding copper wires, comprising an electroplating bath (1), characterized in that, The electroplating tank (1) has a feed hole (2) through its inner wall and a discharge trough (3) through its inner wall. A first auxiliary roller (4) is rotatably connected to the inner wall of the electroplating tank (1), and a second auxiliary roller (5) is rotatably connected to the inner wall of the electroplating tank (1). A limit frame (6) is fixedly connected to the inner wall of the electroplating tank (1). A connecting plate (7) is slidably connected to the inner wall of the limit frame (6). A fixing ring (8) is fixedly connected to the bottom surface of the connecting plate (7). A through-shaft tension sensor (9) is fixedly connected to the inner wall of the fixing ring (8). An adjusting wheel (10) is rotatably connected to the inner wall of the through-shaft tension sensor (9). (1) An internal lifting mechanism is provided. The lifting mechanism consists of a threaded rod (11), a threaded sleeve (12), and a driven wheel (13). The threaded rod (11) is rotatably connected to the inner wall of the electroplating tank (1) and rotatably connected to the inner wall of the limiting frame (6). The threaded sleeve (12) is fixedly connected to the surface of the connecting plate (7), and the inner wall of the threaded sleeve (12) is threadedly connected to the surface of the threaded rod (11). The inner wall of the driven wheel (13) is fixedly connected to the surface of the threaded rod (11). A driving assembly is provided on the top surface of the electroplating tank (1). A moving adjustment mechanism is provided on the left side of the electroplating tank (1). A winding assembly is provided on the left side of the electroplating tank (1).

2. The nickel plating apparatus for bonding copper wires according to claim 1, characterized in that, The drive assembly consists of a fixed frame (14), a first servo motor (15), a drive wheel (16), and a transmission belt (17). The fixed frame (14) is fixedly connected to the top surface of the electroplating tank (1). The first servo motor (15) is fixedly connected to the inner wall of the fixed frame (14). The inner wall of the drive wheel (16) is fixedly connected to the output end of the first servo motor (15). The transmission belt (17) meshes with the inner wall of the drive wheel (16) and also meshes with the inner wall of the driven wheel (13).

3. The nickel plating apparatus for bonding copper wires according to claim 1, characterized in that, The moving adjustment mechanism consists of a linear motor (18) and a guide ring (19). The linear motor (18) is fixedly connected to the left side of the electroplating tank (1), and the guide ring (19) is fixedly connected to the moving end of the linear motor (18).

4. The nickel plating device for bonding copper wire according to claim 1, characterized in that, The winding assembly consists of a fixed plate (20), a second servo motor (21), and a winding roller (22). The fixed plate (20) is fixedly connected to the left side of the electroplating tank (1). The second servo motor (21) is fixedly connected to the front side of the fixed plate (20), and the output end of the second servo motor (21) is rotatably connected to the inner wall of the fixed plate (20). The winding roller (22) is rotatably connected to the inner wall of the fixed plate (20), and the winding roller (22) is fixedly connected to the output end of the second servo motor (21).

5. The nickel plating apparatus for bonding copper wires according to claim 1, characterized in that, The number of the limiting frames (6) is multiple, and all the limiting frames (6) are located inside the electroplating tank (1).

6. The nickel plating apparatus for bonding copper wires according to claim 1, characterized in that, The connecting plate (7) is rectangular and made of metal.

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