Tester for semiconductor device detection

Abstract

The utility model discloses a tester for semiconductor device detection, which relates to the technical field of semiconductor detection, and comprises a box body, an adjusting assembly is arranged in the box body, the adjusting assembly comprises a motor and a connecting plate, a supporting plate is arranged above the adjusting assembly, a rotating assembly is arranged at the bottom of the supporting plate, and the rotating assembly is connected with the motor. The rotating assembly comprises a rotating rod and a sliding rail, a bearing plate is arranged above the supporting plate, two clamping assemblies are arranged on the upper surface of the bearing plate, and each clamping assembly comprises a fixing plate. Through cooperation of the adjusting assembly, the rotating assembly, the supporting plate and the bearing plate, a motor is started to drive a threaded rod to rotate, a connecting plate moves upwards to drive a semiconductor device to move, then an electric telescopic rod is started to push a sliding block to move front and back, and a rotating disc can rotate; therefore, the height and direction of the semiconductor device can be adjusted, and the accuracy of the test result of the semiconductor device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically a tester for testing semiconductor devices. Background Technology

[0002] In semiconductor device manufacturing, from semiconductor single crystal wafer to the final product, dozens or even hundreds of processes are required. In order to ensure that the product performance is qualified, stable and reliable, the finished product needs to be tested. The equipment used for testing is generally an optical inspection instrument, which is a device based on optical principles to detect common defects encountered in the welding production.

[0003] Traditional semiconductor device testers fix semiconductors on a testing platform for testing. However, this method is inconvenient because it is difficult to adjust the height and orientation of the semiconductor device during testing, which makes it impossible to guarantee the accuracy of the test results. Therefore, we provide a semiconductor device testing instrument to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a test instrument for testing semiconductor devices.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor device testing instrument, comprising a housing, an adjustment assembly inside the housing, the adjustment assembly including a motor and a connecting plate, a support plate above the adjustment assembly, a rotating assembly at the bottom of the support plate, the rotating assembly including a rotating rod and a slide rail, a bearing plate above the support plate, two clamping assemblies on the upper surface of the bearing plate, each clamping assembly including a fixing plate, an L-shaped plate fixedly connected to the upper surface of the housing, and a testing instrument mounted on the bottom surface of the L-shaped plate.

[0006] Preferably, the motor is installed on the inner bottom wall of the housing, and a threaded rod is fixedly connected to the output end of the motor. The outer surface of the threaded rod is threadedly connected to the inner wall of the connecting plate. Two support columns are fixedly connected to the upper surface of the connecting plate, and the upper surfaces of the two support columns are fixedly connected to the bottom surface of the support plate.

[0007] Preferably, two connecting blocks are fixedly connected to the outer surface of the connecting plate, and two limiting grooves are opened on the inner wall of the box. The outer surfaces of the two connecting blocks are slidably connected to the inner walls of the two limiting grooves respectively.

[0008] Preferably, the outer surface of the rotating rod is rotatably connected to the inner wall of the support plate, the upper surface of the rotating rod is fixedly connected to the bottom surface of the bearing plate, a turntable is fixedly connected to the bottom surface of the rotating rod, a first connecting rod is rotatably connected to the bottom surface of the turntable, and a second connecting rod is rotatably connected to the end of the first connecting rod away from the turntable.

[0009] Preferably, the slide rail is fixed to the bottom surface of the support plate, an electric telescopic rod is fixedly connected to the inner side wall of the slide rail, a slider is fixedly connected to the telescopic end of the electric telescopic rod, the outer surface of the slider is slidably connected to the inner wall of the slide rail, and the bottom surface of the slider is fixedly connected to the upper surface of the second connecting rod.

[0010] Preferably, the bottom surface of the fixing plate is fixedly connected to the upper surface of the bearing plate, a tension rod is slidably connected to the inner wall of the fixing plate, a spring is sleeved on the outer surface of the tension rod, the two ends of the spring are fixedly connected to the outer surface of the fixing plate and one end of the turntable, respectively, and a clamping plate is fixedly connected to the other end of the tension rod.

[0011] Beneficial effects:

[0012] Compared with existing technologies, this semiconductor device testing instrument has the following advantages:

[0013] I. This utility model, through the cooperation of the adjustment component, rotating component, support plate and bearing plate, starts the motor to drive the threaded rod to rotate, causing the connecting plate to move upward and drive the semiconductor device to move. Then, the electric telescopic rod is activated to push the slider to move back and forth, so that the turntable can rotate, thereby achieving the effect of adjusting the height and direction of the semiconductor device and improving the accuracy of the semiconductor device test results.

[0014] Second, this utility model utilizes the cooperation between the carrier plate and the clamping assembly to pull the tension rod so that the two clamping plates move away from each other. Then, the semiconductor device is placed on the upper surface of the carrier plate, and the tension rod is released so that the clamping plates clamp the semiconductor device, which is convenient and quick. Attached Figure Description

[0015] Figure 1 This is a three-dimensional front view structural diagram of the present invention;

[0016] Figure 2 This is a three-dimensional structural diagram of the adjustment component of this utility model;

[0017] Figure 3 This is a three-dimensional structural diagram of the rotating component of this utility model;

[0018] Figure 4 This is a three-dimensional structural diagram of the clamping component of this utility model.

[0019] In the diagram: 1. Housing; 2. Adjustment assembly; 201. Motor; 202. Threaded rod; 203. Connecting plate; 204. Connecting block; 205. Limiting groove; 206. Support column; 3. Rotating assembly; 301. Rotating rod; 302. Turntable; 303. First connecting rod; 304. Second connecting rod; 305. Slider; 306. Slide rail; 307. Electric telescopic rod; 4. Support plate; 5. Bearing plate; 6. Clamping assembly; 601. Fixing plate; 602. Tension rod; 603. Spring; 604. Clamping plate; 7. L-shaped plate; 8. Testing instrument. Detailed Implementation

[0020] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0021] See Figures 1-4 A semiconductor device testing instrument includes a housing 1. An adjustment component 2 is provided inside the housing 1. The adjustment component 2 includes a motor 201 and a connecting plate 203. The motor 201 is installed on the inner bottom wall of the housing 1 and is fixed to the inner bottom wall of the housing 1 by bolts, which facilitates the subsequent disassembly and maintenance of the motor 201.

[0022] The output end of the motor 201 is fixedly connected to a threaded rod 202. The outer surface of the threaded rod 202 is threadedly connected to the inner wall of the connecting plate 203. Two support columns 206 are fixedly connected to the upper surface of the connecting plate 203. By utilizing the threaded connection between the threaded rod 202 and the connecting plate 203, the connecting plate 203 can be moved upward when the threaded rod 202 rotates, thereby realizing the function of adjusting the height.

[0023] The upper surfaces of the two support columns 206 are fixedly connected to the bottom surface of the support plate 4. Two connecting blocks 204 are fixedly connected to the outer surface of the connecting plate 203. Two limiting grooves 205 are opened on the inner wall of the box 1. The outer surfaces of the two connecting blocks 204 are slidably connected to the inner walls of the two limiting grooves 205 respectively. The connecting blocks 204 can limit the connecting plate 203 to prevent the connecting plate 203 from rotating with the threaded rod 202, which would affect the normal use of the device.

[0024] A support plate 4 is provided above the adjustment component 2, and a rotating component 3 is provided at the bottom of the support plate 4. The rotating component 3 includes a rotating rod 301 and a slide rail 306. The outer surface of the rotating rod 301 is rotatably connected to the inner wall of the support plate 4. The inner wall of the support plate 4 is provided with a through hole that matches the rotating rod 301, so that the rotating rod 301 can rotate in the through hole, which facilitates the subsequent rotation of the semiconductor device.

[0025] The upper surface of the rotating rod 301 is fixedly connected to the bottom surface of the bearing plate 5. A turntable 302 is fixedly connected to the bottom surface of the rotating rod 301. A first connecting rod 303 is rotatably connected to the bottom surface of the turntable 302. A second connecting rod 304 is rotatably connected to the end of the first connecting rod 303 away from the turntable 302. The slide rail 306 is fixed to the bottom surface of the support plate 4. An electric telescopic rod 307 is fixedly connected to the inner wall of the slide rail 306. A slider 305 is fixedly connected to the telescopic end of the electric telescopic rod 307. The outer surface of the slider 305 is slidably connected to the inner wall of the slide rail 306. The bottom surface of the slider 305 is fixedly connected to the upper surface of the second connecting rod 304. The electric telescopic rod 307 pushes the slider 305 to move back and forth, causing the first connecting rod 303 to drive the turntable 302 to rotate, thereby achieving the effect of rotating the bearing plate 5.

[0026] A support plate 5 is provided above the support plate 4. Two clamping components 6 are provided on the upper surface of the support plate 5. Both clamping components 6 include a fixing plate 601. The bottom surface of the fixing plate 601 is fixedly connected to the upper surface of the support plate 5. The fixing plate 601 and the support plate 5 are welded together with a strong weld to prevent breakage when clamping the semiconductor device, which would affect the subsequent testing of the semiconductor device.

[0027] A tension rod 602 is slidably connected to the inner wall of the fixing plate 601. A spring 603 is sleeved on the outer surface of the tension rod 602. The two ends of the spring 603 are fixedly connected to the outer surface of the fixing plate 601 and one end of the turntable 302, respectively. A clamping plate 604 is fixedly connected to the other end of the tension rod 602. By pulling the tension rod 602, the two clamping plates 604 are moved away from each other. Then, the semiconductor device is placed on the upper surface of the carrier plate 5. The tension rod 602 is released so that the clamping plates 604 clamp the semiconductor device, which is convenient and quick.

[0028] An L-shaped plate 7 is fixedly connected to the upper surface of the housing 1, and a tester 8 is installed on the bottom surface of the L-shaped plate 7. The semiconductor device can be tested by the tester 8.

[0029] Working principle: In use, when adjusting the height and angle of a semiconductor device during testing, the motor 201 is first started to drive the threaded rod 202 to rotate. During the rotation of the threaded rod 202, the connecting plate 203 moves upward, thereby moving the semiconductor device above the support plate 5 upward. Then, the electric telescopic rod 307 is started to drive the second connecting rod 304 and the slider 305 to move back and forth. When the second connecting rod 304 moves, the end of the first connecting rod 303 that contacts the turntable 302 will make a circular motion, thereby driving the support plate 5 to rotate. This achieves the effect of adjusting the height and direction of the semiconductor, which can improve the accuracy of semiconductor device testing. At the same time, all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A tester for testing semiconductor devices, comprising a housing (1), characterized in that: An adjustment assembly (2) is provided inside the housing (1). The adjustment assembly (2) includes a motor (201) and a connecting plate (203). A support plate (4) is provided above the adjustment assembly (2). A rotating assembly (3) is provided at the bottom of the support plate (4). The rotating assembly (3) includes a rotating rod (301) and a slide rail (306). A bearing plate (5) is provided above the support plate (4). Two clamping assemblies (6) are provided on the upper surface of the bearing plate (5). Both clamping assemblies (6) include a fixing plate (601). An L-shaped plate (7) is fixedly connected to the upper surface of the housing (1). A testing instrument (8) is installed on the bottom surface of the L-shaped plate (7).

2. The semiconductor device testing instrument according to claim 1, characterized in that: The motor (201) is installed on the inner bottom wall of the housing (1). The output end of the motor (201) is fixedly connected to a threaded rod (202). The outer surface of the threaded rod (202) is threadedly connected to the inner wall of the connecting plate (203). Two support columns (206) are fixedly connected to the upper surface of the connecting plate (203). The upper surfaces of the two support columns (206) are fixedly connected to the bottom surface of the support plate (4).

3. The semiconductor device testing instrument according to claim 1, characterized in that: Two connecting blocks (204) are fixedly connected to the outer surface of the connecting plate (203), and two limiting grooves (205) are opened on the inner wall of the box (1). The outer surfaces of the two connecting blocks (204) are slidably connected to the inner walls of the two limiting grooves (205) respectively.

4. The semiconductor device testing instrument according to claim 1, characterized in that: The outer surface of the rotating rod (301) is rotatably connected to the inner wall of the support plate (4), the upper surface of the rotating rod (301) is fixedly connected to the bottom surface of the bearing plate (5), the bottom surface of the rotating rod (301) is fixedly connected to a turntable (302), the bottom surface of the turntable (302) is rotatably connected to a first connecting rod (303), and the end of the first connecting rod (303) away from the turntable (302) is rotatably connected to a second connecting rod (304).

5. A semiconductor device testing instrument according to claim 4, characterized in that: The slide rail (306) is fixed to the bottom surface of the support plate (4). An electric telescopic rod (307) is fixedly connected to the inner wall of the slide rail (306). A slider (305) is fixedly connected to the telescopic end of the electric telescopic rod (307). The outer surface of the slider (305) is slidably connected to the inner wall of the slide rail (306). The bottom surface of the slider (305) is fixedly connected to the upper surface of the second connecting rod (304).

6. A semiconductor device testing instrument according to claim 1, characterized in that: The bottom surface of the fixing plate (601) is fixedly connected to the upper surface of the bearing plate (5). A tension rod (602) is slidably connected to the inner wall of the fixing plate (601). A spring (603) is sleeved on the outer surface of the tension rod (602). The two sides of the spring (603) The ends are respectively fixedly connected to the outer surface of the fixed plate (601) and one end of the turntable (302). The other end of the tension rod (602) is fixedly connected to a clamping plate (604).

Images