Moisture-proof structure of chip capacitor

Abstract

The utility model discloses a moisture-proof structure of a chip capacitor. The moisture-proof structure comprises a capacitor shell and mounting ends positioned at two ends of the capacitor shell, the mounting ends cover the end part of the capacitor shell; the lower ends of the mounting ends exceed the capacitor shell; the copper foil sheets are positioned at the lower ends of the side surfaces, which are far away from each other, of the mounting end; the auxiliary heat dissipation structure is located at the lower end of the capacitor shell and comprises a plurality of heat dissipation grooves, and moisture absorption pads are arranged in the heat dissipation grooves; and a plurality of heat conduction rods are arranged at the lower end of the capacitor shell and between the heat dissipation grooves. According to the utility model, the capacitor shell is erected by prolonging the length of the mounting end, so that an air circulation space is formed between the lower end of the capacitor shell and the circuit board, and water vapor conduction between the capacitor shell and the circuit board in a humid environment can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of surface mount capacitor technology, specifically to a moisture-proof structure for surface mount capacitors. Background Technology

[0002] Surface mount capacitors, also known as chip capacitors, are capacitors mounted on printed circuit boards using surface mount technology. Surface mount capacitors are small in size, allowing for compact placement on circuit boards and high assembly efficiency. They possess the basic functions of a capacitor—store electrical energy—and can charge and discharge in circuits, making them suitable for various applications such as filtering, coupling, decoupling, voltage regulation, oscillation, and phase shifting.

[0003] In practical applications, when the humidity in the air is too high, moisture will form a thin film on the surface of the capacitor casing, reducing the surface insulation resistance. Moisture may also penetrate into the capacitor dielectric, further reducing the insulation resistance and affecting the capacitor's insulation performance. In addition, when the internal temperature of the surface mount capacitor is also high, the high temperature and high humidity environment can easily cause electrochemical corrosion at the lead roots, affecting the capacitor's performance. Current technology attempts to reduce the impact of moisture by strategically placing the surface mount capacitors in lower humidity areas, but surface mount capacitors themselves lack moisture-proof structures, and their close mounting to the circuit board results in poor air circulation, easily creating a high temperature and high humidity environment. Therefore, there is room for technological improvement. Utility Model Content

[0004] This invention aims to solve the above-mentioned technical problems that surface mount capacitors lack moisture-proof structures and that surface mount capacitors, when bonded to circuit boards, easily create high-temperature and high-humidity environments, by providing a moisture-proof structure for surface mount capacitors.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: a surface mount capacitor moisture-proof structure, including a capacitor shell and mounting ends located at both ends of the capacitor shell; the mounting ends all cover the ends of the capacitor shell; the lower ends of the mounting ends all extend beyond the capacitor shell; and further includes:

[0006] Copper foil sheets; all copper foil sheets are located at the lower ends of the sides of the mounting end that are far apart from each other;

[0007] Internal electrodes; located inside the capacitor housing, including a dielectric body, wherein the dielectric body is provided with internal electrodes in layers;

[0008] Outer electrode; located inside the mounting end, consisting of a tin layer, a nickel layer, and a flexible terminal from the outside to the inside;

[0009] Auxiliary heat dissipation structure; located at the lower end of the capacitor housing, including several heat dissipation grooves, each groove containing a moisture-absorbing pad; several heat-conducting rods are provided at the lower end of the capacitor housing and between the heat dissipation grooves.

[0010] Furthermore, the lower ends of the mounting ends are all soldered to the circuit board.

[0011] Furthermore, the bottom surface of the copper foil sheets is in contact with the circuit board.

[0012] Furthermore, the capacitor housing is made of thermally conductive silicone.

[0013] Furthermore, all the heat dissipation grooves are elongated strips; the inner side of the moisture-absorbing pad is made of a super-absorbent polymer, and the outer side is wrapped with a protective mesh; the heat-conducting rods are made of metal, and their lower ends are in contact with the circuit board.

[0014] Furthermore, a plurality of reinforcing ribs are evenly provided on the outer side of the capacitor housing, and the reinforcing ribs are fixed on the outer side of the capacitor housing.

[0015] Furthermore, the inner side of the capacitor housing is provided with thermally conductive pads, all of which are made of graphite.

[0016] The advantages of this utility model compared with the prior art are as follows:

[0017] By extending the length of the mounting end to elevate the capacitor casing, an air circulation space is created between its lower end and the circuit board, which can prevent moisture conduction between the capacitor and the circuit board in a humid environment.

[0018] Based on the above structure, a heat dissipation groove is provided at the lower end of the capacitor shell to assist in heat conduction, and a moisture-absorbing pad is added in the heat dissipation groove. This reduces the temperature inside the capacitor shell while preventing moisture conduction, resulting in good moisture-proof and heat dissipation performance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0021] Figure 3 This is a schematic diagram of the auxiliary heat dissipation structure of this utility model.

[0022] Figure 4 This is a schematic diagram of the bottom part of the capacitor shell of this utility model.

[0023] As shown in the figure: 1. Capacitor housing, 2. Mounting end, 3. Copper foil, 4. Dielectric, 5. Internal electrode, 6. Tin layer, 7. Nickel layer, 8. Flexible terminal, 9. Heat dissipation groove, 10. Moisture-absorbing pad, 11. Thermal rod, 12. Reinforcing rib, 13. Thermal pad. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings.

[0025] Example 1, in conjunction with Appendix Figure 1 , 2 3. A surface mount capacitor moisture-proof structure, including a capacitor housing 1 and mounting ends 2 located at both ends of the capacitor housing 1; the lower ends of the mounting ends 2 are soldered to the circuit board, fixing the mounting ends 2 to the corresponding positions on the circuit board, and playing multiple functions such as filtering, coupling, decoupling, voltage stabilization, oscillation, and phase shifting according to actual needs;

[0026] Among them, the capacitor shell 1 is made of thermally conductive silicone, which has good thermal conductivity and can dissipate heat from the inside of the shell in a timely manner to ensure the internal operating temperature.

[0027] A plurality of reinforcing ribs 12 are evenly provided on the outer side of the capacitor housing 1. The reinforcing ribs 12 are fixed to the outer side of the capacitor housing 1. Since the unavoidable temperature difference during use will cause the capacitor housing 1 to bear a certain amount of stress and deformation, the reinforcing ribs 12 can improve the structural strength of the capacitor housing 1 and make it less prone to cracking.

[0028] Mounting ends 2 cover the ends of capacitor housing 1, thereby protecting and securing the ends of capacitor housing 1 to the circuit board.

[0029] The lower ends of mounting ends 2 extend beyond the capacitor housing 1, creating an air circulation space between the lower end of the capacitor housing 1 and the circuit board. This prevents moisture conduction between the capacitor housing 1 and the circuit board in humid environments, thus achieving better moisture protection.

[0030] Combined with appendix Figure 1 , 2 3, also includes copper foil 3; copper foil 3 are all located at the lower ends of the sides of the mounting end 2 that are far apart from each other; the bottom surface of copper foil 3 is in contact with the circuit board; it can expand the contact area between the mounting end 2 and the circuit board, thereby improving the heat conduction efficiency, so that heat can be conducted to the circuit board and dissipated.

[0031] Combined with appendix Figure 2 Internal electrode; located inside the capacitor housing 1, including dielectric 4, with internal electrode 5 layered inside dielectric 4; external electrode; located inside the mounting end 2, including tin layer 6, nickel layer 7, and soft terminal 8 from the outside to the inside.

[0032] A thermal pad 13 is provided on the inner side of the capacitor housing 1. The thermal pad 13 is made of graphite and is located on the outer side of the dielectric 4 to help dissipate the heat inside the capacitor housing 1 to the outside.

[0033] Combined with appendix Figure 3 , 4It also includes an auxiliary heat dissipation structure; located at the lower end of the capacitor housing 1, it includes several heat dissipation grooves 9, each of which is provided with a moisture-absorbing pad 10; at the lower end of the capacitor housing 1 and between the heat dissipation grooves 9, several heat-conducting rods 11 are provided; the heat-conducting rods 11 are located in the space formed between the capacitor housing 1 and the circuit board, which not only assists in heat conduction, but also plays a supporting role for the capacitor housing 1, making its connection with the circuit board stable.

[0034] Specifically, the heat dissipation slots 9 are all elongated to increase the heat dissipation area; the inner side of the moisture-absorbing pad 10 is made of super absorbent polymer, and the outer side is wrapped with a protective net. The protective net has multiple round holes that can catch and hold the moisture inside the moisture-absorbing pad 10 to prevent it from dripping; the super absorbent polymer has good water absorption and can absorb several times its own weight in water, so that the heat dissipation slots 9 can collect moisture near the circuit board while playing a heat dissipation role.

[0035] The heat-conducting rod 11 is made of metal, and its lower end is in contact with the circuit board. The heat-conducting rod 11 can be made of metals such as copper, which has good thermal conductivity and can conduct the heat from the bottom of the capacitor shell 1 to the circuit board and dissipate it.

[0036] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A surface mount capacitor moisture-proof structure, comprising a capacitor housing (1) and mounting ends (2) located at both ends of the capacitor housing (1); characterized in that: The mounting ends (2) all cover the ends of the capacitor housing (1); the lower ends of the mounting ends (2) all extend beyond the capacitor housing (1); and also include: Copper foil (3); the copper foil (3) are all located at the lower ends of the sides of the mounting end (2) that are far apart from each other; Internal electrodes; located inside the capacitor housing (1), including a dielectric body (4), wherein internal electrodes (5) are provided in layers inside the dielectric body (4); The outer electrode is located inside the mounting end (2) and consists of a tin layer (6), a nickel layer (7), and a flexible terminal (8) from the outside to the inside. Auxiliary heat dissipation structure; located at the lower end of the capacitor housing (1), including several heat dissipation grooves (9), each of which is provided with a moisture-absorbing pad (10); several heat-conducting rods (11) are provided at the lower end of the capacitor housing (1) and between the heat dissipation grooves (9).

2. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The lower ends of the mounting ends (2) are all soldered to the circuit board.

3. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The bottom surface of the copper foil sheet (3) is in contact with the circuit board.

4. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The capacitor housing (1) is made of thermally conductive silicone.

5. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The heat dissipation grooves (9) are all elongated strips; the inner side of the moisture-absorbing pad (10) is made of super-absorbent polymer, and the outer side is wrapped with a protective net; the heat-conducting rods (11) are made of metal, and their lower ends are in contact with the circuit board.

6. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The capacitor housing (1) is provided with a plurality of reinforcing ribs (12) evenly distributed on the outside of the capacitor housing (1), and the reinforcing ribs (12) are fixed on the outside of the capacitor housing (1).

7. The surface mount capacitor moisture-proof structure according to claim 1, characterized in that: The capacitor housing (1) has a thermal pad (13) on its inner side, and the thermal pad (13) is made of graphite.

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