Heat dissipation cooling device and new energy automobile
By integrating oil coolers and chip heat sinks into new energy vehicles, the space and cost issues caused by separate installations are solved, achieving efficient heat dissipation and economic benefits.
Patent Information
- Application Number
- CN202423249631.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In existing new energy vehicles, the oil cooler and chip heat sink are set up separately, which takes up a lot of space and has high production costs.
Design a heat dissipation and cooling device that integrates an oil cooler and a chip heat sink. The integration of the oil cooler and the chip heat sink is achieved through cooling grooves and mounting ports on the substrate. Coolant is used to cool the chip and the oil, reducing space occupation and lowering costs.
This technology integrates the oil cooler and the chip heat sink, reducing space requirements and production costs while ensuring effective heat dissipation for both the oil and the chip, thus improving the economic benefits of new energy vehicles.
Smart Images
Figure CN223842964U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, and more specifically, to a heat dissipation and cooling device and a new energy vehicle. Background Technology
[0002] Currently, with the rapid development of new energy vehicles (hybrid vehicles and electric vehicles), people have increasingly higher functional requirements for them. Modern new energy vehicles generally include oil coolers and chip coolers. The oil cooler dissipates heat from the oil (hydraulic oil or lubricating oil) to cool the engine, transmission, or motor, while the chip cooler dissipates heat from the vehicle's internal chips to ensure their operational performance. However, current oil coolers and chip coolers are installed separately, occupying a large space and resulting in high production costs.
[0003] In view of this, designing and manufacturing a heat dissipation and cooling device that occupies little space and has low production cost is particularly important for new energy vehicles, especially in the production of new energy vehicles. Utility Model Content
[0004] The purpose of this invention is to provide a heat dissipation and cooling device that integrates an oil cooler and a chip heat sink, thereby reducing space occupation and production costs while ensuring the heat dissipation effect of the oil and the chip.
[0005] Another objective of this invention is to provide a new energy vehicle that integrates an oil cooler and a chip heat sink, thereby reducing space occupation and production costs while ensuring the heat dissipation effect of the oil and the chip.
[0006] This utility model is achieved by the following technical solution.
[0007] A heat dissipation and cooling device includes a substrate, an oil cooler, and a chip heat sink. The substrate has a cooling tank, the oil cooler is connected to the substrate and covers the outside of the cooling tank, and the oil cooler is in communication with the cooling tank. The substrate has an installation port in communication with the cooling tank, and the chip heat sink is installed in the installation port. The cooling tank is used to allow coolant to flow in to cool the chip heat sink and to supply coolant to the oil cooler.
[0008] Optionally, the substrate has a liquid inlet hole communicating with the cooling tank, and the oil cooler has a first liquid passage hole communicating with the cooling tank. The position of the first liquid passage hole corresponds to the position of the liquid inlet hole.
[0009] Optionally, the oil cooler also has a second liquid passage, which is connected to the cooling tank and is diagonally opposite to the first liquid passage.
[0010] Optionally, the substrate has an oil inlet hole, which is spaced apart from the cooling tank. The oil cooler has a first oil passage hole, which is connected to the oil inlet hole. The oil inlet hole and the first oil passage hole are used to supply oil in sequence.
[0011] Optionally, the substrate has an oil outlet hole, which is spaced apart from the cooling tank. The oil cooler has a second oil passage hole, which is connected to the oil outlet hole. The second oil passage hole and the first oil passage hole are arranged diagonally. The second oil passage hole and the oil outlet hole are used to supply oil to be discharged sequentially.
[0012] Optionally, there are multiple chip heat sinks and mounting ports, with multiple mounting ports spaced apart, and each chip heat sink is installed in one mounting port.
[0013] Optionally, the bottom wall of the cooling tank is provided with a partition wall protruding towards the oil cooler. The partition wall is located between two adjacent installation ports and is used to separate multiple liquid flow channels in the cooling tank. Each liquid flow channel is connected to an installation port.
[0014] Optionally, the oil cooler includes an overlapping top plate, a bottom plate, and multiple heat exchange plates, which are connected in sequence. The top plate is connected to the top of the multiple heat exchange plates, and the bottom plate is connected to the bottom of the multiple heat exchange plates. The bottom plate covers the outside of the cooling tank and is connected to the base plate.
[0015] Optionally, the multiple heat exchange plates include multiple first heat exchange plates and multiple second heat exchange plates, which are arranged alternately in sequence. A first heat exchange plate forms a first heat exchange channel with an adjacent second heat exchange plate and a second heat exchange channel forms with an adjacent second heat exchange plate. The multiple first heat exchange channels are connected in sequence, and the multiple second heat exchange channels are connected in sequence.
[0016] A new energy vehicle includes a vehicle body and the aforementioned heat dissipation and cooling device. The heat dissipation and cooling device includes a substrate, an oil cooler, and a chip heat sink. The substrate has a cooling groove, the oil cooler is connected to the substrate and covers the outside of the cooling groove, and the oil cooler is in communication with the cooling groove. The substrate has an installation port that communicates with the cooling groove, and the chip heat sink is installed in the installation port. The cooling groove is used to allow coolant to flow in for cooling and to supply coolant to the oil cooler. The substrate has an installation hole located outside the covering surface of the oil cooler, and the installation hole is used to install the substrate to the vehicle body.
[0017] The heat dissipation and cooling device and the new energy vehicle provided by this utility model have the following beneficial effects:
[0018] The heat dissipation and cooling device provided by this utility model includes a cooling tank on a substrate, an oil cooler connected to the substrate and covering the cooling tank, and the oil cooler communicating with the cooling tank. The substrate has a mounting port communicating with the cooling tank, and a chip heat sink is installed in the mounting port. The cooling tank is used to supply coolant for cooling the chip heat sink and to supply coolant to the oil cooler. Compared with the prior art, the heat dissipation and cooling device provided by this utility model, by using an oil cooler connected to the substrate and a chip heat sink installed in the mounting port, can achieve integrated operation of the oil cooler and the chip heat sink, reducing space occupation and lowering production costs while ensuring the heat dissipation effect of the oil and the chip.
[0019] The new energy vehicle provided by this utility model includes a heat dissipation and cooling device that can integrate an oil cooler and a chip heat sink, reducing space occupation and production costs while ensuring the heat dissipation effect of oil and chip. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 A schematic diagram of the heat dissipation and cooling device provided in an embodiment of this utility model from one perspective;
[0022] Figure 2 A schematic diagram of the heat dissipation and cooling device provided in an embodiment of this utility model from another perspective;
[0023] Figure 3 An exploded view of the heat dissipation and cooling device provided in an embodiment of this utility model;
[0024] Figure 4 A flow diagram of the coolant in the heat dissipation and cooling device provided in this embodiment of the utility model;
[0025] Figure 5 A flow diagram of the oil in the heat dissipation and cooling device provided in this embodiment of the utility model.
[0026] Icons: 100-Cooling device; 110-Baseboard; 111-Cooling tank; 112-Mounting port; 113-Liquid inlet; 114-Oil inlet; 115-Oil outlet; 116-Partition wall; 117-Liquid flow channel; 120-Oil cooler; 121-First liquid passage; 122-Second liquid passage; 123-First oil passage; 124-Second oil passage; 125-Top plate; 126-Bottom plate; 127-Heat exchange plate; 1271-First heat exchange plate; 1272-Second heat exchange plate; 128-First heat exchange channel; 129-Second heat exchange channel; 130-Fins; 140-Chip heat sink. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of this utility model, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the features in the following embodiments can be combined with each other.
[0033] Please refer to the reference. Figures 1 to 5 This utility model embodiment provides a new energy vehicle (not shown). It can integrate the oil cooler 120 and the chip heat sink 140 into one unit, reducing the space occupied and lowering the production cost while ensuring the heat dissipation effect of the oil and the chip.
[0034] It should be noted that the new energy vehicle includes the vehicle body (not shown) and a heat dissipation and cooling device 100, a chip (not shown), and a drive unit (not shown) installed on the vehicle body. The heat dissipation and cooling device 100 is connected to both the chip and the drive unit. The heat dissipation and cooling device 100 is used to dissipate heat and cool the chip, and it is also used to cool the drive unit through oil. The heat dissipation and cooling device 100 includes an engine, transmission, or motor, and it is used to cool the engine, transmission, or motor through oil.
[0035] The heat dissipation and cooling device 100 includes a substrate 110, an oil cooler 120, and a chip heat sink 140. The oil cooler 120 is connected to the drive device, and the oil in the oil cooler 120 and the drive device can circulate between them. The chip is mounted on the chip heat sink 140. Specifically, the substrate 110 has a cooling tank 111 for supplying coolant. The oil cooler 120 is connected to the substrate 110 and covers the cooling tank 111, sealing it to prevent coolant overflow. The oil cooler 120 communicates with the cooling tank 111, allowing coolant to flow into it, thus supplying coolant to the oil cooler 120 and cooling the oil, which in turn cools the drive device. The substrate 110 has a mounting port 112 that communicates with the cooling tank 111. That is, the bottom wall of the cooling tank 111 has a mounting port 112. The chip heat sink 140 is installed in the mounting port 112. The chip heat sink 140 is used to seal the mounting port 112 to prevent the coolant in the cooling tank 111 from overflowing out through the mounting port 112. The coolant in the cooling tank 111 can exchange heat with the chip through the chip heat sink 140 to achieve the cooling function of the chip.
[0036] In this way, the coolant flowing into the cooling tank 111 can simultaneously cool the chip through the chip heat sink 140 and also enter the oil cooler 120 to cool the oil inside, thus simultaneously reducing the temperature of both the chip and the drive device, ensuring their operational performance and service life. The heat dissipation and cooling device 100 integrates the oil cooler 120 and the chip heat sink 140 into one unit, reducing space occupation, lowering production costs, and improving economic efficiency while ensuring effective heat dissipation for both the oil and the chip.
[0037] Specifically, the substrate 110 has mounting holes (not shown in the figure). The mounting holes are located outside the covering surface of the oil cooler 120. The mounting holes are used to mount the substrate 110 to the vehicle body, thereby mounting the entire heat dissipation and cooling device 100 to the vehicle body to achieve the positioning of the heat dissipation and cooling device 100.
[0038] Preferably, the substrate 110 has a liquid inlet hole 113 communicating with the cooling tank 111, that is, the bottom wall of the cooling tank 111 has a liquid inlet hole 113 for allowing coolant to enter the cooling tank 111. The oil cooler 120 has a first liquid passage hole 121 communicating with the cooling tank 111 and for allowing coolant to enter the oil cooler 120 to achieve the function of supplying coolant to the oil cooler 120. Specifically, the position of the first liquid passage hole 121 corresponds to the position of the liquid inlet hole 113 in the height direction of the heat dissipation and cooling device 100, so that part of the coolant can directly enter the oil cooler 120 through the first liquid passage hole 121.
[0039] Furthermore, the oil cooler 120 is also provided with a second liquid passage 122, which is connected to the cooling tank 111. The coolant in the cooling tank 111, after heat exchange with the chip heat sink 140, can enter the oil cooler 120 through the second liquid passage 122 and be discharged outwards. Specifically, because this part of the coolant has a high temperature (having absorbed heat from the chip), it will not participate in cooling the oil in the oil cooler 120, but will be discharged directly outwards.
[0040] It should be noted that the coolant entering the cooling tank 111 through the inlet hole 113 is divided into two parts. The first part of the coolant directly enters the oil cooler 120 through the first through hole 121 to supply coolant to the oil cooler 120 and cool the oil. The second part of the coolant flows along the cooling tank 111 toward the direction of the second through hole 122. During this process, the second part of the coolant cools the chip heat sink 140 installed in the mounting port 112 to achieve the heat dissipation function of the chip. Afterward, the second part of the coolant enters the oil cooler 120 through the second through hole 122 and is discharged directly to the outside.
[0041] In this embodiment, the oil cooler 120 is generally rectangular in shape. The second liquid passage 122 is diagonally arranged with the first liquid passage 121, that is, the liquid inlet 113 and the second liquid passage 122 are diagonally arranged. This allows the second portion of coolant entering the cooling tank 111 through the liquid inlet 113 to flow a longer distance within the cooling tank 111 before reaching the second liquid passage 122 and entering the oil cooler 120. This prolongs the flow time of the second portion of coolant within the cooling tank 111, ensuring the cooling effect of the second portion of coolant on the chip heat sink 140. However, this is not the only embodiment. In other embodiments, the second liquid passage 122 and the first liquid passage 121 can also be arranged opposite each other on the same side. The specific layout of the second liquid passage 122 and the first liquid passage 121 is not limited.
[0042] Preferably, the substrate 110 has an oil inlet hole 114, which is spaced apart from and independently arranged from the cooling tank 111. The oil cooler 120 has a first oil passage hole 123, which is connected to the oil inlet hole 114. The oil inlet hole 114 and the first oil passage hole 123 are used to supply oil in sequence. The high-temperature oil in the drive device can enter the oil cooler 120 through the oil inlet hole 114 and the first oil passage hole 123, so as to use the first part of the coolant to cool down the high-temperature oil.
[0043] Correspondingly, the substrate 110 is provided with an oil outlet hole 115, which is spaced apart from and independently arranged from the cooling tank 111. The oil cooler 120 is provided with a second oil passage hole 124, which is connected to the oil outlet hole 115. The second oil passage hole 124 and the oil outlet hole 115 are used to supply oil to be discharged in sequence. The oil in the oil cooler 120 can be discharged outward through the second oil passage hole 124 and the oil outlet hole 115, so as to transport the low-temperature oil after cooling to the drive device, thereby realizing the cooling and temperature reduction of the drive device.
[0044] In this embodiment, the oil cooler 120 is rectangular in shape. The second oil passage 124 and the first oil passage 123 are diagonally arranged, that is, the oil inlet 114 and the oil outlet 115 are diagonally arranged. The line connecting the second oil passage 124 and the first oil passage 123 intersects the line connecting the second liquid passage 122 and the first liquid passage 121. That is, the first liquid passage 121, the first oil passage 123, the second liquid passage 122 and the second oil passage 124 are distributed in a rectangular array and are respectively arranged at the four corners of the oil cooler 120 to facilitate the flow direction control of oil and coolant.
[0045] Preferably, there are multiple chip heat sinks 140 and mounting ports 112 (two or more), with multiple mounting ports 112 spaced apart. Each chip heat sink 140 is installed in one mounting port 112, and each chip heat sink 140 is used to install a group of chips. Multiple chip heat sinks 140 work together to simultaneously achieve the heat dissipation and cooling function of multiple groups of chips, thereby improving heat dissipation efficiency.
[0046] Furthermore, a partition wall 116 protrudes from the bottom wall of the cooling tank 111 towards the oil cooler 120. The partition wall 116 is located between two adjacent mounting ports 112 and serves to create multiple liquid flow channels 117 within the cooling tank 111. Each liquid flow channel 117 is connected to one mounting port 112, meaning that the coolant in each liquid flow channel 117 is used to dissipate heat from one chip heat sink 140. Specifically, the partition wall 116 separates the multiple liquid flow channels 117, causing turbulence in the coolant within the cooling tank 111 during flow, thereby improving the heat dissipation effect on the chip heat sink 140.
[0047] In this embodiment, there are two chip heat sinks 140 and two mounting ports 112. A partition wall 116 is disposed between the two mounting ports 112 to create two liquid flow channels 117 within the cooling tank 111. Each liquid flow channel 117 is connected to one mounting port 112. However, this is not the only embodiment. In other embodiments, the number of chip heat sinks 140, mounting ports 112, and liquid flow channels 117 can be three or four. The specific number of chip heat sinks 140, mounting ports 112, and liquid flow channels 117 is not limited.
[0048] The oil cooler 120 includes an overlapping top plate 125, a bottom plate 126, and multiple heat exchange plates 127. The multiple heat exchange plates 127 are connected sequentially, with the top plate 125 connected to the top of the multiple heat exchange plates 127 and the bottom plate 126 connected to the bottom of the multiple heat exchange plates 127. The bottom plate 126 covers the cooling tank 111 and is connected to the base plate 110. Specifically, a first liquid passage 121, a first oil passage 123, a second liquid passage 122, and a second oil passage 124 are all formed on the bottom plate 126 to facilitate the flow of oil and coolant.
[0049] Furthermore, the plurality of heat exchange plates 127 includes a plurality of first heat exchange plates 1271 and a plurality of second heat exchange plates 1272. The plurality of first heat exchange plates 1271 and the plurality of second heat exchange plates 1272 are arranged alternately in sequence. A first heat exchange plate 1271 forms a first heat exchange channel 128 with an adjacent second heat exchange plate 1272, and a second heat exchange channel 129 forms with an adjacent second heat exchange plate 1272. The plurality of first heat exchange channels 128 are sequentially connected, and the plurality of second heat exchange channels 129 are sequentially connected. Specifically, the first heat exchange channel 128 is used for coolant flow, and the second heat exchange channel 129 is used for oil flow. The coolant and oil exchange heat through the first heat exchange plates 1271 or the second heat exchange plates 1272 to achieve the function of cooling the oil.
[0050] In this embodiment, fins 130 are provided in the first heat exchange channel 128. The fins 130 are used to increase the contact area with the coolant and improve the heat exchange efficiency. However, it is not limited to this. In other embodiments, fins 130 can be provided in the second heat exchange channel 129 to increase the contact area with the oil, which can also improve the heat exchange efficiency.
[0051] The heat dissipation and cooling device 100 provided in this embodiment of the utility model has a cooling groove 111 formed on a substrate 110. An oil cooler 120 is connected to the substrate 110 and covers the outside of the cooling groove 111, communicating with the cooling groove 111. The substrate 110 has a mounting port 112 communicating with the cooling groove 111, and a chip heat sink 140 is installed in the mounting port 112. The cooling groove 111 is used to supply coolant to cool the chip heat sink 140 and to supply coolant to the oil cooler 120. Compared with the prior art, the heat dissipation and cooling device 100 provided in this utility model, by using the oil cooler 120 connected to the substrate 110 and the chip heat sink 140 installed in the mounting port 112, can achieve the integration of the oil cooler 120 and the chip heat sink 140, reducing the space occupied and lowering production costs while ensuring the heat dissipation effect of the oil and the chip. This results in high heat dissipation efficiency, good heat dissipation effect, and good economic benefits for new energy vehicles.
[0052] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A heat dissipation and cooling device, characterized in that, The device includes a substrate, an oil cooler, and a chip heat sink. The substrate has a cooling groove, the oil cooler is connected to the substrate and covers the outside of the cooling groove, the oil cooler is in communication with the cooling groove, the substrate has a mounting port in communication with the cooling groove, the chip heat sink is installed in the mounting port, the cooling groove is used to allow coolant to flow in to cool the chip heat sink and to supply coolant to the oil cooler.
2. The heat dissipation and cooling device according to claim 1, characterized in that, The substrate has a liquid inlet hole that communicates with the cooling tank, and the oil cooler has a first liquid outlet hole that communicates with the cooling tank. The position of the first liquid outlet hole corresponds to the position of the liquid inlet hole.
3. The heat dissipation and cooling device according to claim 2, characterized in that, The oil cooler also has a second liquid passage hole, which is connected to the cooling tank and is diagonally opposite to the first liquid passage hole.
4. The heat dissipation and cooling device according to claim 1, characterized in that, The substrate has an oil inlet hole, which is spaced apart from the cooling tank. The oil cooler has a first oil passage hole, which is connected to the oil inlet hole. The oil inlet hole and the first oil passage hole are used to supply oil in sequence.
5. The heat dissipation and cooling device according to claim 4, characterized in that, The substrate has an oil outlet hole, which is spaced apart from the cooling tank. The oil cooler has a second oil passage hole, which is connected to the oil outlet hole. The second oil passage hole and the first oil passage hole are arranged diagonally. The second oil passage hole and the oil outlet hole are used to supply oil to be discharged sequentially.
6. The heat dissipation and cooling device according to any one of claims 1-5, characterized in that, The number of chip heat sinks and mounting ports are both multiple, with the multiple mounting ports spaced apart, and each chip heat sink is installed in one mounting port.
7. The heat dissipation and cooling device according to claim 6, characterized in that, The bottom wall of the cooling tank is provided with a partition wall protruding towards the oil cooler. The partition wall is located between two adjacent mounting ports and is used to separate multiple liquid flow channels in the cooling tank. Each liquid flow channel is connected to one of the mounting ports.
8. The heat dissipation and cooling device according to claim 1, characterized in that, The oil cooler includes an overlapping top plate, a bottom plate, and multiple heat exchange plates, which are connected in sequence. The top plate is connected to the top of the multiple heat exchange plates, and the bottom plate is connected to the bottom of the multiple heat exchange plates. The bottom plate covers the cooling tank and is connected to the base plate.
9. The heat dissipation and cooling device according to claim 8, characterized in that, The plurality of heat exchange plates include a plurality of first heat exchange plates and a plurality of second heat exchange plates, which are arranged alternately in sequence. A first heat exchange plate forms a first heat exchange channel with an adjacent second heat exchange plate and a second heat exchange channel forms with an adjacent second heat exchange plate. The plurality of first heat exchange channels are connected in sequence, and the plurality of second heat exchange channels are connected in sequence.
10. A new energy vehicle, characterized in that, The device includes a vehicle body and a heat dissipation and cooling device as described in any one of claims 1-9, wherein the substrate has a mounting hole located outside the coverage surface of the oil cooler, and the mounting hole is used to mount the substrate to the vehicle body.