Depth camera
By integrating an optoelectronic system and a shock-absorbing sleeve into the depth camera, and utilizing the elastic deformation of the shock-absorbing sleeve to absorb vibrations, the problem of poor vibration resistance of the depth camera is solved, achieving both compactness and improved vibration resistance of the equipment, making it suitable for automotive-grade applications.
Patent Information
- Application Number
- CN202520172280.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Existing depth cameras have poor shock resistance in outdoor scenarios and cannot meet automotive-grade shock resistance requirements, resulting in decreased equipment accuracy and short service life.
A depth camera was designed by integrating the optoelectronic system with a shock-absorbing sleeve on the optoelectronic bracket. The elastic deformation of the shock-absorbing sleeve absorbs vibrations, and the combination of mechanical fixation and elastic damping improves the shock resistance of the equipment.
This has improved the compactness and shock resistance of depth cameras, meeting automotive-grade shock resistance requirements, increasing equipment accuracy, and extending service life.
Smart Images
Figure CN223843835U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of machine vision technology, and in particular to a depth camera. Background Technology
[0002] A depth camera (3D camera) is a device that captures distance information between an object and the camera, typically used to generate 3D scenes and perform 3D reconstruction. With the rapid development of computer vision, depth cameras, as one of the core modules for realizing 3D vision, have seen tremendous growth and are widely used in smartphones, smart homes, smart cars, security equipment, VR (Virtual Reality) / AR (Augmented Reality) gesture interaction, and intelligent robots. As application scenarios become increasingly complex, the requirements for depth cameras are also rising. In some special application scenarios (such as bumpy outdoor environments), depth cameras are easily impacted; if their impact resistance is poor, it can lead to a decrease in accuracy during operation.
[0003] Given that existing depth cameras have poor adaptability to outdoor scenes, especially in terms of shock resistance, and cannot meet automotive-grade shock resistance requirements, resulting in low equipment accuracy and short service life, there is an urgent need for a depth camera that meets automotive-grade shock resistance requirements. Utility Model Content
[0004] The purpose of this application is to provide a depth camera that addresses the problem of poor anti-vibration performance of existing depth cameras.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0006] This application provides a depth camera, comprising: a housing; an optoelectronic bracket disposed within the housing, the optoelectronic bracket having a positioning channel; an optoelectronic system including an electrically connected lens module and a computing module, the lens module being disposed within the optoelectronic bracket and the computing module being disposed on one side of the optoelectronic bracket; and a shock-absorbing sleeve comprising a sleeve body and a shock-absorbing column connected to the sleeve body, the sleeve body being fitted onto the side of the optoelectronic bracket facing away from the computing module, and the shock-absorbing column passing through the positioning channel to reduce the vibration experienced by the optoelectronic system through the elastic deformation of the shock-absorbing column.
[0007] The depth camera provided in this application improves the compactness of the equipment by integrating the optoelectronic system and the shock-absorbing sleeve onto the optoelectronic bracket, which is conducive to miniaturization design. The optoelectronic system can capture information, and the shock-absorbing sleeve can reduce the vibration of the optoelectronic system, thereby effectively improving the vibration resistance of the equipment, meeting automotive-grade vibration resistance requirements, improving equipment accuracy, and extending its service life. Attached Figure Description
[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0009] Figure 1 This is one of the structural schematic diagrams of a depth camera provided in an embodiment of this application;
[0010] Figure 2 for Figure 1 The exploded view of the depth camera structure is shown below;
[0011] Figure 3 for Figure 1 The diagram shows a cross-sectional view of the shock-absorbing sleeve and photoelectric support structure of the depth camera.
[0012] Figure 4 This is a second schematic diagram of the structure of a depth camera provided in an embodiment of this application;
[0013] Figure 5 for Figure 4 The exploded view of the depth camera structure is shown below;
[0014] Figure 6 for Figure 4 The diagram shows a cross-sectional view of the shock-absorbing sleeve and photoelectric support structure of the depth camera.
[0015] The following are the labeling elements in the figure:
[0016] 1. Housing; 2. Optoelectronic bracket; 3. Optoelectronic system; 4. Shock-absorbing sleeve; 5. Lens module;
[0017] 6. Computing module; 7. Front shell; 8. Rear shell; 9. Sealing ring; 10. First light-transmitting hole;
[0018] 11. Second light-transmitting hole; 12. Third light-transmitting hole; 13. Light-transmitting lens; 14. Cover;
[0019] 15. Positioning channel; 16. Sleeve; 17. Shock-absorbing column; 18. Flange; 19. Positioning step;
[0020] 20. Peripheral wall; 21. Protruding rib; 22. Head plate; 23. First infrared camera;
[0021] 24. Second infrared camera; 25. RGB camera; 26. Laser emitter; 27. First positioning channel;
[0022] 28. Second positioning channel; 29. First damping column; 30. Second damping column; 31. First thermal pad;
[0023] 32. Computing board; 33. Heat sink; 34. Second thermal pad; 35. Computing board bracket;
[0024] 36. Third thermal pad; 37. Interface board; 38. Fourth thermal pad; 39. Interface;
[0025] 40. Fifth thermal pad. Detailed Implementation
[0026] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.
[0027] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0029] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0030] Reference Figures 1 to 6As shown, this application provides a depth camera, including a housing 1, an optoelectronic bracket 2, an optoelectronic system 3, and a shock-absorbing sleeve 4. The optoelectronic bracket 2 is disposed within the housing 1; the optoelectronic system 3 includes an electrically connected lens module 5 and a computing module 6, with the lens module 5 disposed within the optoelectronic bracket 2 and the computing module 6 disposed on one side of the optoelectronic bracket 2; the shock-absorbing sleeve 4 is disposed on the side of the optoelectronic bracket 2 facing away from the computing module 6.
[0031] Specifically, housing 1 serves as the outer shell of the entire depth camera, providing protection for the internal components. Housing 1 may include a front shell 7 and a rear shell 8 fixedly connected by screws, and a sealing ring 9 may be provided at the connection between the front shell 7 and the rear shell 8 to improve sealing performance and achieve waterproof and dustproof effects.
[0032] Furthermore, the front shell 7 has at least one first light-transmitting hole 10, the photoelectric bracket 2 has at least one second light-transmitting hole 11, and the shock-absorbing sleeve 4 has at least one third light-transmitting hole 12. The first light-transmitting hole 10, the second light-transmitting hole 11, and the third light-transmitting hole 12 are connected in a one-to-one correspondence. Each component of the lens module 5 passes through the corresponding light-transmitting hole. In addition, a light-transmitting lens 13 can be provided on the front shell 7 to cover each light-transmitting hole and the lens module 5, so as to play the role of light transmission and sealing protection.
[0033] A pressure cap 14 is provided on the side of the optoelectronic bracket 2 facing away from the shock-absorbing sleeve 4. This cap is used to stably press the lens module 5 into the optoelectronic bracket 2, ensuring the relative positional stability between the lens module 5 and the computing module 6. The lens module 5 is responsible for capturing external light signals and converting them into electrical signals. The computing module 6 processes the data acquired by the lens module 5, performing distance or depth information calculations and other necessary image processing tasks. The shock-absorbing sleeve 4 is designed to absorb and reduce the impact of external vibrations on the optoelectronic system 3, thereby preventing damage to internal precision components and maintaining its performance stability.
[0034] Understandably, by integrating components such as the photoelectric system 3 and the shock-absorbing sleeve 4 onto the photoelectric bracket 2, this application reduces unnecessary space occupation, miniaturizes the equipment, and makes it suitable for applications with strict size requirements, such as automotive applications. Furthermore, the presence of the shock-absorbing sleeve 4 effectively enhances the stability of the photoelectric system 3, which not only helps improve the accuracy of each measurement but also extends the overall lifespan of the equipment by reducing the possibility of mechanical wear or electrical failures caused by vibration.
[0035] Therefore, the depth camera provided in this application embodiment achieves a balance between compactness, shock resistance, and performance stability through optimized structural design, and is particularly suitable for depth perception applications that need to withstand a certain degree of vibration, such as robots, autonomous vehicles, and drones.
[0036] In some embodiments, refer to Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the photoelectric support 2 has a positioning channel 15, and the shock-absorbing sleeve 4 includes a sleeve body 16 and a shock-absorbing column 17. The sleeve body 16 is fitted on the side of the photoelectric support 2 facing away from the computing module 6. The shock-absorbing column 17 is connected to the sleeve body 16 and passes through the positioning channel 15, so as to reduce the vibration of the photoelectric system through the elastic deformation of the shock-absorbing sleeve.
[0037] In one embodiment, the end of the shock-absorbing column 17 away from the sleeve 16 is provided with a flange 18, which abuts against the end of the positioning channel 15 away from the photoelectric support 2. Specifically, the end of the shock-absorbing column 17 is provided with a radially outwardly expanding flange 18, which serves to prevent the shock-absorbing column 17 from sliding out of the positioning channel 15. When the flange 18 abuts against the end of the positioning channel 15 away from the photoelectric support 2 (i.e., the end of the positioning channel 15), it clamps the positioning channel 15 together with the sleeve 16, thereby firmly fixing the shock-absorbing sleeve 4 to the photoelectric support 2.
[0038] The shock-absorbing sleeve 4 can be a one-piece molded structure and can be made of soft materials such as rubber or silicone to facilitate installation and better absorb vibration. During installation, the sleeve body 16 of the shock-absorbing sleeve 4 is fitted onto the photoelectric bracket 2, and the shock-absorbing column 17 is passed through the positioning hole 15 on the photoelectric bracket 2. Then, by adjusting the position of the shock-absorbing column 17, the flange 18 is accurately abutted against the end of the positioning hole 15, thus completing the installation of the shock-absorbing sleeve 4.
[0039] When external vibrations are transmitted to the damping sleeve 4 through the housing 1, the sleeve 16 and the damping column 17 will effectively absorb the vibration energy due to their elastic properties, thereby achieving the damping effect of the photoelectric system 3 and preventing its damage.
[0040] Therefore, the embodiments of this application cleverly combine the advantages of mechanical fixing and elastic damping, which not only achieves effective installation of the damping sleeve 4, but also ensures its stability and reliability in the working environment.
[0041] In some embodiments, refer to Figure 2 and Figure 5 As shown, the photoelectric bracket 2 has a positioning step 19 on its edge, and the sleeve 16 has a peripheral wall 20 fitted on the positioning step 19. The outer side of the peripheral wall 20 is provided with a plurality of elastic ribs 21 at intervals, so as to reduce the vibration of the photoelectric system by the elastic deformation of the ribs 21.
[0042] Specifically, the cooperation between the positioning step 19 and the peripheral wall 20 ensures that the shock-absorbing sleeve 4 can be quickly and accurately fitted onto the photoelectric bracket 2, thereby simplifying the assembly process and ensuring the positional stability of the shock-absorbing sleeve 4 during long-term use. It is understandable that the peripheral wall 20 not only provides shape support for the shock-absorbing sleeve 4 and improves the overall structural strength, but also absorbs vibration energy.
[0043] The ribs 21 can be strip-shaped protrusions arranged at intervals on the outer side of the peripheral wall 20. These ribs 21 can effectively disperse and absorb vibrations from different directions on the side, thereby further improving the seismic performance of the damping sleeve 4.
[0044] Therefore, by optimizing the design of the shock-absorbing sleeve 4 in this embodiment, we can ensure convenient and stable installation on the one hand, and effectively improve shock absorption and reliability on the other hand.
[0045] In some embodiments, refer to Figure 2 and Figure 3 As shown, the lens module 5 includes a head plate 22 and a first infrared camera 23, a second infrared camera 24, an RGB camera 25 and a laser emitter 26 electrically connected to the head plate 22. The head plate 22 is electrically connected to the computing module 6. The RGB camera 25 and the laser emitter 26 are both located between the first infrared camera 23 and the second infrared camera 24.
[0046] The positioning channel 15 includes a first positioning channel 27 and a second positioning channel 28. The first positioning channel 27 is located between the first infrared camera 23 and the RGB camera 25, and the second positioning channel 28 is located between the second infrared camera 24 and the RGB camera 25. The shock-absorbing column 17 includes a first shock-absorbing column 29 and a second shock-absorbing column 30. The first shock-absorbing column 29 passes through the first positioning channel 27, and the second shock-absorbing column 30 passes through the second positioning channel 28.
[0047] Specifically, this embodiment is an active binocular structured light depth camera. A first infrared camera 23 and a second infrared camera 24 are used to capture infrared images from different perspectives, providing data for depth information calculation. An RGB camera 25 is responsible for capturing color images, enabling the generated 3D model or scene to have realistic color information. A laser emitter 26 is used to project structured light patterns, helping the infrared camera to more accurately measure the distance or depth of objects.
[0048] Understandably, this depth camera employs an active binocular structured light method. Specifically, a laser emitter 26 projects a specific pattern of light onto the target object, and two infrared cameras capture the reflected light from different angles. The depth information of the object is then calculated based on triangulation principles. An RGB camera 25 supplements the color information, ensuring that the final output 3D data includes both precise geometry and realistic color texture.
[0049] Furthermore, by designing the positions of the lens module 5 and the shock-absorbing column 17, the depth camera can reduce the overall length by staggering the two, thereby achieving compactness and miniaturization of the whole machine.
[0050] Therefore, by optimizing the internal space layout, the embodiments of this application achieve miniaturization and shock resistance of the device while maintaining high performance, making it particularly suitable for applications in fields with strict requirements for size and reliability, such as autonomous driving and robot vision.
[0051] In other embodiments, reference is made to Figure 5 and Figure 6 As shown, the lens module 5 includes a head plate 22 and a first infrared camera 23, a second infrared camera 24 and an RGB camera 25 electrically connected to the head plate 22. The head plate 22 is electrically connected to the computing module 6, and the RGB camera 25 is located between the first infrared camera 23 and the second infrared camera 24.
[0052] The positioning channel 15 includes a first positioning channel 27 and a second positioning channel 28 located at both ends of the photoelectric bracket 2, and the first positioning channel 27 and the second positioning channel 28 are located on both sides of the first infrared camera 23 and the second infrared camera 24, respectively. The shock-absorbing column 17 includes a first shock-absorbing column 29 and a second shock-absorbing column 30 located at both ends of the sleeve 16. The first shock-absorbing column 29 passes through the first positioning channel 27, and the second shock-absorbing column 30 passes through the second positioning channel 28.
[0053] Specifically, this embodiment is a passive binocular depth camera. A first infrared camera 23 and a second infrared camera 24 are used to capture infrared images from two different perspectives. These images are then processed to calculate the distance or depth of objects. An RGB camera 25 is located between the two infrared cameras and is responsible for acquiring color images to add realistic color information to the generated 3D data.
[0054] Understandably, since no active light source is used, this camera operates based on the principle of stereoscopic vision under natural lighting conditions. That is, it uses two infrared cameras to observe the same scene from different angles, and then calculates the depth information of objects based on triangulation. The RGB camera 25 provides additional color information, making the final generated 3D model more realistic.
[0055] Furthermore, by rationally arranging the positions of various components, especially by placing the RGB camera 25 between the two infrared cameras and setting the shock-absorbing columns 17 at both ends of the photoelectric bracket 2, this layout not only simplifies the installation process but also helps to improve the stability of the overall structure, especially in miniaturized designs.
[0056] Therefore, the embodiments of this application achieve the goal of maintaining high performance and miniaturization by optimizing the layout of internal components, while ensuring good seismic performance and ease of installation, making them suitable for a variety of application scenarios that require high-precision depth sensing.
[0057] In some embodiments, refer to Figure 2 and Figure 5 As shown, the photoelectric bracket 2 is provided with a first thermal pad 31 on one side of the sleeve 16 of the shock-absorbing sleeve 4, and the first thermal pad 31 passes through the sleeve 16 of the shock-absorbing sleeve 4 and contacts the front shell 7 of the housing 1.
[0058] Specifically, there can be multiple first thermal pads 31. The heat generated by the lens module 5 during operation can be transferred to the front shell 7 through the photoelectric bracket 2 and the first thermal pads 31, and then quickly dissipated to the external environment through the front shell 7 with a large surface area. This keeps the working temperature of the internal components within a safe range, avoids performance degradation or failure due to overheating, and improves the stability and adaptability of the equipment in high-temperature environments.
[0059] In some embodiments, refer to Figure 2 and Figure 5 As shown, the computing module 6 includes a computing board 32, a heat sink 33, and a second thermal pad 34. The computing board 32 is electrically connected to the head plate 22 of the lens module 5. The heat sink 33 is located between the computing board 32 and the cover 14 of the optoelectronic bracket 2, and contacts the rear shell 8 of the housing 1. The second thermal pad 34 is located between the heat sink 33 and the computing board 32.
[0060] Specifically, the computing board 32 may include a computing chip, which serves as the core component for processing image data. It is electrically connected to the head board 22 of the lens module 5 and is responsible for receiving and processing data from components such as the infrared camera, RGB camera 25, and laser emitter 26.
[0061] The main function of the heat sink 33 is to absorb and conduct the heat generated by the computing board 32 and then transfer it to the back shell 8. Since the back shell 8 has a large surface area, it can provide a more efficient heat dissipation effect.
[0062] There can be multiple second thermal pads 34, which can be installed on high-power components (such as computing chips) on the computing board 32. The thermal pads have good flexibility and compressibility, which can ensure close contact even on slightly uneven surfaces, thereby reducing thermal resistance and improving heat dissipation.
[0063] During operation, the heat generated by the computing board 32 is absorbed by the second thermal pad 34 on the front, and then quickly conducted to the heat sink 33. Through the heat sink 33, the heat is quickly transferred to the back shell 8 and finally dissipated into the external environment.
[0064] Therefore, through the above-described heat conduction design, the heat generated by the computing board 32 can be quickly transferred to the rear shell 8, avoiding the accumulation of heat inside the camera, reducing the internal temperature, and improving the stability and reliability of the device.
[0065] In some embodiments, refer to Figure 2 As shown, the computing module 6 also includes a computing board support 35 and a third thermal pad 36. The computing board support 35 is used to support the computing board 32 and is in contact with the rear shell 8 of the housing 1. The third thermal pad 36 is disposed between the computing board support 35 and the computing board 32. There can be multiple third thermal pads 36, which can be installed on components with high operating power on the computing board 32.
[0066] Specifically, the heat generated by the computing board 32 during operation can be transferred to the rear shell 8 via the second thermal pad 34 and the heat sink 33 on the front. On the other hand, it can also be conducted to the computing board support 35 via the third thermal pad 36 on the back, and then transferred to the rear shell 8 by the computing board support 35, thereby achieving rapid heat dissipation.
[0067] Therefore, the dual-path heat dissipation design of the front and back sides in this application embodiment can significantly improve heat dissipation efficiency, help maintain a uniform temperature distribution of the computing board 32, reduce the risk of local overheating, and thus improve the stability and reliability of the device.
[0068] In some embodiments, refer to Figure 2 As shown, the computing power module 6 also includes an interface board 37 and a fourth thermal pad 38. The interface board 37 is located on the side of the computing power board bracket 35 facing away from the computing power board 32 and is electrically connected to the computing power board 32. The fourth thermal pad 38 is located between the side of the interface board 37 facing away from the computing power board bracket 35 and the rear shell 8 of the housing 1.
[0069] Specifically, the interface board 37 can provide an interface 39 for connecting to external devices (such as robots, vehicles, etc.), such as a FAKRA interface, for transmitting data or power signals.
[0070] Multiple fourth thermal pads 38 can be used and can be installed on high-power components on the interface board 37. Heat generated during interface board 37 operation can be transferred to the rear housing 8 via the fourth thermal pads 38 and ultimately dissipated into the external environment. This design further improves overall heat dissipation performance, ensuring stable operation of the device even in high-temperature environments.
[0071] In some embodiments, refer to Figure 5 As shown, the computing module 6 also includes a fifth thermal pad 40, which is located between the side of the computing board 32 facing away from the heat sink 33 and the rear shell 8 of the housing 1. There can be multiple fifth thermal pads 40, which can be installed on components with higher operating power on the computing board 32.
[0072] Specifically, the heat generated by the computing board 32 during operation can be transferred to the rear shell 8 via the second thermal pad 34 and the heat sink 33 on the front side. On the other hand, it can also be transferred to the rear shell 8 via the fifth thermal pad 40 on the back side, thereby achieving rapid heat dissipation.
[0073] This application embodiment cancels... Figure 2 The computing board bracket 35 of the depth camera shown can simplify the structure, improve heat conduction efficiency, and make the entire computing module 6 more compact, which is conducive to the miniaturization design of the device.
[0074] And, as Figure 5 As shown, the depth camera in this embodiment of the application can be further eliminated. Figure 2 The depth camera interface board 37 shown can directly integrate interface 39 on the computing board 32, such as a USB interface or a MIPI interface. This design further simplifies the structure and facilitates the miniaturization of the device.
[0075] In some embodiments, refer to Figure 2 and Figure 5 As shown, there are gaps between the sides of the optoelectronic bracket 2 and the computing module 6 and the housing 1. It is understandable that, since the lens module 5 is located inside the optoelectronic bracket 2, there is also a gap between the lens module 5 and the housing 1. This design effectively isolates the impact of vibrations from the housing 1 on the internal precision optoelectronic system 3, reducing interference.
[0076] In summary, this application can improve the vibration reduction and heat dissipation performance of depth cameras, thereby meeting the reliability requirements of outdoor automotive-grade cameras.
[0077] The above are merely preferred embodiments of this application and are not intended to limit the embodiments of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the embodiments of this application should be included within the protection scope of the embodiments of this application.
Claims
1. A depth camera, characterized in that, include: case; A photoelectric support is disposed inside the housing, and the photoelectric support has positioning channels. The optoelectronic system includes an electrically connected lens module and a computing module, wherein the lens module is disposed within the optoelectronic bracket and the computing module is disposed on one side of the optoelectronic bracket; The shock-absorbing sleeve includes a sleeve body and a shock-absorbing column connected to the sleeve body. The sleeve body is fitted onto the side of the optoelectronic bracket facing away from the computing module. The shock-absorbing column passes through the positioning channel to reduce the vibration of the optoelectronic system through the elastic deformation of the shock-absorbing sleeve.
2. The depth camera according to claim 1, characterized in that, The shock-absorbing column has a flange at one end away from the sleeve, and the flange abuts against the end of the positioning channel away from the photoelectric bracket to prevent the shock-absorbing column from sliding out of the positioning channel; and / or, the edge of the photoelectric bracket has a positioning step, the sleeve has a peripheral wall fitted on the positioning step, and the outer side of the peripheral wall is provided with elastic ribs at intervals to reduce the vibration of the photoelectric system through the elastic deformation of the ribs.
3. The depth camera according to claim 1, characterized in that, The lens module includes a head plate and a first infrared camera, a second infrared camera, an RGB camera, and a laser emitter electrically connected to the head plate. The head plate is electrically connected to the computing power module. The RGB camera and the laser emitter are both located between the first infrared camera and the second infrared camera. The positioning channel includes a first positioning channel and a second positioning channel. The first positioning channel is located between the first infrared camera and the RGB camera, and the second positioning channel is located between the second infrared camera and the RGB camera. The shock-absorbing column includes a first shock-absorbing column and a second shock-absorbing column. The first shock-absorbing column passes through the first positioning channel, and the second shock-absorbing column passes through the second positioning channel.
4. The depth camera according to claim 1, characterized in that, The lens module includes a head plate and a first infrared camera, a second infrared camera and an RGB camera electrically connected to the head plate. The head plate is electrically connected to the computing power module. The RGB camera is located between the first infrared camera and the second infrared camera. The positioning channel includes a first positioning channel and a second positioning channel located at both ends of the photoelectric bracket. The shock-absorbing column includes a first shock-absorbing column and a second shock-absorbing column located at both ends of the sleeve. The first shock-absorbing column passes through the first positioning channel, and the second shock-absorbing column passes through the second positioning channel.
5. The depth camera according to claim 1, characterized in that, The photoelectric bracket has a first thermal pad on one side adjacent to the sleeve, and the first thermal pad passes through the sleeve and contacts the housing.
6. The depth camera according to any one of claims 1 to 5, characterized in that, The computing power module includes: The computing board is electrically connected to the lens module; A heat sink is disposed between the computing board and the optoelectronic bracket, and contacts the housing; The second thermal pad is disposed between the heat sink and the computing board.
7. The depth camera according to claim 6, characterized in that, The computing power module also includes: A computing board bracket is used to support the computing board and to contact the housing; The third thermal pad is disposed between the computing board bracket and the computing board.
8. The depth camera according to claim 7, characterized in that, The computing power module also includes: An interface board is located on the side of the computing board bracket facing away from the computing board and is electrically connected to the computing board. The fourth thermal pad is located between the interface plate on the side facing away from the computing board bracket and the housing.
9. The depth camera according to claim 6, characterized in that, The computing power module also includes: The fifth thermal pad is located between the computing board on the side facing away from the heat sink and the housing.
10. The depth camera according to claim 6, characterized in that, There is a gap between the side of the optoelectronic bracket and the computing module and the housing.