Lightweight heat-conducting plate and heat-conducting structure of commercial microsatellite PCB (printed circuit board) component
By designing a lightweight heat-conducting plate, the problems of low heat dissipation efficiency and unreasonable structure of PCB boards for commercial microsatellites are solved, achieving efficient heat dissipation and structural compactness, ensuring stable operation of electronic equipment and adapting to the complex internal environment of satellites.
Patent Information
- Application Number
- CN202520343582.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Commercial microsatellite PCBs suffer from low heat dissipation efficiency, unreasonable structural design, failure to fully consider space environment and compatibility, and lack of differentiated heat dissipation design, resulting in decreased performance of electronic components and impact on overall functionality.
The lightweight heat-conducting plate includes a flat block plate, a connecting structure, a heat-conducting structure, a weight-reducing groove, and a weight-reducing cutout. It utilizes a heat-conducting structure composed of high thermal conductivity metal materials and thermally conductive silicon pads and tantalum sheets to adapt to the height differences of high heat source components on the PCB board. The weight-reducing design avoids protruding components, ensuring rapid heat conduction.
Significantly improves heat dissipation efficiency, ensures stable operation of electronic equipment, enhances structural compactness and compatibility, adapts to complex internal space layout of satellites, extends equipment lifespan, and improves space utilization.
Smart Images
Figure CN223843956U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of satellite thermal management technology, specifically a lightweight heat-conducting plate and heat-conducting structure for PCB board components of commercial microsatellites. Background Technology
[0002] In commercial microsatellite electronic systems, printed circuit boards (PCBs) serve as the carriers of various electronic components, and their integration is becoming increasingly sophisticated. As the functions of commercial microsatellites continue to expand and strengthen, the heat generated by the electronic components on the PCBs increases dramatically during operation. If this heat cannot be dissipated in a timely and effective manner, the PCB temperature will continue to rise, leading to decreased performance of electronic components, unstable signal transmission, and in severe cases, even damage to the components. This, in turn, affects the normal operation of the overall satellite function.
[0003] The existing heat dissipation methods for commercial microsatellite PCBs mainly have the following problems: First, the heat dissipation efficiency is low, the thermal resistance between traditional heat sinks and PCBs is large, and the heat transfer speed is slow; second, the structural design is not reasonable enough, failing to fully consider the complex space environment inside the satellite and the compatibility between various components, resulting in inconvenient installation or affecting the normal operation of other components; third, there is a lack of targeted heat dissipation optimization, and there is no differentiated heat dissipation design based on the heat dissipation characteristics of heat-generating components in different areas of the PCB. Utility Model Content
[0004] To address the shortcomings of the existing technology, this utility model provides a lightweight heat-conducting plate and heat-conducting structure for PCB board components of commercial microsatellites. This significantly improves the heat dissipation efficiency of the PCB board, ensures the stable operation of the satellite electronic system, and enhances the compactness and compatibility of the structure to adapt to the complex spatial layout inside the satellite.
[0005] To achieve the above objectives, this utility model provides a lightweight heat-conducting plate for components on a commercial microsatellite PCB board, comprising a flat, block-shaped plate and components disposed on the plate:
[0006] A connecting structure is provided on the side of the plate body for fixing the plate body to the structural frame;
[0007] A heat-conducting structure is provided on the top surface of the plate to contact the high heat source components of the PCB board and conduct the heat of the high heat source components of the PCB board to the structural frame.
[0008] Weight reduction troughs are provided on the top and bottom surfaces of the plate for weight reduction processing;
[0009] Weight reduction cutouts are provided on the board body to reduce weight and avoid protruding components on the PCB board.
[0010] In one embodiment, the connection structure includes:
[0011] Side plates are fixedly installed on the side of the plate and perpendicular to the plate, and are used to conduct heat in contact with the structural frame;
[0012] A threaded hole is provided on the side plate for use with screws to fix the side plate to the structural frame.
[0013] A threaded hole reinforcing post is connected to the inner side of the side plate and corresponds to the position of the threaded hole, with the bottom of the threaded hole located inside the threaded hole reinforcing post.
[0014] In one embodiment, the thermally conductive structure includes:
[0015] A thermally conductive silicone pad is fixedly mounted on the top surface of the plate.
[0016] A tantalum sheet is disposed on the thermally conductive silicon pad.
[0017] In one embodiment, reinforcing ribs are provided on the side of the plate, in the weight-reducing hollow, in the weight-reducing groove, and / or on the top surface of the plate.
[0018] In one embodiment, the top surface of the plate is provided with a boss or groove corresponding to the position of the heat-conducting structure to accommodate the height of high heat source components on the PCB board.
[0019] In one embodiment, on the bottom surface of the plate, the weight-reducing groove is located at a position corresponding to the boss.
[0020] In one embodiment, the plate is made of a metallic material.
[0021] To achieve the above objectives, this utility model also provides a lightweight thermal conductive structure for components on a commercial microsatellite PCB board, including a structural frame, a PCB board, and the aforementioned lightweight thermal conductive plate.
[0022] Both the PCB board and the lightweight heat-conducting plate are fixedly connected to the structural frame, and the heat-conducting structure on the lightweight heat-conducting plate is in contact with the high-heat-source components on the PCB board.
[0023] Compared with the prior art, the present invention has the following beneficial technical effects:
[0024] 1. This utility model uses a metal material with high thermal conductivity to prepare the board body and arranges a heat-conducting structure on the board body that contacts the high heat source components of the PCB board, thereby improving the heat dissipation efficiency of the PCB board and enabling the heat generated by electronic devices to be quickly dissipated to the outside, ensuring the stable operation of electronic devices.
[0025] 2. This utility model achieves weight reduction by setting weight reduction grooves and weight reduction cutouts on the board body. The weight reduction cutouts can achieve weight reduction of the board body while avoiding protruding components on the PCB board, while the weight reduction grooves can achieve weight reduction of the board body while ensuring that the board body has a certain structural strength.
[0026] 3. In the preferred embodiment of this utility model, a boss or groove is provided on the upper surface of the plate to make the heat conduction structure adapt to the height of high heat source components on the PCB board. That is, the shape of the lightweight heat conduction plate is adapted to the PCB board, thereby minimizing the occupation of the satellite's internal space, improving the satellite's space utilization rate, and ensuring the stability and reliability of the structure. The structure is also convenient and quick to install. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0028] Figure 1 This is an isometric view of the top surface of the lightweight heat-conducting plate in Embodiment 1 of this utility model;
[0029] Figure 2 This is an isometric view of the bottom surface of the lightweight heat-conducting plate in Embodiment 1 of this utility model;
[0030] Figure 3 This is an isometric view of the lightweight thermally conductive structure in Embodiment 2 of this utility model.
[0031] Reference numerals: 1. Plate body, 2. Weight reduction groove, 3. Weight reduction cutout, 4. Side plate, 5. Threaded hole, 6. Threaded hole reinforcing post, 7. Thermal conductive silicone pad, 8. Tantalum sheet, 9. Boss, 10. Reinforcing rib, 11. Structural frame, 12. PCB board, 13. Lightweight thermal conductive plate.
[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0034] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0035] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal connection of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0037] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0038] Example 1
[0039] This embodiment discloses a lightweight heat-conducting plate (hereinafter referred to as "lightweight heat-conducting plate") for components on a commercial microsatellite PCB board. It mainly includes a flat, block-shaped plate body 1, and connecting structures, a heat-conducting structure, a weight-reducing groove 2, and a weight-reducing cutout 3 disposed on the plate body 1. The connecting structure is used to fix the plate body 1 to the structural frame. The heat-conducting structure is used to contact the high-heat-source components on the PCB board after the plate body 1 is connected to the structural frame and to conduct the heat from the high-heat-source components on the PCB board to the structural frame. The weight-reducing groove 2 and the weight-reducing cutout 3 are used to achieve lightweighting of the plate body 1 while avoiding protruding components on the PCB board.
[0040] In this embodiment, the plate 1 is made of a metallic material. Specifically, the plate 1 uses a metallic material with high thermal conductivity as the substrate and performs surface treatment on it. For example, a high-performance lightweight aluminum alloy is used as the substrate of the plate 1, and the surface of the plate 1 is subjected to black anodizing treatment.
[0041] In this embodiment, the connecting structure is located on both sides of the board 1, specifically including a side plate 4, threaded holes 5, and threaded hole reinforcing posts 6. The side plate 4 is integrally formed on the side of the board 1 and perpendicular to the board 1. The threaded holes 5 are formed on the side plate 4. The threaded hole reinforcing posts 6 are integrally formed with the side plate 4, and the threaded hole reinforcing posts 6 are located on the side of the side plate 4 facing the center of the board 1 and corresponding to the position of the threaded holes 5. The bottom of the threaded holes 5 is located inside the threaded hole reinforcing posts 6. During connection, the screw first passes through the through hole on the structural frame and then threadedly connects to the threaded holes 5, and is screwed into the threaded hole reinforcing posts 6, so that the side plate 4 is fixedly connected to the structural frame. At the same time, the side plate 4 and the structural frame form a surface contact, so that the heat source heat discharged by the heat conduction structure can be quickly conducted to the structural frame, ensuring the operating efficiency of the PCB board and extending the working time and service life.
[0042] In the specific implementation process, the overall shape of board 1, as well as the size, quantity, and location of the heat-conducting structures on board 1, are determined based on the installation location of the PCB board and factors such as the size, height, and heat generation of the components on the board. For example Figure 1 , Figure 2 The lightweight heat-conducting plate shown has a total of 7 heat-conducting structures. Two of the heat-conducting structures are located at one end of the plate 1 with the connecting structure, four heat-conducting structures are located at the other end of the plate 1 with the connecting structure, and the last heat-conducting structure is located in the middle area of the plate 1.
[0043] In this embodiment, the thermally conductive structure consists of a thermally conductive silicon pad 7 and a tantalum sheet 8. The thermally conductive silicon pad 7 is bonded to a predetermined position on the top surface of the board 1, and the tantalum sheet 8 is bonded to the thermally conductive silicon pad 7. After the lightweight thermally conductive plate is installed on the structural frame, the tantalum sheet 8 directly contacts and connects with the high-heat-generating components on the PCB board. The thermally conductive silicon pad 7 acts as an elastic medium, filling the microscopic gap between the tantalum sheet 8 and the top surface of the board 1, eliminating contact thermal resistance caused by surface unevenness, and ensuring efficient heat transfer to the thermally conductive plate. The flexibility of the thermally conductive silicon pad 7 can adapt to the minute deformations or assembly tolerances of the PCB components, avoiding localized stress concentration caused by rigid contact. Simultaneously, the tantalum sheet 8, as a metal layer, directly adheres to the high-heat-generating components, utilizing its high thermal conductivity to quickly dissipate heat. The thermally conductive silicon pad 7 acts as a buffer layer, ensuring heat flow continuity and mitigating the impact of mechanical vibrations during satellite launch on the solder joints, preventing desoldering.
[0044] In a preferred embodiment, the top surface of the board 1 has a boss 9 or a groove corresponding to the position of the heat-conducting structure to accommodate the height of high heat-generating components on the PCB board. The stepped design of the boss 9 or groove allows the heat-conducting structure on the board 1 to precisely match the height differences of different components on the PCB board (such as chips, power devices, etc.), ensuring complete contact between the high heat-generating components and the heat-conducting structure, avoiding localized suspension or insufficient contact pressure due to height mismatch, thereby significantly improving heat transfer efficiency. More preferably, on the bottom surface of the board 1, a weight-reducing groove 2 is located directly below the boss 9 on the top surface at the corresponding position.
[0045] In this embodiment, the weight-reducing cutouts 3 and the weight-reducing grooves 2 on the top surface of the board 1 are mainly distributed in areas on the board 1 where no heat-conducting structures are provided. That is, the weight-reducing cutouts 3 and the weight-reducing grooves 2 on the top surface of the board 1 are concentrated in the non-heat-conducting functional area of the board 1. The position and size of the weight-reducing cutouts 3 and the grooves 2 are also designed based on the size and height of the components on the PCB board. In specific implementation, the type of weight-reducing structure is selected according to the following rules:
[0046] If the height of the PCB components exceeds the mounting reference surface of the board 1 on the structural frame, the corresponding area adopts through-hole type weight reduction cutout 3 to achieve lightweighting and space avoidance.
[0047] If the height of the PCB components does not exceed the mounting reference plane of the board 1 on the structural frame, the top surface weight reduction sink 2 is used to achieve the weight reduction target by removing local materials, while retaining the base thickness to maintain the structural rigidity.
[0048] In the specific implementation process, reinforcing ribs are provided on the sides of the plate 1, inside the weight-reducing hollow 3, inside the weight-reducing groove 2, and / or on the top surface of the plate 1. By arranging reinforcing ribs 10 in the weight-reducing hollow 3 and the weight-reducing groove 2, the strength loss caused by weight reduction can be effectively compensated, and cracking or plastic deformation of the plate 1 under vibration environment can be prevented. Arranging reinforcing ribs 10 on the top surface and sides of the plate 1 can improve the bending stiffness of the plate 1 with minimal mass loss, ensure the contact stability of the heat dissipation interface under mechanical load, and avoid the surge in thermal resistance due to deformation.
[0049] Example 2
[0050] Based on the lightweight heat-conducting plate in Example 1, this example discloses a lightweight heat-conducting structure for components on a commercial microsatellite PCB board, which mainly includes a structural frame 11, a PCB board 12, and the lightweight heat-conducting plate 13 from Example 1. Both the PCB board 12 and the lightweight heat-conducting plate 13 are fixedly connected to the structural frame 11, and the heat-conducting structure on the lightweight heat-conducting plate 13 is in contact with the high-heat-source components on the PCB board 12.
[0051] The above description is only a preferred embodiment of the present utility model and does not limit the scope of protection of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.
Claims
1. A lightweight heat-conducting plate for components on a commercial microsatellite PCB board, characterized in that, Includes a flat, block-shaped plate and the following on the plate: A connecting structure is provided on the side of the plate body for fixing the plate body to the structural frame; A heat-conducting structure is provided on the top surface of the plate to contact the high heat source components of the PCB board and conduct the heat of the high heat source components of the PCB board to the structural frame. Weight reduction troughs are provided on the top and bottom surfaces of the plate for weight reduction processing; Weight reduction cutouts are provided on the board body to reduce weight and avoid protruding components on the PCB board.
2. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 1, characterized in that, The connection structure includes: Side plates are fixedly installed on the side of the plate and perpendicular to the plate, and are used to conduct heat in contact with the structural frame; A threaded hole is provided on the side plate for use with screws to fix the side plate to the structural frame. A threaded hole reinforcing post is connected to the inner side of the side plate and corresponds to the position of the threaded hole, with the bottom of the threaded hole located inside the threaded hole reinforcing post.
3. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 1, characterized in that, The thermally conductive structure includes: A thermally conductive silicone pad is fixedly mounted on the top surface of the plate. A tantalum sheet is disposed on the thermally conductive silicon pad.
4. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 1, 2, or 3, characterized in that, Reinforcing ribs are provided on the side of the plate, in the weight-reducing hollow, in the weight-reducing groove, and / or on the top surface of the plate.
5. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 1, 2, or 3, characterized in that, The top surface of the plate is provided with a boss or groove corresponding to the position of the heat-conducting structure, so as to adapt to the height of high heat source components on the PCB board.
6. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 5, characterized in that, On the bottom surface of the plate, the weight-reducing groove is located at a position corresponding to the boss.
7. The lightweight heat-conducting plate for commercial microsatellite PCB board components according to claim 1, 2, or 3, characterized in that, The plate is made of metal.
8. A lightweight thermal conductivity structure for components on a commercial microsatellite PCB board, characterized in that, Includes a structural frame, a PCB board, and the lightweight heat-conducting plate as described in any one of claims 1 to 7; Both the PCB board and the lightweight heat-conducting plate are fixedly connected to the structural frame, and the heat-conducting structure on the lightweight heat-conducting plate is in contact with the high-heat-source components on the PCB board.