Blocking structure for preventing glue on silver substrate from diffusing
Patent Information
- Application Number
- CN202520362334.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-04
AI Technical Summary
Existing technologies struggle to effectively address the issue of silver substrate adhesive diffusion during LED packaging, leading to poor solder joints that affect device reliability and lifespan. Furthermore, existing methods may increase costs or negatively impact conductivity and heat dissipation performance.
A trench structure is designed on the surface of a silver substrate, and a flow guiding component, including a flow guide wall and a covering component, is set in the trench. The hydrophobic coating is used to improve the flowability and distribution of the adhesive, and the trench structure blocks the diffusion of the adhesive, thus optimizing the flow path of the adhesive in the trench.
It effectively blocks adhesive diffusion, avoids poor soldering of wire bonding, improves the reliability and lifespan of LED devices, and has a simple structure that does not increase cost or complexity, while improving adhesive filling effect and flow performance.
Smart Images
Figure CN223844174U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging technology, specifically to a barrier structure that prevents the diffusion of adhesive on a silver substrate. Background Technology
[0002] Silver substrate materials are widely used in lighting fixtures and LED devices due to their excellent electrical and thermal conductivity. However, in the molding process, when the silver substrate comes into contact with the encapsulating adhesive, the adhesive is prone to spreading along the surface, especially causing contamination of the bonding wire area, which can lead to poor soldering and seriously threaten the reliability and lifespan of LED devices.
[0003] Currently, solutions to the adhesive diffusion problem mainly include: First, optimizing the adhesive formulation by adjusting parameters such as viscosity and surface tension to reduce its diffusion. However, while this method can reduce the possibility of adhesive contamination to some extent, its effectiveness is limited and may cause performance degradation in other aspects of the adhesive. Second, attempting to add barrier structures to the surface of the silver substrate, such as printed inks or adhesive tape, to prevent adhesive diffusion. This method can reduce adhesive contamination to some extent, but it also brings challenges in terms of process complexity and increased cost, and may affect the conductivity and heat dissipation performance of the silver substrate.
[0004] Therefore, existing technologies have significant limitations in solving the problem of adhesive diffusion, and there is an urgent need for a barrier structure to prevent adhesive diffusion on silver substrates. Utility Model Content
[0005] To address the shortcomings of existing technologies, this invention provides a barrier structure to prevent the diffusion of adhesive on a silver substrate, thus solving the technical problems mentioned in the background section.
[0006] The technical solution of this utility model is as follows: a barrier structure for preventing the diffusion of adhesive on a silver substrate, comprising a silver substrate, wherein a first functional area and a second functional area are arranged sequentially from left to right on the top of the silver substrate, and a first functional area bonding area and a second functional area bonding area are respectively arranged on the top of the first functional area and the second functional area, wherein a die bonding area is arranged on the top of the first functional area bonding area, and a groove is formed on the top of the silver substrate to prevent the adhesive from diffusing into the first functional area bonding area.
[0007] And, a flow guiding component installed in the trench.
[0008] Preferably, the flow guiding component includes a guiding component disposed on the inner sidewall of the trench to guide the adhesive to flow in all directions, and a covering component below the guiding component to uniformly fill the trench with adhesive.
[0009] Preferably, the guiding component includes a drainage wall disposed on the inner sidewall of the trench, the drainage wall including, but not limited to, minute wavy, spiral, or serrated structures.
[0010] Preferably, the surface of the drainage wall is coated with a hydrophobic coating that alters the interfacial tension between the wall and the adhesive, and the hydrophobic coating is formed by multiple printing processes of graphene.
[0011] Preferably, the covering component includes a plurality of semi-circular grooves formed in the bottom wall of the groove to expand the adhesive capacity, and each pair of the plurality of semi-circular grooves is provided with a semi-circular protrusion to make the adhesive evenly distributed.
[0012] Preferably, the top of the inner wall of the trench is sloped, and the slope angle is less than 45°.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0014] 1. This utility model effectively prevents adhesive from diffusing into the bonding area of a functional region by setting a trench structure on the surface of the silver substrate, thereby avoiding the problem of poor soldering and improving the reliability and service life of LED devices. At the same time, the structure is simple and easy to implement, without increasing additional costs or process complexity.
[0015] 2. This utility model optimizes the flow path and distribution of adhesive in the groove. Combined with the flow guiding component, it effectively improves the diffusion speed and uniformity of adhesive in the groove. It not only ensures that the adhesive can be smoothly and evenly filled into every corner, but also significantly improves the flow efficiency of adhesive through meticulous guidance and the effect of hydrophobic coating, thereby greatly improving the overall filling effect and flow performance of adhesive. Attached Figure Description
[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0017] Figure 1 This is a schematic diagram of the planar structure proposed in this utility model;
[0018] Figure 2 This is a partial three-dimensional structural diagram of the present invention;
[0019] Figure 3 This is a schematic diagram of a partial planar structure proposed in this utility model.
[0020] In the figure: 1. Silver substrate; 2. Functional area 1; 3. Functional area 2; 4. Bonding area of functional area 1; 5. Bonding area of functional area 2; 6. Die bonding area; 7. Trench; 8. Current guiding component; 81. Current guiding wall; 811. Hydrophobic coating; 82. Semicircular groove; 83. Semicircular bump. Detailed Implementation
[0021] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model.
[0022] Currently, solutions to the adhesive diffusion problem mainly include: First, optimizing the adhesive formulation by adjusting parameters such as viscosity and surface tension to reduce its diffusion. However, while this method can reduce the possibility of adhesive contamination to some extent, its effectiveness is limited and may cause performance degradation in other aspects of the adhesive. Second, attempting to add barrier structures to the surface of the silver substrate, such as printed inks or adhesive tape, to prevent adhesive diffusion. This method can reduce adhesive contamination to some extent, but it also brings challenges in terms of process complexity and increased cost, and may affect the conductivity and heat dissipation performance of the silver substrate.
[0023] Example 1
[0024] To prevent adhesive from spreading to bonding area 4 of functional zone 1, thereby avoiding cold solder joints and improving the reliability and lifespan of LED devices, please refer to [link to relevant documentation]. Figures 1-3 This embodiment provides a barrier structure to prevent the diffusion of adhesive on a silver substrate. The structure includes a silver substrate 1. From left to right, a first functional region 2 and a second functional region 3 are sequentially arranged on the top of the silver substrate 1. A first functional region bonding area 4 and a second functional region bonding area 5 are respectively arranged on the top of the first functional region 2 and the second functional region 3. A die-bonding region 6 is arranged on the top of the first functional region bonding area 4. A trench 7 is formed on the top of the silver substrate 1 to prevent adhesive from diffusing into the first functional region bonding area 4. By designing and constructing a detailed trench 7 structure on the surface of the silver substrate 1, the diffusion range of the adhesive during application is effectively limited, preventing it from penetrating into the first functional region bonding area 4. This design not only successfully avoids the problem of poor soldering caused by adhesive interference but also significantly improves the reliability and durability of LED devices during long-term use.
[0025] Example 2
[0026] High-viscosity adhesives have strong surface tension, making it difficult for them to spread to every corner of the groove 7, resulting in localized concentrations. As the adhesive solidifies and accumulates in these localized areas, it overflows from the groove 7 too quickly, preventing the groove 7 from fully fulfilling its interception function. Based on Example 1, and referring to... Figures 2-3A flow guiding component 8, disposed within the groove 7, enhances the diffusion and filling of the adhesive. The top of the inner wall of the groove 7 is sloped with an inclination angle of less than 45°, which facilitates the flow of adhesive into the groove 7 and its smooth expansion, preventing the adhesive from failing to flow smoothly into the groove 7 due to surface tension issues. The flow guiding component 8 includes a guide component disposed on the inner wall of the groove 7 to enhance the diffusion of the adhesive. The guide component includes a guide wall 81 disposed on the inner wall of the groove 7. The guide wall 81 includes, but is not limited to, a small wavy, spiral, or serrated structure, which helps to improve the fluidity of the adhesive and helps to guide the adhesive to deeper parts, ensuring uniform adhesive distribution. The surface of the drainage wall 81 is coated with a hydrophobic coating 811 that alters the interfacial tension between itself and the adhesive, while also aiding in better adhesive distribution. The hydrophobic coating 811 is formed by at least 1-3 printing operations using graphene, but not limited to graphene. By altering the interfacial tension, it helps the adhesive flow and distribute better. The use of multiple graphene printing ensures the uniformity and durability of the coating, further improving the fluidity and diffusion of the adhesive. The inner bottom wall of the trench 7 is provided with a covering component to aid in adhesive filling. This covering component includes several semi-circular grooves 82 formed in the inner bottom wall of the trench 7 to increase adhesive capacity. Each pair of semi-circular grooves 82 is connected by semi-circular protrusions 83 to ensure even adhesive distribution. The increased adhesive capacity through the semi-circular grooves 82 prevents insufficient adhesive at the bottom of the trench 7. The design of the semi-circular groove 82 helps to store more glue and promotes uniform distribution, further improving the filling effect. The semi-circular bumps 83 set between the semi-circular grooves 82 help to distribute the glue evenly, prevent glue accumulation or uneven flow in some areas, and ensure that the glue can fully fill every corner of the groove 7.
[0027] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A barrier structure for preventing the diffusion of adhesive on a silver substrate, comprising a silver substrate (1), characterized in that, The top of the silver substrate (1) is provided with a first functional area (2) and a second functional area (3) from left to right. The top of the first functional area (2) and the second functional area (3) are respectively provided with a first functional area bonding area (4) and a second functional area bonding area (5). The top of the first functional area bonding area (4) is provided with a die bonding area (6). The top of the silver substrate (1) is provided with a groove (7) to prevent the adhesive from diffusing into the first functional area bonding area (4). And a flow guiding component (8) disposed in the trench (7).
2. The barrier structure for preventing the diffusion of adhesive on a silver substrate according to claim 1, characterized in that, The flow guiding component (8) includes a guiding component disposed on the inner sidewall of the groove (7) to guide the glue to flow in all directions, and a covering component under the guiding component to make the glue evenly fill the groove (7).
3. The barrier structure for preventing the diffusion of adhesive on a silver substrate according to claim 2, characterized in that, The guiding component includes a drainage wall (81) disposed on the inner sidewall of the trench (7), the drainage wall (81) including, but not limited to, minute wavy, spiral or sawtooth structures.
4. The barrier structure for preventing the diffusion of adhesive on a silver substrate according to claim 3, characterized in that, The surface of the drainage wall (81) is coated with a hydrophobic coating (811) that changes the interfacial tension between it and the adhesive. The hydrophobic coating (811) is formed by printing graphene multiple times.
5. The barrier structure for preventing the diffusion of adhesive on a silver substrate according to claim 2, characterized in that, The covering component includes a plurality of semi-circular grooves (82) formed in the bottom wall of the groove (7) to expand the glue capacity, and each of the plurality of semi-circular grooves (82) is provided with a semi-circular protrusion (83) between each pair to make the glue evenly distributed.
6. The barrier structure for preventing the diffusion of adhesive on a silver substrate according to claim 1, characterized in that, The top of the inner wall of the groove (7) is set as an inclined surface, and the inclination angle of the inclined surface is less than 45°.