Display device and electronic apparatus

Abstract

The utility model relates to a display device and electronic equipment, and relates to the technical field of display. The display device comprises a display panel and a flexible circuit board, the display panel is provided with a display area and a peripheral area outside the display area, and the peripheral area comprises a binding part. The flexible circuit board is connected with the binding part, and at least part of the flexible circuit board is located on the backlight side of the display panel; the flexible circuit board comprises a main body part and an extension part which are distributed in the first direction, the extension part is provided with two side edges distributed in the second direction, the distance between the two side edges of the extension part is smaller than the width of the main body part in the second direction, and the first direction intersects with the second direction. The main body part comprises a circuit board layer and a first bonding layer, and the circuit board layer is bonded with the display panel through the first bonding layer; the main body part is provided with a main body area and an avoiding area connected with the extension part; the elastic modulus of the avoiding area is smaller than that of the main body area; or at most one of the circuit board layer and the display panel in the avoiding area is bonded with the first bonding layer.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display device and an electronic device. Background Technology

[0002] With the development of display technology, display devices are becoming thinner and thinner. However, as the thickness decreases, unevenness, or molding phenomenon, can easily occur in some areas of the display device. This unevenness can lead to display abnormalities and affect the display effect.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] This disclosure provides a display device and an electronic device that can improve printing problems.

[0005] According to one aspect of this disclosure, a display device is provided, comprising:

[0006] A display panel has a display area and a peripheral area outside the display area, the peripheral area including a mounting portion;

[0007] A flexible circuit board is connected to the bonding portion and is at least partially located on the backlight side of the display panel; the flexible circuit board includes a main body portion and an extension portion distributed along a first direction, the extension portion having two sides distributed along a second direction, the distance between the two sides of the extension portion being less than the width of the main body portion in the second direction, the first direction and the second direction intersecting;

[0008] The main body includes a circuit board layer and a first adhesive layer, wherein the circuit board layer is bonded to the display panel through the first adhesive layer; the main body has a main area and a clearance area connected to the extension; the elastic modulus of the clearance area is less than the elastic modulus of the main area; or, at most one of the circuit board layer and the display panel in the clearance area is bonded to the first adhesive layer.

[0009] In one exemplary embodiment of this disclosure, the first adhesive layer has a clearance notch near the edge of the extension that exposes the circuit board layer, and the clearance notch is located in the clearance area; the extension is connected to the area of ​​the circuit board layer exposed by the clearance notch.

[0010] In one exemplary embodiment of this disclosure, the boundary of the clearance gap includes two side walls distributed along the second direction and a bottom wall connecting the two side walls; the two sides of the extension are located between the two side walls of the clearance gap.

[0011] In one exemplary embodiment of this disclosure, the two side walls of the clearance notch are parallel and extend along the first direction, and the bottom wall extends along the second direction.

[0012] In one exemplary embodiment of this disclosure, the distance between the two side walls of the clearance notch gradually decreases in the direction away from the extension.

[0013] In one exemplary embodiment of this disclosure, the sidewall of the clearance notch is a curved surface that rises away from the viewpoint, and the bottom wall extends along the second direction.

[0014] In one exemplary embodiment of this disclosure, the boundary of the clearance gap includes two intersecting sidewalls.

[0015] In one exemplary embodiment of this disclosure, the boundary of the avoidance gap is arc-shaped.

[0016] In one exemplary embodiment of this disclosure, the main body further includes:

[0017] A second adhesive layer is disposed within the clearance notch, and the portion of the circuit board layer exposed by the clearance notch is bonded to the display panel through the second adhesive layer; the elastic modulus of the second adhesive layer is less than that of the first adhesive layer.

[0018] In one exemplary embodiment of this disclosure, the main body further includes a barrier layer located in the avoidance area, the barrier layer being separated between the first adhesive layer and the circuit board layer, and being bonded to the first adhesive layer.

[0019] In one exemplary embodiment of this disclosure, the main body further includes a barrier layer located in the avoidance area, the barrier layer being located on the surface of the first adhesive layer away from the circuit board layer and being bonded to the first adhesive layer.

[0020] In one exemplary embodiment of this disclosure, the two sides of the extension are located within the boundary of the avoidance area in the second direction.

[0021] In one exemplary embodiment of this disclosure, the width of the avoidance area in the first direction is not less than 1 mm.

[0022] In one exemplary embodiment of this disclosure, the distance between the side of the extension and the boundary of the avoidance area in the second direction is greater than 0.

[0023] In one exemplary embodiment of this disclosure, the width of the avoidance area in the first direction is 2 mm, and the distance between the side of the extension and the boundary of the avoidance area in the second direction is 2 mm.

[0024] In one exemplary embodiment of this disclosure, the peripheral area is partially bent to the backlight side of the display panel, and the bonding portion is located on the backlight side of the display panel, wherein the flexible circuit board is connected to the bonding portion on the backlight side of the display panel.

[0025] In one exemplary embodiment of this disclosure, the display panel includes:

[0026] Display substrate;

[0027] A heat dissipation support layer is disposed on the backlight side of the display substrate;

[0028] The first adhesive layer is bonded to the surface of the heat dissipation support layer away from the display substrate.

[0029] According to one aspect of this disclosure, an electronic device is provided, including the display device described in any one of the foregoing claims.

[0030] The display device and electronic equipment disclosed herein can bond the main body area of ​​the flexible circuit board to the display panel, thereby fixing the main body and the display panel relatively. Drive signals can be transmitted to the display panel through the extension and the main body to achieve image display. Simultaneously, before the product leaves the factory, the extension can be connected to a test circuit to test the display panel. In this case, the extension needs to be bent. Although the main body is bonded to the display panel, a clearance area is provided outside the main body area to connect with the extension. If the elastic modulus of the clearance area is less than that of the main body area, the clearance area itself is more easily deformed than the main body area. Bending the extension will cause deformation of the clearance area itself, which is less likely to be transmitted to the display panel, thus reducing the risk of local unevenness of the display panel caused by bending the extension during testing. If at most one of the circuit board layer and the display panel within the clearance area is bonded to the first adhesive layer, i.e., the first adhesive layer is not bonded to at least one of the circuit board layer or the display panel, the deformation of the extension is also less likely to be transmitted to the display panel through the first adhesive layer, thereby reducing the risk of unevenness of the display panel. This can improve the overall molding problem of the display device and help improve the display effect.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0033] Figure 1 This is a top view schematic diagram of one embodiment of the display device of this disclosure.

[0034] Figure 2 This is a cross-sectional schematic diagram of one embodiment of the display device disclosed herein.

[0035] Figure 3 This is a cross-sectional schematic diagram of another embodiment of the display device disclosed herein.

[0036] Figure 4 This is a partial cross-sectional schematic diagram of the first embodiment of the display device of the first type disclosed herein.

[0037] Figure 5 This is a partial top view of a flexible circuit board according to a first embodiment of a first type of display device of this disclosure.

[0038] Figure 6 This is a partial top view of the flexible circuit board of the second embodiment of the first type of display device disclosed herein.

[0039] Figure 7 This is a partial top view of the flexible circuit board of the third embodiment of the first type of display device disclosed herein.

[0040] Figure 8 This is a partial top view of the flexible circuit board of the fourth embodiment of the first type of display device disclosed herein.

[0041] Figure 9 This is a partial top view of the flexible circuit board of the fifth embodiment of the first type of display device disclosed herein.

[0042] Figure 10 This is a partial cross-sectional schematic diagram of the sixth embodiment of the first type of display device disclosed herein.

[0043] Figure 11 This is a partial top view of the flexible circuit board of the sixth embodiment of the first type of display device disclosed herein.

[0044] Figure 12 This is a partial cross-sectional schematic diagram of the seventh embodiment of the first type of display device disclosed herein.

[0045] Figure 13 This is a partial top view of the flexible circuit board of the seventh embodiment of the first type of display device disclosed herein.

[0046] Figure 14 This is a partial cross-sectional schematic diagram of the first embodiment of the second type of display device disclosed herein.

[0047] Figure 15 This is a partial top view of the flexible circuit board of the first embodiment of the second type of display device disclosed herein.

[0048] Figure 16 This is a partial cross-sectional schematic diagram of a second embodiment of the display device of the present disclosure.

[0049] Figure 17 This is a partial top view of the flexible circuit board of the second embodiment of the display device of the present disclosure. Detailed Implementation

[0050] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0051] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0052] This disclosure provides a display device, such as... Figures 1-3 As shown, it may include a display panel 100 and a flexible circuit board 1, wherein:

[0053] The display panel 100 can be divided into multiple regions, including a display area AA and a peripheral area WA located outside the display area AA. The peripheral area WA can be a continuous annular region surrounding the display area AA, or a discontinuous region surrounding the display area AA. The peripheral area WA can include a bonding portion PA, which can include multiple pads that can be connected to the flexible circuit board 1 to transmit signals to the display panel 100.

[0054] The number of bonding pads PA can be one, two, or more. Correspondingly, there can be one, two, or more flexible circuit boards 1, each of which can be connected to one bonding pad PA. For example, for electronic devices with small-sized display devices such as mobile phones and watches, there can be one bonding pad PA and one flexible circuit board 1. The flexible circuit board 1 can be connected to the bonding pad PA and to the motherboard of the electronic device. For electronic devices with large-sized display devices such as televisions and computer monitors, there can be multiple bonding pads PA and flexible circuit boards 1. Each bonding pad PA can be connected to each flexible circuit board 1 in a one-to-one correspondence, and each flexible circuit board 1 can be connected to the same motherboard.

[0055] like Figure 2 and Figure 3 As shown, the display panel 100 may include a display substrate PNL, which may include a driving backplate and a plurality of light-emitting devices disposed on one side of the driving backplate. Each light-emitting device may be arrayed along a first direction Y and a second direction X and is located in the display area AA. The light-emitting devices can be driven to emit light by the driving circuit in the driving backplate to display an image; wherein:

[0056] The driving backplane may include a substrate and circuit layers stacked on one side of the substrate. The substrate may be a flat plate structure, and its material may be a rigid material such as glass or a flexible material such as polyimide.

[0057] The circuit layer includes the aforementioned driving circuitry. For example, the driving circuitry may include pixel circuitry located in display area AA and peripheral circuitry located in peripheral area WA. Pixel circuitry can be 7T1C, 8T1C, or similar structures, as long as it can drive the light-emitting devices to emit light; its structure is not specifically limited here. Here, nTmC indicates that one pixel circuitry includes n thin-film transistors (represented by the letter "T") and m capacitors (represented by the letter "C"). The number of pixel circuits can be the same as the number of light-emitting devices, and they are connected one-to-one with each light-emitting device. Of course, multiple light-emitting devices can be connected to the same pixel circuitry; this is not specifically limited here. Peripheral circuitry is connected to the pixel circuitry and is used to input driving signals to the pixel circuitry to control the light-emitting devices to emit light. Peripheral circuitry may include gate driving circuitry and light-emitting control circuitry; of course, it may also include other circuitry. The specific structure of the peripheral circuitry is not specifically limited here.

[0058] The light-emitting device can be an OLED (organic light-emitting diode) using organic light-emitting materials, or a Mini LED (sub-millimeter light-emitting diode with a size of 100μm-200μm), Micro LED (micro light-emitting diode with a size of no more than 100μm), or LED (light-emitting diode with a size of more than 200μm) using inorganic light-emitting materials. No special restrictions are imposed here, as long as it can emit light.

[0059] Taking an OLED as an example, the light-emitting device may include a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the driving backplane. By applying an electrical signal to the first and second electrodes, the light-emitting layer can be excited to emit light; the specific light-emitting principle will not be detailed here. Simultaneously, the display substrate PNL may also include a pixel definition layer separating the light-emitting devices, which may be disposed on the same surface of the driving backplane as the light-emitting devices. The pixel definition layer has pixel openings exposing each of the first electrodes, and the light-emitting layer and the second electrode are stacked sequentially on the first electrodes within the pixel openings.

[0060] In some embodiments of this disclosure, the display substrate PNL may further include an encapsulation layer that covers each light-emitting device to block external water and oxygen from corroding the light-emitting devices. For example, the encapsulation layer may be a thin-film encapsulation method, which may include a first inorganic layer, an organic layer, and a second inorganic layer, wherein:

[0061] The first inorganic layer can cover each light-emitting device, that is, the first inorganic layer can cover the surface of the second electrode away from the driving backplane. The material of the first inorganic layer can include inorganic insulating materials such as silicon nitride and silicon oxide. The organic layer can be disposed on the surface of the first inorganic layer away from the driving backplane, and the boundary of the organic layer can be defined inside the boundary of the first inorganic layer by a barrier dam located in the peripheral area WA. At the same time, the boundary of the orthographic projection of the organic layer on the driving backplane can be located in the peripheral area WA, ensuring that the organic layer can cover each light-emitting device. The second inorganic layer can cover the organic layer and the first inorganic layer not covered by the organic layer. The second inorganic layer can block the intrusion of water and oxygen, and planarization is achieved by the organic layer having fluidity before curing. The material of the second inorganic layer can include inorganic insulating materials such as silicon nitride and silicon oxide. The bonding part PA is located outside the range of the barrier dam, and the encapsulation layer exposes the bonding part PA in order to facilitate bonding with the flexible circuit board 1.

[0062] Furthermore, such as Figure 2 and Figure 3 As shown, the display panel 100 may further include an anti-reflective layer (POL) and a transparent cover plate (CG), wherein:

[0063] The anti-reflection layer (POL) can be located on the light-emitting side of the display substrate PNL, that is, on the side of the encapsulation layer away from the driving backplane, to reduce the reflection of ambient light. It can be a circular polarizer, or a color filter can be used to absorb some of the ambient light and reduce the reflection of ambient light.

[0064] The transparent cover plate CG can be located on the side of the anti-reflection layer POL away from the display substrate PNL, and can be bonded to the anti-reflection layer POL through the optical adhesive layer OCA. The transparent cover plate CG can be made of materials such as glass and acrylic.

[0065] Of course, in some embodiments, the display panel 100 may also include a touch layer, which may be disposed on the light-emitting side of the display substrate PNL, for example, on the side of the encapsulation layer away from the driving backplane. The anti-reflection layer POL may be disposed on the side of the touch layer away from the display substrate PNL.

[0066] like Figure 2 and Figure 3 As shown, the display panel 100 may further include a back film and a heat dissipation support layer SCF, wherein:

[0067] The back film can be adhered to the backlight side of the display substrate PNL. For example, the back film can be adhered to the surface of the substrate away from the light-emitting device. The back film can provide a certain degree of protection, and it can be made of flexible material, which helps to reduce molding.

[0068] The heat dissipation support layer SCF can be disposed on the backlight side of the display substrate PNL. It can be bonded to the surface of the back film away from the display substrate PNL. Of course, for the display substrate PNL without a back film, the heat dissipation support layer SCF can be bonded to the surface of the display substrate PNL on the backlight side, that is, the surface of the display substrate PNL away from the transparent cover CG.

[0069] In some embodiments of this disclosure, the heat dissipation support layer (SCF) may include an adhesive layer, a buffer layer, a support layer, and a heat dissipation layer stacked sequentially in a direction away from the display substrate (PNL), wherein:

[0070] The adhesive layer can be a mesh adhesive (Embo), which has the function of bonding and venting, and is flexible, so it does not affect the flexibility of the flexible display panel 100.

[0071] The buffer layer can be bonded to the surface of the adhesive layer away from the display substrate PNL, and the buffer layer can be made of foam or other elastic materials.

[0072] The support layer is attached to the surface of the buffer layer away from the display substrate PNL, and it can play a supporting and reinforcing role. The support layer can be made of materials such as polyimide (PI).

[0073] The heat dissipation layer can be located on the surface of the support layer away from the display substrate PNL, and can be bonded to the support layer by adhesives such as pressure-sensitive adhesive. The heat dissipation layer can be made of materials such as metal or alloy to conduct heat. For example, the material of the heat dissipation layer can be copper.

[0074] like Figures 1-3As shown, the flexible circuit board 1 can be used to connect the display panel 100 and the motherboard of the electronic device, so as to control the display panel 100 to display images via the motherboard. Specifically, one end of the flexible circuit board 1 can be connected to the bonding portion PA of the peripheral area WA, and the other end can be connected to the motherboard. The display device may also include a driver chip TIC, which can be connected to the driver circuit and the bonding portion PA. At least a portion of the traces of the driver circuit of the drive backplane can extend to the peripheral area WA and be connected to at least one of the driver chip TIC and the bonding portion PA. The motherboard can transmit drive signals to the driver chip TIC and the traces via the bonding portion PA in order to control the display panel 100 to display images.

[0075] The flexible circuit board 1 is connected to the main board at one end, located on the backlight side of the display panel 100, specifically on the side of the heat dissipation support layer SCF away from the display substrate PNL; thus, the main board can be positioned on the backlight side of the display panel 100. The connection between the flexible circuit board 1 and the main board on the backlight side of the display panel 100 can be achieved by bending the flexible circuit board 1 or bending the display substrate PNL. The flexible circuit board 1 may also be provided with multiple electronic components 13, which can be capacitors, resistors, transistors, etc., without specific limitations.

[0076] In some embodiments of this disclosure, the display panel 100 may be a flexible structure at least partially in the peripheral region WA, for example, Figure 1 As shown, the peripheral area WA may include a fan-out area FA extending in a direction away from the display area AA, which may be an area protruding outward from the peripheral area WA. A bonding portion PA is located in the fan-out area FA. The fan-out area FA and the display area AA may be distributed along a first direction. The fan-out area FA may have a bent area extending along a second direction, which may be bent toward the backlight side of the display panel 100, thereby placing the bonding portion PA on the backlight side of the display panel 100. A driver chip TIC may be disposed in the fan-out area FA, and may be located between the bent area and the bonding portion PA. After the bent area is bent, the driver chip TIC is located on the backlight side of the display panel 100.

[0077] To make the bending area bendable, through holes can be made in this area to improve its flexibility. Furthermore, some film layers of the display panel 100 can be broken in this area, reducing thickness and further enhancing flexibility. For example, ... Figure 2 and Figure 3 As shown, the anti-reflection layer POL and the heat dissipation support layer SCF are both located on the side of the bending area closer to the display area AA. This means that the anti-reflection layer POL and the heat dissipation support layer SCF do not participate in the bending process, making the thickness of the display panel 100 in the bending area less than the thickness in other areas, which is beneficial for improving flexibility. Meanwhile, as... Figure 2As shown, flexible structural adhesive MC can be used to cover the bending area, which can ensure the overall flatness of the panel while maintaining flexibility. After bending, the bending area can be arc-shaped, and the structural adhesive MC fits the bending area accordingly, thus also being arc-shaped.

[0078] In addition, such as Figure 2 As shown, the display device may also include a support SP, which is located in the peripheral area WA and is supported between the fan-out area FA, which is bent to the backlight side of the display panel 100, and the display panel 100, so as to keep the structure of the fan-out area FA stable and not easy to collapse.

[0079] In some embodiments of this disclosure, such as Figure 3 As shown, the display panel 100 can also be a rigid structure rather than a bendable structure. For example, the peripheral area WA may include a fan-out area FA extending in a direction away from the display area AA, which may be an area protruding outward from the peripheral area WA. The bonding portion PA is located in the fan-out area FA. The fan-out area FA and the display area AA may be distributed along a first direction. The main board of the electronic device is located on the backlight side of the display panel 100. By bending the flexible circuit board 1, the main board can be connected to the bonding portion PA without bending the display panel 100. The driver chip TIC may be located in the fan-out area FA or on the flexible circuit board 1.

[0080] Of course, in some implementations, the peripheral area WA may not need to have a dedicated fan-out area FA, as long as it has a bonding part PA.

[0081] like Figure 4 and Figure 5 As shown, the flexible circuit board 1 may include a main body 11 and an extension 12. The main body 11 can be connected to a bonding portion PA, and the extension 12 can extend along a first direction Y and be distributed along the first direction Y with the main body 11, and connect with the main body 11. The extension 12 can be used to connect with a motherboard. Meanwhile, the extension 12 has two sides distributed along a second direction X, and the distance between the two sides of the extension 12 is smaller than the width of the main body 11 in the second direction X, that is, the width of the extension 12 in the second direction X is smaller than the width of the main body 11 in the second direction X.

[0082] like Figure 2 and Figure 3 As shown, in order to fix the position of the flexible circuit board 1 and prevent it from easily coming loose, the main body 11 of the flexible circuit board 1 can be glued to the backlight side of the display panel 100. For example, the flexible circuit board 1 can be glued to the surface of the heat dissipation support layer SCF away from the display substrate PNL, but the extension 12 is not glued to the display substrate PNL so that it can be connected to the motherboard later.

[0083] The inventors discovered that the front of the display panel 100 sometimes exhibits mold marks, which is caused by local unevenness of the display panel 100. Further testing revealed that some of these mold marks are located near the area where the extension 12 of the flexible circuit board 1 connects to the main body 11. Analysis showed that before leaving the factory, the display device requires testing, such as lamp illumination testing. The extension 12 needs to be connected to the test circuit to input test signals. During this process, the extension 12 needs to be pulled to facilitate wiring. This pulling causes deformation at the connection point between the main body 11 and the extension 12. Because the main body 11 is bonded to the display panel 100, this deformation can be transmitted to the display panel 100, eventually reaching the optical adhesive layer (OCA), resulting in unevenness in the corresponding area and visually appearing as mold marks, thus affecting the display effect.

[0084] Based on the above-mentioned technical problems, the inventors propose that the design can be made for the part where the main body 11 and the extension 12 meet in the flexible circuit board 1, so that the local deformation caused by the stretching of the extension 12 is not easily transmitted to the display panel 100, thereby preventing the stretching of the extension 12 from causing mold marks on the display panel 100. The following is a detailed description:

[0085] like Figure 4 and Figure 5 As shown, the main body 11 of the flexible circuit board 1 may include a circuit board layer 111 and a first adhesive layer 112. The circuit board layer 111 and the extension 12 may be an integral structure, both being flexible and bendable. The first adhesive layer 112 is located between the circuit board layer 111 and the display panel 100, and the circuit board layer 111 can be bonded to the display panel 100 via the first adhesive layer 112. For example, the first adhesive layer 112 may be bonded to the surface of the heat dissipation support layer SCF away from the display substrate PNL.

[0086] The main body 11 can be divided into at least a main body area M1 and a clearance area M2. The clearance area M2 is smaller than the main body area M1 and is connected to the extension 12. Figures 4-13 As shown, in the first embodiment of this disclosure, the elastic modulus of the avoidance area M2 can be made smaller than that of the main body area M1, making the avoidance area M2 itself more easily deformable than the main body area M1. The bending of the extension 12 will cause the avoidance area M2 itself to deform, and it is not easy to transmit to the display panel 100, thereby reducing the risk of local unevenness of the display panel 100 caused by the bending of the extension 12, which can improve the molding problem of the display device and help improve the display effect.

[0087] like Figures 14-17As shown, in the second embodiment of this disclosure, the first adhesive layer 112 extends into the clearance area M2, and the boundary of the first adhesive layer 112 near the extension 12 can be aligned with the boundary of the circuit board layer 111 near the extension 12. Simultaneously, at most one of the circuit board layer 111 and the display panel 100 within the clearance area M2 can be bonded to the first adhesive layer 112; that is, at least one of the circuit board layer 111 and the display panel 100 is not bonded to the first adhesive layer 112. The unbonded area lacks adhesion, making it difficult for deformation to be transmitted to the display panel 100 through the first adhesive layer 112. This reduces the risk of localized unevenness in the display panel 100 caused by bending of the extension 12, improves the molding problem of the display device, and helps improve the display effect.

[0088] In some embodiments of this disclosure, such as Figures 5-9 , Figure 11 , Figure 13 , Figure 15 , Figure 17 As shown, the width H of the avoidance area M2 in the first direction Y is ≥1mm, for example, H=2mm, which can improve the molding while ensuring the bonding effect.

[0089] The distance L between the side of the extension 12 and the boundary of the clearance area M2 in the second direction X is greater than 0. That is, the width of the extension 12 in the second direction X (the distance between the two sides) is less than the width of the clearance area M2. For example, the two sides of the extension 12 include a first side and a second side. The distance between the first side and the boundary of the clearance area M2 near the first side is greater than 0, and the distance between the second side and the boundary of the clearance area M2 near the first side is also greater than 0. Furthermore, the distance between the first side and the boundary of the clearance area M2 near the first side can be equal to the distance between the second side and the boundary of the clearance area M2 near the first side, and both can be L, where L is greater than 0. For example, L = 2mm, which can improve the molding while ensuring the bonding effect.

[0090] The two types of implementation methods described above are further explained below:

[0091] First type of implementation

[0092] To make the elastic modulus of the clearance area M2 less than that of the main body area M1, the first adhesive layer 112 can be hollowed out or thinned in the clearance area M2, making it difficult for the extension 12 to deform the display panel 100 by passing through the first adhesive layer 112 in the clearance area M2. For example, a clearance notch 112h can be made in the first adhesive layer 112 near the edge of the extension 12. The clearance notch 112h is located in the clearance area M2 and exposes the circuit board layer 111. That is, the clearance notch 112h penetrates the first adhesive layer 112, so that the circuit board layer 111 exposed by the clearance notch 112h cannot be bonded to the display panel 100 through the first adhesive layer 112. The extension 12 can be connected to the area exposed by the clearance notch 112h in the circuit board layer 111. When the extension 12 is pulled, if the connection between the extension 12 and the circuit board layer 111 is deformed, the presence of the clearance notch 112h makes it difficult to transmit the deformation to the display panel 100 even if the circuit board layer 111 exposed by the clearance notch 112h is deformed, thereby improving the molding problem.

[0093] The boundary of the clearance area M2 can be the boundary of the area defined by the clearance notch 112h in the main body 11. Therefore, in the first embodiment, the boundary of the clearance area M2 can be represented by the boundary of the clearance notch 112h. The portion of the boundary of the first adhesive layer 112 near the extension 12, excluding the clearance notch 112h, can be aligned with the boundary of the main body 11 near the extension 12. The clearance notch 112h can be considered as being formed by the inward contraction of the boundary of the first adhesive layer 112 near the extension 12 in a direction away from the extension 12. At the same time, the extension 12 can be located within the boundary of the clearance notch 112h in the second direction X, so that the extension 12 is not wider than the clearance notch 112h, further preventing the extension 12 from causing mold marks through the first adhesive layer 112.

[0094] In some embodiments of this disclosure, the width H of the clearance notch 112h in the first direction Y is ≥1mm, for example, H = 2mm, which can improve the molding while ensuring the bonding effect.

[0095] The extension 12 has two sides, including a first side and a second side. The distance between the first side and the boundary of the clearance notch 112h near the first side is greater than 0, and the distance between the second side and the boundary of the clearance area M2 near the first side is greater than 0. Furthermore, the distances between the first side and the boundary of the clearance notch 112h near the first side and the distances between the second side and the boundary of the clearance notch 112h near the first side can be equal, and both are L, where L is greater than 0. For example, L = 2mm, which can improve the molding process while ensuring adhesion.

[0096] The outline of the clearance gap 112h can be a polygon, triangle, semicircle, semi-ellipse, etc., without special limitation. The following is an example:

[0097] like Figure 4 and Figure 5 As shown, in the first embodiment of the first type, the boundary of the clearance notch 112h may include two sidewalls distributed along the second direction X and a bottom wall connecting the two sidewalls; the two sides of the extension 12 are located between the two sidewalls of the clearance notch 112h. The two sidewalls of the clearance notch 112h are parallel and extend along the first direction Y, and the bottom wall extends along the second direction X, such that the outline of the orthographic projection of the clearance notch 112h on the circuit board layer 111 can be rectangular. The sidewalls and bottom wall of the clearance notch 112h can be connected by rounded corners or form right angles. The depth of the clearance notch 112h in the first direction Y is the distance between its bottom wall and the boundary of the first adhesive layer 112 near the extension 12.

[0098] like Figure 6 As shown, in the second embodiment of the first type, the boundary of the clearance notch 112h may include two sidewalls distributed along the second direction X and a bottom wall connecting the two sidewalls; the two sides of the extension 12 are located between the two sidewalls of the clearance notch 112h. The distance between the two sidewalls of the clearance notch 112h gradually decreases in the direction away from the extension 12, such that the outline of the orthographic projection of the clearance notch 112h on the circuit board layer 111 can be trapezoidal, and the trapezoid can be an isosceles trapezoid.

[0099] like Figure 7 As shown, in the third embodiment of the first type, the boundary of the clearance notch 112h may include two sidewalls distributed along the second direction X and a bottom wall connecting the two sidewalls; the two sides of the extension 12 are located between the two sidewalls of the clearance notch 112h. The two sidewalls of the clearance notch 112h are curved surfaces that rise in opposite directions, that is, the two sidewalls of the clearance notch 112h are curved surfaces that are concave in opposite directions, and the bottom wall extends along the second direction X. The sidewalls and the bottom wall can be smoothly connected, so that the outline of the orthographic projection of the clearance notch 112h on the circuit board layer 111 can be oval.

[0100] like Figure 8 As shown, in the fourth embodiment of the first type, the boundary of the clearance notch 112h may include two intersecting sidewalls, which may form an included angle, which may be an obtuse angle, such that the outline of the orthographic projection of the clearance notch 112h on the circuit board layer 111 may be triangular. The depth of the clearance notch 112h in the first direction Y is the distance between the intersection of the two sidewalls and the boundary of the first adhesive layer 112 near the extension 12.

[0101] like Figure 9As shown, in the fifth embodiment of the first type, the boundary of the clearance notch 112h can be arc-shaped, that is, the outline of the orthographic projection of the clearance notch 112h on the circuit board layer 111 can be arc-shaped. The depth of the clearance notch 112h in the first direction Y is the maximum distance between the sidewall of the clearance notch 112h and the boundary of the first adhesive layer 112 near the extension 12, which is also the height of the arc.

[0102] like Figure 10 and Figure 1 As shown, in the sixth embodiment of the first type, the main body 11 further includes a second adhesive layer 113, which can be disposed within the clearance notch 112h, and the portion of the circuit board layer 111 exposed by the clearance notch 112h is bonded to the display panel 100 through the second adhesive layer 113; that is, the clearance notch 112h can be filled with the second adhesive layer 113, and the circuit board layer 111 and the display panel 100 are bonded at the clearance notch 112h through the second adhesive layer 113, so that the clearance area M2 is no longer hollowed out.

[0103] The second adhesive layer 113 and the first adhesive layer 112 can be made of different adhesive materials, which can make the elastic modulus of the second adhesive layer 113 smaller than that of the first adhesive layer 112. This makes the second adhesive layer 113 more easily deformable than the first adhesive layer 112. When the extension 12 is pulled, it will cause the second adhesive layer 113 to deform. However, because the elastic modulus of the second adhesive layer 113 is lower, it is less likely to transmit deformation to the display panel 100 than the first adhesive layer 112. Even if it can cause deformation of the display panel 100, the degree of deformation is smaller than that transmitted by the first adhesive layer 112 in the clearance area M2. This can improve the flatness of the display panel 100 and improve the molding problem.

[0104] The thickness of the second adhesive layer 113 can be the same as the thickness of the first adhesive layer 112, and the boundary of the second adhesive layer 113 is the boundary of the clearance notch 112h. Therefore, the shape of the second adhesive layer 113 is the same as the shape of the clearance notch 112h, so that the clearance notch 112h can be filled. Of course, the second adhesive layer 113 may not fill the clearance notch 112h completely, that is, the second adhesive layer 113 may only fill a part of the clearance notch 112h, and the clearance area M2 is only bonded to the display panel 100 by the second adhesive layer 113, while the area of ​​the clearance notch 112h not filled by the second adhesive layer 113 is hollowed out.

[0105] The shape of the clearance notch 112h in the sixth embodiment described above can be the same as the shape of the clearance notch 112h in any of the first to fifth embodiments described above. Of course, other shapes can also be used. The shape of the second adhesive layer 113 is constrained by the clearance notch 112h.

[0106] like Figure 12 and Figure 13 As shown, in the seventh embodiment of the first type, the avoidance area M2 may not have the aforementioned avoidance notch 112h. The boundary of the first adhesive layer 112 near the extension 12 is aligned with the boundary of the circuit board layer 111 near the extension 12, without inwardly retracting to form the avoidance notch 112h. Multiple spaced meshes 112n can be formed in the first adhesive layer 112 within the avoidance area M2, with each mesh 112n exposing the circuit board layer 111, making the first adhesive layer 112 within the avoidance area M2 a mesh structure. This results in the elastic modulus of the first adhesive layer 112 within the avoidance area M2 being less than the elastic modulus of the first adhesive layer 112 within the main body area M1. When the extension 12 is pulled, it will cause the circuit board layer 111 in the avoidance area M2 to deform. The elastic modulus of the avoidance area M2 is less than that of the main body area M1. The bending of the extension 12 will cause the avoidance area M2 to deform itself, which is not easy to be transmitted to the display panel 100. This reduces the risk of the bending of the extension 12 during the test causing local unevenness of the display panel 100, which can improve the overall molding problem of the display device and help improve the display effect.

[0107] Second type of implementation

[0108] like Figures 14-17 As shown, the main body 11 may also include a barrier layer 114 located in the avoidance area M2. The shape of the barrier layer 114 may be the same as the shape of the avoidance notch 112h mentioned above, or it may be a polygon, an oval, etc. The boundary of the barrier layer 114 can be used to represent the boundary of the avoidance area M2, that is, the outline of the orthographic projection of the barrier layer 114 on the display panel 100 coincides with the outline of the orthographic projection of the avoidance area M2 on the display panel 100.

[0109] The barrier layer 114 can be a non-adhesive film or coating, etc. It can separate the first adhesive layer 112 from the display panel 100 or the first adhesive layer 112 from the circuit board layer 111 in the avoidance area M2, thereby preventing the pulling of the extension 12 from being transmitted to the display panel 100 through the first adhesive layer 112.

[0110] In some embodiments of this disclosure, the width H of the barrier layer 114 in the first direction Y is ≥1mm, for example, H = 2mm, which can improve the molding while ensuring the bonding effect.

[0111] The extension 12 has two sides, including a first side and a second side. The distance between the first side and the boundary of the barrier layer 114 near the first side is greater than 0, and the distance between the second side and the boundary of the clearance area M2 near the first side is greater than 0. Furthermore, the distance between the first side and the boundary of the barrier layer 114 near the first side and the distance between the second side and the boundary of the barrier layer 114 near the first side can be equal, and both are L, where L is greater than 0. For example, L = 2mm, which can improve the molding process while ensuring adhesion.

[0112] like Figure 14 and Figure 15 As shown, in the first embodiment of the second type, the barrier layer 114 may be disposed between the first adhesive layer 112 and the circuit board layer 111, and is bonded to the first adhesive layer 112, but not bonded to the circuit board layer 111. When the extension 12 is pulled, the circuit board layer 111 in the avoidance area M2 will be deformed. However, due to the presence of the barrier layer 114, the circuit board layer 111 in the avoidance area M2 is not bonded to the first adhesive layer 112, causing the circuit board layer 111 itself to deform or be lifted, thereby preventing the deformation from being transmitted to the display panel 100 through the first adhesive layer 112, thereby improving the molding problem.

[0113] like Figure 16 and Figure 17 As shown, in the second embodiment of the second type, the barrier layer 114 can be disposed on the surface of the first adhesive layer 112 away from the circuit board layer 111 and is bonded to the first adhesive layer 112, but not bonded to the circuit board layer 111. When the extension 12 is pulled, it will pull the circuit board layer 111 in the avoidance area M2 to deform. Although the circuit board layer 111 in the avoidance area M2 is bonded to the first adhesive layer 112, the presence of the barrier layer 114 causes the avoidance area M2 itself to deform or be lifted, thereby preventing the deformation from being transmitted to the display panel 100 through the first adhesive layer 112, thereby improving the molding problem.

[0114] Alternatively, the circuit board layer 111 of the clearance area M2 and one of the display panel 100 can be bonded to the first adhesive layer 112 in other ways, for example:

[0115] In the second type of third embodiment, the aforementioned barrier layer 114 may be omitted. The boundary of the first adhesive layer 112 near the extension 12 is aligned with the boundary of the circuit board layer 111 near the extension 12, without inwardly retracting to form a clearance notch 112h. At least a portion of the first adhesive layer 112 in the clearance area M2 can be aged using methods such as ultraviolet irradiation, causing the first adhesive layer 112 within the clearance area M2 to fail and not adhere to the circuit board layer 111 and the display panel 100. When the extension 12 is stretched, it deforms the circuit board layer 111 in the clearance area M2. However, since the first adhesive layer 112 in the clearance area M2 is not adhered to the display panel 100 and the circuit board layer 111, the deformation of the circuit board layer 111 is not easily transmitted to the display panel 100, which helps improve the flatness of the display panel 100 and mitigates molding problems.

[0116] This disclosure also provides an electronic device that may include the display device of any of the above embodiments. The specific structure and beneficial effects of the display device can be referred to the above embodiments of the display device, and will not be described in detail here.

[0117] The electronic device disclosed herein may include a motherboard, which may be located on the backlight side of the display device, i.e., the side of the display panel 100 away from the light-emitting device. The motherboard has electronic components such as a central processing unit and a memory, and the motherboard may be connected to the end of the extension 12 of the flexible circuit board 1 away from the main body 11, thereby controlling the display device to display images through the motherboard. The flexible circuit board 1 may be directly conductively bonded or soldered to the motherboard, or it may be connected via a connector or other device.

[0118] The electronic devices disclosed herein may be televisions, tablet computers, laptops, in-vehicle displays, etc., or other electronic devices with display functions such as mobile phones and smartwatches, which will not be listed here.

[0119] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display device, characterized in that, include: A display panel has a display area and a peripheral area outside the display area, the peripheral area including a mounting portion; A flexible circuit board is connected to the bonding portion and is at least partially located on the backlight side of the display panel; the flexible circuit board includes a main body portion and an extension portion distributed along a first direction, the extension portion having two sides distributed along a second direction, the distance between the two sides of the extension portion being less than the width of the main body portion in the second direction, the first direction and the second direction intersecting; The main body includes a circuit board layer and a first adhesive layer, wherein the circuit board layer is bonded to the display panel through the first adhesive layer; the main body has a main area and a clearance area connected to the extension; the elastic modulus of the clearance area is less than the elastic modulus of the main area; or, at most one of the circuit board layer and the display panel in the clearance area is bonded to the first adhesive layer.

2. The display device according to claim 1, characterized in that, The first adhesive layer has a clearance notch near the edge of the extension to expose the circuit board layer, and the clearance notch is located in the clearance area; the extension is connected to the area of ​​the circuit board layer exposed by the clearance notch.

3. The display device according to claim 2, characterized in that, The boundary of the clearance gap includes two side walls distributed along the second direction and a bottom wall connecting the two side walls; the two sides of the extension are located between the two side walls of the clearance gap.

4. The display device according to claim 3, characterized in that, The two side walls of the clearance are parallel and extend along the first direction, while the bottom wall extends along the second direction.

5. The display device according to claim 3, characterized in that, The distance between the two side walls of the clearance gap gradually decreases in the direction away from the extension.

6. The display device according to claim 4, characterized in that, The sidewall of the clearance notch is a curved surface that rises in the opposite direction, and the bottom wall extends along the second direction.

7. The display device according to claim 2, characterized in that, The boundary of the clearance gap includes two intersecting sidewalls.

8. The display device according to claim 2, characterized in that, The boundary of the avoidance gap is arc-shaped.

9. The display device according to claim 2, characterized in that, The main body also includes: A second adhesive layer is disposed within the clearance notch, and the portion of the circuit board layer exposed by the clearance notch is bonded to the display panel through the second adhesive layer; the elastic modulus of the second adhesive layer is less than that of the first adhesive layer.

10. The display device according to claim 1, characterized in that, The main body also includes a barrier layer located in the avoidance area, the barrier layer being separated between the first adhesive layer and the circuit board layer, and being bonded to the first adhesive layer.

11. The display device according to claim 1, characterized in that, The main body also includes a barrier layer located in the avoidance area. The barrier layer is located on the surface of the first adhesive layer away from the circuit board layer and is bonded to the first adhesive layer.

12. The display device according to any one of claims 1-11, characterized in that, The two sides of the extension are located within the boundary of the avoidance area in the second direction.

13. The display device according to claim 12, characterized in that, The width of the avoidance zone in the first direction is not less than 1 mm.

14. The display device according to claim 12, characterized in that, The distance between the side of the extension and the boundary of the avoidance area in the second direction is greater than 0.

15. The display device according to claim 14, characterized in that, The width of the avoidance area in the first direction is 2mm, and the distance between the side of the extension and the boundary of the avoidance area in the second direction is 2mm.

16. The display device according to any one of claims 1-11, characterized in that, The peripheral area is partially bent to the backlight side of the display panel, and the bonding part is located on the backlight side of the display panel. The flexible circuit board is connected to the bonding part on the backlight side of the display panel.

17. The display device according to any one of claims 1-11, characterized in that, The display panel includes: Display substrate; A heat dissipation support layer is disposed on the backlight side of the display substrate; The first adhesive layer is bonded to the surface of the heat dissipation support layer away from the display substrate.

18. An electronic device, characterized in that, Includes the display device according to any one of claims 1-17.

Images