Automatic batch cleaning equipment for semiconductors

Abstract

The utility model discloses automatic batch cleaning equipment for semiconductors, and belongs to the technical field of cleaning equipment. Comprising a rack and auxiliary frames, the auxiliary frames are arranged on the two sides of the rack, two sets of longitudinal moving supports are arranged outside the auxiliary frames, a spraying device is installed at the bottom end of one set of longitudinal moving supports, a drying machine is installed at the bottom end of the other set of longitudinal moving supports, and supporting plates are symmetrically installed on the side wall of the rack; first air cylinders are installed at the top ends of the supporting plates correspondingly, and clamping plates are installed at the output ends of the first air cylinders correspondingly. According to the semiconductor cleaning device, the semiconductors are conveyed, cleaned and dried in batches in sequence through the cleaning device, the labor intensity of workers is reduced, the semiconductor cleaning efficiency of the cleaning device is improved, the semiconductors can be conveyed and collected in a classified mode conveniently and rapidly, and the classified conveying and collecting convenience of the cleaning device is improved.

Description

Technical Field

[0001] This utility model relates to the field of cleaning equipment technology, specifically to a semiconductor batch automated cleaning equipment. Background Technology

[0002] Semiconductor batch automated cleaning equipment adopts advanced cleaning technology and equipment, which can quickly complete cleaning tasks and significantly improve cleaning efficiency. The equipment uses high-quality materials and components, which have good durability and stability and can operate stably for a long time. These devices use green and environmentally friendly cleaning agents and equipment, reducing wastewater discharge and meeting environmental protection requirements. Different types of cleaning equipment can meet the cleaning needs of different sizes and materials.

[0003] An automated semiconductor cleaning device disclosed in the authorization announcement number CN212783390U includes a base plate and a top plate. Support legs are provided at the bottom of the left end and the bottom of the right end of the base plate. The top of the base plate is fixedly connected to the bottom of the support rod. A hydraulic cylinder is installed on the right side of the top end of the support rod. A clamp is installed at the output end of the hydraulic cylinder. A second rectangular opening is provided on the top of the base plate.

[0004] Although it achieves the goal of rotating the first shaft by starting the drive motor, which can drive the front baffle to rotate, and at the same time drive the first bevel gear to drive the second shaft to rotate, thereby causing the fourth bevel gear to rotate, and the fourth bevel gear to drive the third shaft to rotate, and finally cause the rear baffle to rotate, when the front baffle and the rear baffle are perpendicular to the bottom plate, the drive motor is stopped. At this time, the water in the water tank is sprayed out from the nozzle through the water pipe to clean the semiconductor. The sprayed water will splash onto the front baffle and the rear baffle, and finally flow into the collection box through the filter screen.

[0005] However, this does not solve the problem that existing cleaning equipment of this type is generally not conducive to the sequential batch conveying, cleaning and drying of semiconductors, nor is it convenient to classify, convey and collect semiconductors. This greatly affects the labor intensity of manual labor, the efficiency of the cleaning equipment in cleaning semiconductors, and the convenience of the cleaning equipment in classifying, conveying and collecting semiconductors. Utility Model Content

[0006] The purpose of this utility model is to provide an automated batch cleaning device for semiconductors, in order to solve the problems mentioned in the background art, such as the inconvenience of sequentially conveying, cleaning and drying semiconductors in batches, which affects the labor intensity of manual labor, the efficiency of the cleaning device in cleaning semiconductors, and the inconvenience of conveniently classifying, conveying and collecting semiconductors, thus affecting the convenience of the cleaning device in classifying, conveying and collecting semiconductors.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] An automated batch cleaning device for semiconductors includes a frame and auxiliary frames. Auxiliary frames are arranged on both sides of the frame. Two sets of longitudinally moving supports are arranged outside the auxiliary frames. A spraying device is installed at the bottom of one set of longitudinally moving supports, and a dryer is installed at the bottom of the other set. Support plates are symmetrically installed on the side walls of the frame. A first cylinder is installed at the top of each support plate, and a clamping plate is installed at the output end of each first cylinder. Two sets of second cylinders are symmetrically installed at the top of each auxiliary frame. The output end of one set of second cylinders is connected to one set of longitudinally moving supports, and the output end of the other set of second cylinders is connected to the other set of longitudinally moving supports. Support frames are arranged outside the frame, and a gimbal plate is arranged outside the support frames. Two sets of collection boxes are arranged outside the gimbal plate. A raw material conveyor belt is arranged inside the frame. Rotating shafts are arranged at both ends of the raw material conveyor belt. Extension shafts are installed inside each rotating shaft, and these extension shafts extend through the rotating shafts to the outside and are movably connected to the frame.

[0009] Optionally, a servo motor is mounted on the side of the frame away from the support plate, and a worm gear is mounted on the output end of the servo motor.

[0010] Optionally, a worm gear is installed at one end of the extended shaft near the frame, and the worm gear meshes with the worm.

[0011] Optionally, a power motor is installed inside the support frame, and a support shaft is installed at the output end of the power motor.

[0012] Optionally, the support shaft extends through the support frame to its exterior, and the top end of the support shaft is connected to the gimbal plate.

[0013] Optionally, a finished product roller conveyor is installed at the top of the gimbal plate, and three sets of equally spaced support blocks are installed at the bottom of the gimbal plate outside the support shaft.

[0014] Optionally, each support block is movably equipped with a roller at its bottom end, and the roller is movably connected to the support frame.

[0015] Optionally, stepper motors are symmetrically installed inside the collection box, and each stepper motor has a threaded rod installed at its output end.

[0016] Optionally, threaded blocks are fitted onto the surface of the threaded rod, and a placement plate is installed between the two sets of threaded blocks.

[0017] Optionally, a support base is symmetrically installed on the top of the collection box, and the threaded rod is movably connected to the support base.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the cleaning equipment not only realizes the sequential batch conveying, cleaning and drying of semiconductors, reducing the labor intensity of manual labor and improving the efficiency of semiconductor cleaning, but also facilitates the convenient classification, conveying and collecting of semiconductors, thus improving the convenience of classification, conveying and collecting of semiconductors.

[0019] The semiconductors to be cleaned are placed sequentially on the surface of the raw material conveyor belt. A servo motor drives a worm gear to rotate, which in turn drives a worm wheel to rotate. The worm wheel, in turn, drives an extension shaft, a rotating shaft, and the raw material conveyor belt to rotate, thus conveying the semiconductors to be cleaned. When the semiconductors move to one side of the first cylinder, the first cylinder drives a clamping plate to move in the opposite direction. With the cooperation of two sets of first cylinders, the clamping plate centers and clamps the semiconductors to be cleaned. When the semiconductors to be cleaned move to the bottom of the spraying device, the second cylinder drives a longitudinal moving bracket and the spraying device to move up and down. The longitudinal moving bracket drives the spraying device to move left and right, ensuring that the spraying device thoroughly cleans the semiconductors. After cleaning, the semiconductors are conveyed to the bottom of the dryer for drying. After drying, the semiconductors are conveyed to the surface of the finished product roller conveyor for sorting and conveying. This process enables the cleaning equipment to sequentially convey, clean, and dry semiconductors in batches, reducing manual labor intensity and improving the efficiency of semiconductor cleaning.

[0020] When semiconductors need to be sorted and transported after cleaning, if they are finished products, they are transported to a set of collection boxes via a finished product roller conveyor. A stepper motor drives a threaded rod to rotate, which in turn moves a threaded block. The threaded block moves a placement plate to a certain position to collect the semiconductors transported by the finished product roller conveyor. If they are defective products, a power motor drives a support shaft to rotate, which in turn rotates the gimbal plate, the finished product roller conveyor, and the semiconductors. This causes the finished product roller conveyor to move the defective products to another set of collection boxes for collection. This facilitates convenient sorting and transport of semiconductors, enabling the cleaning equipment to easily distinguish, transport, and collect the cleaned semiconductors, thus improving the convenience of sorting, transporting, and collecting semiconductors. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a front view structural diagram of the present utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the second cylinder of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the servo motor of this utility model;

[0026] Figure 5 This is a front view cross-sectional structural diagram of the collection box of this utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the support frame of this utility model;

[0028] Figure 7 This is a three-dimensional structural diagram of the gimbal plate of this utility model.

[0029] Figure label:

[0030] 1. Frame; 2. Auxiliary frame; 3. Support plate; 4. Support frame; 5. Gimbal plate; 6. Collection box; 7. Raw material conveyor belt; 8. First cylinder; 9. Second cylinder; 10. Longitudinal moving bracket; 11. Spraying device; 12. Dryer; 13. Servo motor; 14. Worm gear; 15. Worm wheel; 16. Extended shaft; 17. Rotating shaft; 18. Stepper motor; 19. Threaded rod; 20. Threaded block; 21. Support base; 22. Placement plate; 23. Finished product roller conveyor; 24. Stepper motor; 25. Support shaft; 26. Support block; 27. Roller; 28. Clamping plate.

[0031] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0032] The following is a detailed description of a semiconductor batch automated cleaning device provided by this utility model, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0033] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0034] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0035] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0036] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0037] like Figures 1 to 7As shown, an embodiment of this utility model provides a semiconductor batch automated cleaning equipment, including a frame 1 and an auxiliary frame 2. The auxiliary frame 2 is arranged on both sides of the frame 1. Two sets of longitudinal moving supports 10 are arranged on the outside of the auxiliary frame 2. A spraying device 11 is installed at the bottom of one set of longitudinal moving supports 10, and a dryer 12 is installed at the bottom of the other set of longitudinal moving supports 10. Support plates 3 are symmetrically installed on the side walls of the frame 1. A first cylinder 8 is installed at the top of each support plate 3, and a clamping plate 28 is installed at the output end of each first cylinder 8. Two sets of second cylinders 9 are symmetrically installed at the top of the auxiliary frame 2. The output end of one set of second cylinders 9 is connected to one set of longitudinal moving supports 10, and the other set of second cylinders 10 is connected to the other set of auxiliary supports 10. The output end of the second cylinder 9 is connected to another set of longitudinal moving brackets 10. A support frame 4 is provided on the outside of the frame 1. A gimbal plate 5 is provided on the outside of the support frame 4. Two sets of collection boxes 6 are provided on the outside of the gimbal plate 5. A raw material conveyor belt 7 is provided inside the frame 1. Rotating shafts 17 are provided at both ends of the raw material conveyor belt 7. An extension shaft 16 is installed inside the rotating shaft 17. The extension shaft 16 extends through the rotating shaft 17 and extends to the outside to be movably connected to the frame 1. A servo motor 13 is installed on the side of the frame 1 away from the support plate 3. A worm gear 14 is installed at the output end of the servo motor 13. A worm wheel 15 is installed at the end of the extension shaft 16 near the frame 1. The worm wheel 15 meshes with the worm gear 14.

[0038] When using the automated semiconductor batch cleaning equipment, the semiconductors to be cleaned are placed sequentially on the surface of the raw material conveyor belt 7. The servo motor 13 is turned on, and supported by the frame 1, it drives the worm gear 14 to rotate. The worm gear 14 meshes with the worm wheel 15, causing the worm wheel 15 to rotate. The worm wheel 15 then drives the extension shaft 16, the rotating shaft 17, and the raw material conveyor belt 7 to rotate, thus conveying the semiconductors to be cleaned. When the semiconductors move to one side of the first cylinder 8, two sets of the first cylinders 8 are activated. Supported by the support plate 3, the first cylinders 8 drive the clamping plates 28 to move in opposite directions. With the cooperation of the two sets of first cylinders 8, the clamping plates 28 centrally position and clamp the semiconductors to be cleaned. When the semiconductors to be cleaned move below the spraying device 11, a set of second cylinders 9 is activated. Supported by the auxiliary frame 2, the second cylinders 9 drive the longitudinal moving support 10 and the spraying device 11 to move up and down. Supported by the second cylinder 9, the longitudinally moving support 10 drives the spraying device 11 to move left and right, ensuring that the spraying device 11 thoroughly cleans the semiconductors to be cleaned. When cleaning is complete, the semiconductors are conveyed to the bottom of the dryer 12 for drying. When the semiconductors are moved to the bottom of the dryer 12, another set of second cylinders 9 is activated. Supported by the auxiliary frame 2, the second cylinders 9 drive the longitudinally moving support 10 and the dryer 12 to move up and down. The other set of longitudinally moving support 10 is activated. Supported by the second cylinder 9, the longitudinally moving support 10 drives the dryer 12 to move left and right, ensuring that the dryer 12 thoroughly dries the semiconductors. After drying, the semiconductors are conveyed to the surface of the finished product roller conveyor 23 for sorting and conveying. This facilitates the sequential cleaning and drying of semiconductors, enabling the cleaning equipment to sequentially convey, clean, and dry semiconductors in batches, reducing manual labor intensity and improving the efficiency of semiconductor cleaning.

[0039] The support frame 4 is equipped with a power motor 24. The output end of the power motor 24 is equipped with a support shaft 25. The support shaft 25 extends through the support frame 4 to its outside. The top end of the support shaft 25 is connected to the gimbal plate 5.

[0040] A finished product roller conveyor 23 is installed at the top of the gimbal plate 5, and three sets of support blocks 26 with equal spacing are installed at the bottom of the gimbal plate 5 outside the support shaft 25.

[0041] Rollers 27 are movably mounted on the bottom of each support block 26. The rollers 27 are movably connected to the support frame 4. Stepper motors 18 are symmetrically mounted inside the collection box 6. Threaded rods 19 are mounted on the output ends of each stepper motor 18. Threaded blocks 20 are fitted on the surface of each threaded rod 19. A placement plate 22 is installed between two sets of threaded blocks 20. Support seats 21 are symmetrically mounted on the top of the collection box 6. Threaded rods 19 are movably connected to support seats 21.

[0042] When semiconductors need to be sorted and transported after cleaning, if they are finished products, they are transported to a set of collection boxes 6 via the finished product roller conveyor 23. Two sets of stepper motors 18 inside the collection box 6 are activated. Supported by the collection box 6, the stepper motors 18 drive the threaded rod 19 to rotate. With the threaded connection between the threaded rod 19 and the threaded block 20, the threaded rod 19 moves the threaded block 20. Supported by the support base 21, the threaded block 20 moves the placement plate 22 to a certain position to collect the semiconductors transported by the finished product roller conveyor 23. If they are defective products, the power motor 24 is activated. Supported by the support frame 4, the power motor 24 drives the support shaft 25 to rotate. The support shaft 25 drives the gimbal plate 5, the finished product roller conveyor 23, and the semiconductors to rotate, allowing the finished product roller conveyor 23 to move the defective products to another set of collection boxes 6 for collection. This facilitates convenient sorting and transport of semiconductors, enabling the cleaning equipment to easily distinguish, transport, and collect the cleaned semiconductors, thus improving the convenience of sorting, transporting, and collecting the cleaning equipment.

[0043] The working principle of the technical solution provided by this utility model is as follows: When using the automated semiconductor batch cleaning equipment, the semiconductors to be cleaned are placed sequentially on the surface of the raw material conveyor belt 7. The servo motor 13 drives the worm gear 14 to rotate, the worm gear 14 drives the worm wheel 15 to rotate, and the worm wheel 15 drives the extension shaft 16, the rotating shaft 17, and the raw material conveyor belt 7 to rotate, so that the semiconductors to be cleaned are conveyed. When it moves to one side of the first cylinder 8, the first cylinder 8 drives the clamping plate 28 to move in the opposite direction. With the cooperation of the two sets of first cylinders 8, the clamping plate 28 is used to center and clamp the semiconductors to be cleaned. When the semiconductors to be cleaned move to the bottom of the spraying device 11, the second cylinder 9 drives the longitudinal moving bracket 10 and the spraying device 11 to move up and down. The longitudinal moving bracket 10 drives the spraying device 11 to move left and right, so that the spraying device 11 can fully clean the semiconductors to be cleaned. When the cleaning is completed, it is conveyed to the bottom of the dryer 12 for drying. When the semiconductor moves to the bottom of the dryer 12, another set of second cylinders 9 is opened. 9 drives the longitudinal moving support 10 and the dryer 12 to move up and down, opens another set of longitudinal moving supports 10, and the longitudinal moving support 10 drives the dryer 12 to move left and right, so that the dryer 12 can fully dry the semiconductors. After drying, they are conveyed to the surface of the finished product roller conveyor 23 for classified conveying. When it is necessary to classify and convey the cleaned semiconductors, if they are finished products, the semiconductors are conveyed to the inside of a set of collection boxes 6 through the finished product roller conveyor 23. The stepper motor 18 drives the threaded rod 19 to rotate, the threaded rod 19 drives the threaded block 20 to move, and the threaded block 20 drives the placement plate 22 to move to a certain position to collect the semiconductors conveyed by the finished product roller conveyor 23. If they are defective products, the power motor 24 drives the support shaft 25 to rotate, the support shaft 25 drives the gimbal plate 5, the finished product roller conveyor 23 and the semiconductors to rotate, so that the finished product roller conveyor 23 moves the defective products to another set of collection boxes 6 for collection, which facilitates convenient classification and conveying of semiconductors to complete the use of the cleaning equipment.

[0044] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0045] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor batch automated cleaning equipment, characterized in that: The system includes a frame and auxiliary frames. Auxiliary frames are located on both sides of the frame. Two sets of longitudinally moving supports are located on the outside of each auxiliary frame. A spraying device is installed at the bottom of one set of longitudinally moving supports, and a dryer is installed at the bottom of the other set. Support plates are symmetrically installed on the side walls of the frame. A first cylinder is installed at the top of each support plate, and a clamping plate is installed at the output end of each first cylinder. Two sets of second cylinders are symmetrically installed at the top of each auxiliary frame. The output end of one set of second cylinders is connected to one set of longitudinally moving supports, and the output end of the other set of second cylinders is connected to the other set of longitudinally moving supports. A support frame is located outside the frame, and a gimbal plate is located outside the support frame. Two sets of collection boxes are located outside the gimbal plate. A raw material conveyor belt is located inside the frame, and rotating shafts are located at both ends of the conveyor belt. Extending shafts are installed inside each rotating shaft and extend through the rotating shafts to the outside, movably connecting to the frame.

2. The semiconductor batch automated cleaning equipment according to claim 1, characterized in that: A servo motor is mounted on the side of the frame away from the support plate, and a worm gear is mounted on the output end of the servo motor.

3. The semiconductor batch automated cleaning equipment according to claim 1, characterized in that: A worm gear is installed at one end of the extended shaft near the frame, and the worm gear meshes with the worm.

4. The semiconductor batch automated cleaning equipment according to claim 1, characterized in that: The support frame is equipped with a power motor, and the output end of the power motor is equipped with a support shaft.

5. The semiconductor batch automated cleaning equipment according to claim 4, characterized in that: The support shaft extends through the support frame to its exterior, and the top end of the support shaft is connected to the gimbal plate.

6. The semiconductor batch automated cleaning equipment according to claim 4, characterized in that: A finished product roller conveyor is installed at the top of the gimbal plate, and three sets of support blocks with equal spacing are installed at the bottom of the gimbal plate outside the support shaft.

7. The semiconductor batch automated cleaning equipment according to claim 6, characterized in that: Each support block has a roller movably mounted at its bottom end, and the roller is movably connected to the support frame.

8. The semiconductor batch automated cleaning equipment according to claim 1, characterized in that: The collection box is symmetrically equipped with stepper motors, and each stepper motor has a threaded rod installed at its output end.

9. The semiconductor batch automated cleaning equipment according to claim 8, characterized in that: The surface of the threaded rod is fitted with threaded blocks, and a placement plate is installed between the two sets of threaded blocks.

10. The semiconductor batch automated cleaning equipment according to claim 8, characterized in that: The top of the collection box is symmetrically equipped with support bases, and the threaded rod is movably connected to the support bases.

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