Semiconductor substrate processing device

Abstract

The utility model relates to a semiconductor substrate processing device which comprises a flower basket, a cleaning assembly, a lifting and overturning assembly and a pushing assembly. The flower basket is provided with a first opening and a second opening which are oppositely arranged, the flower basket can enable the semiconductor substrate to be immersed in the wetting groove in a vertical state, and when the semiconductor substrate is immersed in the wetting groove in the vertical state, the first opening faces upwards; the lifting and overturning assembly can drive the flower basket to be lifted and overturned to enable the semiconductor substrate to be located at the pushing position, when the semiconductor substrate is located at the pushing position, the semiconductor substrate is in a horizontal state, and the first opening faces the cleaning assembly; the pushing assembly is used for linearly pushing the semiconductor substrate from the second opening to the cleaning assembly for cleaning when the semiconductor substrate is in the pushing position; by arranging the lifting and overturning assembly and the pushing assembly, the cost is reduced, and by optimizing the transfer operation, the transfer time of the semiconductor substrate is shortened, so that the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a semiconductor substrate processing apparatus. Background Technology

[0002] In semiconductor manufacturing processes, semiconductor substrates, such as wafers, may leave behind polishing slurry residue, abrasive particles, and residues of the polished material layer during CMP (chemical mechanical polishing). Therefore, it is necessary to clean the semiconductor substrate after CMP. Semiconductor substrate cleaning is an indispensable step in semiconductor manufacturing, which directly affects the performance, reliability, and yield of semiconductor devices.

[0003] Semiconductor substrates treated with CMP need to be kept moist; otherwise, residues adhering to the substrate surface will not only increase the difficulty of subsequent cleaning but also damage the circuit patterns on the substrate surface. Therefore, current technology typically involves placing the semiconductor substrate in a basket and immersing both the basket and the substrate in a water tank. When cleaning is required, a transfer robot is needed to remove the substrate from the basket and transfer it to the cleaning equipment. However, the robot itself is expensive, and the transfer process is complex, leading to increased production costs and reduced production efficiency.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] In view of this, the present application aims to provide a semiconductor substrate processing apparatus that can transfer semiconductor substrates at a lower cost and higher efficiency, thereby cleaning the semiconductor substrates.

[0006] In a first aspect, embodiments of this application provide a semiconductor substrate processing apparatus, including:

[0007] A flower basket is used to place a semiconductor substrate. The flower basket has a first opening and a second opening that are arranged opposite to each other. The first end has the first opening, and the semiconductor substrate is placed into the flower basket through the first opening. The flower basket enables the semiconductor substrate to be immersed in a wetting tank in an upright state, wherein the first opening faces upward when the semiconductor substrate is immersed in the wetting tank in an upright state.

[0008] Cleaning components for cleaning the semiconductor substrate;

[0009] A lifting and flipping assembly is connected to the flower basket. The lifting and flipping assembly can drive the flower basket to lift and flip so that the semiconductor substrate is in the pushing position. When the semiconductor substrate is in the pushing position, the semiconductor substrate is in a horizontal state and the first opening faces the cleaning assembly.

[0010] A pushing component is used to push the semiconductor substrate linearly from the second opening to the cleaning component for cleaning when the semiconductor substrate is in the pushing position.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the lifting and flipping assembly includes a lifting mechanism and a flipping mechanism, wherein the power output end of the lifting mechanism is connected to the flipping mechanism, and the power output end of the flipping mechanism is connected to the flower basket.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the flipping mechanism includes a flipping drive and a linkage mechanism, wherein the flipping drive is tractively connected to one end of the linkage mechanism, and the other end of the linkage mechanism is connected to the flipping shaft of the flower basket.

[0013] In conjunction with the first aspect of this application, in an optional embodiment, the flower basket has a first sidewall and a second sidewall located on both sides of the first opening, the flipping shaft has a first shaft portion and a second shaft portion, the first shaft portion is disposed on the outer wall of the first sidewall, the second shaft portion is disposed on the outer wall of the second sidewall, and the linkage mechanism is connected to the first shaft portion;

[0014] The flipping mechanism also includes a first flipping frame and a second flipping frame located on both sides of the flower basket. The first flipping frame is connected to the power output end of the lifting mechanism, the first shaft is connected to the first flipping frame, and the second shaft is connected to the second flipping frame.

[0015] In conjunction with a first aspect of this application, in an optional embodiment, the pushing component includes a fork, the fork including a support portion and a pushing portion connected to the support portion, the support portion being used to support the semiconductor substrate, and the pushing portion being used to abut against the periphery of the semiconductor substrate, thereby applying a pushing force to the semiconductor substrate.

[0016] In conjunction with the first aspect of this application, in an optional embodiment, the pushing component further includes a pushing drive, a pushing guide rail, and a pushing arm, the pushing arm being connected to the power output end of the pushing drive, the fork being fixedly connected to one end of the pushing arm, and the pushing arm having a sliding member that cooperates with the pushing guide rail.

[0017] In conjunction with a first aspect of this application, in an alternative embodiment, when the semiconductor substrate is in the pushing position, the pushing guide is located outside the basket corresponding to the first sidewall or the second sidewall, and the pushing arm has a clearance groove that allows the pushing arm to avoid the first sidewall or the second sidewall when moving along the pushing guide.

[0018] In conjunction with a first aspect of this application, in an alternative embodiment, the cleaning assembly includes at least one set of roller brushes, the roller brushes including an upper roller brush and a lower roller brush arranged in parallel, a first gap being formed between the upper roller brush and the lower roller brush for the semiconductor substrate to pass through.

[0019] In conjunction with the first aspect of this application, in an optional embodiment, the cleaning assembly further includes at least one set of positioning rollers, the positioning rollers including an upper positioning roller and a lower positioning roller arranged in parallel, a second gap being formed between the upper positioning roller and the lower positioning roller for the semiconductor substrate to pass through.

[0020] In conjunction with the first aspect of this application, in an alternative embodiment, both the first gap and the second gap are adjustable.

[0021] The semiconductor substrate processing apparatus provided in this application embodiment immerses the semiconductor substrate in a wetting tank in an upright state. Compared with the existing method of immersing the semiconductor substrate in a horizontal state, this can prevent the semiconductor substrate from floating and detaching from the basket due to the buoyancy of the liquid.

[0022] The semiconductor substrate processing apparatus provided in this application uses a lifting and flipping component to lift and flip the basket, thereby transferring the semiconductor substrate to a pushing position to match the height of the cleaning component and converting it to a horizontal state to be cleaned. The pushing component passes directly through the second end of the basket and pushes the semiconductor substrate linearly to the cleaning component. In this way, the transfer of semiconductor substrates is achieved by using a low-cost lifting and flipping component and a pushing component, replacing the expensive transfer robot and greatly reducing costs. Moreover, compared with existing transfer robots that need to perform clamping and rotating transfer actions for each semiconductor substrate, this application lifts and flips the basket as a whole, and the pushing component only needs to perform a linear pushing action for each semiconductor substrate. The transfer action is simpler and can shorten the transfer time of semiconductor substrates, thereby improving production efficiency.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0024] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0025] Figure 1 A partial structural schematic diagram of the semiconductor substrate processing apparatus provided in an embodiment of this application (in which the basket is lifted and flipped).

[0026] Figure 2 A partial structural diagram of the lifting and flipping assembly and the flower basket in the semiconductor substrate processing apparatus provided in this application embodiment (wherein, the flower basket is not lifted and flipped).

[0027] Figure 3 This is a partial structural schematic diagram of the lifting and flipping assembly in the semiconductor substrate processing apparatus provided in the embodiments of this application;

[0028] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0029] Figure 5 A partial structural diagram of the lifting and flipping assembly and the flower basket in the semiconductor substrate processing apparatus provided in this application embodiment (wherein the flower basket is lifted and flipped).

[0030] Figure 6 This is a partial structural diagram of the push component in the semiconductor substrate processing apparatus provided in the embodiments of this application.

[0031] Figure label:

[0032] 1. Flower basket; 11. First opening; 12. Base plate; 13. First side wall; 14. Second side wall; 15. First shaft; 16. Second shaft;

[0033] 2. Lifting mechanism; 21. Lifting frame; 22. Lifting drive component; 23. Tank track;

[0034] 3. Tilting mechanism; 31. Tilting drive component; 32. Linkage mechanism; 321. First link; 322. Second link; 323. Third link; 3231. Bushing; 33. First tilting frame; 34. Second tilting frame;

[0035] 4. Pushing component; 41. Fork; 411. Pushing part; 42. Pushing guide rail; 43. Pushing arm; 431. First arm; 432. Second arm; 433. Connecting arm; 434. Clearance groove;

[0036] 5. Cleaning components; 51. Brush assembly; 52. Positioning roller assembly;

[0037] 6. Semiconductor substrate. Detailed Implementation

[0038] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0039] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this utility model.

[0040] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly indicate that at least one of those features is included. In the description of this utility model, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0041] In this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] In this utility model, unless otherwise explicitly defined, the terms "above," "on top of," "above," "over," "below," "below," "below," or "below" for "first feature above second feature" can refer to direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Furthermore, "above," "above," and "over" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0043] This disclosure provides an embodiment of a semiconductor substrate processing apparatus, such as... Figures 1 to 6 As shown, the semiconductor substrate processing apparatus includes a basket 1 for placing a semiconductor substrate. The basket 1 has a first end and a second end disposed opposite to each other. The first end has a first opening 11. The semiconductor substrate is placed into the basket 1 through the first opening 11. The semiconductor substrate may be, for example, a wafer. Figure 2 and Figure 5 As shown, the flower basket has a first sidewall 13 and a second sidewall 14 on both sides of the first opening 11. Several parallel slots are provided on the inner walls of both the first sidewall 13 and the second sidewall 14, extending from the first opening 11 to the second end. The slots on both sides cooperate with each other to place the semiconductor substrate. Since the semiconductor substrate needs to be kept moist after CMP treatment, otherwise the residue adhering to the surface of the semiconductor substrate will not only increase the difficulty of subsequent cleaning but also damage the circuit patterns on the surface of the semiconductor substrate. Therefore, the semiconductor substrate is immersed in a wetting tank (not shown) along with the flower basket 1. At this time, as... Figure 2 As shown, the first opening 11 of the basket 1 faces upwards, and the semiconductor substrate is held upright by the slots on both sides of the basket 1. In the prior art, the semiconductor substrate is usually immersed in the wetting tank in a horizontal position. Since the semiconductor substrate is not constrained in the horizontal direction, it will float and detach from the basket due to the buoyancy of the wetting liquid. Placing the semiconductor substrate in an upright position can avoid the problem of the semiconductor substrate floating. It should be noted that the upright position of the semiconductor substrate can be that the plane of the semiconductor substrate coincides with the vertical plane, or that the plane of the semiconductor substrate is at a certain angle to the vertical plane.

[0044] The semiconductor substrate processing apparatus of this disclosure further includes a cleaning component 5 for cleaning the semiconductor substrate. Since the semiconductor substrate is cleaned in a horizontal state, it is necessary to transfer the semiconductor substrate from the wetting tank to the cleaning component 5. In the prior art, a transfer robot is usually used to remove the semiconductor substrate from the basket. The transfer operation of the transfer robot varies depending on the state of the semiconductor substrate in the wetting tank. If the semiconductor substrate is immersed in the wetting tank in a horizontal state, the transfer robot removes the semiconductor substrate from the first opening, and the semiconductor substrate is transferred to the cleaning component through a translation and lifting process. If the semiconductor substrate is immersed in the wetting tank in an upright state, it is necessary to change the semiconductor substrate from an upright state to a horizontal state. The transfer robot removes the upright semiconductor substrate from the first opening, and the semiconductor substrate is transferred to the cleaning component through a lifting and flipping process under the action of the transfer robot. However, regardless of whether the semiconductor substrate is initially upright or horizontal, the aforementioned transfer operation requires a transfer robot to remove the semiconductor substrate from the first opening of the basket, and then use the rotation of the robotic arm to achieve the transfer. The transfer robot has a complex structure and the transfer action is relatively cumbersome. Moreover, transfer robots are generally expensive. In order to remove the upright semiconductor substrate, the transfer robot usually needs to use a fork with vacuum adsorption function to grip and adsorb the semiconductor substrate, so a vacuum device is required, which makes the transfer cost of semiconductor substrate high. In addition, the transfer robot needs to perform adsorption gripping, rotation transfer, and even lifting and flipping actions for each semiconductor substrate, which takes a long time and has low efficiency.

[0045] Therefore, the semiconductor substrate processing apparatus of this disclosure embodiment, such as Figures 1 to 6 As shown, it includes a lifting and flipping assembly and a pushing assembly 4; the lifting and flipping assembly is connected to the flower basket 1, and the lifting and flipping assembly can drive the flower basket 1 to lift and flip so that the semiconductor substrate is in the pushing position, wherein, as Figure 1 and Figure 5 As shown, when the semiconductor substrate is in the pushing position, it is horizontal, with the first opening 11 facing the cleaning component 5. The pushing component 4 is used to linearly push the semiconductor substrate from the second end of the basket 1 to the cleaning component 5 for cleaning when the semiconductor substrate is in the pushing position. By using a low-cost lifting and flipping component and the pushing component 4, the transfer of the semiconductor substrate is achieved, replacing the transfer robot. Since the pushing component 4 only needs to linearly push the semiconductor substrate, there is no need to use vacuum equipment to vacuum-adsorb the semiconductor substrate, which greatly reduces the cost. Moreover, this application lifts and flips the basket as a whole, and the pushing component only needs to perform a linear pushing action on each semiconductor substrate. The transfer action is relatively simple, which can shorten the transfer time of the semiconductor substrate and thus improve production efficiency.

[0046] Those skilled in the art will understand that the second end of the basket 1 has a second opening opposite to the first opening 11, thereby allowing the pushing component 4 to pass through and push the semiconductor substrate from the second end of the basket 1; optionally, as Figure 2 As shown, the flower basket 1 has a base plate 12 at the second end. When the semiconductor substrate is in an upright state, the base plate 12 supports the semiconductor substrate. The second opening is formed on the base plate 12, and the size of the first opening 11 is larger than the size of the second opening. Figure 1 In this illustration, the base plate 12 is not shown to facilitate the demonstration of the transfer component extending into the basket 1 from the second end; in an alternative embodiment, the base plate 12 may be omitted, so that the second end of the basket 1 has a second opening directly, and a corresponding support structure may be provided at the bottom of the basket to support the semiconductor substrate.

[0047] Further optional, such as Figures 1 to 5 As shown, the lifting and flipping assembly includes a lifting mechanism 2 and a flipping mechanism 3. The power output end of the lifting mechanism 2 is connected to the flipping mechanism 3, and the power output end of the flipping mechanism 3 is connected to the basket 1. Decomposing the lifting and flipping action into a lifting action and a flipping action, and thus setting the lifting mechanism 2 and the flipping mechanism 3 separately, facilitates the simplified design of the mechanical transmission structure. The power output end of the lifting mechanism 2 is connected to the flipping mechanism 3, and the power output end of the flipping mechanism 3 is connected to the basket 1. When cleaning the semiconductor substrate is required, the lifting mechanism 2 drives the flipping mechanism 3 and the basket 1 to be raised together to a height suitable for the cleaning assembly 5. Then, the flipping mechanism 3 drives the basket 1 to flip until the first opening 11 faces the cleaning assembly 5. After all the semiconductor substrates in the basket 1 have been transferred, the basket 1 returns to the state where the first opening 11 faces upward in the wetting tank via the lifting and flipping assembly. In other optional embodiments, the power output end of the lifting mechanism can also be connected to the basket, and the power output end of the flipping mechanism can be connected to the lifting mechanism.

[0048] It should be noted that since the semiconductor substrates are arranged in layers in the slots of the basket 1, when the semiconductor substrates are in the horizontal pushing position, the height of each semiconductor substrate is different. After the pushing component 4 completes the pushing of the previous semiconductor substrate, the lifting mechanism 2 will be activated to finely adjust the height of the basket 1, so that the height of the next semiconductor substrate is adapted to the cleaning component 5, ensuring the smooth pushing of the semiconductor substrate.

[0049] Further optional, such as Figures 2 to 3As shown, the lifting mechanism 2 includes a lifting frame 21 and a lifting drive component 22. The lifting drive component 22 is mounted on the lifting frame 21. The lifting drive component 22 can be a lifting motor, a lifting cylinder, a lifting hydraulic cylinder, etc. The power output end of the lifting drive component 22 is connected to the tilting mechanism 3. For example, the power output rod of the lifting cylinder or the lifting hydraulic cylinder can be directly connected to the tilting mechanism 3, and the lifting motor can be connected to the tilting mechanism 3 through a ball screw mechanism, etc. To guide the lifting of the tilting mechanism 3, a lifting guide rail or other guiding structure can be set on the lifting frame 21, and a corresponding slider or other guiding structure can be set on the tilting mechanism 3. In addition, a tank chain 23 can also be set on the lifting frame 21 to facilitate the installation of electrical circuits or air circuits, etc.

[0050] Further optional, such as Figures 2 to 3 As shown, the flipping mechanism 3 includes a flipping drive 31 and a linkage mechanism 32. One end of the flipping drive 31 is connected to one end of the linkage mechanism 32, and the other end of the linkage mechanism 32 is connected to the flipping shaft of the flower basket 1. The rotation of the flipping drive 31 drives the linkage mechanism 32 to move, which in turn drives the flipping shaft to rotate, thus flipping the flower basket 1. The linkage mechanism 32 facilitates smooth torque output. In other optional embodiments, a coupling or other components can be provided between the flipping drive 31 and the flipping shaft of the flower basket 1 to achieve the connection between the flipping drive 31 and the flower basket 1. The flipping drive 31 can be a rotary motor, a rotary cylinder, or the like.

[0051] In some alternative embodiments, such as Figures 3 to 4 As shown, the linkage mechanism 32 includes a first link 321, a second link 322, and a third link 323 connected in sequence. The power output end of the flipping drive 31 is connected to the first link 321, and the end of the third link 323 is connected to the flipping shaft of the flower basket 1. Further, the flower basket 1 has a first sidewall 13 and a second sidewall 14 located on both sides of its first end. The flipping shaft has a first shaft portion 15 and a second shaft portion 16. The first shaft portion 15 is disposed on the outer wall of the first sidewall 13, and the second shaft portion 16 is disposed on the outer wall of the second sidewall 14. The other end of the linkage mechanism 32 is connected to the first shaft portion 15. That is, the end of the third link 323 is connected to the first shaft 15; it can be understood that the inner walls of the first side wall 13 and the second side wall 14 of the flower basket 1 are provided with slots for placing semiconductor substrates, and the flower basket 1 is used to place semiconductor substrates. Therefore, in order not to affect the placement of semiconductor substrates, the flipping shaft is not inserted into the flower basket. The flipping shaft is divided into a first shaft 15 and a second shaft 16, and the first shaft 15 and the second shaft 16 are respectively installed on the outer walls of the first side wall 13 and the second side wall 14. The end of the third link 323 is connected to the first shaft 15, thereby driving the flower basket to flip.

[0052] Specifically, such as Figure 4As shown, the end of the third link 323 has a bushing 3231, which is sleeved on the first shaft portion 15 of the flower basket 1. Several positioning parts (such as splines) and several fixing parts (such as screws) are provided between the bushing 3231 and the first shaft portion 15, so that the third link 323 is fixed to the first shaft portion 15, and the swinging action of the third link 323 is transmitted to the flower basket 1, causing the flower basket 1 to flip.

[0053] Further optional, such as Figure 1 , Figure 2 and Figure 5 As shown, the flipping mechanism 3 also includes a first flipping frame 33 and a second flipping frame 34 located on both sides of the flower basket 1. The first flipping frame 33 is connected to the power output end of the lifting mechanism 2. The first shaft 15 is connected to the first flipping frame 33, and the second shaft 16 is connected to the second flipping frame 34. Specifically, the first shaft 15 and the first flipping frame 33, and the second shaft 16 and the second flipping frame 34 are respectively rotatably connected by bearings. The first flipping frame 33 serves as the main frame of the flipping mechanism 3 and is used to install the flipping drive component 31, the linkage mechanism 32, and the first shaft 15 of the flower basket 1. A guide structure such as a slider that cooperates with the lifting guide rail of the lifting mechanism 2 can be set on the first flipping frame 33 to ensure the stable lifting and lowering of the first flipping frame 33. The second flipping frame 34 is set to install the second shaft 16, so that the flower basket 1 can be supported on both sides, improving its lifting and flipping stability. The second flipping frame 34 can be fixedly connected to the first flipping frame 33, and the lifting mechanism 2 can drive the first flipping frame 33, the second flipping frame 34 and the flower basket 1 to rise and fall together. Of course, the second flipping frame 34 can also be fixedly connected to the lifting frame 21 or fixed to the ground. In this case, the second flipping frame 34 does not rise and fall with the first flipping frame 33. A guide rail can be set on the second flipping frame 34 so that the second shaft part 16 of the flower basket 1 can cooperate with it to slide and rise and fall along the guide rail.

[0054] Further optional, such as Figure 6 As shown, the pushing component 4 includes a fork 41, which includes a support portion (not shown) and a pushing portion 411 connected to the support portion. The support portion supports the semiconductor substrate 6, and the pushing portion 411 abuts against the periphery of the semiconductor substrate 6, thereby applying a pushing force to the semiconductor substrate 6. Unlike the forks with vacuum adsorption function commonly used in the prior art, the fork 41 of this application does not require vacuum adsorption to adsorb the semiconductor substrate, nor does it require fork-shaped grippers to clamp the semiconductor substrate. Since the semiconductor substrate 6 is pushed into the cleaning component 5 in a horizontal straight pushing manner, the fork 41 only needs to support the semiconductor substrate 6 with the support portion and push the semiconductor substrate 6 with the pushing portion 411, which greatly simplifies the structure. The support portion can be two or more slender rod-shaped members, or it can be a thin-walled plate, etc. Figure 6 As shown, the pushing part 411 has an abutting surface that matches the periphery of the semiconductor substrate 6. Preferably, the abutting surface is an arc surface that adapts to the curvature of the periphery of the semiconductor substrate 6. In some embodiments, the abutting surface may also be a plane. In other embodiments, the pushing part 411 may also take the form of an abutting rod.

[0055] Further optional, such as Figure 6 As shown, the pushing assembly 4 also includes a pushing drive (not shown), a pushing guide rail 42, and a pushing arm 43. The pushing arm 43 is connected to the power output end of the pushing drive. The fork 41 is fixedly connected to one end of the pushing arm 43 by a fixing member. The pushing arm 43 has a sliding member that cooperates with the pushing guide rail 42. The pushing drive drives the pushing arm 43 to slide linearly along the pushing guide rail 42, thereby driving the fork 41 at the end of the pushing arm 43 to move linearly. The pushing drive can be a power source such as a motor, cylinder, or hydraulic cylinder.

[0056] In some alternative embodiments, such as Figure 1 , Figure 6 As shown, when the semiconductor substrate is lifted and flipped to the pushing position, the pushing guide 42 is located on the outside of the basket 1 corresponding to the first sidewall 13 or the second sidewall 14. The pushing arm 43 has a clearance groove 434, which allows the pushing arm 43 to avoid the first sidewall 13 or the second sidewall 14 when moving along the pushing guide 42. Specifically, as Figure 1As shown, when the semiconductor substrate is lifted and flipped to the pushing position, the first opening 11 of the basket 1 faces the cleaning component 5. In this state, the pushing guide rail 42 is located beside and parallel to the second side wall 14. The pushing arm 43 has a U-shaped structure, with a first arm 431 and a second arm 432 on both sides, and a connecting arm 433 located between the first arm 431 and the second arm 432. The fork 41 is disposed on the first arm 431, and the second arm 432 slides in cooperation with the pushing guide rail 42. The opening of the U-shaped structure is formed by the first arm 431. 1. The opening formed by the second arm 432 and the connecting arm 433 forms a clearance groove 434 for the push arm 43. The clearance groove 434 allows the push arm 43 to avoid the second side wall 14 when it moves along the push guide rail 42. When the push arm 43 drives the fork 41 to move forward, the fork 41 and the first arm 431 are inserted into the flower basket 1 from the second end of the flower basket 1. The second side wall 14 of the flower basket 1, the second flipping frame 34 corresponding to the second side wall 14 and other components are contained in the clearance groove 434 space and will not interfere with the movement of the push arm 43. In some alternative embodiments, when the semiconductor substrate is lifted and flipped to the pushing position, the pushing guide rail 42 can also be located on the outside of the basket 1 corresponding to the first sidewall 13. The clearance groove 434 allows the pushing arm 43 to avoid the first sidewall 13 when moving along the pushing guide rail 42. When the pushing arm 43 drives the fork 41 to move forward, the fork 41 and the first arm 431 are inserted into the basket 1 from the second end of the basket 1. The first sidewall 13 of the basket 1, the first flipping frame 33 corresponding to the first sidewall 13, and other components are contained within the clearance groove 434. In this way, by setting the position of the pushing guide rail 42 and designing the clearance structure of the pushing arm 43, the space occupied by the pushing component 4 can be reduced, making the overall layout of the lifting and flipping component and the pushing component 4 reasonable and compact.

[0057] In some alternative embodiments, such as Figure 1 As shown, the cleaning assembly 5 includes at least one set of roller brushes 51. Each roller brush set 51 includes an upper roller brush and a lower roller brush arranged in parallel, with a first gap formed between the upper and lower roller brushes for the semiconductor substrate 6 to pass through. It is understood that when the semiconductor substrate 6 is in the pushing position, the height of the semiconductor substrate 6 is adapted to the first gap. The pushing assembly 4 pushes the semiconductor substrate 6 linearly from the pushing position into the first gap between the upper and lower roller brushes. By spraying cleaning fluid onto the surface of the semiconductor substrate 6, the upper and lower roller brushes simultaneously clean the upper and lower surfaces of the semiconductor substrate 6. Figure 1 As shown, the upper and lower roller brushes extend in a straight line along the horizontal plane and are parallel to each other. Preferably, there are two roller brush groups 51, which can improve the cleaning effect. The two roller brush groups 51 can also play a better role in conveying the semiconductor substrate 6. Under the action of the roller brush groups 51, the semiconductor substrate 6 is cleaned and conveyed forward to the next process.

[0058] In some alternative embodiments, such as Figure 1 As shown, the cleaning component 5 also includes at least one set of positioning rollers 52. The positioning rollers 52 include an upper positioning roller and a lower positioning roller arranged in parallel, with a second gap formed between the upper and lower positioning rollers for the semiconductor substrate 6 to pass through. The positioning rollers 52 and the roller brush group 51 are arranged in parallel, with the first gap and the second gap being approximately the same and approximately at the same height. The first gap and the second gap together form a channel for the semiconductor substrate 6 to pass through. The semiconductor substrate 6 is linearly pushed from the pushing position by the pushing component 4 into this channel. The positioning rollers 52 facilitate the guiding and positioning of the semiconductor substrate and also serve to transport the semiconductor substrate. Preferably, there are two or more sets of positioning rollers 52, for example, such as... Figure 1 As shown, two sets of positioning rollers 52 are provided on each side of the roller brush group 51, and another set of positioning rollers 52 is provided between the two sets of roller brush groups 51, so that the semiconductor substrate 6 is positioned and transported more smoothly in the second gap between the upper positioning roller and the lower positioning roller.

[0059] Alternatively, both the first gap and the second gap can be adjusted. By adjusting the first gap and the second gap, semiconductor substrates of different thicknesses can be cleaned and positioned for transport, and the cleaning force of the roller brush can also be adjusted according to specific needs.

[0060] The semiconductor substrate processing apparatus of this embodiment lifts and flips the basket by setting up a lifting and flipping component and a pushing component, so that the semiconductor substrate is transferred from an upright state in the wetting tank to a horizontal state in the pushing position, and then the semiconductor substrate is pushed in a straight line from the second end of the basket to the cleaning component for cleaning. The lifting and flipping component and the pushing component have simple structure, are easy to manufacture, and have low cost. Furthermore, by optimizing the transfer operation, the transfer time of the semiconductor substrate is shortened, thereby improving production efficiency.

[0061] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A semiconductor substrate processing apparatus, characterized in that, include: Flower basket (1), used to place semiconductor substrate (6); The flower basket (1) has a first opening (11) and a second opening arranged opposite to each other; the flower basket (1) enables the semiconductor substrate (6) to be immersed in the wetting tank in an upright state, wherein the first opening (11) faces upward when the semiconductor substrate (6) is immersed in the wetting tank in an upright state. Cleaning component (5) for cleaning the semiconductor substrate (6); The lifting and flipping assembly is connected to the flower basket (1). The lifting and flipping assembly can drive the flower basket (1) to lift and flip so that the semiconductor substrate (6) is in the pushing position. When the semiconductor substrate (6) is in the pushing position, the semiconductor substrate (6) is in a horizontal state and the first opening (11) faces the cleaning assembly (5). The pushing component (4) is used to push the semiconductor substrate (6) in a straight line from the second opening to the cleaning component (5) for cleaning when the semiconductor substrate (6) is in the pushing position.

2. The semiconductor substrate processing apparatus according to claim 1, characterized in that, The lifting and flipping assembly includes a lifting mechanism (2) and a flipping mechanism (3). The power output end of the lifting mechanism (2) is connected to the flipping mechanism (3), and the power output end of the flipping mechanism (3) is connected to the flower basket (1).

3. The semiconductor substrate processing apparatus according to claim 2, characterized in that, The flipping mechanism (3) includes a flipping drive (31) and a linkage mechanism (32). The flipping drive (31) is connected to one end of the linkage mechanism (32), and the other end of the linkage mechanism (32) is connected to the flipping shaft of the flower basket (1).

4. The semiconductor substrate processing apparatus according to claim 3, characterized in that, The flower basket (1) has a first sidewall (13) and a second sidewall (14) located on both sides of the first opening (11). The flipping shaft has a first shaft portion (15) and a second shaft portion (16). The first shaft portion (15) is located on the outer wall of the first sidewall (13), and the second shaft portion (16) is located on the outer wall of the second sidewall (14). The linkage mechanism (32) is connected to the first shaft portion (15). The flipping mechanism (3) also includes a first flipping frame (33) and a second flipping frame (34) located on both sides of the flower basket (1). The first flipping frame (33) is connected to the power output end of the lifting mechanism (2). The first shaft (15) is connected to the first flipping frame (33), and the second shaft (16) is connected to the second flipping frame (34).

5. The semiconductor substrate processing apparatus according to claim 4, characterized in that, The pushing component (4) includes a fork (41), the fork (41) includes a support portion and a pushing portion (411) connected to the support portion. The support portion is used to support the semiconductor substrate (6), and the pushing portion (411) is used to abut against the periphery of the semiconductor substrate (6) to apply a pushing force to the semiconductor substrate (6).

6. The semiconductor substrate processing apparatus according to claim 5, characterized in that, The pushing component (4) further includes a pushing drive, a pushing guide rail (42), and a pushing arm (43). The pushing arm (43) is connected to the power output end of the pushing drive. The fork (41) is fixedly connected to one end of the pushing arm (43). The pushing arm (43) has a sliding member that cooperates with the pushing guide rail (42).

7. The semiconductor substrate processing apparatus according to claim 6, characterized in that, When the semiconductor substrate (6) is in the pushing position, the pushing guide (42) is located on the outside of the basket (1) corresponding to the first sidewall (13) or the second sidewall (14), and the pushing arm (43) has a clearance groove (434) that allows the pushing arm (43) to avoid the first sidewall (13) or the second sidewall (14) when it moves along the pushing guide (42).

8. The semiconductor substrate processing apparatus according to claim 1, characterized in that, The cleaning assembly (5) includes at least one set of roller brushes (51), the roller brushes (51) including an upper roller brush and a lower roller brush arranged in parallel, and a first gap is formed between the upper roller brush and the lower roller brush for the semiconductor substrate (6) to pass through.

9. The semiconductor substrate processing apparatus according to claim 8, characterized in that, The cleaning assembly (5) further includes at least one set of positioning rollers (52), the positioning rollers (52) including an upper positioning roller and a lower positioning roller arranged in parallel, and a second gap is formed between the upper positioning roller and the lower positioning roller for the semiconductor substrate (6) to pass through.

10. The semiconductor substrate processing apparatus according to claim 9, characterized in that, Both the first gap and the second gap are adjustable.

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