Chip packaging structure, vehicle controller and vehicle

Abstract

The utility model relates to a chip packaging structure, which comprises a chip, a first solder layer, a ceramic substrate, a second solder layer and a heat diffusion plate which are arranged in sequence, the heat diffusion plate comprises a bottom plate and heat dissipation fins which are connected with each other, the chip is connected onto the ceramic substrate through the first solder layer, and the ceramic substrate is connected onto the bottom plate through the second solder layer. The utility model also provides a vehicle controller. The utility model further provides a vehicle. According to the utility model, the heat dissipation performance of the chip packaging structure is improved, the application range of the chip packaging structure is widened, and the requirements of miniaturization and light weight of the chip packaging structure can be better met.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a chip packaging structure, a vehicle controller, and a vehicle. Background Technology

[0002] Some chips generate significant heat during operation. For example, IGBT modules in vehicles are characterized by high integration and power density, resulting in high operating temperatures for the IGBT chips inside. Poor heat dissipation in the chip packaging structure negatively impacts chip reliability and performance. Current chip packaging technologies typically suffer from the following technical problems: heat dissipation performance is increasingly insufficient for high-power chips, requiring improvement; adding heat dissipation structures to enhance heat dissipation usually leads to increased package size, hindering miniaturization and weight reduction; and different chip models often employ different packaging structures, resulting in a narrow applicability of each packaging design. Utility Model Content

[0003] The purpose of this invention is to provide a chip packaging structure, a vehicle controller, and a vehicle to mitigate or eliminate at least one of the aforementioned technical problems.

[0004] The present invention discloses a chip packaging structure comprising a chip, a first solder layer, a ceramic substrate, a second solder layer, and a heat dissipation plate arranged sequentially. The heat dissipation plate includes a connected base plate and heat dissipation fins. The chip is connected to the ceramic substrate through the first solder layer, and the ceramic substrate is connected to the base plate through the second solder layer.

[0005] Optionally, the ceramic substrate includes a first metal layer, a silicon carbide ceramic layer, and a second metal layer connected in sequence.

[0006] Optionally, the first metal layer and / or the second metal layer may be copper layers.

[0007] Optionally, the first solder layer and / or the second solder layer are tin-silver solder layers.

[0008] Optionally, the heat diffusion plate is made of copper.

[0009] Optionally, the heat diffusion plate is a single piece.

[0010] Optionally, the chip packaging structure further includes a bottom cover connected to the heat diffusion plate, the bottom cover and the heat diffusion plate forming an inner cavity capable of accommodating a cooling medium, the bottom cover being provided with a cooling medium inlet communicating with the inner cavity and a cooling medium outlet communicating with the inner cavity, and the heat dissipation fins being located inside the inner cavity.

[0011] Optionally, the chip includes an insulated gate bipolar transistor.

[0012] This utility model also proposes a vehicle controller, including the chip packaging structure described in any of the above claims.

[0013] This utility model also proposes a vehicle that includes the chip packaging structure described in any of the above claims.

[0014] This invention improves the heat dissipation performance of the chip packaging structure, broadens the application range of the chip packaging structure, and can better meet the requirements of miniaturization and lightweighting of the chip packaging structure. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the chip packaging structure described in some embodiments.

[0016] Wherein, 1-chip; 2-first solder layer; 3-first sub-metal layer; 4-silicon carbide ceramic layer; 5-second metal layer; 6-second solder layer; 7-heat diffusion plate; 8-bottom cover; 9-second sub-metal layer; 10-bonding wire; 11-inner cavity;

[0017] 701-Base plate; 702-Heat dissipation fins; 801-Bottom wall; 802-Side wall; 803-Cooling medium inlet; 804-Cooling medium outlet. Detailed Implementation

[0018] The embodiments of this utility model will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be understood that the preferred embodiments are only for illustrating this utility model and not for limiting the scope of protection of this utility model.

[0019] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0020] like Figure 1The chip packaging structure shown includes, from top to bottom, a chip 1, a first solder layer 2, a ceramic substrate, a second solder layer 6, and a heat dissipation plate 7. The heat dissipation plate 7 includes a connected base plate 701 and heat dissipation fins 702. The chip 1 is connected to the upper side of the ceramic substrate via the first solder layer 2, and the ceramic substrate is connected to the upper side of the base plate 701 via the second solder layer 6. By adopting the above technical solution, the heat dissipation fins 702 on the heat dissipation plate 7 can improve the heat dissipation performance of the chip packaging structure. The structure in which the chip 1, the first solder layer 2, the ceramic substrate, the second solder layer 6, and the heat dissipation plate 7 are connected in sequence has the characteristics of simple structure and wide applicability.

[0021] In some embodiments, the ceramic substrate includes a first metal layer, a silicon carbide ceramic layer 4, and a second metal layer 5 connected sequentially from top to bottom. The silicon carbide ceramic layer 4 has good heat dissipation performance, which can improve the heat dissipation performance of the chip packaging structure.

[0022] As a specific example, the first metal layer and / or the second metal layer 5 are copper layers. The first metal layer and / or the second metal layer 5 can be connected to the silicon carbide ceramic layer 4 using a DBC process.

[0023] As a specific example, the first metal layer includes a first sub-metal layer 3 and a second sub-metal layer 9 connected to the upper side of the silicon carbide ceramic layer 4. The chip 1 is connected to the first sub-metal layer 3 through a first solder layer 2, and the chip 1 and the second sub-metal layer 9 are connected by a bonding wire 10.

[0024] In some embodiments, the first solder layer 2 and / or the second solder layer 6 are tin-silver solder layers. Tin-silver solder layers have good heat dissipation effects and can improve the heat dissipation performance of the chip package structure.

[0025] In some embodiments, the heat dissipation plate 7 is made of copper. Copper components have better heat dissipation performance, which can improve the heat dissipation performance of the chip packaging structure.

[0026] In some embodiments, the heat dissipation plate 7 is a single piece. The base plate 701 and the heat dissipation fins 702 adopt an integrated structure, which eliminates the need for thermal grease. This structure also reduces the thickness of the heat dissipation plate 7, better meeting the requirements of miniaturization and lightweighting of chip packaging structures.

[0027] In some embodiments, the chip packaging structure further includes a bottom cover 8 connected to the heat diffusion plate 7. The bottom cover 8 and the heat diffusion plate 7 form an inner cavity 11 capable of accommodating a cooling medium. The bottom cover 8 is provided with a cooling medium inlet 803 communicating with the inner cavity 11 and a cooling medium outlet 804 communicating with the inner cavity 11. The heat dissipation fins 702 are located within the inner cavity 11. By adopting the above technical solution, the heat dissipation performance of the heat diffusion plate 7 can be improved by utilizing the cooling medium, thereby improving the heat dissipation performance of the chip packaging structure.

[0028] Specifically, the bottom cover 8 includes a bottom wall 801 and a side wall 802 extending upward from the edge of the bottom wall 801. The upper end of the side wall 802 is connected to the bottom plate 701. A cooling medium inlet 803 and a cooling medium outlet 804 are respectively provided on the side wall 802. In actual use, the cooling medium enters the inner cavity 11 through the cooling medium inlet 803. After exchanging heat with the heat diffusion plate 7, the cooling medium in the inner cavity 11 flows out through the cooling medium outlet 804.

[0029] In some embodiments, chip 1 includes an insulated gate bipolar transistor, and the chip packaging structure can be applied to the IGBT module of a vehicle to ensure the heat dissipation performance of the IGBT module, thereby ensuring the reliability and efficiency of the vehicle motor controller.

[0030] As a preferred example, the ceramic substrate includes a first metal layer, a silicon carbide ceramic layer 4, and a second metal layer 5 connected in sequence; a first solder layer 2 and a second solder layer 6 are tin-silver solder layers, respectively; a heat dissipation plate 7 is a copper component; and the chip 1 includes an insulated gate bipolar transistor. Using the above technical solution, the chip packaging structure has optimal heat dissipation performance, is suitable for mainstream IGBT modules on the market, and better meets the miniaturization and weight reduction requirements of IGBT modules in vehicles.

[0031] Analysis of existing IGBT devices reveals that, regardless of whether it's a single IGBT, an IGBT module, a half-bridge IGBT module, or a full-bridge IGBT module, the main factors affecting heat dissipation are the thermal resistance of the solder layer, the ceramic layer, and the thermal resistance of the heat dissipation plate. To improve the heat dissipation capability of IGBT devices, we analyzed the main materials that can be used in IGBT devices from the market. The details are shown in the table below:

[0032]

[0033] Simulations using the controlled variable method yielded the junction temperatures of IGBT devices under different materials. Specifically: When examining the effects of four solder layer materials, keeping the ceramic layer and heat dissipation plate materials constant and only changing the solder layer material properties, it was found that using tin-silver (Sn-Ag) solder resulted in the lowest IGBT junction temperature and the best heat dissipation. When examining the effects of four ceramic layer materials, keeping the solder layer and heat dissipation plate materials constant, using silicon carbide (SiC) ceramic for the ceramic layer resulted in the lowest IGBT junction temperature and the best heat dissipation. When examining the effects of three heat dissipation plate materials, keeping the ceramic layer and solder layer materials constant, using copper (Cu) heat dissipation plate resulted in the lowest IGBT junction temperature and the best heat dissipation.

[0034] Based on the above analysis, it can be seen that when the ceramic substrate includes a silicon carbide ceramic layer 4, a first solder layer 2 and a second solder layer 6 which are tin-silver solder layers respectively, and the heat dissipation plate 7 is a copper component, the chip packaging structure has the best heat dissipation effect.

[0035] This utility model also proposes a vehicle controller, including the chip packaging structure described in any of the above claims.

[0036] This utility model also proposes a vehicle that includes the chip packaging structure described in any of the above claims.

[0037] The above embodiments are merely preferred embodiments provided to fully illustrate the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present utility model are all within the protection scope of the present utility model. In the description of this specification, the reference to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., means that a specific feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0038] In the description of this utility model, it should be understood that the terms "upper" and "lower," etc., indicate the orientation based on the attached... Figure 1 The coordinate system in the diagram represents the orientation only for the convenience of describing the present invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

Claims

1. A chip packaging structure, characterized in that, The device includes a chip (1), a first solder layer (2), a ceramic substrate, a second solder layer (6), and a heat dissipation plate (7) arranged in sequence. The heat dissipation plate (7) includes a connected base plate (701) and heat dissipation fins (702). The chip (1) is connected to the ceramic substrate through the first solder layer (2), and the ceramic substrate is connected to the base plate (701) through the second solder layer (6).

2. The chip packaging structure according to claim 1, characterized in that, The ceramic substrate includes a first metal layer, a silicon carbide ceramic layer (4), and a second metal layer (5) connected in sequence.

3. The chip packaging structure according to claim 2, characterized in that, The first metal layer and / or the second metal layer (5) are copper layers.

4. The chip packaging structure according to claim 1, characterized in that, The first solder layer (2) and / or the second solder layer (6) are tin-silver solder layers.

5. The chip packaging structure according to claim 1, characterized in that, The heat diffusion plate (7) is made of copper.

6. The chip packaging structure according to claim 1, characterized in that, The heat diffusion plate (7) is a single piece.

7. The chip packaging structure according to claim 1, characterized in that, It also includes a bottom cover (8) connected to the heat diffusion plate (7), and the bottom cover (8) and the heat diffusion plate (7) form an inner cavity (11) that can accommodate the cooling medium. The bottom cover (8) is provided with a cooling medium inlet (803) communicating with the inner cavity (11) and a cooling medium outlet (804) communicating with the inner cavity (11). The heat dissipation fins (702) are located in the inner cavity (11).

8. The chip packaging structure according to claim 1, characterized in that, The chip (1) includes an insulated gate bipolar transistor.

9. A vehicle controller, characterized in that, Includes the chip packaging structure described in any one of claims 1-8.

10. A vehicle, characterized in that, Includes the chip packaging structure described in any one of claims 1-8.

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