Tire pressure sensor chip test sorting machine

Abstract

The utility model provides a tire pressure sensor chip testing and sorting machine which comprises a pressure controller assembly, an air storage tank assembly, a charging tray feeding and discharging mechanism and the like. The utility model has the beneficial effects that the scheme adopts a pre-heating mode and a quick air pressure control mode; according to the principle of the pre-heating mode, the chip is heated to the required temperature in advance and then carried to the test seat for calibration, the series connection mode of heating and testing is changed into the parallel connection mode, the heating time is shortened, meanwhile, the temperatures of all the test suction heads do not affect one another, the temperatures of all the test suction heads can be independently adjusted, and the temperature precision is improved. The principle of the rapid air pressure control mode is that a pressure controller is matched with an air storage tank to assist air supply for boosting, a vacuum generator is matched to assist air exhaust for depressurization, pressure is applied only to a sensor hole in the upper surface of a chip, the volume of controlled air is greatly reduced, and the time required for controlling the air pressure in place is greatly shortened. The calibration test time of the pressure and the temperature of the tire pressure sensor is shortened through two optimization, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the chip test field especially, it relates to a tire pressure sensor chip test sorting machine. BACKGROUND

[0002] The existing tire pressure sensor chip test sorting machine is mainly the warm box type, and the warm box is a sealed structure with a heater and a test seat. The chips are placed in the test seat in the box by manual or using an automatic material taking and placing manipulator, and then the box cover is closed. The heater heats the chips to a specified temperature. The external pressure controller applies different air pressure values to the box to complete the pressure and temperature calibration of the chips. This structure heats the chips from room temperature to high temperature before calibration, and the heating time is long. The chips are heated in the same space, and the distance between the chips and the heat source is far or near, so it is impossible to ensure that the temperature of each chip is consistent. The chips are in the whole pressure environment in the box, and the air volume in the box controlled by the pressure controller is large. The time consumed by the pressure controller in switching different pressures is long. These factors cause the chip temperature calibration to be not accurate enough, and the output of the machine per unit time is low. SUMMARY

[0003] Therefore, the utility model aims at providing a tire pressure sensor chip test sorting machine to solve at least one problem in the prior art.

[0004] To achieve the above purpose, the technical scheme of the utility model is as follows:

[0005] A tire pressure sensor chip test sorting machine, comprising a pressure controller assembly, an air storage tank assembly, a solenoid valve assembly, a tray in-out mechanism, a refrigeration machine, a pre-warming disc assembly, a pre-heating sheet tray assembly, a material conveying trolley, a test suction head arm, a hot air gun assembly, a feeding suction head arm, a discharging suction head arm, a tray conveying arm assembly, a vacuum generator assembly, a test seat assembly, a rack, a machine cover and a large plate, wherein the pressure controller assembly, the air storage tank assembly and the solenoid valve assembly are all installed on the top of the machine cover, the vacuum generator assembly is installed below the solenoid valve assembly, the machine cover and the tray in-out mechanism are installed on the rack, the refrigeration machine is installed inside the rack, and the large plate is also installed on the rack, and the pre-warming disc assembly, the pre-heating sheet tray assembly, the material conveying trolley, the test suction head arm, the hot air gun assembly, the feeding suction head arm, the discharging suction head arm, the tray conveying arm assembly and the test seat assembly are all installed on the large plate.

[0006] Further, the pressure controller assembly comprises a calibration pressure controller module, a gas tank pressure controller module one, a gas tank pressure controller module two, a gas tank pressure controller module three, and a gas tank pressure controller module four; the calibration pressure controller module one side is respectively provided with the gas tank pressure controller module one, the gas tank pressure controller module two, the gas tank pressure controller module three, and the gas tank pressure controller module four, and the gas tank pressure controller module one, the gas tank pressure controller module two, the gas tank pressure controller module three, and the gas tank pressure controller module four are arranged in an array.

[0007] The gas tank assembly comprises a gas tank one, a gas tank two, a gas tank three, and a gas tank four, and the other side of the calibration pressure controller module is sequentially provided with the gas tank four, the gas tank three, the gas tank two, and the gas tank one from left to right.

[0008] Further, the electromagnetic valve assembly comprises a gas tank exhaust electromagnetic valve assembly, a test suction head A electromagnetic valve assembly, a test suction head B electromagnetic valve assembly, and a calibration pressure module electromagnetic valve assembly; the test suction head A electromagnetic valve assembly and the test suction head B electromagnetic valve assembly are symmetrically arranged, and the test suction head A electromagnetic valve assembly and the test suction head B electromagnetic valve assembly one side are respectively provided with the gas tank exhaust electromagnetic valve assembly and the calibration pressure module electromagnetic valve assembly.

[0009] Further, the vacuum generator assembly comprises a vacuum generator body, a vacuum generator busbar, and an air inlet joint; the vacuum generator body is installed on the vacuum generator busbar, and the air inlet joint is installed on the upper and lower ends of the vacuum generator busbar.

[0010] Further, the pre-warming disc assembly comprises a pre-warming disc unit one, a pre-warming disc unit two, a pre-warming disc blowing rod one, and a pre-warming disc blowing rod two, which are all located on the large plate; the pre-warming disc unit one and the pre-warming disc unit two one side are respectively provided with the pre-warming disc blowing rod one and the pre-warming disc blowing rod two.

[0011] The material transport trolley comprises an A trolley assembly and a B trolley assembly, which are symmetrically arranged on the large plate; the A trolley assembly and the B trolley assembly are respectively provided with the B trolley blowing rod one and the B trolley blowing rod two; the A trolley assembly one side is respectively provided with the A trolley blowing rod one and the A trolley blowing rod two.

[0012] Further, the pre-warming disc unit one comprises a pre-warming disc body, a pre-warming disc mounting plate, a heating sheet body, a heating sheet protection plate, and a pre-warming disc support; the pre-warming disc body, the pre-warming disc mounting plate, the heating sheet body, and the heating sheet protection plate are sequentially arranged from top to bottom, and the heating sheet protection plate is installed on the large plate through the pre-warming disc support on both sides.

[0013] Further, the A trolley assembly comprises an A trolley base, an A trolley heating rod, an A trolley mounting plate and an A trolley body, the A trolley base is mounted with the A trolley mounting plate at the top, the A trolley mounting plate is mounted with the A trolley body at the top, and the A trolley mounting plate is internally mounted with the A trolley heating rod.

[0014] Further, the A trolley blowing rod one comprises a blowing rod one cover plate, a blowing rod one body and a blowing rod one base, the blowing rod one base is internally mounted with the blowing rod one body, the blowing rod one base is mounted with the blowing rod one cover plate at the top, and the blowing rod one body and the blowing rod one cover plate are both provided with blowing holes.

[0015] Further, the preheating sheet material disc assembly comprises a hot air gun, a preheating sheet bottom plate, a preheating sheet feeding disc and a preheating sheet body, the hot air gun is mounted at the bottom of the preheating sheet bottom plate, the preheating sheet bottom plate is mounted with the preheating sheet feeding disc above, and the preheating sheet feeding disc is provided with a plurality of placing grooves for placing a plurality of preheating sheet bodies on the surface.

[0016] Further, the test seat assembly comprises a test seat heating rod, a test seat heating frame, a test seat blowing rod, a test seat body, a test seat blowing guide block, a to-be-tested chip and a test seat mounting plate, the test seat heating frame is a hollow rectangular frame structure, the test seat blowing rod is internally mounted in the hollow rectangular frame structure, the test seat heating rod is internally mounted in the test seat heating frame, the test seat mounting plate is mounted below the test seat heating frame, and a plurality of test seat bodies and test seat blowing guide blocks are mounted on the surface of the test seat mounting plate; a plurality of blowing rod air outlet holes are formed in the test seat blowing rod, a guide block air duct is formed in the test seat blowing guide block, a test seat air duct is formed in the test seat body, and a pressure sensor is further arranged on the to-be-tested chip.

[0017] Further, the test suction head arm comprises a test suction head assembly, a test arm horizontal movement assembly, a test arm A vertical movement assembly, a test arm B vertical movement assembly and a test arm mounting plate, the test arm mounting plate is mounted with the test suction head assembly at the bottom, and the test arm horizontal movement assembly, the test arm A vertical movement assembly and the test arm B vertical movement assembly are mounted on the top of the test arm mounting plate.

[0018] Further, the test suction head assembly comprises a test suction head base, a test suction head mounting seat, a suction head heating rod, a suction head temperature measuring sensor, a test suction head body, a sealing ring and a suction head blowing rod, a plurality of test suction head mounting seats are mounted at the bottom of the test suction head base, one test suction head body is mounted on each test suction head mounting seat, and the suction head heating rod, the suction head temperature measuring sensor and the sealing ring are respectively mounted on each test suction head mounting seat, and the suction head blowing rod is further mounted on one side of the test suction head mounting seat.

[0019] Compared with the prior art, the tire pressure sensor chip test sorting machine has the following advantages:

[0020] The utility model discloses a tire pressure sensor chip test sorting machine, and the scheme adopts preheating mode and air pressure quick control mode. The principle of preheating mode is that the chip is heated to the required temperature in advance, and then is transported to the test seat to calibrate, and heating and testing are changed from series connection mode to parallel connection mode, so that the heating time is reduced, and the temperature of each test suction head does not affect each other, and the temperature of each test suction head can be independently adjusted, and the temperature precision is improved. The principle of air pressure quick control mode is that the pressure controller is matched with the air storage tank to assist air supply to increase pressure, and is matched with the vacuum generator to assist air exhaust to reduce pressure, and only the pressure is applied to the sensor hole on the upper surface of the chip, the controlled gas volume is greatly reduced, and the time required for air pressure control is greatly reduced. The two optimizations reduce the calibration and test time of tire pressure sensor pressure and temperature, and improve the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] The drawings that form a part of the present utility model are used to provide further understanding of the present utility model, and the illustrative embodiments of the present utility model and the explanation thereof are used to explain the present utility model, and do not constitute improper limitation on the present utility model. In the drawings:

[0022] Figure 1 The whole structure schematic view is described for the embodiment of the present utility model;

[0023] Figure 2 The whole structure explosion schematic view is described for the embodiment of the present utility model;

[0024] Figure 3 The whole structure partial top view schematic view is described for the embodiment of the present utility model;

[0025] Figure 4 The whole structure partial schematic view is described for the embodiment of the present utility model;

[0026] Figure 5 The electromagnetic valve assembly schematic view is described for the embodiment of the present utility model;

[0027] Figure 6 The preheating disc assembly schematic view is described for the embodiment of the present utility model;

[0028] Figure 7 The preheating disc assembly and material transport trolley connection schematic view is described for the embodiment of the present utility model;

[0029] Figure 8 The preheating disc assembly and material transport trolley connection schematic view is described for the embodiment of the present utility model;

[0030] Figure 9 The preheating disc unit one schematic view is described for the embodiment of the present utility model;

[0031] Figure 10 A trolley assembly schematic view of the utility model embodiment is described;

[0032] Figure 11 A trolley blow bar one schematic view of the utility model embodiment is described;

[0033] Figure 12 Preheating sheet material disc assembly schematic view of the utility model embodiment is described;

[0034] Figure 13 Test seat assembly schematic view of the utility model embodiment is described;

[0035] Figure 14 Test seat assembly bottom view schematic view of the utility model embodiment is described;

[0036] Figure 15 Test seat assembly cross-sectional schematic view of the utility model embodiment is described;

[0037] Figure 16 Test suction head arm schematic view of the utility model embodiment is described;

[0038] Figure 17 Test suction head assembly schematic view of the utility model embodiment is described;

[0039] Figure 18 Test suction head assembly and test seat partial cross-sectional schematic view of the utility model embodiment is described;

[0040] Figure 19 Pneumatic principle schematic view of the utility model embodiment is described.

[0041] Explanation of reference signs:

[0042] 1, pressure controller assembly;2, gas storage tank assembly;3, electromagnetic valve assembly;4, material disc in-out mechanism;5, refrigerating machine;6, pre-warming disc assembly;7, preheating sheet material disc assembly;8, material trolley;9, test suction head arm;10, hot air gun assembly;11, feeding suction head arm;12, discharging suction head arm;13, material disc conveying arm assembly;14, vacuum generator assembly;15, test seat assembly;16, rack;17, machine cover;18, large plate;

[0043] 101, calibration pressure controller module;102, gas storage tank pressure controller module one;103, gas storage tank pressure controller module two;104, gas storage tank pressure controller module three;105, gas storage tank pressure controller module four;

[0044] 201, gas storage tank one;202, gas storage tank two;203, gas storage tank three;204, gas storage tank four;

[0045] 301, air tank exhaust solenoid valve assembly; 302, test suction head A solenoid valve assembly; 303, test suction head B solenoid valve assembly; 304, calibration pressure module solenoid valve assembly;

[0046] 601, pre-warming disc unit one; 602, pre-warming disc unit two; 603, pre-warming disc blowing rod one; 604, pre-warming disc blowing rod two;

[0047] 6011, pre-warming disc body; 6012, pre-warming disc mounting plate; 6013, heating sheet body; 6014, heating sheet protection plate; 6015, pre-warming disc support;

[0048] 701, hot air gun; 702, pre-heating sheet bottom plate; 703, pre-heating sheet feeding disc; 704, pre-heating sheet body;

[0049] 801, A trolley assembly; 802, B trolley assembly; 803, A trolley blowing rod one; 804, A trolley blowing rod two; 805, B trolley blowing rod one; 806, B trolley blowing rod two;

[0050] 8011, A trolley base; 8012, A trolley heating rod; 8013, A trolley mounting plate; 8014, A trolley body;

[0051] 8031, blowing rod one cover plate; 8032, blowing rod one body; 8033, blowing rod one base;

[0052] 901, test suction head assembly; 902, test arm horizontal movement assembly; 903, test arm A vertical movement assembly; 904, test arm B vertical movement assembly;

[0053] 9011, test suction head base; 9012, test suction head mounting seat; 9013, suction head heating rod; 9014, suction head temperature measuring sensor; 9015, test suction head body; 9016, sealing ring; 9017, suction head blowing rod;

[0054] 1401, vacuum generator body; 1402, vacuum generator busbar; 1403, air inlet joint;

[0055] 151, test seat heating rod; 152, test seat heating frame; 153, test seat blowing rod; 154, test seat body; 155, test seat blowing guide block; 156, chip to be tested; 157, test seat mounting plate;

[0056] 153A, blowing rod air outlet hole; 154A, test seat air duct; 155A, guide block air duct; 156A, pressure sensor. DETAILED DESCRIPTION

[0057] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0058] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0059] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0060] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0061] like Figures 1 to 19 As shown, a tire pressure sensor chip testing and sorting machine includes a pressure controller assembly 1, an air tank assembly 2, a solenoid valve assembly 3, a material tray inlet / outlet mechanism 4, a refrigeration unit 5, a preheating tray assembly 6, a preheating sheet material tray assembly 7, a material conveying trolley 8, a testing suction head arm 9, a hot air gun assembly 10, a feeding suction head arm 11, a discharging suction head arm 12, a material tray conveying arm assembly 13, a frame 16, a machine cover 17, and a large plate 18.

[0062] Figure 1 This is a front view of the equipment, including a pressure controller assembly 1, an air tank assembly 2, a solenoid valve assembly 3, a tray feeding / discharging mechanism 4, a refrigeration unit 5, a frame 16, and a cover 17. The pressure controller assembly 1, the air tank assembly 2, and the solenoid valve assembly 3 are mounted on top of the cover 17. The cover 17 and the tray feeding / discharging mechanism 4 are mounted on the frame 16, and the refrigeration unit 5 is mounted inside the frame 16.

[0063] Figure 2 is the back view of the equipment, including pre-warming tray assembly 6, pre-warming sheet tray assembly 7, material transport trolley 8, test probe arm 9, upper material loading probe arm 11, lower material unloading probe arm 12, tray transfer arm assembly 13 and large plate 18. Large plate 18 is installed on rack 16, and the rest of the components are installed on large plate 18.

[0064] Figure 3 is the top view after hiding cover 17 and installing the components on the upper part of cover 17. Tray in-out mechanism 4 is used for the feeding and unloading of chips, test probe arm 9, upper material loading probe arm 11 and lower material unloading probe arm 12 are used for carrying chips. The chips to be tested enter from the left tray in-out mechanism 4, are carried to pre-warming tray assembly 6 and material transport trolley 8 using upper material loading probe arm 11, are placed back on material transport trolley 8 after test probe arm 9 sucks the chips to complete testing, and are placed to the right tray in-out mechanism 4 after lower material unloading probe arm 12 sucks the tested chips from material transport trolley 8, to complete the sorting of chips. Tray transfer arm assembly 13 is used for the carrying of trays between each tray in-out mechanism 4. Pressure controller assembly 1 provides a high-pressure test environment for chips. Pre-warming tray assembly 6, material transport trolley 8, test probe assembly 901, hot air gun assembly 10 and refrigerator 5 provide a normal temperature or high temperature test environment.

[0065] Figure 4 is the position diagram of each component installed on cover 17, including calibration pressure controller module 101, air tank pressure controller module one 102, air tank pressure controller module two 103, air tank pressure controller module three 104, air tank pressure controller module four 105, air tank one 201, air tank two 202, air tank three 203, air tank four 204, vacuum generator assembly 14. One pressure controller assembly 1 main machine can be installed with one or two control modules, including calibration pressure controller module 101 and air tank pressure controller module. The calibration pressure controller module 101 is used to accurately control the pressure provided to the chip, and the air tank pressure controller module controls the pressure in the air tank. Air tank pressure controller module one 102 controls air tank one 201, air tank pressure controller module two 103 controls air tank two 202, air tank pressure controller module three 104 controls air tank three 203, and air tank pressure controller module four 105 controls air tank four 204. Vacuum generator assembly 14 is installed on the lower side of the top surface of cover 17, providing vacuum pressure for sucking chips and assisting pressure controller assembly 1 to release pressure.

[0066] Figure 5is the structure diagram of electromagnetic valve assembly 3, including air tank exhaust electromagnetic valve assembly 301, test suction head A electromagnetic valve assembly 302, test suction head B electromagnetic valve assembly 303, calibration pressure module electromagnetic valve assembly 304. The air tank exhaust electromagnetic valve assembly 301 is used to control the time of the air tank to the chip end. The test suction head of the electromagnetic valve assembly 3 is divided into two groups of A and B, the test suction head A electromagnetic valve assembly 302 is used to control the switching of high gas pressure and vacuum of the test suction head A, the test suction head B electromagnetic valve assembly 303 is used to control the switching of high gas pressure and vacuum of the test suction head B, when switching to high gas pressure mode, the chip end is connected to high gas pressure, when switching to vacuum mode, the chip end is adsorbed by the vacuum chuck. The calibration pressure module electromagnetic valve assembly 304 is used to control the connection and disconnection of the calibration pressure module and the chip end.

[0067] Figure 6 is the structure diagram of vacuum generator assembly 14, including vacuum generator body 1401, vacuum generator busbar 1402, air inlet connector 1403. The vacuum generator body 1401 is installed on the vacuum generator busbar 1402, and the vacuum generator body 1401 is provided as 16 pieces, which can provide single 16 chip suction.

[0068] Figure 7 is the installation position diagram of pre-warming disc assembly 6, material transport trolley 8 and test seat assembly 15, including pre-warming disc unit one 601, pre-warming disc unit two 602, A trolley assembly 801, B trolley assembly 802, test seat assembly 15. The pre-warming disc assembly 6 of the device is provided with two groups, which is used to increase the pre-warming number of chips. The material transport trolley 8 is provided with two groups of A and B, which improves the material transport efficiency. The test seat assembly 15 is arranged between the two groups of material transport trolleys 8, which is the test station of the chip.

[0069] Figure 8 is the installation position diagram of pre-warming disc assembly 6 and material transport trolley 8 below the blowing rod, including pre-warming disc blowing rod one 603, pre-warming disc blowing rod two 604, A trolley blowing rod one 803, A trolley blowing rod two 804, B trolley blowing rod one 805, B trolley blowing rod two 806. One blowing rod (pre-warming disc blowing rod one 603, pre-warming disc blowing rod two 604) is arranged below each pre-warming disc, and two blowing rods (A trolley blowing rod 803, A trolley blowing rod two 804, B trolley blowing rod one 805, B trolley blowing rod two 806) are arranged below each material transport trolley 8. The blowing rod blows cold air to reduce the temperature of the pre-warming disc assembly 6 and the material transport trolley 8.

[0070] Figure 9Figure 1 is a structural diagram of the pre-warming disc unit 601, which includes a pre-warming disc body 6011, a pre-warming disc mounting plate 6012, a heating sheet body 6013, a heating sheet protection plate 6014, and a pre-warming disc support 6015. The pre-warming disc body 6011 is used to place the chip, the pre-warming disc mounting plate 6012 is used to place the pre-warming disc body 6011, the heating sheet body 6013 is attached below the pre-warming disc mounting plate 6012 to heat the pre-warming disc body 6011, the heating sheet protection plate 6014 is installed below the heating sheet body 6013, and the pre-warming disc support 6015 fixes the entire assembly on the large plate 18.

[0071] Figure 10 Figure 2 is a structural diagram of the A trolley assembly 801, which includes an A trolley base 8011, an A trolley heating rod 8012, an A trolley mounting plate 8013, and an A trolley body 8014. The A trolley base 8011 is used to drive the A trolley body 8014 to move and carry the chip, the A trolley heating rod 8012 is used to heat the chip and is installed inside the A trolley mounting plate 8013, and the A trolley body 8014 is installed on the top and is provided with 16 chip placing notches to carry 16 chips at a time.

[0072] Figure 11 Figure 3 is a structural diagram of the A trolley blowing rod I 803, which includes a blowing rod I cover plate 8031, a blowing rod I body 8032, and a blowing rod I base 8033. The blowing rod I body 8032 and the blowing rod I cover plate 8031 are provided with blowing holes, cold air flows through the blowing rod I body 8032, and the blowing rod I cover plate 8031 and the blowing rod I base 8033 are made of heat insulation material to isolate the blowing rod I body 8032 from the outside air and prevent dew from forming on the outer surface of the blowing rod I body 8032 due to low temperature.

[0073] Figure 12 Figure 4 is a structural diagram of the pre-heating sheet material disc assembly 7, which includes a hot air gun 701, a pre-heating sheet bottom plate 702, a pre-heating sheet material disc 703, and a pre-heating sheet body 704. The hot air gun 701 is used to heat the normal or low temperature gas blown into the test seat assembly 15 to make the temperature of the test seat assembly 15 reach the required temperature. The pre-heating sheet bottom plate 702 is used to install the pre-heating sheet material disc 703, the pre-heating sheet material disc 703 is provided with a plurality of pre-heating sheet body 704 placing notches, the device can place 16 pre-heating sheet bodies 704, the pre-heating sheet body 704 is made of heat-conducting material, when the test suction head body 9015 sucks the pre-heating sheet body 704 and presses it into the test seat, the pre-heating sheet body 704 transmits the temperature of the test suction head body 9015 and the test seat assembly 15 to make the temperatures of the two consistent, and the temperature test environment of the chip reaches a stable state before testing.

[0074] Figure 13is the upper part of the structure diagram of the test seat assembly 15, including test seat heating rod 151, test seat heating frame 152, test seat blowing rod 153. Test seat heating rod 151 is installed inside test seat heating frame 152, test seat blowing rod 153 is installed inside test seat heating frame 152, and air pipe is used to connect with external hot air gun 701.

[0075] Figure 14 is the lower part of the structure diagram of the test seat assembly 15, including test seat body 154, test seat blowing guide block 155, test seat mounting plate 157, and blowing rod air outlet hole 153A. Test seat body 154 can be connected with chip for communication, which is the test station of chip. The device sets 16 test seat bodies 154, and 16 chips can be tested at a time. Test seat blowing guide block 155 and blowing rod air outlet hole 153A are connected, and high-temperature or low-temperature gas of blowing rod can be introduced into test seat body 154, so that the temperature of test seat body 154 reaches the required temperature. Test seat mounting plate 157 is used to fix test seat body 154, and the temperature of heating rod is transmitted to test seat body 154.

[0076] Figure 15 is the sectional view of the test seat assembly 15, including guide block air duct 155A, test seat air duct 154A, and chip to be tested 156. Air flow enters test seat body 154 through blowing rod and guide block, and is discharged from the other end of test seat body 154, so as to complete the temperature conduction of gas to test seat body 154. The temperature of heating rod is transmitted to test seat body 154 through heating frame and test seat mounting plate 157, and both provide required temperature environment for chip.

[0077] Figure 16 is the structure diagram of test suction head arm 9, including test suction head assembly 901, test arm horizontal movement assembly 902, test arm A vertical movement assembly 903, and test arm B vertical movement assembly 904. Test suction head assembly 901 sucks chip, test arm horizontal movement assembly 902 sets 1 group, drives 2 groups of test suction head bodies 9015 to move at the same time, test arm vertical movement assembly sets 2 groups, and drives test suction head bodies 9015 to rise and fall separately.

[0078] Figure 17This is a structural diagram of one set of test tip assemblies 901, including a test tip base 9011, a test tip mounting base 9012, a tip heating rod 9013, a tip temperature sensor 9014, a test tip body 9015, a sealing ring 9016, and a tip blower 9017. The test tip base 9011 is connected to an external test arm, and 16 sets of test tip bodies 9015 are installed below it. The tip heating rod 9013 is installed inside the test tip mounting base 9012, and the heat generated provides the chip with the required temperature environment. The tip temperature sensor 9014 measures the ambient temperature in real time and feeds it back to the control system, so that the temperature can be stably controlled within the required range. The tip blower 9017 blows out cool air to reduce the temperature of the tip. The sealing ring 9016 contacts and adheres tightly to the upper surface of the chip, sealing the air pressure inside the pipe.

[0079] Figure 18 This is a cross-sectional view of the test tip assembly 901, including the test base body 154, the chip under test 156, the pressure sensor 156A, the tip temperature sensor 9014, the test tip body 9015, and the sealing ring 9016. The pressure sensor 156A is a structure on the chip under test 156 that senses gas pressure to generate an electrical signal. It is surrounded by the sealing ring 9016, which prevents pressure leakage beyond the specified range, thus ensuring that the pressure sensor 156A receives the correct pressure stimulation.

[0080] Figure 19The pneumatic principle diagram is shown in the figure, the gas source is filtered by the gas source processing element, the clean gas enters the vacuum generator assembly 14, the gas tank assembly 2 and the calibration pressure controller module 101, the vacuum generator assembly 14 is used for sucking the chip and assisting in reducing the air pressure at the chip end, the gas tank pressure control module is used for controlling the air pressure in the gas tank to a required value, and the air pressure value is usually slightly greater than the corresponding calibration pressure; the calibration pressure controller module 101 directly controls the calibration pressure required at the chip end, and has two control modes of increasing and decreasing pressure. A working process is that the electromagnetic valve 1 is turned on, the vacuum generator assembly 14 generates vacuum, the chip is sucked, after the chip is placed in the test seat assembly 15, the electromagnetic valve 1 is turned off, the electromagnetic valve 2 and the electromagnetic valve 3 are turned on at the same time, the gas tank is discharged, the pressure calibration module is started to control, the electromagnetic valve 2 is turned off after the gas tank is discharged for a program setting time, the calibration pressure controller module 101 continues to control the pressure to the required pressure range, at this time, the pressure sensor 156A on the chip senses the pressure stimulus to generate an electric signal, the test system program matches the current pressure value of the pressure calibration module with the current electric signal value, and writes into the chip internal program, so that the chip has the correct sensing pressure capability. When the pressure needs to be reduced in the test process, the electromagnetic valve 1 is turned on, the vacuum generator assembly 14 sucks out the gas, the calibration pressure controller module 101 reduces the pressure, the electromagnetic valve 1 is turned off for a program setting time, and the calibration pressure control module continues to control the pressure to the required range, at this time, the vacuum generator assembly 14 plays an auxiliary role in reducing the pressure, and the time consumption of reducing the pressure is reduced. When the test is completed, the electromagnetic valve 3 is turned off, the electromagnetic valve 1 is turned on, the vacuum generator assembly 14 sucks out all the air to generate vacuum, and the chip is adsorbed and removed from the test seat.

[0081] The advantages of the utility model are as follows:

[0082] The preheating mode and the air pressure rapid control mode are adopted in the scheme. The principle of the preheating mode is that the chip is heated to the required temperature in advance, and then is transported to the test seat for calibration. The heating and the test are changed from the series connection mode to the parallel connection mode, the heating time is reduced, the temperature of each test suction head does not affect each other, and the temperature of each test suction head can be independently adjusted, and the temperature precision is improved. The principle of the air pressure rapid control mode is that the pressure controller is matched with the gas tank to assist in air supply to increase the pressure, and is matched with the vacuum generator to assist in air exhaust to reduce the pressure. Only the pressure is applied to the sensor hole on the upper surface of the chip, the gas volume controlled is greatly reduced, and the time required for the air pressure control is greatly reduced. The two optimizations reduce the tire pressure sensor pressure and temperature calibration test time, and improve the production efficiency.

[0083] Embodiment 1

[0084] When the normal temperature 25℃ test, the refrigerator 5 blows out cold air, through the pipeline and the blowing rod, the temperature of the pre-warming disc assembly 6, the material trolley 8, the test seat assembly 15 and the test suction head body 9015 is reduced to below 25℃, combined with the heating function of each component, the temperature is heated back to normal and kept at 25℃. The number of test suction head body 9015 is set to 16, each suction head temperature does not affect each other, and the temperature of each suction head can be adjusted independently, which improves the temperature accuracy. The chip 156 to be tested enters the inside of the equipment from the tray in-out mechanism 4, the loading suction head arm 11 sucks the chip and puts it into the pre-warming disc assembly 6, after the chip is pre-warmed to 25℃, the loading suction head arm 11 sucks the chip and puts it into the material trolley 8, the material trolley 8 carries the chip to the test area, the test suction head arm 9 sucks the chip and presses it into the test seat assembly 15, the calibration pressure controller module 101 applies the required pressure to the chip end, and the gas tank assembly 2 discharges gas to the chip end for a period of time under program control, which assists in pressure rise and reduces time consumption. After the pressure of the chip end is stable, the test program reads the current pressure value and the electrical signal generated by the stimulation of the pressure sensor 156A on the chip (not shown in the figure) is paired and written into the built-in program of the chip. The test program reads the current ambient temperature and the electrical signal generated by the stimulation of the temperature sensor (not shown in the figure) built in the chip at the same time, and the two are paired and written into the built-in program of the chip. After these two steps, the chip has the ability to correctly sense pressure and temperature. If the test process needs to be reduced to the required lower pressure value, the vacuum generator assembly 14 discharges air for a period of time under program control, which assists in pressure reduction and reduces time consumption. When the test is completed, the vacuum generator assembly 14 discharges all the air to form negative pressure, the test suction head arm 9 sucks the chip and moves out of the test seat, and puts it into the material trolley 8. The material trolley 8 carries the tested chip out of the test area, the unloading suction head arm 12 sucks the tested chip and classifies it into the discharge tray of the tray in-out mechanism 4, completing the calibration test and sorting of the chip.

[0085] When the high temperature 70℃ test, refrigerator 5 is closed, the temperature of pre-warming disc assembly 6, material handling trolley 8, test seat assembly 15 and test suction head body 9015 is raised to 70℃ and maintained. The number of test suction head body 9015 is set to 16, each head temperature does not affect each other, and each temperature can be independently adjusted, which improves the temperature accuracy. Because of the high temperature state, the temperature difference between the surface of test seat assembly 15 and the air is large, which causes the test seat assembly 15 to be seriously cooled, so that the actual temperature of test seat assembly 15 cannot reach 70℃ (when the normal temperature is 25℃, because the temperature difference between the surface of test seat assembly 15 and the air is small, the cooling is not obvious, the actual temperature of test seat assembly 15 is close to 25℃, and the actual temperature is not low due to cooling), at this time, the surface of test seat assembly 15 needs to be preheated to 70℃ to ensure that the chip has a correct temperature environment for testing. The preheating method of test seat assembly 15 is as follows: the loading suction head arm 11 sucks the preheating sheet from the preheating sheet disc assembly 7 and puts it on the material handling trolley 8, the material handling trolley 8 carries the preheating sheet to the test area, the test suction head arm 9 sucks the preheating sheet and presses it into the test seat assembly 15, after a period of time, the environment temperature of test seat assembly 15 reaches 70℃, the test suction head arm 9 sucks the preheating sheet and moves out of the test seat assembly 15 and puts it back to the original position. While the test seat assembly 15 is preheating, the chip 156 to be tested has been carried to the pre-warming disc for preheating, after the preheating of test seat assembly 15 is completed, the chip test can be carried out, and the test process is the same as the above normal temperature test process.

[0086] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A tire pressure sensor chip test handler characterized by: The pressure controller assembly (1), the air tank assembly (2), the electromagnetic valve assembly (3), the tray in-out mechanism (4), the refrigeration machine (5), the pre-warming tray assembly (6), the pre-heating sheet tray assembly (7), the material transport trolley (8), the test suction head arm (9), the hot air gun (701) assembly (10), the feeding suction head arm (11), the discharging suction head arm (12), the tray conveying arm assembly (13), the vacuum generator assembly (14), the test seat assembly (15), the rack (16), the machine cover (17) and the large plate (18) are provided, the pressure controller assembly (1), the air tank assembly (2) and the electromagnetic valve assembly (3) are all installed on the top of the machine cover (17), the vacuum generator assembly (14) is installed below the electromagnetic valve assembly (3), the machine cover (17) and the tray in-out mechanism (4) are installed on the rack (16), the refrigeration machine (5) is installed inside the rack (16), the large plate (18) is also installed on the rack (16), and the pre-warming tray assembly (6), the pre-heating sheet tray assembly (7), the material transport trolley (8), the test suction head arm (9), the hot air gun (701) assembly (10), the feeding suction head arm (11), the discharging suction head arm (12), the tray conveying arm assembly (13) and the test seat assembly (15) are all installed on the large plate (18).

2. The tire pressure sensor chip test handler of claim 1, wherein: The pressure controller assembly (1) comprises a calibration pressure controller module (101), an air tank pressure controller module one (102), an air tank pressure controller module two (103), an air tank pressure controller module three (104) and an air tank pressure controller module four (105); the calibration pressure controller module (101) is provided with the air tank pressure controller module one (102), the air tank pressure controller module two (103), the air tank pressure controller module three (104) and the air tank pressure controller module four (105) on one side respectively, and the air tank pressure controller module one (102), the air tank pressure controller module two (103), the air tank pressure controller module three (104) and the air tank pressure controller module four (105) are arranged in an array; The air tank assembly (2) comprises an air tank one (201), an air tank two (202), an air tank three (203) and an air tank four (204), and the calibration pressure controller module (101) is provided with the air tank four (204), the air tank three (203), the air tank two (202) and the air tank one (201) from left to right on the other side.

3. The tire pressure sensor chip test handler of claim 1, wherein: The electromagnetic valve assembly (3) comprises an air tank exhaust electromagnetic valve assembly (301), a test suction head A electromagnetic valve assembly (302), a test suction head B electromagnetic valve assembly (303) and a calibration pressure module electromagnetic valve assembly (304), the test suction head A electromagnetic valve assembly (302) and the test suction head B electromagnetic valve assembly (303) are symmetrically arranged, and the test suction head A electromagnetic valve assembly (302) and the test suction head B electromagnetic valve assembly (303) are respectively provided with the air tank exhaust electromagnetic valve assembly (301) and the calibration pressure module electromagnetic valve assembly (304) on one side.

4. The tire pressure sensor chip test handler of claim 1, wherein: The vacuum generator assembly (14) comprises a vacuum generator body (1401), a vacuum generator busbar (1402) and an air inlet joint (1403), the vacuum generator body (1401) is installed on the vacuum generator busbar (1402), and the air inlet joint (1403) is installed at the upper and lower ends of the vacuum generator busbar (1402) respectively.

5. The tire pressure sensor chip test handler of claim 1, wherein: The pre-warming disc assembly (6) comprises a pre-warming disc unit one (601), a pre-warming disc unit two (602), a pre-warming disc blowing rod one (603) and a pre-warming disc blowing rod two (604) which are all located on the large plate (18), and the pre-warming disc unit one (601) and the pre-warming disc unit two (602) are respectively provided with the pre-warming disc blowing rod one (603) and the pre-warming disc blowing rod two (604) on one side. The material conveying trolley (8) comprises an A-trolley assembly (801) and a B-trolley assembly (802) which are both located on the large plate (18), an A-trolley blowing rod one (803), an A-trolley blowing rod two (804), a B-trolley blowing rod one (805) and a B-trolley blowing rod two (806), the A-trolley assembly (801) and the B-trolley assembly (802) are symmetrically arranged, the B-trolley blowing rod one (805) and the B-trolley blowing rod two (806) are respectively arranged between the A-trolley assembly (801) and the B-trolley assembly (802), and the A-trolley blowing rod one (803) and the A-trolley blowing rod two (804) are respectively arranged on one side of the A-trolley assembly (801).

6. The tire pressure sensor chip test handler of claim 5, wherein: The pre-warming disc unit one (601) comprises a pre-warming disc body (6011), a pre-warming disc mounting plate (6012), a heating sheet body (6013), a heating sheet protection plate (6014) and a pre-warming disc support (6015), the pre-warming disc body (6011), the pre-warming disc mounting plate (6012), the heating sheet body (6013) and the heating sheet protection plate (6014) are sequentially arranged from top to bottom, and the heating sheet protection plate (6014) is arranged on both sides of the pre-warming disc support (6015) and is mounted to the large plate (18); The A-trolley assembly (801) comprises an A-trolley base (8011), an A-trolley heating rod (8012), an A-trolley mounting plate (8013) and an A-trolley body (8014), the A-trolley base (8011) is arranged on the top of the A-trolley mounting plate (8013), the A-trolley mounting plate (8013) is arranged on the top of the A-trolley body (8014), and the A-trolley heating rod (8012) is arranged in the A-trolley mounting plate (8013); The A-trolley blowing rod one (803) comprises a blowing rod one cover plate (8031), a blowing rod one body (8032) and a blowing rod one base (8033), the blowing rod one body (8032) is arranged in the blowing rod one base (8033), the blowing rod one cover plate (8031) is arranged on the top of the blowing rod one base (8033), and the blowing rod one body (8032) and the blowing rod one cover plate (8031) are both provided with air blowing holes.

7. The tire pressure sensor chip test handler of claim 1, wherein: The preheating sheet disc assembly (7) comprises a hot air gun (701), a preheating sheet bottom plate (702), a preheating sheet feeding disc (703) and a preheating sheet body (704), the hot air gun (701) is installed at the bottom of the preheating sheet bottom plate (702), the preheating sheet feeding disc (703) is installed above the preheating sheet bottom plate (702), and a plurality of placing grooves for placing a plurality of preheating sheet bodies (704) are formed on the surface of the preheating sheet feeding disc (703).

8. The tire pressure sensor chip test handler of claim 1, wherein: The test seat assembly (15) comprises a test seat heating rod (151), a test seat heating frame (152), a test seat blowing rod (153), a test seat body (154), a test seat blowing guide block (155), a chip to be tested (156) and a test seat mounting plate (157), the test seat heating frame (152) is a hollow rectangular frame structure, the test seat blowing rod (153) is installed inside the hollow rectangular frame structure, the test seat heating rod (151) is installed inside the test seat heating frame (152), the test seat mounting plate (157) is installed below the test seat heating frame (152), and a plurality of test seat bodies (154) and test seat blowing guide blocks (155) are installed on the surface of the test seat mounting plate (157); a plurality of blowing rod air outlet holes (153A) are formed on the test seat blowing rod (153), the test seat blowing guide block (155) is provided with a guide block air duct (155A), and the test seat body (154) is provided with a test seat air duct (154A); and the chip to be tested (156) is further provided with a pressure sensor (156A).

9. The tire pressure sensor chip test handler of claim 1, wherein: The test suction head arm (9) comprises a test suction head assembly (901), a test arm horizontal movement assembly (902), a test arm A vertical movement assembly (903), a test arm B vertical movement assembly (904) and a test arm mounting plate, the test suction head assembly (901) is installed at the bottom of the test arm mounting plate, and the test arm horizontal movement assembly (902), the test arm A vertical movement assembly (903) and the test arm B vertical movement assembly (904) are installed at the top of the test arm mounting plate.

10. The tire pressure sensor chip test handler of claim 9, wherein: The test suction head assembly (901) comprises a test suction head base (9011), a test suction head mounting seat (9012), a suction head heating rod (9013), a suction head temperature sensor (9014), a test suction head body (9015), a sealing ring (9016) and a suction head blowing rod (9017), a plurality of test suction head mounting seats (9012) are installed at the bottom of the test suction head base (9011), one test suction head body (9015) is installed on each test suction head mounting seat (9012), and the suction head heating rod (9013), the suction head temperature sensor (9014) and the sealing ring (9016) are respectively installed on each test suction head mounting seat (9012), and the suction head blowing rod (9017) is installed on one side of the test suction head mounting seat (9012).

Images