Tin and glue removing device for BGA (Ball Grid Array) chip

Abstract

The utility model provides a BGA chip tin and glue removing device, and relates to the technical field of tin and glue removing, the BGA chip tin and glue removing device comprises a tin and glue removing structure, the tin and glue removing structure comprises a lifting type tin and glue removing part, the lifting type tin and glue removing part comprises a third air cylinder, the telescopic end of the third air cylinder is connected with a first air cylinder, and the first air cylinder is connected with a first connecting frame; the bottom end of the first connecting frame is connected with a left storage tank, the bottom end of the left storage tank is connected with a left suction nozzle, the side face of the left storage tank is connected with a left vacuum suction nozzle connector, and the telescopic end of the first air cylinder is connected with a left poking needle. According to the tin-removing and glue-removing device, the lifting type tin-removing and glue-removing part is arranged, a left ultrasonic vibrator, a left heating rod and a left vibration rod are matched with one another to conduct ultrasonic high-frequency vibration to achieve heating, breaking and stripping of tin soldering points, and then broken tin soldering and glue are sucked into a left storage tank through a left suction nozzle to achieve the tin-removing purpose; therefore, smoke pollution caused by tin removal of a traditional hot air gun is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of tin and glue removing, specifically relates to a BGA chip tin and glue removing device. BACKGROUND

[0002] In the manufacturing process of the mobile phone mainboard, the mainboard needs to be disassembled for maintenance, and when the electronic components on the mainboard are disassembled, the excess tin slag will be left on the mainboard, which needs to be cleaned with a special tool. The traditional tin removing method is to use a hot air gun to heat and remove the tin slag on the mainboard. The tin slag is heated by high-temperature hot air, which melts and is quickly cleaned away, thereby achieving the purpose of tin removal.

[0003] However, a large amount of smoke and dust will be generated during the tin removal process of the hot air gun, which not only pollutes the environment, but also damages the health of the operator. Especially when the hot air gun is used without good ventilation conditions, the smoke and dust will easily accumulate in the air, causing many adverse effects on the human body. Therefore, we have improved it and proposed a BGA chip tin and glue removing device. SUMMARY

[0004] The utility model provides a BGA chip tin and glue removing device, including tin and glue removing structure, the tin and glue removing structure includes the lifting type tin and glue removing part, the lifting type tin and glue removing part includes third air cylinder, the telescopic end of third air cylinder is connected with first air cylinder, first air cylinder is connected with first connecting frame, and the bottom of first connecting frame is connected with left storage tank, the bottom of left storage tank is connected with left suction nozzle, the side of left storage tank is connected with left vacuum suction nozzle interface, the telescopic end of first air cylinder is connected with left needle, and the bottom of left needle passes through left storage tank and left suction nozzle.

[0005] One side of left storage tank is provided with left clamp, and left clamp is connected with left ultrasonic vibrator, the bottom of left ultrasonic vibrator is connected with left heating rod, the bottom of left heating rod is connected with left vibration rod, and the bottom of left suction nozzle is above the bottom of left vibration rod.

[0006] As a preferred technical solution of the application, the third air cylinder is connected with a bottom plate, and a detection part is arranged on one side of the third air cylinder on the bottom plate.

[0007] As a preferred technical solution of the application, the detection part includes a camera mounting plate mounted on the bottom plate, and a CCD visual detection camera is mounted on the camera mounting plate.

[0008] As a preferred technical solution of the application, a light source is also mounted on the bottom plate, and the light source is located below the CCD visual detection camera.

[0009] As a preferred technical solution of this application, a rotary desoldering and de-adhesive removal section is installed on the base plate, and the rotary desoldering and de-adhesive removal section is located on one side of the lifting desoldering and de-adhesive removal section.

[0010] As a preferred technical solution of this application, the rotary desoldering and desmearing unit includes a bearing seat mounted on a base plate. A connecting pipe is rotatably connected to the bearing seat via a bearing. A second connecting frame is connected to the bottom end of the connecting pipe. A right storage tank is connected to the bottom end of the second connecting frame. A right suction nozzle is connected to the bottom end of the right storage tank. A right vacuum suction nozzle interface is connected to the right storage tank.

[0011] As a preferred technical solution of this application, a slotted switch is installed on the base plate, and the position of the slotted switch corresponds to the position of the right suction nozzle.

[0012] As a preferred technical solution of this application, a servo motor is installed on the base plate, and the output shaft of the servo motor and the top of the connecting pipe are both connected to synchronous pulleys, and a synchronous belt is connected between the two synchronous pulleys.

[0013] As a preferred technical solution of this application, a second cylinder is installed on the base plate above the bearing seat. The telescopic end of the second cylinder is connected to a right needle. The bottom end of the right needle passes through the connecting pipe, the right storage tank and the right suction nozzle.

[0014] As a preferred technical solution of this application, a second clamp located on one side of the right storage tank is installed on the base plate. A right ultrasonic vibrator is installed on the second clamp. A right heating rod is connected to the bottom end of the right ultrasonic vibrator. A right vibrating rod is connected to the bottom end of the right heating rod. The bottom end of the right vibrating rod is located above the bottom end of the right suction nozzle.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] In the scheme of this application:

[0017] This application utilizes a lifting-type solder and adhesive removal section. The left ultrasonic vibrator, left heating rod, and left vibrating rod work together to perform high-frequency ultrasonic vibration to heat, break, and peel off the solder joints. Then, the left suction nozzle sucks the broken solder and adhesive into the left storage tank to achieve the purpose of solder removal, thereby reducing the smoke and dust pollution generated by traditional hot air gun solder removal. Attached Figure Description

[0018] Fig. 1 A schematic diagram of the BGA chip desoldering and de-adhesive removal device provided in this application;

[0019] Fig. 2 A schematic diagram of the detinning and adhesive removal structure provided in this application;

[0020] Fig. 3 The structure diagram of the rotating tin and glue removing part is provided for the application.

[0021] Indicated in the figure:

[0022] 2, bottom plate; 3, first air cylinder; 31, first connecting frame; 4, CCD visual inspection camera; 41, camera mounting plate; 6, left poking needle; 7, left ultrasonic vibrator; 71, left clamp; 8, light source; 9, left storage tank; 10, left heating rod; 11, left suction nozzle; 12, left vibrating rod; 14, left vacuum suction nozzle interface; 15, right vibrating rod; 16, right suction nozzle; 17, right heating rod; 18, height gauge; 19, right storage tank; 191, slot switch; 20, right vacuum suction nozzle interface; 21, right poking needle; 22, right ultrasonic vibrator; 221, second clamp; 23, third air cylinder; 24, synchronous belt; 25, synchronous wheel; 251, bearing seat; 252, second connecting frame; 26, servo motor; 27, second air cylinder; 28, tin and glue removing structure. DETAILED DESCRIPTION

[0023] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0024] It should be noted that the embodiments and the features and technical schemes in the embodiments in the present application can be combined with each other without conflict.

[0025] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0026] Embodiment, please refer to Figs. 1-3 A BGA chip tin and glue removing device, comprising a tin and glue removing structure 28, the tin and glue removing structure 28 comprises a lifting type tin and glue removing part, the lifting type tin and glue removing part comprises a third air cylinder 23, the third air cylinder 23 is connected with a first air cylinder 3 at the telescopic end, the first air cylinder 3 is connected with a first connecting frame 31, and the bottom end of the first connecting frame 31 is connected with a left storage tank 9, the bottom end of the left storage tank 9 is connected with a left suction nozzle 11, the side of the left storage tank 9 is connected with a left vacuum suction nozzle interface 14, the telescopic end of the first air cylinder 3 is connected with a left poking needle 6, and the bottom end of the left poking needle 6 penetrates through the left storage tank 9 and the left suction nozzle 11;

[0027] The left storage tank 9 is provided with a left clamp 71, and the left clamp 71 is connected with a left ultrasonic vibrator 7. The bottom end of the left ultrasonic vibrator 7 is connected with a left heating rod 10. The bottom end of the left heating rod 10 is connected with a left vibrating rod 12. The bottom end of the left suction nozzle 11 is located above the bottom end of the left vibrating rod 12. The left ultrasonic vibrator 7, the left heating rod 10 and the left vibrating rod 12 cooperate with each other to realize ultrasonic high-frequency vibration to heat, break and strip the soldering points. Then the broken soldering and glue are sucked into the left storage tank 9 by the left suction nozzle 11 to achieve the purpose of removing tin, thereby reducing the smoke pollution generated by the traditional hot air gun tin removal.

[0028] The part A in the figure is marked as a component that needs to be removed from tin and glue.

[0029] Further, the third cylinder 23 is connected with the bottom plate 2, and the bottom plate 2 is provided with a detection part located on one side of the third cylinder 23. The detection part includes a camera mounting plate 41 mounted on the bottom plate 2, and a CCD visual detection camera 4 mounted on the camera mounting plate 41. A light source 8 is also mounted on the bottom plate 2 and located below the CCD visual detection camera 4. The light source 8 is used for light compensation for the CCD visual detection camera 4.

[0030] Further, a rotary tin and glue removal part is mounted on the bottom plate 2 and located on one side of the lifting tin and glue removal part. The rotary tin and glue removal part includes a bearing seat 251 mounted on the bottom plate 2, and a connecting pipe rotatably connected to the bearing seat 251. The bottom end of the connecting pipe is connected with a second connecting frame 252. The bottom end of the second connecting frame 252 is connected with a right storage tank 19. The bottom end of the right storage tank 19 is connected with a right suction nozzle 16. The right storage tank 19 is connected with a right vacuum suction nozzle interface 20. The rotation angle range of the right suction nozzle 16 is 0-90 degrees. This action function enables the right suction nozzle 16 to suck tin residue within the range of 0-90 degrees. A height measuring instrument 18 is also mounted on the bottom plate 2.

[0031] Further, a slot switch 191 is mounted on the bottom plate 2 and the position of the slot switch 191 corresponds to the position of the right suction nozzle 16. The slot switch 191 is used to sense the rotation angle range of the right suction nozzle 16.

[0032] Further, a servo motor 26 is mounted on the bottom plate 2. The output shaft of the servo motor 26 and the top end of the connecting pipe are both connected with synchronous wheels 25. A synchronous belt 24 is connected between the two synchronous wheels 25. The servo motor 26 can drive the connecting pipe to rotate through the synchronous belt 24 and the synchronous wheels 25. The connecting pipe can drive the right storage tank 19 and the right suction nozzle 16 to rotate through the second connecting frame 252 during the rotation process.

[0033] Further, the second cylinder 27 is installed on the bottom plate 2 above the bearing seat 251, the telescopic end of the second cylinder 27 is connected with the right punch needle 21, the bottom end of the right punch needle 21 penetrates through the connecting pipe, the right storage tank 19 and the right suction nozzle 16, the second cylinder 27 is used to drive the right punch needle 21 to ascend and descend, the right punch needle 21 penetrates through the right suction nozzle 16 in the descending process, and then the right suction nozzle 16 is cleaned.

[0034] Further, the second clamp 221 is installed on the bottom plate 2 at one side of the right storage tank 19, the right ultrasonic vibrator 22 is installed on the second clamp 221, the bottom end of the right ultrasonic vibrator 22 is connected with the right heating rod 17, the bottom end of the right heating rod 17 is connected with the right vibration rod 15, and the bottom end of the right vibration rod 15 is located above the bottom end of the right suction nozzle 16; the right ultrasonic vibrator 22, the right heating rod 17 and the right vibration rod 15 are used to cooperate with each other to realize the heating, breaking and peeling of the soldering point through ultrasonic high-frequency vibration, then the broken soldering and glue are sucked into the right storage tank 19 by the right suction nozzle 16 to achieve the purpose of removing the solder, so that the smoke pollution generated by the traditional hot air gun is reduced.

[0035] The application is based on the breaking and peeling of the soldering point through ultrasonic high-frequency vibration, and then the broken soldering is sucked away by the vacuum suction nozzle to achieve the purpose of removing the solder, and the application has the following advantages:

[0036] The left vibration rod 12 and the right vibration rod 15 with two different sizes and shapes of vibration heads are configured, different vibration heads can be switched according to different sizes of elements to remove the solder and glue;

[0037] The left heating rod 10 and the right heating rod 17 are used for auxiliary heating to reduce the situation that the tin slag blocks the left suction nozzle 11 and the right suction nozzle 16;

[0038] The bottom plate 2 is installed on the existing driving module, such as XYZR four-axis driving, when in use, so that the path of removing the solder can be freely set;

[0039] The first cylinder 3 drives the left punch needle 6 to move downward, so that the left punch needle 6 can clean the left suction nozzle 11, the second cylinder 27 drives the right punch needle 21 to descend, so that the right punch needle 21 can clean the right suction nozzle 16, and then the tin paste adhered to the left suction nozzle 11 and the right suction nozzle 16 can be removed;

[0040] The CCD visual detection camera 4 is configured to cooperate with the existing visual system to locate the solder removal area;

[0041] The height detector 18 can detect the height of the tin paste;

[0042] The left heating rod 10 and the right heating rod 17 transmit heat through the left vibrating rod 12 and the right vibrating rod 15 respectively, and the heating serves as an auxiliary, and the tin and the glue are mainly removed by vibration, so that high temperature direct heating is not needed, the problems of PCB deformation and damage of thermal sensitive elements are reduced, and the pads and the substrate are better protected;

[0043] In use, the bottom plate 2 is fixed on an existing XYZR four-axis driving module, so that the bottom plate 2 can move along a set path; the left vacuum suction nozzle interface 14 and the right vacuum suction nozzle interface 20 are connected to an external vacuum generating device;

[0044] According to the size, the interval and the glue layer characteristics of the solder joints of the BGA chip to be processed,

[0045] The device is driven by the XYZR four-axis driving module to move above the PCB to be processed, the solder joint area of the BGA chip on the PCB is photographed by the CCD visual detection camera 4, the existing visual system is combined to analyze the image, the specific position of the tin and the glue to be removed is located, the lifting type tin and glue removing part or the rotary type tin and glue removing part is selected according to the size and the position of the solder joint, and the two ways are described below respectively:

[0046] The lifting type tin and glue removing part operation: the left vibrating rod 12 and the left suction nozzle 11 are moved to the target solder joint directly above by the XYZR four-axis driving module; the first cylinder 3 and the left storage tank 9 are driven to descend as a whole by the third cylinder 23, so that the left vibrating rod 12 is close to the surface of the solder joint, the left heating rod 10 is started, heat is transmitted to the solder joint through the left vibrating rod 12, and the tin paste and the glue layer are softened; at the same time, the left ultrasonic vibrator 7 is started, the left vibrating rod 12 generates high-frequency vibration, the tin solder joint is broken and separated from the PCB, after the tin solder joint is broken, the tin slag and the glue scraps are sucked into the left storage tank 9 by the negative pressure generated by the left vacuum suction nozzle interface 14, and the tin and the glue in the area are removed; if the left suction nozzle 11 is blocked, the left poking needle 6 is driven to descend by the first cylinder 3, the left poking needle 6 penetrates through the left storage tank 9 and the left suction nozzle 11, and the tin paste or the glue scraps adhered to the nozzle are removed, and the left poking needle 6 is reset after cleaning;

[0047] The operation of the rotary tin and glue removing part: the XYZR four-axis driving module moves the right vibrating rod 15 and the right suction nozzle 16 to the target area; if the suction angle needs to be adjusted, the servo motor 26 drives the connecting pipe to rotate through the synchronous belt 24 and the synchronous wheel 25, drives the right storage tank 19 and the right suction nozzle 16 to rotate within the range of 0-90 degrees, adjusts the right vibrating rod 15 to be close to the surface of the welding spot, starts the right heating rod 17, the heat is transmitted to the welding spot through the right vibrating rod 15, the right ultrasonic vibrator 22 is started, the right vibrating rod 15 vibrates at high frequency to break the tin welding spot and the glue layer, the right suction nozzle 16 generates negative pressure through the right vacuum suction nozzle interface 20, and the broken tin residues and glue scraps are sucked into the right storage tank 19; if the right suction nozzle 16 is blocked, the second air cylinder 27 drives the right poking needle 21 to descend and pass through the connecting pipe, the right storage tank 19 and the right suction nozzle 16, and is reset after removing the blockage; when the rotary tin and glue removing part is used, the left vibrating rod 12 and the left suction nozzle 11 are adjusted to the highest position.

[0048] During or after the tin removing process, the height detector 18 detects the treatment area to confirm whether the tin paste residual height meets the requirements; the CCD visual detection camera 4 takes pictures of the treatment area again, judges the tin and glue removing effect through the visual system, and if there is an area that is not cleaned, the above tin removing step is repeated until the requirements are met.

[0049] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do the broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection or each other can communicate;Can be directly connected, also can pass through the intermediate medium indirectly connect, can be two elements inside the communication or two element's interaction relationship, unless another definite limitation.For the ordinary skilled person in the art, the above terms can be understood according to the specific meaning in the utility model.

[0050] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, and not all the embodiments, and the preferred embodiments of the utility model are given in the drawings, but do not limit the patent range of the utility model.The utility model can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.Although the utility model is described in detail with reference to the foregoing embodiments, the skilled person in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement to part of the technical features.All equivalent structures made by using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, are also within the patent protection range of the utility model.

Claims

1. A BGA chip desmear apparatus, characterized by, Including tin and glue removal structure (28), the tin and glue removal structure (28) includes lifting type tin and glue removal part, the lifting type tin and glue removal part includes third air cylinder (23), the telescopic end of third air cylinder (23) is connected with first air cylinder (3), first air cylinder (3) is connected with first connecting frame (31), and the bottom end of first connecting frame (31) is connected with left storage tank (9), the bottom end of left storage tank (9) is connected with left suction nozzle (11), the side of left storage tank (9) is connected with left vacuum suction nozzle interface (14), the telescopic end of first air cylinder (3) is connected with left needle (6), and the bottom end of left needle (6) passes through left storage tank (9) and left suction nozzle (11); One side of left storage tank (9) is provided with left clamp (71), and left clamp (71) is connected with left ultrasonic vibrator (7), the bottom end of left ultrasonic vibrator (7) is connected with left heating rod (10), the bottom end of left heating rod (10) is connected with left vibration rod (12), and the bottom end of left suction nozzle (11) is located above the bottom end of left vibration rod (12).

2. The BGA chip desmear apparatus of claim 1, wherein The third air cylinder (23) is connected with the bottom plate (2), and the detection part is arranged on one side of the third air cylinder (23) on the bottom plate (2).

3. The BGA chip desmear apparatus of claim 2, wherein The detection part includes a camera mounting plate (41) mounted on the bottom plate (2), and a CCD vision detection camera (4) is mounted on the camera mounting plate (41).

4. The BGA chip desmear apparatus of claim 3, wherein the desmear solution is applied to the BGA chip by a spray nozzle. A light source (8) is also mounted on the bottom plate (2), and the light source (8) is located below the CCD vision detection camera (4).

5. The BGA chip desmear apparatus of claim 2, wherein A rotary tin and glue removal part is mounted on the bottom plate (2), and the rotary tin and glue removal part is located on one side of the lifting type tin and glue removal part.

6. The BGA chip desmear apparatus of claim 5, wherein The rotary tin and glue removal part includes a bearing seat (251) mounted on the bottom plate (2), a connecting pipe is rotatably connected to the bearing seat (251) through a bearing, the bottom end of the connecting pipe is connected with a second connecting frame (252), the bottom end of the second connecting frame (252) is connected with a right storage tank (19), the bottom end of the right storage tank (19) is connected with a right suction nozzle (16), and the right storage tank (19) is connected with a right vacuum suction nozzle interface (20).

7. The BGA chip desmear apparatus of claim 6, wherein A slot switch (191) is mounted on the bottom plate (2), and the position of the slot switch (191) corresponds to the position of the right suction nozzle (16).

8. The BGA chip desmear apparatus of claim 7, wherein the desmear solution is applied to the BGA chip by a spray nozzle. A servo motor (26) is mounted on the bottom plate (2), an output shaft of the servo motor (26) and a top end of the connecting pipe are both connected with a synchronous wheel (25), and a synchronous belt (24) is connected between the two synchronous wheels (25).

9. The BGA chip desmear apparatus of claim 8, wherein, A second air cylinder (27) is mounted on the bottom plate (2) above the bearing seat (251), the telescopic end of the second air cylinder (27) is connected with a right needle (21), and the bottom end of the right needle (21) passes through the connecting pipe, the right storage tank (19) and the right suction nozzle (16).

10. The BGA chip desmear apparatus of claim 9, wherein The bottom plate (2) is provided with a second clamp (221) on the right side of the right storage tank (19), the second clamp (221) is provided with a right ultrasonic vibrator (22), the bottom end of the right ultrasonic vibrator (22) is connected with a right heating rod (17), the bottom end of the right heating rod (17) is connected with a right vibrating rod (15), and the bottom end of the right vibrating rod (15) is located above the bottom end of a right suction nozzle (16).

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