Silicon carbide crystal grooving device

Abstract

The utility model provides a silicon carbide crystal grooving device, belongs to the technical field of silicon carbide crystal processing, and solves the problem of poor grooving precision of silicon carbide crystals in the prior art. The device comprises a bearing table, a crystal orientation detector and a laser, a bearing area is formed on the bearing table, the bearing area is used for bearing crystals, the crystal orientation detector is arranged on one side of the bearing table and provided with a detection end, the detection end faces the bearing area, the laser is provided with a transmitting end, and the transmitting end faces the bearing area. And the transmitting end faces the bearing area. Through X-ray diffraction detection of the crystal orientation detector, the crystal orientation of the crystal is detected, the to-be-slotted position is determined, the laser is projected to the to-be-slotted area of the crystal through the transmitting end of the laser device for machining, finally slotting is completed, the detection precision of the crystal orientation detector and the cutting precision of the laser device are good, and the machining precision is high. Therefore, the grooving precision of the silicon carbide crystal can be improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon carbide crystal processing, and particularly relates to a silicon carbide crystal slotting device. BACKGROUND

[0002] Notch slotting is one of important processes in the processing of a silicon carbide crystal ingot. After the end face and the outer circle of the silicon carbide crystal ingot are processed, the Notch slot needs to be processed for subsequent positioning.

[0003] At present, the Notch slot is generally processed by using a grinding wheel. The circumferential position of the Notch slot on the silicon carbide crystal ingot and the angle and size of the Notch slot itself have strict regulations. In order to ensure the processing quality of the Notch slot, the silicon carbide crystal ingot needs to be manually oriented in advance to determine the position of the Notch slot. In addition, the Notch slot grinding wheel must be parallel to the axis of the silicon carbide crystal ingot during grinding, and the processing precision is difficult to guarantee.

[0004] Based on the above, the technical problem to be solved by the application is that the slotting precision of the silicon carbide crystal is poor. CONTENT OF THE UTILITY MODEL

[0005] The application aims to solve the problem of poor slotting precision of the silicon carbide crystal in the prior art, and improve the processing precision of the slotting of the silicon carbide crystal.

[0006] The purpose of the application can be achieved by the following technical scheme: a silicon carbide crystal slotting device, comprising: a bearing table, a bearing area is formed on the bearing table, and the bearing area is used for bearing a crystal; a crystal direction detector, the crystal direction detector is arranged on one side of the bearing table, and the crystal direction detector has a detection end, and the detection end faces the bearing area; and a laser, the laser has an emission end, and the emission end faces the bearing area.

[0007] For example, the bearing area can be formed on the upper surface of the bearing table, or when the bearing table has the ability to adsorb or paste or hang the crystal, the bearing area can also be formed on the side surface of the bearing table. Taking the example of the bearing area on the upper surface of the bearing table, the crystal is fixed after being placed in the bearing area, and the crystal direction is detected by X-ray diffraction detection of the crystal direction detector, so as to determine the position to be slotted. Then, the laser emitted by the emission end of the laser is projected to the area to be slotted of the crystal for processing, and finally the slotting is completed. Compared with the prior art, the detection precision of the crystal direction detector and the cutting precision of the laser are better, so that the slotting precision of the silicon carbide crystal can be improved.

[0008] In the above-mentioned silicon carbide crystal slotting device, the carrier table is relatively rotated with the crystal direction detector and the laser, so that the carrier area is relatively rotated with the crystal direction detector and the laser. It can be understood that by rotating the carrier table or rotating the crystal direction detector or the laser, the crystal direction position can be quickly detected and determined, and the slotting efficiency is improved.

[0009] In the above-mentioned silicon carbide crystal slotting device, the carrier table comprises: a protractor disc, one end surface of the protractor disc is formed with the carrier area; and a rotating mechanism, which is arranged on the side of the protractor disc away from the carrier area and acts on the protractor disc to drive the protractor disc to rotate. It can be understood that by arranging the rotatable protractor disc and the rotating mechanism capable of driving the protractor disc to rotate, the crystal direction detector can be quickly detected, and the laser can be quickly rotated to the appropriate position for slotting processing. For example, the rotating mechanism is a driving motor, and the output shaft of the driving motor is connected with the center area of the bottom surface of the protractor disc.

[0010] In the above-mentioned silicon carbide crystal slotting device, the rotating mechanism is respectively communicatively connected with the crystal direction detector and the laser. It can be understood that by communicatively connecting the rotating mechanism with the crystal direction detector and the laser, the position of the rotating mechanism can be adjusted based on the detection data obtained by the crystal direction detector, and the crystal direction position can be determined by continuous detection and adjustment. Furthermore, based on the obtained crystal direction position, the rotating mechanism can drive the slotting area of the carrier table to rotate to the projection range of the emission end of the laser, so that the laser cutting slotting is quickly completed.

[0011] In the above-mentioned silicon carbide crystal slotting device, the protractor disc is provided with a vacuum adsorption structure, which comprises: an adsorption hole arranged on the protractor disc and adsorbing the carrier area; a cavity formed in the protractor disc and communicating with the adsorption hole; and a vacuum pump in communication with the cavity to act on the cavity. It can be understood that by arranging the vacuum adsorption structure on the protractor disc, the silicon carbide crystal can be quickly fixed or removed, so as to improve the processing and transportation efficiency. Preferably, the number of adsorption holes is multiple, and they are preferably uniformly distributed on the upper surface of the protractor disc, so as to provide stable and uniform adsorption force. The vacuum pump can be a gas pump, which extracts the gas in the cavity to form a negative pressure adsorption force on the surface of the adsorption hole.

[0012] In the above-mentioned silicon carbide crystal slotting device, a base is further arranged below the bearing table, and the bearing table is detachably connected with the base. It can be understood that by arranging the base below the bearing table, the working height of the bearing table is provided, and in some working scenarios, the bearing table can be adjusted horizontally relative to the base.

[0013] In the above-mentioned silicon carbide crystal slotting device, a plurality of connecting blocks are arranged on the base, and a connecting strip is arranged at the bottom of the bearing table, and the connecting strip is slidably coupled with the connecting blocks. It can be understood that by arranging a plurality of connecting blocks on the base, the connecting strip of the bearing table is connected and fixed, preferably by sliding connection or threaded connection, which is convenient for disassembly and separation.

[0014] In the above-mentioned silicon carbide crystal slotting device, the laser has a vertical movement degree, so that the emitting end has a vertical cutting ability. For example, a vertical linear driving mechanism such as an electric cylinder can be arranged outside the laser, so that the height position of the laser can be quickly adjusted, and the cutting area range of the emitting end is expanded, so that the emitting end has the ability to slot along the thickness direction of the crystal.

[0015] In the above-mentioned silicon carbide crystal slotting device, a protective cover is arranged outside the emitting end of the laser, and the protective cover is used to protect the emitting end. It can be understood that by arranging the protective cover outside the laser, especially outside the emitting end, the cutting dust outside is prevented from entering the inside of the laser, thereby prolonging the service life of the laser.

[0016] In the above-mentioned silicon carbide crystal slotting device, the crystal direction detector has a vertical movement degree, so that the detecting end has a tendency towards the bearing area. For example, a vertical linear driving mechanism such as an electric cylinder can also be arranged outside the crystal direction detector, so that the height position of the crystal direction detector can be quickly adjusted, so that it can adaptively detect the crystal direction of crystals of different thicknesses.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] 1. The X-ray diffraction detection of the crystal direction detector is used to detect the crystal direction of the crystal, determine the position to be slotted, and project laser light to the area to be slotted of the crystal by the emitting end of the laser for processing, and finally complete the slotting. The detection accuracy of the crystal direction detector and the cutting accuracy of the laser are better, so that the slotting accuracy of the silicon carbide crystal can be improved;

[0019] 2. The bearing table is rotated, or the crystal direction detector or the laser is rotated, so that the crystal direction position of the crystal can be quickly detected and determined, and the slotting efficiency is improved;

[0020] 3、The application can determine the crystal orientation position by connecting the rotating mechanism with the crystal orientation detector and the laser respectively, and adjusting the position of the rotating mechanism based on the detection data obtained by the crystal orientation detector, and continuously detecting and adjusting, so as to determine the crystal orientation position, and based on the obtained crystal orientation position, the rotating mechanism can drive the carrier to rotate so that the to-be-slotted region is rotated to the projection range of the emission end of the laser, thereby quickly completing the laser cutting and slotting. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a perspective structural schematic diagram of the silicon carbide crystal slotting device embodiment 1 of the application;

[0022] Figure 2 is Figure 1 is a perspective structural schematic diagram of the carrier and the base in the structure shown;

[0023] Figure 3 is a cross-sectional structural schematic diagram of the carrier;

[0024] Figure 4 is a perspective structural schematic diagram of the laser;

[0025] Figure 5 is a perspective structural schematic diagram of the crystal orientation detector;

[0026] Figure 6 is a perspective structural schematic diagram of the silicon carbide crystal slotting device embodiment 2 of the application;

[0027] In the figure, 100, carrier; 110, index plate; 120, rotating mechanism; 130, vacuum adsorption structure; 131, adsorption hole; 132, cavity; 133, vacuum extraction piece; 140, connecting strip; M, carrier area; 200, crystal orientation detector; 210, detection end; 300, laser; 310, emission end; 320, protective cover; 400, base; 410, connecting block. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application will be described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the application. However, the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the application, so the application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0030] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0031] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0033] It is to be understood that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood that, when a term is used in this specification and / or claims - such as "horizontal" or "vertical" or "up" or "down" or like terms - that there are a number of possible orientations to the apparatus described and claimed with respect thereto. As such, "horizontal" can for example mean both horizontal and upright orientations.

[0034] Referring to the drawings Figure 1 and Figure 2 The present application includes a bearing table 100, a crystal direction detector 200 and a laser 300. The bearing table 100 has a bearing area M for bearing a crystal. The crystal direction detector 200 is disposed on one side of the bearing table 100 and has a detection end 210 facing the bearing area M. The laser 300 has an emission end 310 facing the bearing area M.

[0035] For example, the bearing area M can be formed on the upper surface of the bearing table 100, or when the bearing table 100 has the ability to adsorb or stick or mount the crystal, the bearing area M can also be formed on the side surface of the bearing table 100. Taking the bearing area M on the upper surface of the bearing table 100 as an example, the crystal is fixed after being placed on the bearing area M. The crystal direction is detected by X-ray diffraction detection of the crystal direction detector 200, so as to determine the position to be slotted. Then, the laser emitted by the emission end 310 of the laser 300 is projected to the area of the crystal to be slotted for processing, and finally the slotting is completed. Compared with the prior art, the detection accuracy of the crystal direction detector 200 and the cutting accuracy of the laser 300 are better, so as to improve the slotting accuracy of the silicon carbide crystal.

[0036] In some embodiments, the bearing table 100 rotates relative to the crystal direction detector 200 and the laser 300, so that the bearing area M rotates relative to the crystal direction detector 200 and the laser 300. It can be understood that by rotating the bearing table 100 or rotating the crystal direction detector 200 or the laser 300, the crystal direction position of the crystal can be quickly detected and determined, and the slotting efficiency is improved.

[0037] Continuing to refer to Figure 1 In some embodiments, a base table 400 is further included, which is disposed below the bearing table 100 and detachably connected to the bearing table 100. It can be understood that by disposing the base table 400 below the bearing table 100, the working height of the bearing table 100 is provided, and in some working scenarios, the bearing table 100 can adjust the horizontal position relative to the base table 400.

[0038] Referring to Figure 1and Figure 2 In some embodiments, the base 400 is provided with a plurality of connecting blocks 410, and the bottom of the carrier table 100 is provided with a connecting strip 140, which is slidable and coupled with the connecting blocks 410. It can be understood that by providing a plurality of connecting blocks 410 on the base 400, the connecting strip 140 of the carrier table 100 is connected and fixed, preferably by sliding connection or threaded connection, which is convenient for disassembly and separation.

[0039] Referring to Figures 1 to 3 In some embodiments, the carrier table 100 includes a protractor 110 and a rotating mechanism 120. The protractor 110 has a bearing area M formed on one end surface thereof. The rotating mechanism 120 is arranged on the side of the protractor 110 away from the bearing area M, and acts on the protractor 110 to drive the protractor 110 to rotate. It can be understood that by providing a rotatable protractor 110 and a rotating mechanism 120 that can drive the protractor 110 to rotate, it is convenient to cooperate with the crystal direction detector 200 for rapid detection, and the laser 300 can be quickly rotated to the appropriate position for slotting processing. For example, the rotating mechanism 120 is a driving motor, and the output shaft of the driving motor is connected to the center area of the bottom surface of the protractor 110.

[0040] In some embodiments, the rotating mechanism 120 is respectively connected in communication with the crystal direction detector 200 and the laser 300. It can be understood that by connecting the rotating mechanism 120 in communication with the crystal direction detector 200 and the laser 300, the position of the rotating mechanism 120 can be adjusted based on the detection data obtained by the crystal direction detector 200, and the position of the crystal direction can be determined by continuous detection and adjustment. Based on the obtained crystal direction position, the rotating mechanism 120 can drive the area to be slotted of the carrier table 100 to rotate to the projection range of the emission end 310 of the laser 300, so as to quickly complete the laser cutting and slotting.

[0041] Referring to Figure 2 and Figure 3In some embodiments, the index plate 110 is provided with a vacuum adsorption structure 130, which includes an adsorption hole 131, a cavity 132 and a vacuumizing member 133. The adsorption hole 131 is arranged on the index plate 110 and adsorbs the carrier area M. The cavity 132 is formed in the index plate 110 and communicates with the adsorption hole 131. The vacuumizing member 133 communicates with the cavity 132 to act on the cavity 132. It can be understood that the silicon carbide crystal can be quickly fixed or removed by arranging the vacuum adsorption structure 130 on the index plate 110, thereby improving the processing and transportation efficiency. The number of adsorption holes 131 is preferably configured to be multiple, and is preferably uniformly distributed on the upper surface of the index plate 110, thereby providing stable and relatively uniform adsorption force. The vacuumizing member 133 can be a gas pump, which extracts the gas in the cavity 132, so that the surface of the adsorption hole 131 forms a negative pressure adsorption force.

[0042] Referring to Figure 1 and Figure 4 In some embodiments, the laser 300 is provided with a protective cover 320 outside the emitting end 310, which is used to protect the emitting end 310. It can be understood that by arranging the protective cover 320 outside the laser 300, especially outside the emitting end 310, the external cutting dust is prevented from entering the inside of the laser 300, thereby prolonging the service life of the laser 300.

[0043] In some embodiments, the laser 300 has a vertical direction of movement freedom, so that the emitting end 310 has the ability to cut along the vertical direction. For example, a linear driving mechanism in the vertical direction, such as an electric cylinder, can be arranged outside the laser 300, so that the height position of the laser 300 can be quickly adjusted, and the cutting area range of the emitting end 310 is expanded, so that it has the ability to groove along the thickness direction of the crystal.

[0044] In some embodiments, the crystal direction detector 200 has a vertical direction of movement freedom, so that the detection end 210 has a tendency to face the carrier area M. For example, a linear driving mechanism in the vertical direction, such as an electric cylinder, can also be arranged outside the crystal direction detector 200, so that the height position of the crystal direction detector 200 can be quickly adjusted, so that it can adaptively detect the crystal direction of crystals with different thicknesses.

[0045] Advantages:

[0046] The application detects the crystal orientation of the crystal through X-ray diffraction detection of the crystal orientation detector 200, determines the position to be slotted, and projects laser to the region to be slotted of the crystal through the emitting end 310 of the laser 300 for processing, finally completes the slotting, and the detection accuracy of the crystal orientation detector 200 and the cutting accuracy of the laser 300 are better, so that the slotting accuracy of the silicon carbide crystal can be improved; by rotating the bearing table 100 or rotating the crystal orientation detector 200 or the laser 300, the crystal orientation position of the crystal can be quickly detected and determined, and the slotting efficiency is improved; by communicating the rotating mechanism 120 with the crystal orientation detector 200 and the laser 300 respectively, the position of the rotating mechanism 120 can be adjusted based on the detection data obtained by the crystal orientation detector 200, and the position of the crystal orientation is determined by continuous detection and adjustment, and based on the obtained crystal orientation position, the rotating mechanism 120 can drive the bearing table 100 to rotate so that the region to be slotted is rotated to the projection range of the emitting end 310 of the laser 300, so that the laser cutting slotting is quickly completed.

[0047] The specific embodiments described herein are merely illustrative of the application. Various modifications or changes can be made to the described embodiments without departing from the spirit of the application. The modifications or changes are intended to fall within the scope of the application as defined by the appended claims.

Claims

1. A silicon carbide crystal grooving device, characterized in that, The utility model relates to a kind of laser cutting device, including: Bearing table (100), the bearing area (M) for bearing crystal is formed on the bearing table (100); Crystal direction detector (200), the crystal direction detector (200) is set to the bearing table (100) side, and the crystal direction detector (200) has detection end (210), and the detection end (210) is towards the bearing area (M); And Laser (300), the laser (300) has emission end (310), and the emission end (310) is towards the bearing area (M).

2. The silicon carbide crystal slotting apparatus of claim 1, wherein The bearing table (100) is relatively rotated with the crystal direction detector (200), the laser (300), to make the bearing area (M) be relatively rotated with the crystal direction detector (200), the laser (300).

3. The silicon carbide crystal slotting apparatus of claim 2, wherein, The bearing table (100) includes: Index plate (110), one end surface of the index plate (110) is formed with the bearing area (M); Rotary mechanism (120), the rotary mechanism (120) is set to index plate (110) side away from the bearing area (M), and the rotary mechanism (120) acts on the index plate (110) to drive the index plate (110) rotation.

4. The silicon carbide crystal slotting apparatus of claim 3, wherein The rotary mechanism (120) is connected with the crystal direction detector (200), the laser (300) communication respectively.

5. The silicon carbide crystal slotting apparatus of claim 3, wherein Vacuum adsorption structure (130) is equipped on the index plate (110), and the vacuum adsorption structure (130) includes: Adsorption hole (131), the adsorption hole (131) is set to the index plate (110), and the adsorption hole (131) adsorption acts on the bearing area (M); Cavity (132), the cavity (132) is formed in the index plate (110), and the cavity (132) is communicated with the adsorption hole (131);And Vacuumizing part (133), the vacuumizing part (133) is communicated with the cavity (132) to act on the cavity (132).

6. The silicon carbide crystal slotting apparatus of claim 1, wherein, Still include base (400), the base (400) is set to the bearing table (100) below, and the bearing table (100) is detachably connected with the base (400).

7. The silicon carbide crystal slotting apparatus of claim 6, wherein, Multiple connecting blocks (410) are equipped on the base (400), and the bottom of the bearing table (100) is equipped with connecting strip (140), and the connecting strip (140) can be slidably coupled with the connecting block (410).

8. The silicon carbide crystal slotting apparatus of claim 1, wherein, The laser (300) has the freedom of movement in vertical direction, so that the emission end (310) has the ability of cutting along vertical direction.

9. The silicon carbide crystal slotting apparatus of claim 1, wherein, Protective cover (320) is equipped outside the emission end (310) of the laser (300), and the protective cover (320) is used for protecting the emission end (310).

10. The silicon carbide crystal slotting apparatus of claim 1, wherein, The crystal direction detector (200) has the freedom of movement in vertical direction, so that the detection end (210) has the tendency towards the bearing area (M).

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