Plastic packaging mold of electronic component

Abstract

The utility model discloses a plastic package mould for electronic components, which comprises a table board, a fixed block and a lower mould are fixedly connected to the top of the table board, an upper mould is arranged above the lower mould, an electric cylinder is fixedly mounted at the bottom of the table board, and a first sliding plate is fixedly connected between the movable end of the electric cylinder and the upper mould. An injection molding opening is fixedly connected to the top of the upper mold, a sealing gasket is fixedly connected between the inner walls of the injection molding opening, a vertical plate is fixedly connected to the top of the fixing block, an injection molding box is arranged on one side of the vertical plate and located above the upper mold, and a feeding opening is fixedly connected to the top of the injection molding box; the bottom of the injection molding box is fixedly connected with an injection molding head. After the plastic package work of the electronic component is completed, the lifting assembly drives the injection molding box to be far away from the upper mold, and then the electric cylinder drives the upper mold to be far away from the lower mold, so that the electronic component subjected to plastic package molding is quickly demolded, and the plastic package efficiency of the electronic component is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the plastic package process technical field of electronic components, specifically is a plastic package mould of electronic components. BACKGROUND

[0002] The plastic package process of electronic components refers to an important manufacturing process for packaging electronic components, which aims to protect the components from environmental influences, thereby improving their reliability and service life. The plastic package material usually uses polymers such as epoxy resin, which has superior insulation and corrosion resistance, making it an ideal choice for packaging.

[0003] In the existing plastic package process, the plastic package of electronic components usually uses a splicing mold. This mold is composed of multiple splicing parts. Although it has certain flexibility and reusability in actual application, it often takes a lot of time in the demolding process. Due to the complex structure of the mold, the time required for disassembly and assembly increases the production cycle, thereby reducing production efficiency. Especially in mass production, long-term demolding operation directly affects productivity. SUMMARY

[0004] The utility model aims at providing a plastic package mould of electronic components to solve the problems raised in the background.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a plastic package mould of electronic components, comprising a table top, the top of the table top is fixedly connected with a fixed block and a lower mold, the upper part of the lower mold is provided with an upper mold, the bottom of the table top is fixedly installed with an electric cylinder, the movable end of the electric cylinder is fixedly connected with a first sliding plate between the upper mold, the outer side of the first sliding plate is slidingly connected with the table top, the top of the upper mold is fixedly connected with an injection port, the inner wall of the injection port is fixedly connected with a sealing gasket, the top of the fixed block is fixedly connected with a vertical plate, the vertical plate is provided with an injection box on one side and above the upper mold, the top of the injection box is fixedly connected with a feeding port, the bottom of the injection box is fixedly connected with an injection head, one end of the injection head extends to the inside of the injection port, one side of the vertical plate is provided with a lifting assembly, and the lifting assembly is used to move the injection box.

[0006] As a further preferred embodiment of the present technical solution, the lifting assembly comprises a lifting groove, the lifting groove is formed on one side of the vertical plate, a lifting screw is rotatably connected between the inner walls of the lifting groove, the outer side of the lifting screw is threadedly connected with a connecting plate, and one side of the connecting plate is fixedly connected with the injection box.

[0007] As a further preferred of the technical solution, the lower mold is fixedly connected with a second sliding plate on the side far from the first sliding plate and at the bottom of the upper mold, the outer side of the second sliding plate is slidingly connected with the table top, and the end far from the upper mold of the second sliding plate is fixedly connected with a limiting plate.

[0008] As a further preferred of the technical solution, the top of the injection molding box is fixedly installed with a booster and a stirring motor, the output end of the stirring motor extends to the inside of the injection molding box and is fixedly connected with a stirring rod.

[0009] As a further preferred of the technical solution, the outer side of the injection molding box is fixedly installed with an electric heater, the output end of the electric heater extends to the inside of the injection molding box, and the inside of the injection head is fixedly installed with a solenoid valve.

[0010] As a further preferred of the technical solution, the top of the vertical plate is fixedly installed with a lifting motor, the output end of the lifting motor extends to the inside of the lifting groove and is fixedly connected with a lifting screw rod.

[0011] As a further preferred of the technical solution, the top of the upper mold is fixedly installed with a negative pressure device, and the input end of the negative pressure device extends to the inside of the upper mold.

[0012] The utility model provides a kind of plastic package mould of electronic component, with following beneficial effect:

[0013] (1) the utility model after completing the plastic package work of electronic component, by lifting assembly drives injection molding box far from upper mold, then by electric cylinder drives upper mold far from lower mold, so that the electronic component after plastic package forming is quickly demoulded, to improve the plastic package efficiency of electronic component.

[0014] (2) the utility model is driven by stirring motor, and stirring rod is rotated in the inside of injection molding box, so that the injection material that enters the inside of injection molding box is fully stirred, and is continuously heated to injection material by cooperating electric heater, so that it can keep active, avoid solidification by other factors, influence subsequent use. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 it is the three-dimensional structure schematic diagram of the utility model;

[0016] Figure 2 it is the bottom structure schematic diagram of the utility model;

[0017] Figure 3 it is the injection molding box half cut structure schematic diagram of the utility model;

[0018] Figure 4 it is the upper mold connection structure schematic diagram of the utility model;

[0019] In the figure: 1, the table top; 2, fixed block; 3, lower mold; 4, upper mold; 5, injection port; 6, gasket; 7, the first sliding plate; 8, the second sliding plate; 9, the limiting plate; 10, the vertical plate; 11, the lifting groove; 12, the lifting screw; 13, the lifting motor; 14, the connecting plate; 15, the injection box; 16, the electric heater; 17, the injection head; 18, the electromagnetic valve; 19, the stirring motor; 20, the stirring rod; 21, the inlet; 22, the electric cylinder; 23, the negative pressure device; 24, the pressure booster. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model.

[0021] The utility model provides technical scheme: as Figures 1-4 The utility model discloses a plastic package mold for electronic components, which comprises a table top 1, a fixed block 2 and a lower mold 3 fixedly connected to the top of the table top 1, an upper mold 4 arranged above the lower mold 3, an electric cylinder 22 fixedly installed at the bottom of the table top 1, a first sliding plate 7 fixedly connected between the movable end of the electric cylinder 22 and the upper mold 4, the outer side of the first sliding plate 7 being slidingly connected to the table top 1, an injection port 5 fixedly connected to the top of the upper mold 4, a gasket 6 fixedly connected between the inner walls of the injection port 5, a vertical plate 10 fixedly connected to the top of the fixed block 2, an injection box 15 arranged on one side of the vertical plate 10 and above the upper mold 4, an inlet 21 fixedly connected to the top of the injection box 15, an injection head 17 fixedly connected to the bottom of the injection box 15, one end of the injection head 17 extending into the interior of the injection port 5, a lifting assembly arranged on one side of the vertical plate 10, the lifting assembly being used for moving the injection box 15, a second sliding plate 8 fixedly connected to the bottom of the upper mold 4 and away from the first sliding plate 7, the outer side of the second sliding plate 8 being slidingly connected to the table top 1, a limiting plate 9 fixedly connected to the end of the second sliding plate 8 away from the upper mold 4, a pressure booster 24 and a stirring motor 19 fixedly installed at the top of the injection box 15, the output end of the stirring motor 19 extending into the interior of the injection box 15 and being fixedly connected to a stirring rod 20, an electric heater 16 fixedly installed at the outer side of the injection box 15, the output end of the electric heater 16 extending into the interior of the injection box 15, an electromagnetic valve 18 fixedly installed in the interior of the injection head 17, a lifting motor 13 fixedly installed at the top of the vertical plate 10, the output end of the lifting motor 13 extending into the interior of a lifting groove 11 and being fixedly connected to a lifting screw 12.

[0022] In the plastic packaging work of electronic components, first, the electronic component carrier is placed in the inside of the lower mold 3, then the upper mold 4 is driven by the electric cylinder 22 to move to the lower mold 3, so that the upper mold 4 and the lower mold 3 are spliced to form the plastic packaging mold of the electronic component (the mold is made of aluminum alloy material), then the injection box 15 is moved by the lifting assembly, so that the injection head 17 at the bottom end of the injection box 15 extends to the inside of the injection port 5, at this time, the injection material is introduced into the inside of the injection box 15 through the inlet 21, then the stirring motor 19 is started, the stirring motor 19 drives the stirring rod 20 to uniformly stir the injection material in the inside of the injection box 15, at the same time, the electric heater 16 (specifically a silica gel heating pad) is started to heat the injection material in the inside of the injection box 15, so that the injection material remains active and avoids solidification affecting use, finally, the electromagnetic valve 18 is opened to cooperate with the pressure booster 24 (specifically an Aro PB series pneumatic booster pump) to push the injection material in the inside of the injection box 15 to enter the plastic packaging mold through the injection head 17, in the process of injection, the air in the plastic packaging mold is discharged by the negative pressure device 23 (specifically a Rotron series electric vacuum pump), so that the electronic component can complete the corresponding plastic packaging work faster and better.

[0023] After the injection plastic packaging work of the electronic component is completed, first, the injection head 17 is closed by the electromagnetic valve 18, then the injection box 15 is driven away from the upper mold 4 by the lifting assembly again, so that the injection head 17 is separated from the injection port 5, after the injection head 17 is separated, the injection port 5 is sealed by the sealing gasket 6 to avoid external air entering the injection mold, after the electronic component is formed, the upper mold 4 is pushed away from the lower mold 3 by the electric cylinder 22 (the inside of the lower mold 3 and the upper mold 4 is provided with a polytetrafluoroethylene PTFE coating, which can effectively prevent the adhesion between the plastic and the mold, and realize good demolding effect), thereby realizing the demolding work of the electronic component plastic packaging processing, and improving the production efficiency and the production capacity of the electronic component, which facilitates the use of the plastic packaging mold.

[0024] As shown in Figures 1-4 The lifting assembly includes a lifting groove 11, the lifting groove 11 is opened in one side of the vertical plate 10, the inner wall of the lifting groove 11 is rotatably connected with a lifting screw 12, the outer side of the lifting screw 12 is threadedly connected with a connecting plate 14, one side of the connecting plate 14 is fixedly connected with the injection box 15, the top of the vertical plate 10 is fixedly installed with a lifting motor 13, the output end of the lifting motor 13 extends to the inside of the lifting groove 11 and is fixedly connected with the lifting screw 12.

[0025] The lifting screw 12 is driven by the lifting motor 13 to rotate between the inner walls of the lifting groove 11, so that the connecting plate 14 moves on the outer side of the lifting screw 12, so that the injection box 15 moves at the same time, thereby facilitating the injection box 15 to move away from the upper mold 4, and improving the efficiency of the electronic component plastic packaging demolding work.

[0026] The utility model provides a kind of plastic package mould of electronic component, specific working principle is as follows: after completing the injection plastic package work of electronic component, first, injection head 17 is closed using electromagnetic valve 18, then it is rotated between the inner wall of lifting groove 11 by lift motor 13 drive lift screw rod 12, so that connecting plate 14 moves in the outside of lift screw rod 12, so that injection box 15 moves simultaneously and away from upper die 4, so that injection head 17 is separated from injection port 5, after injection head 17 is separated, sealing gasket 6 is used to seal injection port 5, avoid external air to enter injection mould, after electronic component is formed, upper die 4 is pushed away from lower die 3 using electric cylinder 22, to realize the demoulding work of electronic component plastic package processing, and then improve production efficiency and the production capacity of electronic component, facilitate the use of plastic package mould.

[0027] Although the embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A plastic encapsulation mold for electronic components, comprising a table (1), characterized in that: The top of the table (1) is fixedly connected with a fixed block (2) and a lower mold (3), the upper side of the lower mold (3) is provided with an upper mold (4), the bottom of the table (1) is fixedly installed with an electric cylinder (22), the movable end of the electric cylinder (22) is fixedly connected with a first sliding plate (7) between the upper mold (4), the outer side of the first sliding plate (7) is slidably connected with the table (1), the top of the upper mold (4) is fixedly connected with an injection port (5), the inner wall of the injection port (5) is fixedly connected with a sealing gasket (6), the top of the fixed block (2) is fixedly connected with a vertical plate (10), the side of the vertical plate (10) and above the upper mold (4) is provided with an injection box (15), the top of the injection box (15) is fixedly connected with a feeding port (21), the bottom of the injection box (15) is fixedly connected with an injection head (17), one end of the injection head (17) extends to the inside of the injection port (5), one side of the vertical plate (10) is provided with a lifting assembly, and the lifting assembly is used to drive the injection box (15) to move.

2. The plastic encapsulation mold for electronic components according to claim 1, wherein: The lifting assembly comprises a lifting groove (11) which is formed in one side of the vertical plate (10), and a lifting screw (12) is rotatably connected between the inner walls of the lifting groove (11), a connecting plate (14) is threadedly connected to the outer side of the lifting screw (12), and one side of the connecting plate (14) is fixedly connected with the injection box (15).

3. The plastic encapsulation mold for electronic components according to claim 1, wherein: The side, away from the first sliding plate (7) of the lower mold (3) and located at the bottom of the upper mold (4) is fixedly connected with a second sliding plate (8), the outer side of the second sliding plate (8) is slidably connected with the table (1), and one end, away from the upper mold (4) of the second sliding plate (8) is fixedly connected with a limiting plate (9).

4. The plastic encapsulation mold for electronic components according to claim 1, wherein: The top of the injection box (15) is fixedly installed with a booster (24) and a stirring motor (19), the output end of the stirring motor (19) extends to the inside of the injection box (15) and is fixedly connected with a stirring rod (20).

5. The plastic encapsulation mold for electronic components according to claim 1, wherein: The outer side of the injection box (15) is fixedly installed with an electric heater (16), the output end of the electric heater (16) extends to the inside of the injection box (15), and the inside of the injection head (17) is fixedly installed with a solenoid valve (18).

6. The plastic encapsulation mold for electronic components according to claim 2, wherein: The top of the vertical plate (10) is fixedly installed with a lifting motor (13), the output end of the lifting motor (13) extends to the inside of the lifting groove (11) and is fixedly connected with the lifting screw (12).

7. The plastic encapsulation mold for electronic components according to claim 1, wherein: The top of the upper mold (4) is fixedly installed with a negative pressure device (23), and the input end of the negative pressure device (23) extends to the inside of the upper mold (4).

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