TVS tube copper particle annealing treatment device for reducing thermal cycle stress

Abstract

The utility model relates to the technical field of copper particle annealing treatment, in particular to a TVS (Transient Voltage Suppressor) copper particle annealing treatment device for reducing thermal cycle stress, which comprises a copper particle bearing table, a copper particle conveying device, a heating resistance wire, a nitrogen nozzle, a temperature sensor, a partition plate, an adjustable telescopic rod and a control unit. The copper particle processing device has good heat insulation performance and structural stability, the copper particle bearing table is directly used for containing copper particles to be processed, the bottom of the copper particle bearing table is connected with the copper particle conveying device, the copper particle conveying device is composed of grooves provided with round wheels, and the copper particle bearing table is stably conveyed in the whole device through rolling of the round wheels; the copper particle bearing platform can pass through each temperature zone at a uniform speed, meanwhile, the stability of copper particles is ensured, the annealing quality problem caused by vibration or non-uniform movement is avoided, and the reliability and the service life of the TVS tube can be improved and prolonged through multi-stage temperature control and uniform cooling of the copper particles.

Description

TECHNICAL FIELD

[0001] The utility model relates to copper particle annealing treatment technical field especially relates to a kind of TVS pipe copper particle annealing treatment device for reducing thermal cycle stress. BACKGROUND

[0002] Transient voltage suppression diode (TVS pipe) is a kind of semiconductor device commonly used in circuit protection, can effectively absorb transient overvoltage, protect sensitive electronic components from damage. However, in thermal cycle environment test, TVS pipe needs to withstand severe high-low temperature impact, and stress concentration is easy to generate in device interior due to the difference of material thermal expansion coefficient. This stress change can be transmitted to chip through copper particle, causing microstructure instability inside chip, and then leading to the drift or failure of electrical performance parameters.

[0003] The internal structure of TVS pipe is usually composed of soldering sheet, copper particle, chip, lead wire and packaging, wherein copper particle is the key element of heat conduction and mechanical support, and its rigidity directly affects the reliability of chip in TC test. Since the copper particle without annealing treatment has high hardness and rigidity, the rigid extrusion of copper particle on chip will further aggravate the risk of chip failure when temperature changes sharply.

[0004] In order to improve this problem, it is necessary to change the hardness of copper particle through temperature control technology. By precise temperature control, the hardness and rigidity of copper particle are gradually adjusted, so as to effectively alleviate the influence of stress of copper particle in thermal cycle environment on TVS pipe chip. Proper temperature control can make copper particle more ductile in thermal cycle change, reduce the mechanical extrusion force of copper particle on chip, and avoid the failure of chip electrical performance. However, the existing temperature control equipment is often difficult to realize multi-stage temperature control and uniform cooling, resulting in unstable annealing treatment effect, so a high-efficiency and precise temperature control device is urgently needed to improve the reliability and service life of TVS pipe. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of TVS pipe copper particle annealing treatment device for reducing thermal cycle stress to solve the problems raised in the above background.

[0006] In order to solve the above technical problems, the utility model provides the following technical scheme: a kind of TVS pipe copper particle annealing treatment device for reducing thermal cycle stress, including copper particle bearing table, copper particle conveying device, heating resistance wire, nitrogen gas nozzle, temperature sensor, partition plate, adjustable telescopic link and control unit, characterized in that: the copper particle bearing table is directly used to place the copper particle to be treated, and is connected with copper particle conveying device, which can uniformly pass through heating treatment area and each temperature zone by using circular groove.

[0007] According to the above technical scheme, the heating resistance wire has nine groups respectively arranged in heating treatment area and each temperature zone.

[0008] According to the above technical scheme, the nitrogen gas nozzle is five, respectively arranged in the first cooling zone, the second cooling zone, the third cooling zone, the fourth cooling zone and the fourth holding zone.

[0009] According to the above technical scheme, the heating treatment zone heats the copper particles from room temperature to 630 DEG C by heating resistance wire, and the heating time is 30 minutes.

[0010] According to the above technical scheme, the first cooling zone reduces the temperature of the copper particles from 630 DEG C to 380 DEG C by nitrogen gas nozzle, and the cooling time is 30 minutes. After the cooling is finished, the copper particles are transmitted to the first holding zone. The first holding zone maintains 380 DEG C constant temperature by heating resistance wire, and the holding time is 2 hours. After the holding is finished, the copper particles are transmitted to the second cooling zone.

[0011] According to the above technical scheme, the second cooling zone reduces the temperature of the copper particles from 380 DEG C to 250 DEG C by nitrogen gas nozzle, and the cooling time is 30 minutes. After the cooling is finished, the copper particles are transmitted to the second holding zone. The second holding zone maintains 250 DEG C constant temperature by heating resistance wire, and the holding time is 2 hours. After the holding is finished, the copper particles are transmitted to the third cooling zone.

[0012] According to the above technical scheme, the third cooling zone reduces the temperature of the copper particles from 250 DEG C to 120 DEG C by nitrogen gas nozzle, and the cooling time is 30 minutes. After the cooling is finished, the copper particles are transmitted to the third holding zone. The third holding zone maintains 120 DEG C constant temperature by heating resistance wire, and the holding time is 1 hour. After the holding is finished, the copper particles are transmitted to the fourth cooling zone.

[0013] According to the above technical scheme, the fourth cooling zone reduces the temperature of the copper particles from 120 DEG C to 40 DEG C by nitrogen gas nozzle, and the cooling time is 30 minutes. After the cooling is finished, the copper particles are transmitted to the fourth holding zone. The fourth holding zone maintains 40 DEG C constant temperature by heating resistance wire, and the holding time is 1 hour.

[0014] According to the above technical scheme, in the fourth holding zone, the temperature is further reduced from 40 DEG C to room temperature 25 DEG C by nitrogen gas nozzle, and the annealing treatment of the copper particles is completed.

[0015] According to the above technical scheme, the partition plate and the partition plate positioning groove are matched, the adjustable telescopic rod is used for opening and closing action, the heat insulation of the temperature zone and the smooth connection of the transmission operation are ensured, each temperature zone is equipped with a temperature sensor, the temperature is monitored in real time, and the heating resistance wire power, the nitrogen gas regulating valve opening and closing and the action of the transmission device are uniformly managed by the control unit.

[0016] Compared with the prior art, the utility model discloses have reached the beneficial effect is: the utility model discloses, through copper particle bearing platform, copper particle conveying device, heating resistance wire, nitrogen gas nozzle, temperature sensor, partition, adjustable telescopic link and control unit etc. Part composition, whole adopts ceramic material, possesses excellent heat insulation and structural stability, and the device passes through multistage temperature control and nitrogen gas flow regulation, ensures that copper particle is heated and cooling in each temperature zone evenly, to reduce the mechanical stress to TVS tube chip, in each cooling zone, the device passes through nitrogen gas nozzle control cooling rate, ensures the stability of copper particle at each stage temperature, thereby promotes the performance of copper particle and prolongs the service life of TVS tube, the device can effectively improve the precision and efficiency of copper particle annealing process, ensures that copper particle keeps stable in multiple thermal cycles, avoids the failure of chip electric performance, thereby improves the reliability and performance of TVS tube. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute the limitation to the utility model. In the drawings,

[0018] Fig. 1 It is a kind of TVS tube copper particle annealing treatment device for reducing thermal cycle stress that the utility model proposes, and it is plan view;

[0019] Fig. 2 It is a kind of TVS tube copper particle annealing treatment device main body structure that the utility model proposes, and it is plan view;

[0020] Fig. 3 It is a kind of TVS tube copper particle annealing treatment device for reducing thermal cycle stress that the utility model proposes, and it is the structure diagram of hot barrier upper cover plate.

[0021] In the drawing: 1 copper particle bearing platform, 2 heating resistance wire, 3 partition positioning recess, 4 adjustable telescopic link, 5 temperature sensor, 6 nitrogen gas regulating valve, 7 nitrogen gas storage tank, 8 heating treatment area, 9 first cooling zone, 10 first holding zone, 11 second cooling zone, 12 second holding zone, 13 third cooling zone, 14 third holding zone, 15 fourth cooling zone, 16 fourth holding zone, 17 control unit, 18 nitrogen gas nozzle, 19 hot barrier upper cover plate, 20 partition, 21 copper particle conveying device. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0023] Embodiment:

[0024] Referring to Figs. 1-3 A copper particle annealing device for reducing thermal cycle stress of a TVS tube, comprising a copper particle bearing table 1, a copper particle conveying device 21, a heating resistance wire 2, a nitrogen gas nozzle 18, a temperature sensor 5, a partition plate 20, an adjustable telescopic rod 4 and a control unit 17, the device as a whole is mainly made of ceramic material, has good heat insulation performance and structural stability, the copper particle bearing table 1 is directly used for placing copper particles to be treated, the bottom thereof is connected with the copper particle conveying device 21, the copper particle conveying device 21 is composed of grooves provided with round wheels, the stable conveying of the copper particle bearing table 1 in the whole annealing device is realized by the rolling of the round wheels, the copper particle bearing table 1 can pass through various temperature zones at a uniform speed, while the stability of the copper particles is ensured, and the annealing quality problem caused by vibration or uneven movement is avoided, the heating treatment zone 8 is the first functional area of the device, a heat source is provided by the internal heating resistance wire 2, the copper particles are rapidly heated from room temperature to 630 DEG C, the heating process is regulated and controlled by the external control unit 17, the copper particles are uniformly heated to the target temperature within 30 minutes, in addition, the heating resistance wire 2 has nine groups in total, which are respectively placed in various temperature zones,

[0025] After heating is completed, the copper particle bearing table 1 is conveyed to various cooling zones and holding zones, including a first-stage cooling zone 9, a first-stage holding zone 10, a second-stage cooling zone 11, a second-stage holding zone 12, a third-stage cooling zone 13, a third-stage holding zone 14, a fourth-stage cooling zone 15 and a fourth-stage holding zone 16, nitrogen gas is used for cooling in the cooling zones, the nitrogen gas storage tank 7 provides sufficient nitrogen gas, the flow is controlled by the nitrogen gas regulating valve 6, and the nitrogen gas is uniformly sprayed into the cooling zones by the nitrogen gas nozzle 18, so that the temperature is stably lowered, the target temperatures of each stage of cooling are 380 DEG C, 250 DEG C, 120 DEG C and 40 DEG C respectively, the cooling rate is controlled at 30 minutes, after the target cooling is completed in each cooling zone, the internal heating resistance wire is quickly restored to the temperature before cooling, the heat balance of the temperature zone is maintained, the thermal interference of adjacent areas is prevented, the holding zone maintains the set constant temperature state by the heating resistance wire, and the constant temperature treatment is carried out at 380 DEG C, 250 DEG C, 120 DEG C and 40 DEG C for 2 hours or 1 hour respectively, so that the internal structure of the copper particles is gradually stabilized at a specific temperature.

[0026] The entire device is divided into zones by the partition plate 20, which is fixed by fitting into the partition plate positioning groove 3 below and can move in the heat shield upper cover plate 19 above. The partition plate 20 ensures that the heat and nitrogen flow in each temperature zone do not interfere with each other. Two adjustable telescopic rods 4 are arranged at the bottom of each partition plate positioning groove 3. When the copper particle carrying platform 1 needs to enter the next temperature zone, the adjustable telescopic rods 4 will lift the partition plate 20, and then the telescopic rods will return to their original position. The partition plate 20 slowly descends at a speed slower than the carrying platform passing speed.

[0027] Each temperature zone is equipped with a temperature sensor 5 that detects the current temperature data in real time and feeds back to the control unit 17. The control unit 17 adjusts the heating power and nitrogen flow based on the sensor data to ensure that the temperature of each temperature zone meets the set requirements. In addition, the device performs final cooling in the four-stage heat preservation zone 16, and uses the nitrogen gas jet 18 to continue releasing nitrogen gas to further reduce the temperature of the region from 40℃ to room temperature 25℃, completing the annealing process of the copper particles.

[0028] The heat source, transmission, and temperature regulation of the overall device are managed by the control unit 17, including power adjustment of the heating resistance wire, opening and closing control of the nitrogen regulating valve, and action instructions of the telescopic rod. The control unit ensures the automation and precision of the entire annealing process, effectively improving the efficiency and quality of copper particle annealing.

[0029] When using the device, the copper particles to be processed are evenly placed on the copper particle carrying platform 1. The bottom of the carrying platform is connected to the copper particle conveying device 21, which realizes continuous transportation throughout the annealing process. In the initial state, all partition plates 20 are in the closed state to ensure the independence of each temperature zone. The copper particle carrying platform is conveyed to the heating treatment zone 8, which rapidly raises the temperature to 630℃ through the heating resistance wire 2. The heating process is monitored by the control unit 17 to ensure that the target temperature is reached within 30 minutes and that the temperature distribution is uniform. After heating is completed, the control unit instructs the adjustable telescopic rod 4 to lift the partition plate 20, and the copper particle carrying platform 1 enters the first-stage cooling zone 9. In the cooling zone, the nitrogen gas storage tank 7 supplies gas to the nitrogen gas jet 18 through the nitrogen regulating valve 6. The nitrogen gas jet uniformly sprays cold gas flow to rapidly reduce the temperature in the zone. The cooling stage includes the following steps:

[0030] First-stage cooling zone 9: reduce the copper particle temperature from 630℃ to 380℃, the process lasts for 30 minutes.

[0031] First-stage heat preservation zone 10: maintain a constant temperature of 380℃ through the heating resistance wire, and preserve for 2 hours to ensure that the copper particle structure is fully stable.

[0032] Second-stage cooling zone 11: reduce from 380℃ to 250℃, the process lasts for 30 minutes.

[0033] Second-stage heat preservation zone 12: constant temperature of 250℃, preservation for 2 hours.

[0034] The third temperature decreasing zone 13: from 250℃ to 120℃, the process lasts for 30 minutes.

[0035] The third temperature holding zone 14: constant temperature 120℃, holding for 1 hour.

[0036] The fourth temperature decreasing zone 15: from 120℃ to 40℃, the process lasts for 30 minutes.

[0037] The fourth temperature holding zone 16: constant temperature 40℃, holding for 1 hour.

[0038] After the fourth temperature holding, the nitrogen jet 18 further decreases the temperature of the fourth temperature holding zone to normal temperature 25℃, which ensures the temperature of the copper particles to return to the safe range, and provides guarantee for the subsequent operation or storage. After the fourth temperature holding and the final cooling, the copper particles are transmitted out of the device by the conveying device, and the workers unload the copper particles on the carrying table, and the whole annealing process is completed.

[0039] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0040] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A copper particle annealing device for reducing thermal cycle stress of a TVS tube, comprising a copper particle bearing table (1), a copper particle conveying device (21), a heating resistance wire (2), a nitrogen gas nozzle (18), a temperature sensor (5), a partition plate (20), an adjustable telescopic rod (4), and a control unit (17), characterized in that: The copper particle bearing table (1) is directly used for placing the copper particles to be treated, is connected with the copper particle conveying device (21), and can uniformly pass through the heating treatment area (8) and each temperature area by using the circular wheel groove.

2. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 1, characterized in that: The heating resistance wires (2) are nine groups in total and are arranged in the heating treatment area (8) and each temperature area.

3. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 2, characterized in that: The nitrogen gas nozzles (18) are five in total and are arranged in the first-stage cooling area (9), the second-stage cooling area (11), the third-stage cooling area (13), the fourth-stage cooling area (15) and the fourth-stage holding area (16).

4. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 1, characterized in that: The heating treatment area (8) heats the copper particles from normal temperature to 630 DEG C by the heating resistance wires (2), and the heating time is 30 minutes.

5. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 3, characterized in that: The first-stage cooling area (9) reduces the temperature of the copper particles from 630 DEG C to 380 DEG C by the nitrogen gas nozzles (18), the cooling time is 30 minutes, after the cooling is completed, the copper particles are conveyed to the first-stage holding area (10), the first-stage holding area (10) maintains 380 DEG C by the heating resistance wires, the holding time is 2 hours, after the holding is completed, the copper particles are conveyed to the second-stage cooling area (11).

6. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 5, wherein: The second-stage cooling area (11) reduces the temperature of the copper particles from 380 DEG C to 250 DEG C by the nitrogen gas nozzles, the cooling time is 30 minutes, after the cooling is completed, the copper particles are conveyed to the second-stage holding area (12), the second-stage holding area (12) maintains 250 DEG C by the heating resistance wires, the holding time is 2 hours, after the holding is completed, the copper particles are conveyed to the third-stage cooling area (13).

7. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 6, characterized in that: The third-stage cooling area (13) reduces the temperature of the copper particles from 250 DEG C to 120 DEG C by the nitrogen gas nozzles, the cooling time is 30 minutes, after the cooling is completed, the copper particles are conveyed to the third-stage holding area (14), the third-stage holding area (14) maintains 120 DEG C by the heating resistance wires, the holding time is 1 hour, after the holding is completed, the copper particles are conveyed to the fourth-stage cooling area (15).

8. The copper grain annealing device for reducing thermal cycle stress of a TVS tube according to claim 7, characterized in that: The fourth-stage cooling area (15) reduces the temperature of the copper particles from 120 DEG C to 40 DEG C by the nitrogen gas nozzles, the cooling time is 30 minutes, after the cooling is completed, the copper particles are conveyed to the fourth-stage holding area (16), the fourth-stage holding area (16) maintains 40 DEG C by the heating resistance wires, the holding time is 1 hour.

9. The copper grain annealing apparatus for reducing thermal cycle stress of a TVS tube according to claim 8, wherein: In the fourth-stage holding area (16), the temperature is further reduced from 40 DEG C to normal temperature 25 DEG C by the nitrogen gas nozzles, and the annealing treatment of the copper particles is completed.

10. The copper grain annealing apparatus for reducing thermal cycle stress of a TVS tube according to claim 1, wherein: The partition plates (20) are matched with the partition plate positioning grooves (3), the opening and closing actions are realized by the adjustable telescopic rods (4), the heat insulation of the temperature areas and the smooth connection of the conveying operations are ensured, each temperature area is provided with a temperature sensor (5) for real-time monitoring of the temperature, feedback to the control unit (17), and unified management of the heating resistance wire power, the nitrogen gas regulating valve opening and closing and the action of the conveying device by the control unit (17).

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