Alkaline nickel plating system for rolled copper foil production

Abstract

The utility model provides an alkaline nickel plating system. The alkaline nickel plating system comprises a first stirring tank, a second stirring tank and a liquid storage tank, the first stirring tank is used for preparing a nickel solution. The second stirring tank is connected with a first pipeline and a second pipeline, the first pipeline is used for adding the nickel solution into the second stirring tank, the second pipeline is used for adding part of the electroplating liquid in the electroplating bath into the second stirring tank, and the second stirring tank is configured to stir and mix the nickel solution and the electroplating liquid to prepare a first solution. The liquid storage tank is connected with a third pipeline, a fourth pipeline and a fifth pipeline, the third pipeline is used for adding the first solution into the liquid storage tank, and the fourth pipeline is used for adding part of the electroplating liquid in the electroplating bath into the liquid storage tank; the liquid storage tank is configured to mix the first solution and the electroplating liquid to form a second solution, and the second solution is discharged into the electroplating bath through the fifth pipeline. The utility model solves the problem that the existing alkaline nickel plating system cannot balance the blockage of the filtering system and the rising of the liquid level of the liquid storage tank in the nickel supplementing process, and achieves the purpose of reducing the electroplating production cost.

Description

TECHNICAL FIELD

[0001] The utility model relates to calendered copper foil surface treatment equipment technical field, especially a kind of for the alkaline nickel plating system of calendered copper foil production. BACKGROUND

[0002] At present, calendered copper foil is treated by alkaline nickel plating, a layer of nickel plating layer can be deposited on its surface, which enhances the corrosion resistance and oxidation resistance of calendered copper foil, so that it is better applied in flexible copper-clad plate, flexible circuit board, communication, aerospace and other high-tech fields.

[0003] The existing alkaline nickel plating system includes a nickel supplement device and an electroplating device. The nickel supplement device includes a stirring tank, a liquid storage tank and a filtration system. The electroplating device includes an electroplating tank. The filtration system is arranged on a liquid inlet pipe. The liquid storage tank and the electroplating tank are connected by the liquid inlet pipe and a liquid return pipe to circulate the nickel plating solution. The stirring tank is connected with a water inlet pipe. A liquid inlet is arranged on the stirring tank. A stirrer is arranged in the stirring tank. The working process of the alkaline nickel plating system is as follows: water and nickel sulfate are added into the stirring tank through the water inlet pipe and the liquid inlet. After stirring, a nickel solution is obtained. The nickel solution is added into the liquid storage tank through a pipeline. The electroplating solution in the electroplating tank is added into the liquid storage tank through the liquid return pipe. After mixing, the mixture is transported into the electroplating tank through the filtration system and the liquid inlet pipe to maintain the stability of the pH value and the nickel ion concentration of the electroplating solution in the electroplating tank.

[0004] However, the pH value and the concentration of the nickel solution discharged from the stirring tank and the alkaline electroplating solution discharged from the electroplating tank are quite different. After mixing, nickel hydroxide precipitate is immediately generated. The nickel hydroxide precipitate enters the filtration system to cause blockage before it is dissolved. In order to slow down the blockage speed, it is usually necessary to reduce the concentration of nickel sulfate in the nickel solution, which will lead to the supplement of the same amount of nickel and the introduction of more water, causing the liquid level of the liquid storage tank to rise, thereby increasing the electroplating wastewater treatment cost. CONTENT

[0005] In view of the above problems, the utility model is provided to overcome the above problems or at least partially solve the above problems, so as to solve the problem that the existing alkaline nickel plating system cannot balance the blockage of the filtration system and the rise of the liquid level of the liquid storage tank in the nickel supplement process, so as to achieve the purpose of reducing the electroplating production cost.

[0006] To achieve the above purpose, the utility model provides an alkaline nickel plating system, which comprises:

[0007] A first stirring tank is configured to configure a nickel solution.

[0008] a second stirring tank, the second stirring tank is connected with a first pipeline and a second pipeline, the first pipeline is used for adding the nickel solution into the second stirring tank, the second pipeline is used for adding part of the electroplating solution in the electroplating tank into the second stirring tank, and the second stirring tank is configured to stir and mix the nickel solution and the electroplating solution to prepare a first solution;

[0009] a liquid storage tank, the liquid storage tank is connected with a third pipeline, a fourth pipeline and a fifth pipeline, the third pipeline is used for adding the first solution into the liquid storage tank, the fourth pipeline is used for adding part of the electroplating solution in the electroplating tank into the liquid storage tank, and the liquid storage tank is configured to mix the first solution and the electroplating solution to form a second solution, and the second solution is discharged into the electroplating tank through the fifth pipeline.

[0010] Optionally, the first stirring tank is provided with a heating device, the first stirring tank is connected with a water adding pipe, and the first stirring tank is provided with a medicine adding opening.

[0011] Optionally, at least one of the first pipeline, the second pipeline, the third pipeline, the fourth pipeline and the fifth pipeline is provided with a metering pump.

[0012] Optionally, the fifth pipeline is provided with a filtering system.

[0013] Optionally, the first stirring tank is provided with a first stirring device.

[0014] The second stirring tank is provided with a second stirring device.

[0015] Optionally, the liquid storage tank is provided with a third stirring device.

[0016] Optionally, the first stirring device, the second stirring device and the third stirring device are paddle type stirrers or screw type stirrers.

[0017] Optionally, the alkaline nickel plating system further comprises:

[0018] an electroplating tank, the electroplating tank is used for containing an electroplating solution, the electroplating tank has a first outlet and a second outlet, the inlet of the second pipeline is communicated with the first outlet, and the inlet of the fourth pipeline is communicated with the second outlet.

[0019] Optionally, the third pipeline and / or the second pipeline are provided with a filtering bag at the outlet.

[0020] The filtering bag has a multilayer structure, and the filtering pore size of the filtering bag gradually decreases from inside to outside.

[0021] Optionally, the first stirring tank is provided with a first liquid discharge opening.

[0022] The second stirring tank is provided with a second liquid discharge port.

[0023] The alkaline nickel plating system of the utility model discloses, between the first stirring tank and the liquid storage tank, increase the second stirring tank.Nickel solution of high concentration and electroplating solution are primarily mixed and stirred in the first stirring tank, and form the uniform first solution.Because the pH and the reagent concentration difference of the first solution and the electroplating solution are relatively small, can effectively avoid the formation of nickel hydroxide precipitate in the liquid storage tank, so that the uniform second solution can be obtained, greatly relieve the risk of the filter system connected with the liquid storage tank, improve the stability and operating efficiency of the system as a whole.Further, because the nickel solution concentration configured by the first stirring tank is high, the water consumption during the whole nickel supplement process is greatly reduced.Therefore, the embodiment can avoid the liquid level rise of the liquid storage tank, also reduces the electroplating wastewater treatment cost, so that the total electroplating production cost can be reduced, and the production cost of the rolled copper foil can be further reduced.

[0024] The above and other objects, advantages and features of the present utility model will become more apparent from the following detailed description of the preferred embodiments thereof, when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0025] Some specific embodiments of the present utility model will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference signs in the drawings denote the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0026] Figure 1 is a schematic structural diagram of the alkaline nickel plating system according to an embodiment of the present utility model;

[0027] Figure 2 is a schematic structural diagram of the alkaline nickel plating system according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0028] The alkaline nickel plating system for rolled copper foil production of the embodiments of the present utility model will be described below with reference to Figures 1 to 2 In the description of the present embodiment, it should be understood that the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features, that is, one or more of the features. In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and other features can be further included.

[0029] Unless otherwise clearly indicated or implied, the terms "set", "mounted", "connected", "coupled", "fixed", "coupling" and the like should be given their broadest interpretation in accordance with the context in which they are used. For example, they can be fixed connections, or detachable connections, or integral; they can be mechanical, electrical, or both mechanical and electrical; they can be direct connections, or indirect connections through an intermediate medium, or they can be a communication between two elements, or an interaction between two elements, unless otherwise clearly indicated or implied. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0030] In addition, in the description of the present embodiment, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. That is, in the description of the present embodiment, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature "under", "below" or "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0031] In the description of the present embodiment, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] Figure 1 is a schematic structural diagram of the alkaline nickel plating system 100 according to one embodiment of the present application, as shown in Figure 1 and referring to Figure 2The utility model embodiment provides a kind of for calendered copper foil production's alkaline nickel plating system 100 including first agitator 110, second agitator 120 and liquid storage tank 130.First agitator 110 is configured for nickel solution.Second agitator 120 is connected with first pipeline 151 and second pipeline 152, first pipeline 151 is used to add nickel solution into second agitator 120, second pipeline 152 is used to add part of electroplating solution in electroplating bath 140 into second agitator 120, second agitator 120 is configured to stir and mix nickel solution with electroplating solution, and make first solution.Liquid storage tank 130 is connected with third pipeline 153, fourth pipeline 154 and fifth pipeline 155, third pipeline 153 is used to add first solution into liquid storage tank 130, fourth pipeline 154 is used to add part of electroplating solution in electroplating bath 140 into liquid storage tank 130;Liquid storage tank 130 is configured to mix first solution and electroplating solution to form second solution, and second solution is discharged into electroplating bath 140 by fifth pipeline 155.

[0033] The working process of the alkaline nickel plating system 100 in this embodiment is as follows: when it is necessary to supplement nickel ions to the electroplating bath 140, first, configure a high-solubility nickel solution in the first agitator 110. Then, send the nickel solution in the first agitator 110 and part of the electroplating solution in the electroplating bath 140 into the second agitator 120 for preliminary mixing. At this time, nickel hydroxide precipitate will be formed, but under the stirring action of the second agitator 120, the nickel hydroxide precipitate can be dissolved, thereby forming a uniform first solution. Then, send the first solution and another part of the electroplating solution in the electroplating bath 140 into the liquid storage tank 130 for secondary mixing, to form a final second solution. Finally, send the second solution back into the electroplating bath 140, to realize the recycling use and component stability of the electroplating solution, and ensure the continuity and efficiency of the electroplating process.

[0034] In this embodiment, compared with the prior art, the second agitator 120 is added between the first agitator 110 and the liquid storage tank 130. The high-concentration nickel solution and the electroplating solution are preliminarily mixed and stirred in the first agitator 110 to form a uniform first solution. Since the pH and the difference in the concentration of the medicament between the first solution and the electroplating solution are relatively small, the formation of nickel hydroxide precipitate in the liquid storage tank 130 can be effectively avoided, thereby obtaining a uniform second solution, greatly relieving the risk of blockage of the filtration system 160 connected to the liquid storage tank 130, and improving the overall stability and operating efficiency of the system. Further, since the nickel solution configured by the first agitator 110 has a high concentration, the amount of water required in the entire nickel supplementing process can be greatly reduced. Therefore, the liquid level of the liquid storage tank 130 can be prevented from rising, and the electroplating wastewater treatment cost is also reduced, thereby reducing the total electroplating production cost.

[0035] In some optional embodiments of the utility model, the first stirring tank 110 is provided with a heating device, the first stirring tank 110 is connected with a water adding pipe 112, and the first stirring tank 110 is provided with a medicine adding opening. The first stirring tank 110 is provided with a first stirring device 111.

[0036] In the embodiment, the process of configuring the nickel solution in the first stirring tank 110 is as follows: according to the required concentration of the nickel solution, a proper amount of nickel sulfate 200 is added into the first stirring tank 110 through the medicine adding opening, and a proper amount of water is added into the first stirring tank 110 through the water adding pipe 112; then the heating device is started to heat the solution in the first stirring tank 110 to accelerate the solution speed of the nickel sulfate 200 in water; and the first stirring device 111 is started to mix and stir the solution in the first stirring tank 110, so that a uniform nickel solution concentration can be formed.

[0037] The first stirring tank 110 of the embodiment integrates the heating device, the water adding pipe 112, the medicine adding opening and the first stirring device 111, which is beneficial to realize the preparation efficiency and efficient mixing of the nickel solution. The heating device ensures that the solution is prepared in the optimal temperature range, accelerates the dissolution of the nickel sulfate 200, and improves the solution uniformity and purity. The water adding pipe 112 and the medicine adding opening are arranged, so that the operation of the nickel solution is more convenient, and the preparation efficiency can be improved. The first stirring device 111 ensures the rapid and uniform mixing of the solution components.

[0038] Specifically, the heating device can be an electric heating wire, an electric heating rod or a microwave heater, etc.

[0039] As shown in Figs. Figure 1 and Figure 2 In some optional embodiments of the utility model, a metering pump 170 is arranged on the first pipeline.

[0040] The metering pump 170 is additionally arranged on the first pipeline in the embodiment, the metering pump 170 can accurately control the delivery amount of the nickel solution to the second stirring tank 120, so that the mixing ratio of the nickel solution and the electroplating solution in the second stirring tank 120 can reach the optimal state, and the controllability of the electroplating process is enhanced.

[0041] Specifically, the specific position of the metering pump 170 can be selected by the person skilled in the art according to the specific conditions such as installation space. For example, the metering pump 170 can be arranged at the inlet of the first pipeline, or at the outlet of the first pipeline, or at the middle position of the first pipeline.

[0042] In some alternative embodiments of this invention, the inlet of the first pipeline 151 is higher than the outlet of the first pipeline. A valve is provided on the first pipeline 151 to control its connection, disconnection, or opening degree. Further, the bottom of the first stirring tank 110 is higher than the outlet of the first pipeline. In this case, the nickel solution can be transported to the second stirring tank 120 by gravity.

[0043] like Figure 1 and Figure 2 As shown, in some optional embodiments of this utility model, a filtration system 160 is provided on the fifth pipeline 155. The filtration system 160 provided on the fifth pipeline 155 is mainly used to filter suspended impurities, precipitates and tiny particles in the second solution, ensuring the purity and stability of the electroplating solution, thereby improving the quality of the electroplated layer, extending the service life of the electroplating solution, and effectively preventing the electroplating tank 140 of the equipment from becoming clogged, ensuring the smoothness and efficiency of the electroplating process.

[0044] like Figure 1 and Figure 2 As shown, in some optional embodiments of this utility model, a second stirring device 112 is provided inside the second stirring tank 120. The second stirring device 112 can be a paddle mixer or a screw mixer.

[0045] In some optional embodiments of this utility model, the first stirring device 111 can be a paddle mixer or a screw mixer.

[0046] In some optional embodiments of this utility model, a third stirring device is provided inside the storage tank 130. This embodiment, by providing a third stirring device inside the storage tank 130, effectively improves the mixing uniformity of the liquid in the storage tank 130, ensuring the consistency of the second solution composition, thereby guaranteeing the nickel replenishment effect on the electroplating tank 140, which is beneficial to ensuring the stability of the liquid in the electroplating tank 140. Furthermore, the third stirring device can also further prevent the formation of sediment in the second solution, thereby further preventing the risk of clogging of the filtration system 160. The third stirring device can be a paddle-type stirrer or a screw-type stirrer. Preferably, the third stirring device is a paddle-type stirrer.

[0047] like Figure 1 and Figure 2 As shown, in some optional embodiments of this utility model, the paddle stirrer includes a first motor, a first stirring shaft, and paddles, with the paddles mounted on the first stirring shaft. The working principle of the paddle stirrer is that the first motor drives the first stirring shaft to rotate, causing the paddles to exert shearing, pushing, and tumbling effects on the solution, thereby forming a vortex in the container and fully mixing the solution, thus promoting chemical reactions, accelerating dissolution, or achieving homogenization of the solution.

[0048] In some optional embodiments of the utility model, the screw stirrer comprises a second motor, a second stirring shaft and a second helical blade. The helical blade is arranged around the stirring shaft at a specific angle. The working principle of the screw stirrer is that the motor drives the stirring shaft to rotate the helical blade, and through forced convection and shearing action, the solution is lifted from the bottom of the container to the top and is thrown along the axis, realizing efficient mixing and uniform dispersion.

[0049] As Figure 1 and Figure 2 shown, in some optional embodiments of the utility model, the alkaline nickel plating system 100 further comprises an electroplating tank 140. The electroplating tank 140 is used to contain the electroplating solution and carry out nickel plating treatment on the rolled copper foil to form a layer of nickel plating layer on the surface of the rolled copper foil.

[0050] The electroplating tank 140 has a first outlet and a second outlet, the inlet of the second pipeline 152 communicates with the first outlet, and the inlet of the fourth pipeline 154 communicates with the second outlet. The fourth pipeline 154 and the second pipeline 152 are provided with electromagnetic valves for controlling the on-off and opening degree of the two pipelines, so as to facilitate the control of the flow rate and flow of the electroplating solution.

[0051] The first outlet and the second outlet are provided in the embodiment, which facilitates the separate control of the amount and liquid adding speed of the electroplating solution added into the second stirring tank and the liquid storage tank 130.

[0052] As Figure 2 shown, in some optional embodiments of the utility model, a filter bag 180 is sleeved at the outlet of the third pipeline. The filter bag 180 is used to collect impurities, precipitates and the like in the electroplating solution discharged by the third pipeline.

[0053] As Figure 2 shown, in some optional embodiments of the utility model, a filter bag 180 is sleeved at the outlet of the second pipeline. The filter bag 180 is used to collect impurities, precipitates and the like in the electroplating solution discharged by the second pipeline.

[0054] As Figure 2 shown, in some optional embodiments of the utility model, filter bags 180 are sleeved at the outlets of the second pipeline 152 and the third pipeline 153.

[0055] In the above several embodiments, the filter bag 180 can be fixed by a rope, which facilitates the replacement of the filter bag 180.

[0056] In some optional embodiments of the present application, the filter bag 180 is a multi-layer structure, and the filter pore size of the filter bag 180 gradually decreases from inside to outside. For example, the filter pore size of the filter bag 180 from inside to outside is 10 μm, 5 μm, 1 μm, and the filter bag 180 can filter impurities, precipitates and the like above 1 μm in the solution. The present embodiment can efficiently intercept impurities of different sizes layer by layer, improve the filtering precision and efficiency, prolong the service life of the filter bag 180, and ensure that the filtered solution is more pure.

[0057] In some optional embodiments of the present application, the first stirring tank 110 is provided with a first liquid discharge port. Preferably, the first liquid discharge port is arranged at the bottom of the first stirring tank 110. By arranging the first liquid discharge port, after the nickel plating work is completed, the solution in the first stirring tank 110 can flow out through the first liquid discharge port, facilitating the cleaning of the first stirring tank 110 and the collection of the remaining nickel solution.

[0058] In some optional embodiments of the present application, the second stirring tank 120 is provided with a second liquid discharge port. Preferably, the second liquid discharge port is arranged at the bottom of the second stirring tank 120. By arranging the second liquid discharge port, after the nickel plating work is completed, the solution in the second stirring tank 120 can flow out through the second liquid discharge port, facilitating the cleaning of the second stirring tank 120 and the collection of the remaining first solution.

[0059] In some optional embodiments of the present application, the second pipeline 152 is provided with a metering pump.

[0060] In some optional embodiments of the present application, the third pipeline 153 is provided with a metering pump.

[0061] In some optional embodiments of the present application, the fourth pipeline 154 is provided with a metering pump.

[0062] In some optional embodiments of the present application, the fifth pipeline 155 is provided with a metering pump.

[0063] In the above several embodiments, by arranging the metering pump on the second pipeline, the third pipeline, the fourth pipeline and the fifth pipeline, the liquid can be accurately metered and conveyed, so as to facilitate the improvement of the nickel supplement amount and the accurate control of the nickel supplement amount.

[0064] At this point, those skilled in the art should realize that although the present application has been shown and described in detail in the above several exemplary embodiments, many other variants or modifications conforming to the principles of the present application can be directly determined or deduced according to the disclosure of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. An alkaline nickel plating system for the production of rolled copper foil, characterized by, It comprises: a first stirring tank for preparing a nickel solution; a second stirring tank connected with a first pipeline for adding the nickel solution into the second stirring tank and a second pipeline for adding part of electroplating solution in an electroplating tank into the second stirring tank, the second stirring tank being configured to stir and mix the nickel solution and the electroplating solution to form a first solution; a storage tank connected with a third pipeline for adding the first solution into the storage tank, a fourth pipeline for adding part of the electroplating solution in the electroplating tank into the storage tank, and a fifth pipeline for discharging the second solution formed by mixing the first solution and the electroplating solution into the electroplating tank.

2. The alkaline nickel plating system according to claim 1, wherein the first stirring tank is provided with a heating device, a water adding pipe, and a chemical adding port.

3. The alkaline nickel plating system according to claim 1, wherein at least one of the first pipeline, the second pipeline, the third pipeline, the fourth pipeline, and the fifth pipeline is provided with a metering pump.

4. The alkaline nickel plating system according to claim 1, wherein the fifth pipeline is provided with a filtering system.

5. The alkaline nickel plating system according to claim 1, wherein the first stirring tank is provided with a first stirring device, and the second stirring tank is provided with a second stirring device.

6. The alkaline nickel plating system according to claim 5, wherein the storage tank is provided with a third stirring device.

7. The alkaline nickel plating system according to claim 6, wherein the first stirring device, the second stirring device, and the third stirring device are paddle type stirrers or screw type stirrers. It further comprises: an electroplating tank for containing electroplating solution, the electroplating tank having a first outlet and a second outlet, the inlet of the second pipeline being in communication with the first outlet, and the inlet of the fourth pipeline being in communication with the second outlet.

9. The alkaline nickel plating system according to claim 1, wherein the outlet of the third pipeline and / or the second pipeline is sleeved with a filter bag.

10. The alkaline nickel plating system according to claim 1, wherein the first stirring tank is provided with a first discharge port, and the second stirring tank is provided with a second discharge port. ​ ​ ​ 8. The alkaline nickel plating system according to claim 1, wherein ​ ​ ​ ​ ​ ​ ​ ​

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