Heat conduction and storage integrated temperature control device

Abstract

The utility model relates to a heat conduction and storage integrated temperature control device which comprises a shell, a solid-state carbon-based high heat conduction plate is arranged in the shell, a heating unit making contact with the outside of one end of the solid-state carbon-based high heat conduction plate is arranged on the shell, and a hollow filler area of a porous structure is arranged outside the other end of the solid-state carbon-based high heat conduction plate. The hollow filler area is used for filling a phase change material. The solid-state high-thermal-conductivity sheet and the phase-change material are integrally combined, the problems that a traditional heat conduction and heat storage split type structure is large in contact thermal resistance and low in thermal response rate are solved, and the limitation of a heat pipe of a conventional heat conduction structure on the aspects of gravity, acceleration, drying-out, leakage and the like is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat conduction heat storage technical field, especially in heat conduction heat storage integration temperature control device. BACKGROUND

[0002] Phase change heat storage refers to a way of absorbing a large amount of heat when phase change material changes phase. Phase change heat storage technology has the advantages of high heat storage density, stable working performance, small temperature change during phase change process, and simple system, so the temperature control technology based on phase change heat storage is considered as an effective and reliable heat dissipation method. To improve the heat response capability of phase change heat storage, researchers combine heat conduction structure with heat storage structure to improve the temperature control capability of high-power electronic equipment to some extent and improve the reliability and service life of products.

[0003] At present, the existing heat conduction heat storage structure has the following shortcomings: first, the existing traditional heat conduction structure and heat storage structure are assembled in a split type, which increases the contact thermal resistance between the heat conduction structure and the heat storage structure, resulting in large contact thermal resistance and low heat dissipation efficiency of the split type heat conduction and heat storage structure.

[0004] Second, the existing conventional heat pipe type heat conduction structure, such as the existing patent 202010557409.9, discloses a heat conduction heat storage integrated heat control structure and a preparation method. In the patent, the heat conduction structure mainly adopts heat pipe technology, and the heat conduction technology is realized by using capillary wicking and liquid phase change of working medium. However, the product has certain limitations and is not suitable for aerospace application scenarios that require gravity and acceleration. Some phased array radars require temperature control devices to have a thermal shock resistance of ≥30g, so the product is no longer applicable. Moreover, it has poor environmental applicability and risks such as bulging, leakage, and dry-out failure. INVENTION CONTENTS

[0005] In view of the problems in the prior art, the utility model provides a heat conduction heat storage integrated temperature control device.

[0006] The utility model discloses a technical scheme adopted to solve the above technical problems: a heat conduction heat storage integrated temperature control device, comprising a shell, a solid carbon-based high-thermal-conductivity plate is arranged inside the shell, a heating unit is arranged on the shell and in external contact with one end of the solid carbon-based high-thermal-conductivity plate, a hollow filler area with a porous structure is arranged on the other end of the solid carbon-based high-thermal-conductivity plate in external, and the hollow filler area is used for filling phase change material.

[0007] As a preferred scheme, the shell is provided with a pouring hole.

[0008] As a preferred scheme, the shell is provided with a mounting groove for mounting the heating unit.

[0009] As a preferred scheme, the heating unit is a heating chip.

[0010] As a preferred scheme, a plurality of reinforcing sheets are arranged below the mounting groove on the solid carbon-based high-thermal-conductivity plate.

[0011] As a preferred scheme, the solid carbon-based high-thermal-conductivity plate is a graphene plate or an aluminum-diamond composite plate.

[0012] As a preferred scheme, the hollow filler area is formed by high-temperature expansion of expanded graphite.

[0013] As a preferred scheme, the shell and the reinforcing sheets are made of metal materials.

[0014] The application has the following beneficial effects: 1. The solid high-thermal-conductivity sheet is integrated with the phase-change material, thereby solving the problem of large contact thermal resistance and slow thermal response rate of the traditional split structure of heat storage and heat conduction, and avoiding the limitations of the conventional heat pipe structure in terms of gravity, acceleration, dryout, leakage and the like.

[0015] 2. The expanded graphite is arranged at one end of the solid carbon-based high-thermal-conductivity plate, thereby connecting the solid carbon-based high-thermal-conductivity plate and the phase-change material to form a continuous heat conduction path, realizing a new high-efficiency heat conduction and storage integrated temperature control technology, and improving the thermal response rate of the temperature control device. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 FIG. 1 is a structural schematic diagram of the application;

[0017] Figure 2 FIG. 2 is a sectional view of the application; Figure 1

[0018] Figure 3 FIG. 3 is a structural schematic diagram of the solid high-thermal-conductivity sheet of the application;

[0019] Figure 4 FIG. 4 is a structural schematic diagram of the mounting groove of the application.

[0020] Marked in the figure: 1, shell, 11, pouring hole, 12, mounting groove, 13, reinforcing sheet, 2, heating unit, 3, solid carbon-based high-thermal-conductivity plate, 4, hollow filler area. DETAILED DESCRIPTION

[0021] ​In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that, in the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more than two; the directions or position relations indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like are based on the directions or position relations shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0022] Please refer to Figure 1-4 The utility model discloses a heat conduction and heat storage integrated temperature control device, including shell 1, the inside of shell 1 is equipped with solid carbon base high heat conduction plate 3, is equipped with heating unit 2 with the outside contact of one end of solid carbon base high heat conduction plate 3 on shell 1, the outside of the other end of solid carbon base high heat conduction plate 3 is provided with the hollow filler area 4 of porous structure, and the hollow filler area 4 is used for filling phase change material.

[0023] Among them, the shell 1 is equipped with the perfusion hole 11, and the shell 1 is equipped with the mounting groove 12 for installing the heating unit 2, the heating unit 2 is a heating chip, the shell 1 has a base portion and a protruding portion located at the upper end of the base portion, the perfusion hole 11 is arranged on the base portion, the mounting groove 12 is three, and the heating chip is also three, and the mounting groove 12 is arranged on the protruding portion.

[0024] Specifically, the solid carbon base high heat conduction plate 3 is T-shaped and has a horizontal portion and a vertical portion, the protruding portion wraps the horizontal portion, the heating chip contacts the horizontal portion, a plurality of reinforcing sheets 13 are arranged below the mounting groove 12 on the solid carbon base high heat conduction plate 3, the reinforcing sheets 13 are arranged on the vertical portion at intervals, the reinforcing sheets 13 are six, the strength of the solid carbon base high heat conduction plate 3 can be enhanced, and the solid carbon base high heat conduction plate 3 is a graphene plate or an aluminum diamond composite plate. It should be noted that the parts not described in the application are prior art.

[0025] The shell 1 and the reinforcing sheet 13 adopt a metal material with high thermal conductivity, the protruding portion and the solid carbon base high heat conduction plate 3 are connected and combined through a welding process to obtain a carbon-based material-metal solid heat conduction structure, and in order to reduce the thermal resistance between the heating chip and the carbon-based material-metal solid heat conduction structure, the mounting groove 12 is arranged on the shell 1, the heating chip directly contacts the solid carbon base high heat conduction plate 3, the carbon-based material-metal solid heat conduction structure and the base portion are welded into an integrated structure, and the thermal resistance is reduced.

[0026] In addition, the hollow filler area 4 is formed by expanding the expanded graphite at high temperature, and the shell 1 and the reinforcing sheet 13 are both made of metal materials.

[0027] The application integrates the solid high-thermal-conductivity sheet and the phase change material, solves the large contact thermal resistance and slow thermal response rate of the traditional heat conduction and heat storage split structure, and avoids the limitations of the conventional heat conduction structure heat pipe in terms of gravity, acceleration, dry burning, leakage and the like.

[0028] The expanded graphite is arranged at one end of the solid carbon-based heat conduction plate, connects the solid carbon-based heat conduction plate and the phase change material, forms a continuous heat conduction path, realizes the high-efficiency heat conduction and heat storage integrated temperature control new technology, and improves the thermal response rate of the temperature control device.

[0029] In order to improve the thermal conductivity of the phase change material and reduce the contact thermal resistance between the phase change material and the solid carbon-based high-thermal-conductivity plate 3, the preparation and filling of the composite phase change material are completed through the following steps.

[0030] Step one: a certain amount of expandable graphite is injected into the shell 1 through the filling hole 11;

[0031] Step two: the shell body containing the expandable graphite is placed in a high-temperature environment to ensure sufficient heat preservation time to make the expandable graphite in the shell body fully expand and fill the entire cavity to form a heat conduction framework with a porous structure; wherein the temperature of the high-temperature environment should not be higher than the melting point temperature of the shell 1;

[0032] Step three: the phase change material is heated to completely melt into a liquid state, and then the shell 1 is vacuumized, and the liquid phase change material is filled by means of external pressure. Before filling, the shell 1 is heated to ensure that the temperature of the shell 1 and the internal expanded graphite is not lower than the temperature of the liquid phase change material, so that the heat of the liquid phase change material is not absorbed by the expanded graphite during the filling process. The expanded graphite and the liquid phase change material in the shell body can be fully and uniformly mixed to form a composite phase change material by using vibration, stirring, ultrasonic wave and the like. The mass fraction of the expanded graphite is about 0.1% to 15%, and the phase change material can be an organic phase change material and an inorganic phase change material.

[0033] Step four: the filling hole 11 is sealed to obtain the heat conduction and heat storage integrated temperature control device.

[0034] The application first constructs the expanded graphite high-thermal-conductivity framework and then fills the phase change material, which not only solves the problems of low thermal conductivity of the conventional phase change material and high risk of solid-liquid phase change leakage, but also solves the problem of large contact thermal resistance between the composite phase change material and the heat conduction structure or the shell body.

[0035] It should be noted that the above embodiments are only used to illustrate the present application, but the present application is not limited to the above embodiments, any simple modification, equivalent change and modification according to the technical essence of the present application to the above embodiments are all within the protection scope of the present application.

Claims

1. A heat-conducting heat-storage integrated temperature control device, characterized in that, The application relates to a high-thermal-conductivity plate with a solid carbon base, which comprises a shell (1), a solid carbon base high-thermal-conductivity plate (3) arranged in the shell (1), a heating unit (2) arranged on the shell (1) and in contact with one end of the solid carbon base high-thermal-conductivity plate (3), and a hollow filler area (4) with a porous structure arranged on the other end of the solid carbon base high-thermal-conductivity plate (3) and used for filling a phase change material. 2.The heat-conducting and heat-storing integrated temperature control device according to claim 1, characterized in that: The shell (1) is provided with a pouring hole (11). 3.The heat-conducting and heat-storing integrated temperature control device according to claim 1, characterized in that: The shell (1) is provided with a mounting groove (12) for mounting the heating unit (2).

4. The heat-conducting and heat-storing integrated temperature control device according to claim 3, characterized in that: The heating unit (2) is a heating chip.

5. The heat-conducting heat-storing integrated temperature control device according to claim 4, characterized in that: A plurality of reinforcing sheets (13) are arranged below the mounting groove (12) on the solid carbon base high-thermal-conductivity plate (3). 6.The heat-conducting and heat-storing integrated temperature control device according to claim 1, characterized in that: The solid carbon base high-thermal-conductivity plate (3) is a graphene plate or an aluminum-diamond composite plate. 7.The heat-conducting and heat-storing integrated temperature control device according to claim 1, characterized in that: The hollow filler area (4) is formed by high-temperature expansion of expanded graphite. 8.The heat-conducting and heat-storing integrated temperature control device according to claim 5, characterized in that: The shell (1) and the reinforcing sheets (13) are made of metal materials.

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