Thermal management device of high-density PCB (Printed Circuit Board)
By combining the design of heat dissipation base, heat conduction pillar, heat dissipation fin assembly, clamping and fixing frame and elastic pressing assembly, the problems of insufficient hot spot contact and uneven pressure in high-density PCB board thermal management devices are solved, achieving efficient heat transfer and dissipation and extending the service life of electronic components.
Patent Information
- Application Number
- CN202520398133.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-07
AI Technical Summary
Existing thermal management devices for high-density PCBs lack effective direct-contact heat dissipation mechanisms for hot spots and stable contact methods with adjustable pressure, leading to heat accumulation and aging failure of electronic components.
The design employs a combination of a heat sink base, heat conduction pillars, heat sink fin assemblies, clamping brackets, and elastic clamping components to form an efficient heat transfer path. The heat conduction pillars directly contact the hot spots on the PCB board, the heat sink fin assemblies increase the heat dissipation area, the clamping brackets ensure stable installation, and the elastic clamping components provide continuous pressure.
It achieves efficient heat transfer and dissipation, extends the service life of electronic components, and improves system stability and reliability.
Smart Images
Figure CN223859323U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of high-density PCB technology, and more specifically, relates to a thermal management device for high-density PCBs. Background Technology
[0002] With the miniaturization and high integration of electronic devices, high-density PCBs have been widely used in communication equipment, computers, medical devices, and avionics. These high-density PCBs integrate a large number of electronic components, and the heat generated under high load conditions increases rapidly, leading to a significant rise in localized temperatures. Studies show that for every 10°C increase in the temperature of electronic components, their lifespan is shortened by approximately 50%. Therefore, effective thermal management is crucial for ensuring the performance and extending the lifespan of electronic devices. Commonly used PCB heat dissipation methods in existing technologies mainly include natural heat dissipation, air cooling, and liquid cooling. Natural heat dissipation relies on heat sinks and fins to increase the heat dissipation area, but its heat dissipation efficiency is low and it is difficult to meet the requirements of high heat flux density. Air cooling, while more efficient, requires additional fans, increasing system size and energy consumption, and generating noise. Liquid cooling is highly effective, but the system is complex, carries the risk of liquid leakage, and has high maintenance costs. Furthermore, existing heat dissipation devices generally suffer from insufficient contact with hot areas of the PCB, uneven pressure, inability to adapt to minor surface irregularities of the PCB, and inconvenient installation and fixation. Especially for high-density PCBs with concentrated hot spots, traditional heat dissipation methods struggle to achieve precise thermal management, leading to excessively high local temperatures and accelerated aging and failure of electronic components. Currently, there is a lack of a universal thermal management device on the market that can simultaneously meet the requirements of efficient heat dissipation, convenient installation, stable reliability, and applicability to various high-density PCBs. Utility Model Content
[0003] In view of this, the present invention provides a thermal management device for high-density PCB boards, which can solve the problem that existing high-density PCB board thermal management devices lack an effective direct contact heat dissipation mechanism for hot spots and a stable contact method with adjustable pressure, and cannot achieve efficient heat transfer and dissipation while ensuring the safety of the PCB board, thereby affecting the performance and service life of electronic components.
[0004] This utility model is implemented as follows:
[0005] This utility model provides a thermal management device for a high-density PCB board, comprising: a heat dissipation base, heat-conducting pillars, heat dissipation fin assemblies, a clamping and fixing frame, and an elastic pressing assembly; the heat dissipation base is rectangular flat, with a groove in the central area of its upper surface; a heat-conducting pillar is disposed within the groove, the heat-conducting pillar being cylindrical, its bottom tightly fitting the bottom surface of the groove; the top of the heat-conducting pillar passes through the upper surface of the heat dissipation base and extends upward; the heat dissipation fin assembly is sleeved on the outside of the heat-conducting pillar, the heat dissipation fin assembly comprising multiple layers of annular heat dissipation fins, the inner hole of each annular heat dissipation fin being interference-fitted with the outer wall of the heat-conducting pillar; the clamping and fixing frame is installed around the upper surface of the heat dissipation base for clamping and fixing the PCB board, so that the hot spot area of the PCB board contacts the top of the heat-conducting pillar; the elastic pressing assembly is installed on the clamping and fixing frame for applying upward pressure to the PCB board, ensuring that the hot spot area of the PCB board is in close contact with the top of the heat-conducting pillar.
[0006] The technical advantages of the thermal management device for high-density PCBs provided by this utility model are as follows: Through the synergistic action of the heat dissipation base, heat-conducting pillars, heat dissipation fin assemblies, clamping and fixing brackets, and elastic clamping components, a complete heat transfer path and heat dissipation system are formed. The heat-conducting pillars directly contact the hot spots of the PCB board, quickly absorbing heat; the heat dissipation fin assemblies increase the heat dissipation area, accelerating the dissipation of heat to the environment; the clamping and fixing brackets ensure the stable positioning of the PCB board; and the elastic clamping components provide continuous and stable pressure, ensuring close contact between the heat-conducting pillars and the hot spots of the PCB board, maximizing heat conduction efficiency. This effectively solves the problem of heat accumulation generated by high-density PCBs during operation, extends the lifespan of electronic components, and improves system stability.
[0007] Based on the above technical solution, the thermal management device for a high-density PCB board of this utility model can be further improved as follows:
[0008] The heat-conducting column is a stepped cylinder, including a lower large-diameter section and an upper small-diameter section. The lower large-diameter section is embedded in the groove of the heat sink base and fits tightly with the inner wall of the groove. The upper small-diameter section passes through the upper surface of the heat sink base and extends upward. The heat dissipation fin assembly is sleeved on the outside of the upper small-diameter section of the heat-conducting column. The top of the heat-conducting column is a chamfered spherical crown shape to increase the contact area with the PCB board.
[0009] The beneficial effects of adopting the above-mentioned improved scheme are as follows: The stepped design of the heat-conducting pillar structure enhances heat conduction performance and structural stability. The lower large-diameter section is embedded in the groove and fits tightly with the inner wall of the groove, increasing the contact area and improving heat conduction efficiency; the upper small-diameter section extends through the heat sink base, facilitating the assembly of the heat sink fins. The chamfered spherical crown design at the top of the heat-conducting pillar increases the contact area with the PCB board and reduces stress concentration, preventing PCB board damage. It also adapts to minor unevenness on the PCB board surface, ensuring optimal contact under elastic pressure and significantly improving heat conduction efficiency.
[0010] Furthermore, the heat dissipation fin assembly includes fifteen layers of annular heat dissipation fins, each layer of annular heat dissipation fins is radially arranged, extending outward from the center; gaps are provided between adjacent layers of annular heat dissipation fins for air circulation; the thickness of each layer of annular heat dissipation fins is 0.5 mm to 1.5 mm; the outer edge of the annular heat dissipation fins is wavy to increase the heat dissipation area; the annular heat dissipation fins are made of aluminum alloy material.
[0011] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the heat dissipation fin assembly composed of fifteen layers of radial annular heat dissipation fins greatly increases the heat dissipation surface area. The gaps between each layer of fins form airflow channels, promoting natural convection heat dissipation; the fin thickness of 0.5-1.5 mm reduces weight while ensuring strength; the wavy outer edge design further increases the heat dissipation area, breaks the boundary layer, and promotes heat exchange; the aluminum alloy material combines good thermal conductivity, lightweight, and cost-effectiveness. This carefully designed heat dissipation fin assembly can efficiently dissipate the heat absorbed by the heat-conducting column into the air, significantly improving the heat dissipation efficiency of the entire device.
[0012] Furthermore, the clamping and fixing frame includes four uprights and four crossbeams; the four uprights are respectively fixed at the four corners of the heat dissipation base, and each upright has an internal thread at its top; the four crossbeams are respectively connected to the tops of two adjacent uprights to form a rectangular frame structure; the inner side of the crossbeams is provided with flanges for limiting and fixing the edge of the PCB board; the distance between the upper surface of the heat dissipation base and the flanges is adapted to the thickness of the PCB board.
[0013] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the clamping and fixing frame composed of four uprights and four crossbeams forms a robust and stable support structure. The four-corner upright layout provides balanced support force, ensuring the stable installation of the PCB board; the inner flange of the crossbeam precisely limits and fixes the edge of the PCB board to prevent displacement; the distance between the upper surface of the heat sink base and the flange is adapted to the thickness of the PCB board, ensuring that the PCB board is accurately positioned so that the hot spot area is exactly in contact with the top of the heat conduction pillar. This structural design not only provides stable and reliable mechanical support, but also ensures the precise positioning of the PCB board, providing ideal contact conditions for heat conduction, while facilitating installation, disassembly, and maintenance.
[0014] Furthermore, the elastic clamping assembly includes a clamping plate and four elastic supports; the clamping plate is rectangular with a through hole in the central area, the diameter of which is larger than the external dimensions of the electronic components on the PCB board; the clamping plate has through holes at its four corners for connecting the elastic supports; the elastic supports are spring sleeve structures, with their bottoms fixedly connected to the clamping plate and their tops fixed to the top of the column via threaded connections; the elastic supports have compression springs inside for providing upward elastic pressure.
[0015] The beneficial effects of the above-mentioned improved design are as follows: the elastic clamping assembly achieves uniform clamping of the PCB board through the clamping plate and four elastic supports. The central through-hole of the clamping plate avoids electronic components on the PCB board to prevent damage; the four corner through-holes connect to the elastic supports to achieve balanced pressure at four points; the spring sleeve structure of the elastic supports provides adjustable continuous pressure; the internal compression spring can adapt to minor displacements caused by temperature changes and mechanical vibrations, always maintaining close contact between the hot spots on the PCB board and the top of the heat-conducting pillars. This design ensures efficient heat conduction while avoiding damage to the PCB board that may be caused by excessive pressure, achieving a balanced, continuous, stable, safe, and reliable clamping effect.
[0016] Furthermore, the bottom of the heat dissipation base is provided with multiple heat dissipation feet, which are cylindrical and have an extended disc at the bottom; the heat dissipation feet are arranged in a matrix at the bottom of the heat dissipation base to increase the contact area between the heat dissipation base and the outside world; the heat dissipation feet and the heat dissipation base are integrally formed; the heat dissipation base and the heat dissipation feet are made of copper.
[0017] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the multiple heat dissipation feet at the bottom of the heat dissipation base significantly enhance the overall heat dissipation performance. The extended disks at the bottom of the cylindrical feet increase the contact area with the mounting surface; the matrix-arranged foot structure forms airflow channels, promoting convection heat dissipation; the one-piece molding design eliminates thermal contact resistance and improves heat conduction efficiency; the high thermal conductivity of copper ensures that heat is quickly transferred from the heat dissipation base to the heat dissipation feet and dissipated into the environment. This design not only enhances the heat dissipation capacity of the heat dissipation base but also improves the stability and support capacity of the entire device, making the heat dissipation effect more significant, while reducing the thermal resistance of the device and accelerating the heat dissipation process.
[0018] Furthermore, thermal grease is filled between the heat-conducting pillar and the groove of the heat dissipation base; the heat-conducting pillar is made of pure copper; the top spherical crown-shaped surface of the heat-conducting pillar is plated with a layer of silver with a thickness of 0.05 mm to 0.1 mm; the height of the heat-conducting pillar is 1.5 to 2 times the thickness of the PCB board.
[0019] The beneficial effects of the above-mentioned improvement scheme are as follows: the thermal grease filling the gap between the heat-conducting pillar and the groove of the heat sink eliminates tiny gaps and reduces contact thermal resistance; the pure copper heat-conducting pillar has extremely high thermal conductivity, ensuring rapid heat transfer; the silver plating on the top spherical crown further improves the thermal conductivity of the contact surface with the PCB board, as silver has the highest thermal conductivity among metals; the 0.05-0.1 mm silver layer thickness strikes a balance between economy and thermal conductivity; the heat-conducting pillar height of 1.5-2 times the thickness of the PCB board ensures sufficient heat transfer path and installation space for the heat sink fins. These design details work together to maximize heat conduction efficiency and accelerate the transfer of heat from hot spots on the PCB board to the heat dissipation system.
[0020] Furthermore, the upper surface of the heat sink base is provided with multiple anti-slip bumps in an annular area 5 mm to 10 mm away from the edge of the groove; the anti-slip bumps are hemispherical and have a height of 0.3 mm to 0.8 mm; the anti-slip bumps are evenly distributed along the annulus and there are twenty-four of them; the anti-slip bumps are used to increase the friction between the PCB board and the heat sink base and prevent the PCB board from sliding in the horizontal direction.
[0021] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the anti-slip bump design in the annular area on the upper surface of the heat sink effectively improves the stability of PCB board installation. The hemispherical bumps provide point contact, increasing friction without affecting heat dissipation; the moderate height of 0.3-0.8 mm ensures sufficient friction without causing PCB board deformation; the twenty-four evenly distributed bumps provide all-round anti-slip protection; the placement of the bumps 5-10 mm from the edge of the groove avoids critical areas of the PCB board and does not affect the layout of electronic components. This design effectively prevents the PCB board from sliding relative to each other in the horizontal direction due to vibration or temperature changes, maintains precise alignment between hot spots and heat conduction pillars, and ensures continuous and stable heat conduction.
[0022] Furthermore, the column is a hollow tubular structure with a through cavity inside; a hexagonal inner cavity is provided below the internal thread at the top of the column for installing a torque wrench; the outer wall of the column is provided with heat dissipation ribs, which extend along the axial direction of the column and are distributed in a spiral shape; the column is made of aluminum alloy material.
[0023] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the hollow tubular column structure reduces the overall weight while maintaining sufficient strength. The internal through cavity facilitates the passage of wiring or fasteners; the hexagonal inner cavity at the top allows for precise control of the tightening force using a torque wrench; the spiral heat dissipation fins on the outer wall increase the surface area, improving heat dissipation while also enhancing structural strength; the aluminum alloy material combines lightweight, high strength, and good thermal conductivity. This column design not only meets the functional requirements of supporting and fixing the PCB board, but also achieves multi-functional integration through ingenious structural design, improving heat dissipation performance, facilitating installation and adjustment, while maintaining the overall structural lightness and strength requirements.
[0024] Furthermore, the upper surface of the clamping plate is provided with a cross-shaped reinforcing rib, the height of which is 0.5 times the thickness of the clamping plate; the edge of the clamping plate is chamfered at a chamfer angle of 45 degrees; the inner wall of the through hole at the four corners of the clamping plate is provided with annular grooves for accommodating sealing rings; the clamping plate is made of polycarbonate material; the thickness of the clamping plate is 3 mm to 5 mm; the edge of the central through hole of the clamping plate is provided with an arc transition with a radius of 1.5 mm to 2 mm.
[0025] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the structural design of the clamping plate takes into account the requirements of strength, weight, and functionality. Cross-shaped reinforcing ribs enhance rigidity and prevent deformation; chamfered edges avoid scratches from sharp corners, improving safety; the annular groove on the inner wall of the through-hole matches the sealing ring, providing dust and moisture protection; polycarbonate material has high strength, low weight, and good insulation; the 3-5 mm plate thickness achieves a balance between strength and lightweight; the rounded transition at the edge of the central through-hole reduces stress concentration and improves service life. This comprehensive design enables the clamping plate to provide stable pressure while possessing the characteristics of safety, reliability, durability, protection, and aesthetic appeal, meeting the diverse thermal management needs of high-density PCB boards.
[0026] Compared with the prior art, the beneficial effects of the thermal management device for high-density PCB boards provided by this utility model are:
[0027] Through the rational coordination of a heat dissipation base, heat-conducting pillars, heat dissipation fin assemblies, clamping and fixing brackets, and elastic clamping components, a complete and efficient thermal management system is constructed, achieving precise heat dissipation of hot spots on high-density PCB boards. The heat-conducting pillars directly contact the hot spots on the PCB board, forming an efficient heat transfer channel. The use of pure copper material and a top silver plating significantly improves thermal conductivity. The multi-layered radial design of the heat dissipation fin assembly greatly increases the heat dissipation area. The clamping and fixing brackets ensure precise positioning of the PCB board. The elastic clamping components provide adjustable and balanced pressure to ensure stable contact. The stepped heat-conducting pillars and chamfered spherical cap design increase the contact area and reduce thermal resistance. The heat dissipation feet at the bottom of the heat dissipation base enhance the overall heat dissipation capacity. Anti-slip protrusions prevent the PCB board from sliding horizontally. The hollow pillars and lightweight clamping plates balance strength and functionality. The entire device not only solves the heat dissipation problem of hot spots on high-density PCB boards but also possesses comprehensive advantages such as convenient installation, adjustable pressure, structural stability, and optimized materials. It effectively extends the service life of electronic components, improves system stability and reliability, and provides an innovative solution for the thermal management of high-density electronic equipment. Attached Figure Description
[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0029] Figure 1 This is a schematic diagram of a thermal management device for a high-density PCB board.
[0030] The attached diagram lists the components represented by each number as follows:
[0031] 10. Heat sink base; 20. Heat conduction pillar; 30. Heat sink fin assembly; 40. Clamping bracket; 50. Elastic clamping assembly. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.
[0033] like Figure 1The illustration shows an embodiment of a thermal management device for a high-density PCB board provided by this utility model. In this embodiment, it includes: a heat dissipation base 10, heat-conducting pillars 20, a heat dissipation fin assembly 30, a clamping and fixing frame 40, and an elastic pressing assembly 50. The heat dissipation base is a rectangular flat plate with a groove in the central area of its upper surface. A heat-conducting pillar, cylindrical in shape, is disposed within the groove, its bottom tightly fitting the bottom surface of the groove. The top of the heat-conducting pillar passes through the upper surface of the heat dissipation base and extends upwards. The heat dissipation fin assembly is sleeved on the outside of the heat-conducting pillar, and includes multiple layers of annular heat dissipation fins, with the inner hole of each annular heat dissipation fin interlocking with the outer wall of the heat-conducting pillar. The clamping and fixing frame is installed around the upper surface of the heat dissipation base to clamp and fix the PCB board, ensuring that the hot spot area of the PCB board contacts the top of the heat-conducting pillar. The elastic pressing assembly is installed on the clamping and fixing frame to apply upward pressure to the PCB board, ensuring that the hot spot area of the PCB board is in close contact with the top of the heat-conducting pillar.
[0034] In the above technical solution, the heat-conducting column is a stepped cylinder, including a lower large-diameter section and an upper small-diameter section; the lower large-diameter section is embedded in the groove of the heat sink base and fits tightly with the inner wall of the groove; the upper small-diameter section passes through the upper surface of the heat sink base and extends upward; the heat dissipation fin assembly is sleeved on the outside of the upper small-diameter section of the heat-conducting column; the top of the heat-conducting column is a chamfered spherical crown shape to increase the contact area with the PCB board.
[0035] Furthermore, in the above technical solution, the heat dissipation fin assembly includes fifteen layers of annular heat dissipation fins, each layer of annular heat dissipation fins is radial, extending outward from the center; gaps are provided between adjacent layers of annular heat dissipation fins for air circulation; the thickness of each layer of annular heat dissipation fins is 0.5 mm to 1.5 mm; the outer edge of the annular heat dissipation fins is wavy to increase the heat dissipation area; the annular heat dissipation fins are made of aluminum alloy material.
[0036] Furthermore, in the above technical solution, the clamping and fixing frame includes four uprights and four crossbeams; the four uprights are respectively fixed at the four corners of the heat dissipation base, and each upright has an internal thread at its top; the four crossbeams are respectively connected to the tops of two adjacent uprights to form a rectangular frame structure; the inner side of the crossbeams is provided with flanges for limiting and fixing the edge of the PCB board; the distance between the upper surface of the heat dissipation base and the flanges is adapted to the thickness of the PCB board.
[0037] Furthermore, in the above technical solution, the elastic clamping assembly includes a clamping plate and four elastic supports; the clamping plate is rectangular, with a through hole in the central area, the diameter of which is larger than the external dimensions of the electronic components on the PCB board; the clamping plate has through holes at its four corners for connecting the elastic supports; the elastic supports are spring sleeve structures, with their bottoms fixedly connected to the clamping plate and their tops fixed to the top of the column via threaded connections; the elastic supports have compression springs inside for providing upward elastic pressure.
[0038] Furthermore, in the above technical solution, the bottom of the heat dissipation base is provided with multiple heat dissipation feet, which are cylindrical and have an extended disc at the bottom; the heat dissipation feet are arranged in a matrix at the bottom of the heat dissipation base to increase the contact area between the heat dissipation base and the outside world; the heat dissipation feet and the heat dissipation base are integrally formed; the heat dissipation base and the heat dissipation feet are made of copper material.
[0039] Furthermore, in the above technical solution, thermal grease is filled between the heat-conducting pillar and the groove of the heat sink base; the heat-conducting pillar is made of pure copper; the top of the heat-conducting pillar has a spherical crown-shaped surface plated with a layer of silver with a thickness of 0.05 mm to 0.1 mm; the height of the heat-conducting pillar is 1.5 to 2 times the thickness of the PCB board.
[0040] Furthermore, in the above technical solution, the upper surface of the heat sink base is provided with multiple anti-slip bumps in an annular area 5 mm to 10 mm away from the edge of the groove; the anti-slip bumps are hemispherical and have a height of 0.3 mm to 0.8 mm; the anti-slip bumps are evenly distributed along the annulus and there are twenty-four of them; the anti-slip bumps are used to increase the friction between the PCB board and the heat sink base and prevent the PCB board from sliding in the horizontal direction.
[0041] Furthermore, in the above technical solution, the column is a hollow tubular structure with a through cavity inside; a hexagonal inner cavity is provided below the internal thread at the top of the column for installing a torque wrench; the outer wall of the column is provided with heat dissipation ribs, which extend along the axial direction of the column and are distributed in a spiral shape; the column is made of aluminum alloy material.
[0042] Furthermore, in the above technical solution, the upper surface of the clamping plate is provided with a cross-shaped reinforcing rib, the height of which is 0.5 times the thickness of the clamping plate; the edge of the clamping plate is chamfered with a chamfer angle of 45 degrees; the inner wall of the through hole at the four corners of the clamping plate is provided with annular grooves to accommodate the sealing ring; the clamping plate is made of polycarbonate material; the thickness of the clamping plate is 3 mm to 5 mm; the edge of the central through hole of the clamping plate is provided with an arc transition with an arc radius of 1.5 mm to 2 mm.
[0043] Specifically, the principle of this utility model is as follows: First, select a suitable high-density PCB thermal management device based on the PCB size and hotspot distribution. Before use, check the heat sink base, heat conduction pillars, heat sink fin assembly, clamping bracket, and elastic clamping assembly for damage. Fill the space between the heat conduction pillars and the grooves of the heat sink base with an appropriate amount of thermal grease to ensure tight contact. Place the device on a flat and stable surface with the heat sink pillars facing downwards. Loosen the threaded connection at the bottom of the elastic clamping assembly and remove the clamping plate. Remove the crossbeam or part of the crossbeam to expose the PCB installation space. Carefully place the PCB on the heat sink base, ensuring that the hotspot area of the PCB is directly opposite the top of the heat conduction pillar. A small amount of thermal grease can be applied to the spherical crown surface at the top of the heat conduction pillar to enhance heat conduction. Reinstall the crossbeam, ensuring the flange correctly limits and fixes the edge of the PCB. Install the clamping plate, aligning its central through-hole with the electronic components on the PCB to avoid contact. Adjust the threaded connection depth of the elastic pillar to control the clamping force; a hexagonal inner cavity with a torque wrench can precisely control the tightening force. After installation, check that the PCB board is stably fixed and that the hot spots are in close contact with the top of the heat sink. During use, periodically check the thermal paste condition and clean dust from the heat sink fins to ensure effective heat dissipation. To replace or maintain the PCB board, simply disassemble the device in reverse order. The entire operation is simple and intuitive, requiring no special tools, making it suitable for maintenance personnel of various electronic devices.
Claims
1. A thermal management device for high density PCB boards, characterized by, The utility model relates to a heat dissipation base, heat conduction column, heat dissipation fin assembly, clamping fixing frame and elastic compression assembly are included, the heat dissipation base is rectangular flat plate, and the upper surface central area is equipped with recess, the recess is equipped with heat conduction column, and the heat conduction column is cylindrical, and the bottom is closely combined with recess bottom surface, the heat conduction column top passes through the upper surface of heat dissipation base and extends upward, the heat dissipation fin assembly is set in the outside of heat conduction column, and the heat dissipation fin assembly includes multilayer annular heat dissipation fin, and the inner hole of each layer annular heat dissipation fin is with the outer wall of heat conduction column interference fit, the clamping fixing frame is installed on the upper surface of heat dissipation base four quarters and is used for clamping fixed PCB board, and makes PCB board hot spot area with heat conduction column top contact, and the elastic compression assembly is installed on the clamping fixing frame and is used for exerting the pressure of upward to PCB board. The heat conduction column is stepped cylinder, including lower part big diameter section and upper part small diameter section, the lower part big diameter section is embedded in the recess of heat dissipation base and is closely matched with recess inner wall, the upper part small diameter section passes through the upper surface of heat dissipation base and extends upward, the heat dissipation fin assembly is set in the outside of the upper part small diameter section of heat conduction column.
2. The thermal management device of a high density PCB board of claim 1, wherein, The heat dissipation fin assembly includes fifteen layers of annular heat dissipation fins, each layer of annular heat dissipation fins extends radially outward from the center, and gaps are provided between adjacent layers of annular heat dissipation fins for air flow. Each layer of annular heat dissipation fins has a thickness of 0.5mm to 1.5mm. The outer edge of the annular heat dissipation fins is wavy to increase the heat dissipation area. The annular heat dissipation fins are made of aluminum alloy material.
3. The thermal management device of a high density PCB board of claim 2, wherein, The clamping fixing frame includes four vertical columns and four cross beams. The four vertical columns are fixed at the four corners of the heat dissipation base, and each vertical column has an inner thread at the top. The four cross beams are connected to the top of adjacent two vertical columns to form a rectangular frame structure. The inner side of the cross beam is provided with a flange for limiting and fixing the edge of the PCB. The distance between the upper surface of the heat dissipation base and the flange is matched with the thickness of the PCB.
4. The thermal management device of a high density PCB board of claim 3, wherein, The elastic compression assembly includes a compression plate and four elastic supports. The compression plate is rectangular with a through hole in the center area, and the diameter of the through hole is larger than the outer dimension of the electronic components on the PCB. The four corners of the compression plate are provided with through holes for connecting the elastic supports.
5. The thermal management device of a high density PCB board of claim 4, wherein, The bottom of the heat dissipation base is provided with a plurality of heat dissipation columns. The heat dissipation columns are cylindrical with an expanded disc at the bottom. The heat dissipation columns are arranged in a matrix on the bottom of the heat dissipation base to increase the contact area between the heat dissipation base and the outside world. The heat dissipation columns and the heat dissipation base are integrally formed.
6. The thermal management device of a high density PCB board of claim 5, wherein, The heat conduction column and the recess of the heat dissipation base are filled with heat-conducting silicone grease.
7. The thermal management device of a high density PCB board of claim 6, wherein, The upper surface of the heat dissipation base is provided with a plurality of anti-slip bumps in the annular area 5mm to 10mm away from the edge of the recess. The anti-slip bumps are hemispherical with a height of 0.3mm to 0.8mm. The anti-slip bumps are evenly distributed along the annular with twenty-four in number. The anti-slip bumps increase the friction between the PCB and the heat dissipation base to prevent the PCB from sliding horizontally.
8. The thermal management device of a high density PCB board of claim 7, wherein, 9. The thermal management device of a high density PCB board of claim 8, wherein, The column is a hollow tubular structure, and a through cavity is arranged in the column; a hexagonal inner cavity is arranged below the inner thread at the top of the column, and a torque wrench is arranged in the hexagonal inner cavity; a heat dissipation rib is arranged on the outer wall of the column, the heat dissipation rib extends along the axial direction of the column, and the heat dissipation rib is distributed in a spiral shape; and the column is made of an aluminum alloy material.
10. The thermal management device of a high density PCB board of claim 9, wherein, The upper surface of the pressing plate is provided with a cross-shaped reinforcing rib, the height of the reinforcing rib is 0.5 times the thickness of the pressing plate, the edge of the pressing plate is provided with a chamfer, the chamfer angle is forty-five degrees, the inner wall of the through hole at the four corners of the pressing plate is provided with an annular groove for accommodating a sealing ring, and the pressing plate is made of a polycarbonate material.