Cushion pad for hot pressing of PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of buffer pads, in particular to a buffer pad for hot pressing of a PCB (Printed Circuit Board), which comprises a first support plate, a second support plate and a fixed plate which are vertically arranged, elastic pads are arranged between the first support plate and the second support plate, and the elastic pads are symmetrically arranged; a first buffer spring is further arranged between the first supporting plate and the second supporting plate. A first buffer spring is arranged between the first supporting plate and the fixing plate, a second buffer spring is arranged between the second supporting plate and the fixing plate, and the elastic rigidity of the second buffer spring is larger than that of the first buffer spring. And the second supporting plate can longitudinally move, and second-stage buffering is conducted through the second buffering spring.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of buffer pad, specifically relates to a buffer pad for PCB hot pressing. BACKGROUND

[0002] In the process of PCB hot pressing, in order to reduce mechanical damage, such as scratch or indentation, protect PCB from direct pressure or heat damage, and reduce mechanical stress on PCB components, protect solder joints and components and other reasons, it is necessary to set up a buffer pad for support.

[0003] Chinese patent: CN202320147902.2 discloses a buffer pad for PCB hot pressing, including base, the top of base is provided with buffer pad main part, buffer pad main part includes external buffer mechanism and fixed mechanism, type is set up a plurality of buffer springs in fixed mechanism, while buffering circuit board, the elastic property of buffer spring, plus the disc fixed on the top of suction cup is fixedly bonded in the through hole on the top of protective layer, can ensure that the suction cup can keep synchronization with external buffer mechanism, and buffer spring will not interfere with elastic layer;Elastic layer is made of silica gel, and protective layer is made of felt layer and a layer of PTFE solution solidification formed on the surface of felt layer.

[0004] Although the above-mentioned patent rebounds through buffer spring and does not interfere with elastic layer, but its buffering effect is relatively single, and the effect of layered buffering of different intensity cannot be realized. UTILITY MODEL CONTENT

[0005] Therefore, the utility model aims at providing a buffer pad for PCB hot pressing to solve the technical problem that the buffering effect realized by single spring in the prior art is relatively single and layered buffering of different intensity cannot be realized.

[0006] In order to achieve the above purpose, the utility model provides a buffer pad for PCB hot pressing, which comprises a first supporting plate, a second supporting plate and a fixed plate arranged vertically, an elastic pad is arranged between the first supporting plate and the second supporting plate, and the elastic pad is symmetrically arranged.

[0007] A first buffer spring is further arranged between the first supporting plate and the second supporting plate.

[0008] A second buffer spring is arranged between the second supporting plate and the fixed plate, and the elastic stiffness of the second buffer spring is greater than that of the first buffer spring.

[0009] Preferably, a limiting rod is arranged at the bottom of the first supporting plate, and a first flange plate is arranged on the limiting rod, and the limiting rod is fixedly connected with the bottom of the first supporting plate through the first flange plate.

[0010] The bottom end of the limiting rod penetrates through the second supporting plate, a limiting ring is fixedly arranged on the limiting rod, the limiting ring is below the second supporting plate, the first buffer spring is sleeved on the limiting rod, and the two ends of the first buffer spring respectively abut against the first supporting plate and the second supporting plate.

[0011] Preferably, the top end of the limiting rod is provided with a suction disc, the suction disc is fixedly connected with the limiting rod, and is located at the top of the first supporting plate.

[0012] Preferably, the two sides of the fixed plate are provided with vertical plates, and the surfaces of the vertical plates are provided with sliding rails.

[0013] The two sides of the second supporting plate are both provided with sliding grooves, and the second supporting plate is slidably connected with the sliding rails through the sliding grooves.

[0014] The top of the vertical plate is provided with a baffle, and the second supporting plate is between the baffle and the fixed plate.

[0015] Preferably, the bottom of the second supporting plate is provided with a guide rod, the guide rod is provided with a second flange plate, and the guide rod is fixedly connected with the bottom of the second supporting plate through the second flange plate.

[0016] The second buffer spring is sleeved on the guide rod, and the two ends of the second buffer spring respectively abut against the second supporting plate and the fixed plate.

[0017] Preferably, the fixed plate is provided with a hollow opening corresponding to the guide rod, a baffle is slidably arranged in the hollow opening, and an elastic element for pushing the baffle to be below the guide rod is further arranged in the hollow opening.

[0018] The baffle is provided with a guide element, and the bottom end of the limiting rod is provided with a rolling body in contact with the guide element.

[0019] Preferably, the guide element is in a slope surface structure, and the high point of the slope surface structure is below the rolling body.

[0020] Preferably, the rolling body is a ball, and the ball is movably connected with the bottom end of the limiting rod.

[0021] The beneficial effects of the utility model are as follows:

[0022] The utility model discloses a first supporting plate is pressed to buffer through elastic pad and first buffer spring, then after the first supporting plate is pressed to reach a certain degree, the second supporting plate can be moved longitudinally and is buffered in two stages through second buffer spring by driving the baffle to move. BRIEF DESCRIPTION OF DRAWINGS

[0023] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is the front view of the present invention;

[0026] Figure 3 This is a schematic diagram of the internal structure of the present invention;

[0027] Figure 4 for Figure 3 Enlarged view of point A;

[0028] Figure 5 This is a three-dimensional structural diagram of the second support plate and the fixing plate of this utility model;

[0029] The numbers on the map are:

[0030] 1-First support plate; 2-Second support plate; 21-Slide groove; 3-Fixing plate; 31-Upright plate; 311-Slide rail; 32-Baffle; 4-Elastic pad; 5-First buffer spring; 51-Limiting rod; 511-Rolling element; 52-First flange; 53-Limiting ring; 54-Suction cup; 6-Second buffer spring; 61-Guide rod; 62-Second flange; 7-Baffle plate; 71-Guide element; 72-Elastic element. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0032] It should be noted that, unless otherwise defined, technical or scientific terms used in the present application should be understood as having the common meaning in the field of the present application to which they belong. The terms "first", "second" and similar terms used in the present application do not indicate any order, number or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar terms mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships, which may change accordingly when the absolute position of the described object changes.

[0033] The utility model provides a kind of buffer pad for PCB hot pressing, as shown in Figures 1 to 5 It is provided with the first support plate 1, the second support plate 2 and the fixed plate 3 arranged vertically, the elastic pad 4 is arranged between the first support plate 1 and the second support plate 2, and the elastic pad 4 is symmetrically arranged.

[0034] First buffering spring 5 is further arranged between the first support plate 1 and the second support plate 2.

[0035] Second buffering spring 6 is arranged between the second support plate 2 and the fixed plate 3, and the elastic stiffness of the second buffering spring 6 is greater than that of the first buffering spring 5.

[0036] Further more:

[0037] The bottom of the first support plate 1 is provided with a limiting rod 51, and a first flange plate 52 is arranged on the limiting rod 51, and the limiting rod 51 is fixedly connected with the bottom of the first support plate 1 through the first flange plate 52.

[0038] The bottom end of the limiting rod 51 penetrates the second support plate 2, a limiting ring 53 is fixedly arranged on the limiting rod 51, the limiting ring 53 is below the second support plate 2, the first buffering spring 5 is sleeved on the limiting rod 51, and the two ends of the first buffering spring 5 abut against the first support plate 1 and the second support plate 2 respectively.

[0039] Further more:

[0040] The top end of the limiting rod 51 is provided with a suction cup 54, the suction cup 54 is fixedly connected with the limiting rod 51 and is located at the top of the first support plate 1.

[0041] Further more:

[0042] The two sides of the fixed plate 3 are provided with vertical plates 31, and the surfaces of the vertical plates 31 are provided with sliding rails 311;

[0043] The two sides of the second support plate 2 are provided with sliding grooves 21, and the second support plate 2 is slidably connected with the sliding rails 311 through the sliding grooves 21;

[0044] The top of the vertical plate 31 is provided with a baffle 32, and the second support plate 2 is between the baffle 32 and the fixed plate 3.

[0045] Further more,

[0046] The bottom of the second support plate 2 is provided with a guide rod 61, and the guide rod 61 is provided with a second flange plate 62, and the guide rod 61 is fixedly connected with the bottom of the second support plate 2 through the second flange plate 62;

[0047] The second buffer spring 6 is sleeved on the guide rod 61, and the two ends of the second buffer spring 6 abut against the second support plate 2 and the fixed plate 3 respectively.

[0048] Further more,

[0049] The fixed plate 3 is provided with a hollow opening corresponding to the guide rod 61, the hollow opening is slidably provided with a baffle 7, and the hollow opening is further provided with an elastic element 72 for pushing the baffle 7 below the guide rod 61;

[0050] The baffle 7 is provided with a guide 71, and the bottom end of the limiting rod 51 is provided with a rolling body 511 in contact with the guide 71.

[0051] The elastic element 72 is a spring in this scheme, but not limited to this.

[0052] Further more,

[0053] The guide 71 is in a slope structure, and the high point of the slope structure is below the rolling body 511.

[0054] Further more,

[0055] The rolling body 511 is a ball, and the ball is movably connected with the bottom end of the limiting rod 51.

[0056] In this embodiment, the PCB board is placed on the top of the first support plate 1, and the position of the PCB board is fixed by the suction cup 54, and during the hot pressing process of the PCB board, the force of the PCB board is transmitted to the first support plate 1, and the first support plate 1 is buffered by the elastic pad 4 below, and the elastic pad 4 is silica gel in this scheme, but not limited to this;

[0057] In the buffering process, the first support plate 1 will also compress the first buffering spring 5, the first support plate 1 overcomes the pre-tightening force of the first buffering spring 5 and drives the limiting rod 51 to descend, in the descending process, the bottom end of the limiting rod 51 is the rolling body 511 of the ball, which will compress the high point of the slope surface of the guide 71, after the guide 71 is compressed, the displacement of the baffle 7 is caused, after the displacement of the baffle 7, the bottom end of the guide rod 61 will lose the block of the baffle 7, at this time, it is the transition from the first stage buffering to the second stage buffering, if the first support plate 1 is compressed again, the second support plate 2 is connected with the sliding rail 311 through the sliding groove 21, the second buffering spring 6 between the second support plate 2 and the fixed plate 3 will play the role of the second stage buffering;

[0058] The first buffering spring 5 is also used for cooperating with the rapid rebound of the first support plate 1, so that the fatigue of the elastic pad 4 and the slow rebound speed can be reduced.

[0059] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to suggest that the scope (including claims) of the present application is limited to these examples; under the idea of the present application, the above embodiments or technical features in different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for the sake of brevity.

[0060] The present application is intended to cover all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Accordingly, any and all such modifications, variations or equivalents that fall within the spirit and scope of the present application are intended to be included within the scope of the present application.

Claims

1. A cushion pad for hot pressing of a PCB board, characterized by, Including vertically arranged first support plate, second support plate and fixed plate, first support plate and second support plate between the elastic pad is arranged, and the elastic pad is symmetrically arranged; The first support plate and the second support plate are further provided with the first buffer spring; The second support plate and the fixed plate are provided with the second buffer spring, and the elastic stiffness of the second buffer spring is greater than that of the first buffer spring.

2. The cushion pad for hot pressing of a PCB board according to claim 1, wherein The bottom of the first support plate is provided with a limiting rod, and a first flange plate is arranged on the limiting rod, and the limiting rod is fixedly connected with the bottom of the first support plate through the first flange plate; The bottom end of the limiting rod penetrates the second support plate, and a limiting ring is fixedly arranged on the limiting rod, the limiting ring is below the second support plate, the first buffer spring is sleeved on the limiting rod, and the two ends of the first buffer spring respectively abut against the first support plate and the second support plate.

3. The cushion pad for hot pressing of a PCB board according to claim 2, wherein The top end of the limiting rod is provided with a suction cup, the suction cup is fixedly connected with the limiting rod and is located at the top of the first support plate.

4. The cushion pad for hot pressing of a PCB board according to claim 1, wherein The both sides of the fixed plate are provided with vertical plates, and the surface of the vertical plate is provided with a slide rail; The both sides of the second support plate are provided with a sliding groove, and the second support plate is slidably connected with the slide rail through the sliding groove; The top of the vertical plate is provided with a baffle, and the second support plate is between the baffle and the fixed plate.

5. The cushion pad for hot pressing of a PCB board according to claim 4, wherein The bottom of the second support plate is provided with a guide rod, and a second flange plate is arranged on the guide rod, and the guide rod is fixedly connected with the bottom of the second support plate through the second flange plate; The second buffer spring is sleeved on the guide rod, and the two ends of the second buffer spring respectively abut against the second support plate and the fixed plate.

6. The cushion pad for hot pressing of a PCB board according to claim 1, wherein A hollow opening corresponding to the guide rod is formed in the fixed plate, a baffle is slidably arranged in the hollow opening, and an elastic element for pushing the baffle below the guide rod is further arranged in the hollow opening; A guide member is arranged on the baffle, and a rolling body is arranged at the bottom end of the limiting rod and in contact with the guide member.

7. The cushion pad for hot pressing of a PCB board according to claim 6, wherein The guide member is in a slope structure, and the high point of the slope structure is below the rolling body.

8. The cushion pad for hot pressing of a PCB board according to claim 6, wherein The rolling body is a ball, and the ball is movably connected with the bottom end of the limiting rod.

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