Aviation equipment heat dissipation device based on piezoelectric plane fan

Abstract

The utility model discloses an aviation equipment heat dissipation device based on piezoelectric plane fan, which comprises a heat dissipation module and a heat source module, the heat dissipation module comprises a blade piezoelectric plane fan and a driving power supply module, and the driving power supply module comprises a power supply interface module, two break pass filters and a driving module which are connected in sequence. The output of the driving module is connected with the blade piezoelectric plane fan; the power supply interface module is connected with a power supply for electrification, two paths of current respectively pass through the two break pass filters and are accessed to the driving module, and the driving module outputs a high-voltage driving signal to drive the blade piezoelectric plane fan to generate directional air disturbance so as to supply air to the heat source module. The device has the remarkable performance characteristics of high heat dissipation efficiency, small occupied space and light weight.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of avionics communication technology, more particularly to an aviation equipment heat abstractor based on piezoelectric plane fan. BACKGROUND

[0002] With the development of communication and electronic information industry, the process of packaging semiconductor chip integrated circuit is more and more mature, and the requirement of device miniaturization is higher and higher, the volume is reduced, the heat dissipation is increased, and the heat flux density of electronic components is higher and higher. For airborne communication products, light weight, small size, high reliability and electromagnetic compatibility are required, and the equipment must cope with severe climate and electromagnetic environment. Therefore, reliable and effective heat dissipation system is an important part of avionics equipment, which requires small size, high heat exchange efficiency and no influence on electromagnetic compatibility index.

[0003] At present, the heat dissipation mode of avionics communication equipment is usually divided into natural heat dissipation and forced air cooling heat dissipation according to the size of heat flux density. Natural heat dissipation can only dissipate less heat. When the heat source power is high, the heat is conducted to the heat sink or the equipment base, and then the micro fan is used to blow the heat sink to cool, so as to discharge the heat inside the equipment, but this measure must select the matching fan according to the required air pressure and air volume of heat source heat dissipation. Once the heat flux density is large, the heat exchange system and the fan occupy a large volume, and the ordinary fan may also bring the risk of electromagnetic leakage. If liquid cooling, thermoelectric refrigeration, droplet and spray cooling, phase change refrigeration mode is used, the cooling capacity is strong, but the cost is greatly increased, the total volume and weight of heat source and heat exchange part may still increase, and the maintenance is inconvenient. Therefore, it is hoped that a heat dissipation system with stronger heat exchange capacity in a specified narrow space can be designed, which takes into account the volume, weight, performance and electromagnetic environment index, meets the special heat dissipation requirements of the narrow space in the airborne equipment, and meets the harsh environmental conditions of avionics. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing an aviation equipment heat abstractor based on piezoelectric plane fan, which has the significant performance characteristics of high heat dissipation efficiency, small space occupation and light weight, and is suitable for high electromagnetic compatibility requirement of avionics communication equipment.

[0005] The technical solution of the utility model is as follows:

[0006] The application discloses a kind of aviation equipment heat dissipation device based on piezoelectric plane fan, including heat dissipation module and heat source module, the heat dissipation module includes vane piezoelectric plane fan and driving power supply module, the driving power supply module includes power interface module, 2 communication filters and driving module connected in sequence, the output of driving module is connected with vane piezoelectric plane fan;Power interface module is connected with power supply and energized, current respectively passes through 2 communication filters, access driving module, driving module outputs high-voltage driving signal, drives vane piezoelectric plane fan to generate directional air disturbance, and air is sent to heat source module.

[0007] Further, the heat dissipation module is located in the heat dissipation box, the heat source module is located in the heat source box, the heat source box and the heat dissipation box are consistent in shape, and the heat source box is located on one side of the heat dissipation box and fixedly connected with the heat dissipation box.

[0008] Further, the heat dissipation box is divided into a vane piezoelectric plane fan mounting bin and a driving power supply module mounting bin, the driving power supply module mounting bin includes a driving module bin, a transition bin and an interface bin, the power interface module is fixed in the driving module bin and includes a driving module PCB and a driving module integrated circuit, and the driving module integrated circuit is welded on the driving module PCB; the communication filter is installed in the transition bin, one end is fixed on a feedthrough filter fixed plate, and one end of the feedthrough filter is welded on an interface PCB (9) of the interface bin; the interface bin includes a power supply plug and an interface PCB, and the power supply plug is welded on the interface PCB.

[0009] Further, the driving module bin, the transition bin and the interface bin are provided with conductive adhesive strips on the circumferential sides.

[0010] Further, the driving module PCB and the interface PCB are made of glass fiber epoxy resin copper clad plate.

[0011] Further, the heat source box bottom surface is designed with a closed boss structure corresponding to the module bin, the transition bin and the interface bin, so as to isolate the interface bin, the isolation bin and the driving module bin respectively.

[0012] Further, the heat dissipation box and the heat source box are made of aluminum magnesium silicon aluminum alloy, and the circumferential sides of the heat dissipation box and the heat source box are provided with conductive adhesive strips.

[0013] Further, the heat dissipation box is provided with a labyrinth structure wiring slot, and the wiring slot is filled with sealing glue.

[0014] The utility model discloses a heat dissipation system of precision air source, through directional forced air supply of blade, has the significant performance characteristics of high heat dissipation efficiency, small space occupation, light weight, (2) the piezoelectric plane fan driving module circuit adopts electromagnetic shielding, filtering processing technology, has good electromagnetic compatibility, no electromagnetic leakage, no interference to high frequency digital circuit, applicable to the higher electromagnetic compatibility requirement of avionics communication equipment, (3) combined sealing and labyrinth structure design guarantees the severe environment adaptability of the utility model, can realize waterproof sandproof function etc., satisfies the applicable requirement of different working conditions, (4) the utility model has passed test and various test verification, and the performance is stable and reliable. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model will be further described in detail below in combination with the drawings.

[0016] Figure 1 It is the whole machine structure schematic diagram of the utility model, Figure 1 (a) is the perspective schematic drawing, (b) is the plan view, (c) is the bottom view schematic drawing, (d) is the front view schematic drawing, (e) is the side view schematic drawing.

[0017] Figure 2 It is the structure exploded schematic drawing of the utility model.

[0018] Figure 3 It is the heat dissipation principle explanatory view of the utility model.

[0019] Figure 4 It is the piezoelectric plane fan structure outline dimension drawing of the utility model.

[0020] Figure 5 It is the piezoelectric fan driving module circuit principle diagram of embodiment.

[0021] Figure 6 It is the piezoelectric fan driving module wiring schematic drawing of embodiment.

[0022] Figure 7 It is the piezoelectric fan blade resonance interference schematic drawing of embodiment.

[0023] Figure 8 It is the internal labyrinth structure cross section schematic drawing of embodiment.

[0024] Figure 9 It is the application diagram of heat dissipation system in certain airborne equipment. DETAILED DESCRIPTION

[0025] The utility model will be further described in detail below in combination with the drawings.

[0026] The embodiment of the utility model provides a high -efficient air -cooled heat dissipation system for the module needing air -cooled heat dissipation in avionics communication equipment, and the ordinary axial flow fan cannot be embedded in the specific small space because it occupies a certain height, so it cannot supply air and dissipate heat for the narrow space, and the high -efficient heat exchange technology based on the piezoelectric plane fan solves the comprehensive performance requirements of the space characteristics, electrical characteristics, driving mode, electromagnetic compatibility and environmental protection of the airborne electronic equipment.

[0027] The aviation equipment heat dissipation device provided by the embodiment is based on the heat dissipation system design of the piezoelectric plane fan, the small space heat dissipation channel of the aviation equipment is separated out, the piezoelectric plane fan is embedded in the heat dissipation channel, the driving circuit is filtered and electromagnetically shielded and isolated, the high-frequency interference of the fan on the functional module is inhibited through series feedthrough filter, the fan blade resonance noise and the three-proofing problem of the piezoelectric plane fan are solved, and the equipment is efficiently and reliably cooled in the small volume high heat flux density environment. Figure 1 The aviation equipment heat dissipation device based on the piezoelectric plane fan comprises a heat source module I and a heat dissipation module II.

[0028] The aviation equipment heat dissipation device adopts the piezoelectric plane resonant fan as the main heat dissipation mode, has small volume and high heat dissipation efficiency, utilizes the inverse piezoelectric effect of the piezoelectric ceramic, forms the plane forced air flow under the interaction of the driving voltage, stably and accurately acts on the heat dissipation fin of the heat source, can take away 50W of heat in the space with a total height of only 14mm through forced convection air, the vibration amplitude of each blade of the piezoelectric plane resonant fan is 22±2mm, and the vibration frequency is 80Hz±5Hz.

[0029] The aviation equipment heat dissipation device adopts the feedthrough filter power supply, the electromagnetic shielding protection filter power supply input design mode and the labyrinth structure design, and realizes that the electric field radiation emission index of the functional module RE102 is qualified.

[0030] In combination with Figure 2It is illustrated that the heat dissipation module II includes the piezoelectric plane fan 14 and the driving power supply module of the piezoelectric plane fan 14, and the driving power supply module of the piezoelectric plane fan 14 is divided into three compartments, namely a driving module compartment 20, a transition compartment 21 and an interface compartment 22. The cylindrical head screw M1.6*46 is used to fix the driving module PCB 7, wherein the driving module integrated circuit 8 is welded on the driving module PCB 7. Two feedthrough filters 11 are fixed on the feedthrough filter fixing plate 10 through nuts, and the other end is welded on the interface PCB 9. The feedthrough filter fixing plate 10 is movable, and after installation, the large compartment is naturally divided into the transition compartment and the interface compartment. The external power supply plug PDF04M40AA-PA34 112 641 312 of the piezoelectric plane fan is welded on the interface PCB 9, and the interface PCB 9 is fixed in the interface compartment through screws. The countersunk screw M2.5*81 connects and fixes the heat source module box 2 and the heat dissipation module box 15. The driving compartment conductive adhesive strip 3, the transition compartment conductive adhesive strip 4 and the interface compartment conductive adhesive strip 5 are used for electromagnetic shielding, and the sealing of the three compartments of the driving compartment, the transition compartment and the interface compartment is ensured when the heat source module box 2 and the heat dissipation module box 15 are folded. The piezoelectric plane fan 14 is fixed in the heat dissipation module box 15 through six countersunk screws M2.5*513, and the conductive adhesive strip 16 is installed in the shielding conductive groove of the heat dissipation module box 15, so that the electromagnetic shielding effect after installation of the heat dissipation module II and other modules is ensured.

[0031] The heat dissipation principle of the utility model is shown in the figure. Figure 3 As shown in the figure, air flows from one side of the heat dissipation module to the other side through the internal passage, and heat is exchanged from the surface of the heat dissipation rib and the turbulent air flow driven by the piezoelectric fan blade, and the air carries away the heat from the passage to the outside of the equipment, thereby completing the heat exchange process.

[0032] The aviation equipment heat dissipation device adopts aluminum magnesium silicon aluminum alloy, piezoelectric ceramic, 360-degree stress equivalent stainless steel, glass fiber epoxy resin copper-clad plate and pouring heat-conducting glue as main materials. The aluminum magnesium silicon aluminum alloy is mainly used as the main material of the metal shell, the piezoelectric ceramic is mainly used as the vibration body of the piezoelectric fan, the 360-degree stress equivalent stainless steel is used as the fan blade of the piezoelectric fan, the glass fiber epoxy resin copper-clad plate is used as the main material of the PCB, and the pouring heat-conducting glue is used as the main material of the pouring glue.

[0033] The aviation equipment heat dissipation device adopts all aluminum alloy for conductive oxidation Ct.0 surface coating treatment, all driving circuit boards pouring heat-conducting glue 9225, driving ceramic surface coating "three-proof" glue, and all fasteners are made of stainless steel material, so as to realize reliable work in the aviation airborne environment and meet the actual aviation airborne installation requirements.

[0034] The heat dissipation system is powered by the whole machine. It is connected to the DC power supply from the power plug PDF04M40AA-PA3411236413 plug 12. Through the interface fixing board PCB9, the two currents pass through two collapsible filters 11 installed on the collapsible filter fixing wall 10 and are connected to the drive module circuit board 8. The internal MCU of the drive module generates two sets of sine wave signals with the same frequency but opposite phase. The sine wave signals are inverted by high voltage operational amplifier to generate high voltage drive signals. After passing through the labyrinth structure wiring channel, they are connected to the planar piezoelectric fan. The piezoelectric fan blades are driven to move in a regular manner to generate directional air disturbance, which delivers air to the heat dissipation fins of the heat source module box 2.

[0035] This invention can solve the problem of high heat dissipation requirements in small spaces in avionics and communication equipment. It can meet the comprehensive requirements of high heat flux density, compact structure, stability and reliability, light weight, low noise and good electromagnetic compatibility of heat dissipation systems. It provides a good heat dissipation system platform for products that require heat dissipation, such as miniaturized avionics and communication equipment. Through the "three-proof" design and different surface protection measures, the corrosion resistance of the heat dissipation system module itself is improved, which expands its application range and ensures adaptability to the use environment.

[0036] Example 1

[0037] This utility model has been applied to one of our company's airborne communication devices, such as... Figure 9 As shown, the main control module of this airborne shortwave communication equipment has a total heat source of 50W, and the module height must be less than 14mm. To resolve the contradictions arising from the constraints on heat dissipation, size, weight, and electromagnetic compatibility, engineers conducted specialized research and developed a heat dissipation device for aviation equipment based on a novel piezoelectric planar fan, and built an experimental testing platform. According to the experimental results, because the piezoelectric planar fan is driven by synchronous vibration at 80Hz, the piezoelectric constant d... 33 With a dielectric constant ε > 4000 PC / N and a dielectric constant ε > 4000, there is no interference when 5 blades are connected in parallel, resulting in less noise than when 4 blades are connected in parallel. The interference situation in the example is as follows: Figure 7 As shown in the figure. Simultaneously, the corresponding parameters and flow fields based on other axial fans were compared and analyzed. The heat dissipation system based on the piezoelectric planar fan has the advantages of being smaller, having higher heat transfer efficiency, lower noise, simpler and more reliable structure, and better electromagnetic compatibility. Based on this, and combining experimental and simulation methods, parameter suggestions are proposed for the implementation of a high-performance piezoelectric fan based on the piezoelectric effect and piezoelectric equation. The piezoelectric fan of the embodiment is shown in the figure. Figure 4 As shown, it includes an integrated aluminum-based five-unit base and five fan blades. The base contains a temperature sensor. Piezoelectric ceramic is the main material of the piezoelectric fan's vibrating body, and 360-degree stress-equal stainless steel is the main material of the piezoelectric fan's blades. Six countersunk mounting holes are provided so that each fan blade is fixed with screws on both sides to reduce the impact of blade vibration.Figure 5 and Figure 6 The schematic circuit diagram and wiring diagram of the piezoelectric fan driving module of the embodiment are shown in the drawings. In the embodiment, a labyrinth structure is adopted. The labyrinth compartment is arranged in the heat dissipation module box (II), and the back of the heat source module box (I) is provided with a corresponding closed boss structure. The cross-sectional view of the closed boss structure is shown in Figure 8 The interface compartment, isolation compartment and driving module compartment are isolated respectively. Only the communication filter circuit is connected between the interface compartment and the driving module compartment. Several coupling ways of electromagnetic signals are blocked so that the outside and the inside cannot be interfered by direct conduction and radiation. The structure gap of the closed structure is blocked by the conductive adhesive tape to ensure the conductive continuity of the structure of each compartment. In the embodiment, the driving module, interface compartment and wiring slot are filled with sealing glue to ensure the installation strength and sealing property of the PCB structure, thereby greatly improving the structural sealing property, electromagnetic compatibility and environmental adaptability of the power module and the driving module.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A piezoelectric flat fan based aircraft equipment heat sink, comprising: a piezoelectric flat fan heat sink; and a heat spreader in thermal contact with the piezoelectric flat fan heat sink. The heat dissipation module comprises a vane piezoelectric plane fan and a driving power supply module, the driving power supply module comprises a power supply interface module, two feedthrough filters and a driving module connected in sequence, and the output of the driving module is connected with the vane piezoelectric plane fan; the power supply interface module is connected with a power supply to be electrified, the current passes through the two feedthrough filters respectively, is connected to the driving module, the driving module outputs a high-voltage driving signal, the vane piezoelectric plane fan is driven to generate directional air disturbance, and air is supplied to the heat source module.

2. A piezoelectric flat fan based aircraft equipment heat sink as claimed in claim 1, wherein, The heat dissipation module is located in a heat dissipation box, the heat source module is located in a heat source box, the heat source box and the heat dissipation box are consistent in shape, and the heat source box is located on one side of the heat dissipation box and is fixedly connected with the heat dissipation box.

3. A piezoelectric flat fan based aircraft equipment heat sink as claimed in claim 2, wherein, The heat dissipation box is divided into a vane piezoelectric plane fan mounting bin and a driving power supply module mounting bin, the driving power supply module mounting bin comprises a driving module bin, a transition bin and an interface bin, the power supply interface module is fixed in the driving module bin and comprises a driving module PCB and a driving module integrated circuit, the driving module integrated circuit is welded on the driving module PCB, the feedthrough filter is mounted in the transition bin and is fixed at one end on a feedthrough filter fixed plate, and one end of the feedthrough filter is welded on an interface PCB (9) of the interface bin; the interface bin comprises a power supply plug and an interface PCB, and the power supply plug is welded on the interface PCB.

4. The piezoelectric flat fan based aircraft equipment heat sink of claim 3, wherein, The driving module bin, the transition bin and the interface bin are provided with conductive adhesive strips on the circumferential sides.

5. A piezoelectric flat fan based aircraft equipment heat sink as recited in claim 3, wherein, The driving module PCB and the interface PCB adopt glass fiber epoxy resin copper-clad plates.

6. A piezoelectric flat fan based aircraft equipment heat sink device according to claim 3, wherein, The bottom surface of the heat source box is designed with a closed boss structure corresponding to the module bin, the transition bin and the interface bin, and the interface bin, the isolation bin and the driving module bin are isolated respectively.

7. A piezoelectric flat fan based aircraft equipment heat sink as recited in claim 2, wherein, The heat dissipation box and the heat source box adopt aluminum-magnesium-silicon aluminum alloy, and the circumferential sides of the heat dissipation box and the heat source box are provided with conductive adhesive strips.

8. The piezoelectric flat fan based aircraft equipment heat sink of claim 2, wherein, The heat dissipation box is provided with a labyrinth structure wiring groove, and the wiring groove is filled with sealing glue.

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