SVG module
By introducing a temperature sensor and an axial fan control system into the SVG module, the problem of temperature unevenness in miniaturized, high-integration-density SVG modules is solved, improving device stability and power density while reducing costs.
Patent Information
- Application Number
- CN202520151086.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-22
AI Technical Summary
Miniaturized, highly integrated SVG modules are prone to problems such as excessively high internal temperatures or uneven temperatures, which can affect device accuracy and lifespan.
The system adopts a structural design that includes a bus capacitor, a first axial fan, stacked conductive busbars, a water-cooled plate, an IGBT module, a module control board, and a module support frame. The internal temperature of the module is monitored by a temperature sensor, which controls the start and stop of the axial fan to achieve air turbulence and uniform heat dissipation inside the module.
This achieves uniform temperature distribution within the module, improving device stability and lifespan, while also increasing power density and reducing cost.
Smart Images
Figure CN223859479U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of power electronics industry especially relates to a SVG module. BACKGROUND
[0002] With the continuous grid connection of wind power, photovoltaic and other new energy power, the power grid power quality has more and more big challenge, and high voltage direct SVG (Static Var Generator, static var generator) plays an important role in maintaining the stability of power grid voltage and improving power quality. In the power quality and power electronics industry, with the increasingly severe market competition situation, not only the product equipment is required to have high enough performance, but also the cost is faced with great challenge. Under the pressure of cost, the SVG module has the development trend of miniaturization and high integration density, and the cascaded unit is the main component of chain structure, allowing two or more cascaded units to be integrated in one power module, which greatly saves space and improves the power density of the SVG module.
[0003] With the miniaturization of SVG products and the improvement of module power density, the problem of high internal temperature or uneven temperature of the SVG module is prone to occur. The device works in a high temperature environment for a long time, which affects the precision and service life of the device, is not conducive to the stable operation of the device, and even causes the device to fail. SUMMARY
[0004] The technical problem to be solved by the utility model lies in providing a SVG module to solve the problem of high internal temperature or uneven temperature of the miniaturized and high-integration-density SVG module.
[0005] To solve the above technical problems, the utility model adopts the technical scheme as follows:
[0006] A SVG module, comprising a bus capacitor, a first axial flow fan, a laminated conductive row, a water-cooled plate, an IGBT module, a module control board and a module support frame, the bus capacitor, the first axial flow fan, the laminated conductive row, the water-cooled plate and the module control board are all fixed on the module support frame, the IGBT module is fixedly connected with the water-cooled plate and closely adheres to the side surface of the water-cooled plate, the IGBT module is electrically connected with the bus capacitor through the laminated conductive row, the first axial flow fan is located on one side of the laminated conductive row and the air outlet is aligned with the overlapping surface of the IGBT module and the laminated conductive row, the bus capacitor is provided with a first temperature sensor, the laminated conductive row is provided with a second temperature sensor, and the module control board controls the start and stop of the first axial flow fan according to the detection data of the first temperature sensor and the second temperature sensor.
[0007] Preferably, the laminated conductive row comprises horizontal conductive plates and vertical conductive plates vertically arranged opposite to the horizontal conductive plates, and a plurality of through holes are arranged on the horizontal conductive plates and the vertical conductive plates, the through holes on the horizontal conductive plates are connected with the positive and negative poles of the bus capacitor, and the through holes on the vertical conductive plates are connected with the direct current side of the IGBT module.
[0008] Preferably, the through holes on the horizontal conductive plates are connected with the positive and negative poles of the bus capacitor through bolts, and the through holes on the vertical conductive plates are connected with the direct current side of the IGBT module through bolts.
[0009] Preferably, the second temperature sensor is arranged at a temperature hot spot of the vertical conductive plate.
[0010] Preferably, the first temperature sensor is arranged at a temperature hot spot inside the bus capacitor.
[0011] Preferably, the first temperature sensor is arranged on the surface of the shell of the bus capacitor.
[0012] Preferably, the SVG module further comprises a second axial flow fan fixed on the module support frame and arranged opposite to the first axial flow fan, and the module control board controls the starting and stopping of the second axial flow fan according to the detection data of the first temperature sensor and the second temperature sensor.
[0013] Preferably, the module control board is further used for collecting the working voltage of the SVG module and controlling the action of the IGBT module according to the collected working voltage.
[0014] Preferably, the first temperature sensor and the second temperature sensor are insulated from the bus capacitor, the first axial flow fan, the laminated conductive row and the IGBT module respectively, and the first temperature sensor and the second temperature sensor are in the same potential as the module control board.
[0015] Preferably, the first temperature sensor and the second temperature sensor are thermocouples, and the module control board is internally provided with a thermocouple signal analysis circuit.
[0016] The SVG module described above blows air to the joint surface direction of the IGBT module and the laminated conductive row through the first axial flow fan, realizes air stirring in the module, makes the temperature distribution in the module more uniform, is beneficial to heat dissipation of hot spots in the module, and solves the problem that a small-sized and high-integrated-density SVG module is prone to have excessively high internal temperature or uneven temperature. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a structure schematic view of the SVG module in the first embodiment of the utility model;
[0018] Figure 2The position relation schematic view of the second temperature sensor and the laminated conductive row in the embodiment one of the utility model;
[0019] Figure 3 The position relation schematic view of the first temperature sensor and the bus capacitor in the embodiment one of the utility model;
[0020] Figure 4 The structure schematic view of the SVG module in the embodiment two of the utility model;
[0021] Figure 5 The position relation schematic view of the first temperature sensor and the bus capacitor in the embodiment three of the utility model. DETAILED DESCRIPTION
[0022] In order to make those skilled in the art more clearly understand the purpose, technical scheme and advantages of the utility model, the utility model is further described below in conjunction with the drawings and embodiments.
[0023] Embodiment one:
[0024] As shown in the figure, Figures 1-3 The SVG module includes a bus capacitor 20, a first axial flow fan (31, 32), a laminated conductive row 40, a water-cooled plate 50, an IGBT module 60, a module control board 70 and a module support frame 10, the bus capacitor 20, the first axial flow fan, the laminated conductive row 40, the water-cooled plate 50, the module control board 70 are all fixed on the module support frame 10, wherein the bus capacitor 20, the laminated conductive row 40, the water-cooled plate 50 are arranged in turn from bottom to top. Of course, the position relation of the bus capacitor 20, the laminated conductive row 40 and the water-cooled plate 50 can also be adjusted accordingly, for example, the bus capacitor 20, the laminated conductive row 40 and the water-cooled plate 50 are arranged in turn from top to bottom.
[0025] The IGBT module 60 is fixedly connected with the water-cooled plate 50 and closely adheres to the side surface of the water-cooled plate 50, so as to realize good heat dissipation. The IGBT module 60 is electrically connected with the bus capacitor 20 through the laminated conductive row 40. The first axial flow fan is located on one side of the laminated conductive row and the air outlet is aligned with the lap joint surface 61 of the IGBT module 60 and the laminated conductive row 40, the bus capacitor 20 is provided with a first temperature sensor 21, the laminated conductive row 40 is provided with a second temperature sensor 43, and the module control board 70 controls the start and stop of the first axial flow fan (31, 32) according to the detection data of the first temperature sensor 21 and the second temperature sensor 43. In addition, the module control board 70 is also used for collecting the working voltage of the SVG module, and controlling the action of the IGBT module 60 according to the collected working voltage, so as to maintain the stability of the power grid voltage.
[0026] The first temperature sensor 21 and the second temperature sensor 43 can adopt different types of temperature sensing devices such as thermocouples, thermal resistors, etc. When the first temperature sensor 21 and the second temperature sensor 43 adopt thermocouples, a thermocouple signal analysis circuit is arranged inside the module control board 70 for analyzing the thermocouple signals uploaded by the first temperature sensor 21 and the second temperature sensor 43.
[0027] In the present embodiment, the number of IGBT modules 60 and the number of first axial flow fans are both 2. The 2 first axial flow fans are supported by the module support frame 10, arranged in parallel on the same horizontal plane, and fixed to one side of the overlapping surface (here, the hottest point) 61 of the IGBT module 60 and the laminated conductive busbar 40. The air outlets of the first axial flow fans are aligned with the overlapping surface 61 of the IGBT module 60 and the laminated conductive busbar 40, and blow air towards the overlapping surface 61 of the IGBT module 60 and the laminated conductive busbar 40, so as to realize air disturbance inside the module, carry away the heat of the overlapping surface 61, and have good heat dissipation for the laminated conductive busbar 40. In other embodiments, the number of first axial flow fans can be adjusted as needed, so that the number of first axial flow fans is consistent with the number of IGBT modules 60.
[0028] Again referring to Figure 2 , the laminated conductive busbar 40 is bent by 90° and includes a horizontal conductive plate 41 and a vertical conductive plate 42 arranged vertically opposite to the horizontal conductive plate 41. The horizontal conductive plate 41 is provided with a plurality of through holes 411, and the vertical conductive plate 42 is provided with a plurality of through holes 421. The through holes 411 on the horizontal conductive plate 41 are connected to the positive and negative poles of the bus capacitor 20 through bolts, and the through holes 421 on the vertical conductive plate 42 are connected to the DC side of the IGBT module 60 through bolts.
[0029] The second temperature sensor 43 is arranged at the temperature hot spot (the highest temperature point) of the vertical conductive plate 42. Since the temperature at the overlapping surface 61 of the laminated conductive busbar 40 and the IGBT module 60 is the highest, and the vertical conductive plate 42 of the laminated conductive busbar 40 is connected to the DC side of the IGBT module 60, the temperature hot spot of the vertical conductive plate 42 is the laminated conductive busbar 40. The second temperature sensor 43 is used to detect the real-time temperature of the laminated conductive busbar 40 and upload the detection data to the module control board 70 through the data connection line 44 for analysis. The module control board 70 controls the start and stop of the first axial flow fan according to the analyzed detection data.
[0030] Again referring to Figure 3The first temperature sensor 21 is located at a hot spot inside the bus capacitor 20. The first temperature sensor 21 is used to detect the real-time temperature of the bus capacitor 20 and uploads the detection data to the module control board 70 for analysis via the data connection line 22. The module control board 70 controls the start and stop of the first axial fan based on the analyzed detection data.
[0031] The first temperature sensor 21 and the second temperature sensor 43 are insulated from other components inside the SVG module (such as the first axial fan, stacked busbar, IGBT module, etc.), and the first temperature sensor 21 and the second temperature sensor 43 are at the same potential as the module control board 70.
[0032] The present invention provides an SVG module that uses a first axial fan (31, 32) to blow air towards the overlapping surface 61 of the IGBT module 60 and the stacked busbar 40, thereby achieving air turbulence inside the module, making the internal temperature distribution of the module more uniform, which is beneficial to the heat dissipation of hot spots inside the module (such as the overlapping surface of the stacked busbar and the IGBT module, the busbar capacitor cell), and solves the problem that miniaturized, high-integration-density SVG modules are prone to excessive internal temperature or uneven temperature.
[0033] Since this invention solves the problem of heat dissipation inside the SVG module, it can further improve the performance of the internal components of the module and enhance product stability. In addition, it is also conducive to further increasing the power density of SVG module products, further reducing costs, and thus improving product competitiveness.
[0034] Example 2:
[0035] like Figure 4 As shown, the SVG module includes a bus capacitor 20, a first axial fan (31, 32), a second axial fan (33, 34), a stacked conductive bus 40, a water-cooled plate 50, an IGBT module 60, a module control board 70, and a module support frame 10. The bus capacitor 20, the first axial fan, the second axial fan, the stacked conductive bus 40, the water-cooled plate 50, and the module control board 70 are all fixed on the module support frame 10.
[0036] The difference between this embodiment and Embodiment 1 lies in the layout of the axial flow fans. In this embodiment, in addition to the existing two first axial flow fans (31, 32), two second axial flow fans (33, 34) are added. These two second axial flow fans are supported by the module support frame 10 and arranged parallel to each other on the same horizontal plane. The two second axial flow fans are positioned opposite the two first axial flow fans, meaning they are located opposite each other.
[0037] When the axial flow fan works, the first axial flow fan 31 and the second axial flow fan 33 blow air in opposite directions, and the first axial flow fan 32 and the second axial flow fan 34 blow air in opposite directions, further realizing air disturbance in the module, taking away the heat of the lap joint surface 61, and having a good heat dissipation effect on the laminated conductive row 40.
[0038] Embodiment three:
[0039] The SVG module of the embodiment is consistent with the layout of the SVG module of embodiment one, and the difference lies in that the installation position of the first temperature sensor is different. Figure 5 As shown in the figure, the first temperature sensor 21 is arranged on the surface of the shell of the bus capacitor, which is more convenient for installation and is beneficial to production.
[0040] The above only describes the preferred embodiments of the present application, and does not make any form of limitation on the present application. Those skilled in the art can make various equivalent changes and improvements on the basis of the above embodiments, and any equivalent changes or modifications made within the scope of the claims shall fall within the protection scope of the present application.
Claims
1. An SVG module, characterized by: The SVG module comprises a bus capacitor, a first axial flow fan, a laminated conductive row, a water-cooled plate, an IGBT module, a module control board and a module support frame, the bus capacitor, the first axial flow fan, the laminated conductive row, the water-cooled plate and the module control board are fixed on the module support frame, the IGBT module is fixedly connected with the water-cooled plate and closely adheres to the side surface of the water-cooled plate, the IGBT module is electrically connected with the bus capacitor through the laminated conductive row, the first axial flow fan is located on one side of the laminated conductive row and the air outlet is aligned with the overlapping surface of the IGBT module and the laminated conductive row, the bus capacitor is provided with a first temperature sensor, the laminated conductive row is provided with a second temperature sensor, and the module control board controls the start and stop of the first axial flow fan according to the detection data of the first temperature sensor and the second temperature sensor.
2. The SVG module of claim 1, wherein: The laminated conductive row comprises horizontal conductive plates and vertical conductive plates arranged vertically opposite to the horizontal conductive plates, a plurality of through holes are arranged on the horizontal conductive plates and the vertical conductive plates, the through holes on the horizontal conductive plates are connected with the positive and negative poles of the bus capacitor, and the through holes on the vertical conductive plates are connected with the direct current side of the IGBT module.
3. The SVG module of claim 2, wherein: The through holes on the horizontal conductive plates are connected with the positive and negative poles of the bus capacitor through bolts, and the through holes on the vertical conductive plates are connected with the direct current side of the IGBT module through bolts.
4. The SVG module of claim 2, wherein: The second temperature sensor is arranged at a temperature hot spot of the vertical conductive plate.
5. The SVG module of claim 1, wherein: The first temperature sensor is arranged at a temperature hot spot inside the bus capacitor.
6. The SVG module of claim 1, wherein: The first temperature sensor is arranged on the surface of the shell of the bus capacitor.
7. The SVG module of claim 1, wherein: The SVG module further comprises a second axial flow fan fixed on the module support frame and arranged opposite to the first axial flow fan, and the module control board controls the start and stop of the second axial flow fan according to the detection data of the first temperature sensor and the second temperature sensor.
8. The SVG module of claim 1, wherein: The module control board is further used for collecting the working voltage of the SVG module and controlling the action of the IGBT module according to the collected working voltage.
9. The SVG module of claim 1, wherein: The first temperature sensor and the second temperature sensor are insulated from the bus capacitor, the first axial flow fan, the laminated conductive row and the IGBT module respectively, and the first temperature sensor and the second temperature sensor are at the same potential as the module control board.
10. The SVG module of any of claims 1-9, wherein: The first temperature sensor and the second temperature sensor are thermocouples, and the module control board is internally provided with a thermocouple signal analysis circuit.