Silicon wafer texturing device and silicon wafer production equipment

Abstract

The utility model discloses a silicon wafer texturing device and silicon wafer production equipment, and belongs to the technical field of silicon wafer production. The silicon wafer texturing device comprises a mechanical arm cross beam, a clamping assembly, an induction device and a spraying assembly, the clamping assembly is installed on the mechanical arm cross beam and used for clamping a flower basket, the induction device is installed on the clamping assembly and used for detecting whether the flower basket bears a silicon wafer or not, and the spraying assembly is used for cleaning the induction device and installed on the mechanical arm cross beam. According to the technical scheme, through cooperative work of the mechanical arm cross beam, the clamping assembly, the sensing device, the spraying assembly and the like, the texturing process of the silicon wafer can be completed, the stability of all the assemblies in the texturing process of the silicon wafer is kept, the number of equipment failures is reduced, and therefore the texturing efficiency and the yield of the silicon wafer are improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer production, and particularly relates to a silicon wafer texturing device and a silicon wafer production equipment. BACKGROUND

[0002] In the production process of a solar cell, a silicon wafer needs to be cleaned and textured, and most of the texturing processes are alkali texturing. Alkali and the silicon wafer generate relatively uniform pyramids under certain conditions, so as to reduce reflection and improve the absorption of incident light. In the related technology, sodium hydroxide is usually used as an alkali solution, but sodium silicate is generated after sodium hydroxide reacts with the silicon wafer. The sodium silicate accumulates into crystals after cooling, which interferes with the inductor on the mechanical arm, causing the mechanical arm to be prone to failure in the texturing process, thereby affecting the production efficiency and yield of the silicon wafer, and there is room for improvement. CONTENT OF THE UTILITY MODEL

[0003] The application aims to at least solve the technical problem of crystal accumulation on the mechanical arm in the related technology. To this end, the application provides a silicon wafer texturing device and a silicon wafer production equipment, which can reduce the failure frequency of the mechanical arm and improve the production efficiency and yield of the silicon wafer.

[0004] In a first aspect, the application provides a silicon wafer texturing device, comprising:

[0005] A mechanical arm beam;

[0006] A clamping assembly installed on the mechanical arm beam and used for clamping a flower basket;

[0007] A sensing device installed on the clamping assembly and used for detecting whether the flower basket carries a silicon wafer;

[0008] A spraying assembly used for cleaning the sensing device, and the spraying assembly is installed on the mechanical arm beam.

[0009] In the above technical solution, through the cooperative work of the mechanical arm beam, the clamping assembly, the sensing device and the spraying assembly, accurate clamping, detection and cleaning of the silicon wafer can be realized, so that the silicon wafer can maintain high quality and stability in the texturing process, thereby improving the efficiency and yield of the silicon wafer texturing.

[0010] According to one embodiment of the application, the spraying assembly is located above the sensing device.

[0011] In the above technical solution, the spraying assembly can directly clean the sensing device during operation, so as to maintain the cleanliness and sensitivity of the surface of the sensing device.

[0012] According to one embodiment of the present application, the spraying assembly comprises a support, a water pipe and a spray head, the spray head is located at the end of the water pipe, and the support fixes the water pipe.

[0013] In the above technical solution, through the cooperation of the support, the water pipe and the spray head, the inductive device can be accurately cleaned, the cleanliness and sensitivity of the inductive device can be maintained, and the cleaning efficiency and yield can be improved.

[0014] According to one embodiment of the present application, the silicon wafer texturing device further comprises a functional tank and a water tank, and the functional tank and the water tank are alternately distributed along a first direction.

[0015] In the above technical solution, the functional tank comprises an acid tank and an alkali tank, the acid tank and the alkali tank are alternately distributed along the first direction with the water tank, and the acid tank, the alkali tank and the water tank each play a different role and together complete the cleaning and formation of the textured structure on the surface of the silicon wafer, which can improve the photoelectric conversion efficiency of the solar cell.

[0016] According to one embodiment of the present application, the silicon wafer texturing device further comprises a driving mechanism, the driving mechanism drives the mechanical arm beam to move along the first direction, and the mechanical arm beam is arranged to hover above the functional tank or the water tank when moving above the functional tank or the water tank.

[0017] In the above technical solution, the driving mechanism is responsible for driving the mechanical arm beam to move in a specific direction and controlling the hovering of the mechanical arm beam above the functional tank or the water tank, and the hovering function helps to stabilize the processing of the silicon wafer and also improves the production capacity and efficiency of the silicon wafer texturing device.

[0018] According to one embodiment of the present application, when the spraying assembly sprays, the mechanical arm beam is located above the water tank.

[0019] In the above technical solution, the cleaning effect of the water tank and the spraying assembly can be combined to achieve efficient cleaning of the silicon wafer, which provides a strong guarantee for the overall performance and efficiency of the silicon wafer texturing device.

[0020] According to one embodiment of the present application, the mechanical arm beam moves along a second direction to drive the flower basket to enter or exit the functional tank or the water tank.

[0021] In the above technical solution, the mechanical arm beam moves along the second direction to drive the flower basket to enter or exit the functional tank or the water tank, which can improve the processing efficiency and quality of the silicon wafer, and also enhance the flexibility and scalability of the silicon wafer texturing device.

[0022] According to one embodiment of the present application, the silicon wafer texturing device further comprises a support seat configured to connect the mechanical arm beam and the clamping assembly.

[0023] In the above technical solution, the stable connection and support of the support seat between the mechanical arm beam and the clamping assembly can improve the stability and reliability of the silicon wafer texturing device, and enhance the scalability and flexibility.

[0024] According to one embodiment of the present application, a plurality of support seats are uniformly distributed along a third direction.

[0025] According to one embodiment of the present application, a plurality of clamping assemblies are installed on the support seat, and the plurality of clamping assemblies are uniformly distributed along the first direction.

[0026] In the above technical solution, the plurality of support seats are uniformly distributed along the length direction of the mechanical arm beam, which can enhance the stability and carrying capacity of the mechanical arm beam, improve the smoothness and accuracy of the silicon wafer during transmission and processing, and thus improve the yield and efficiency of the silicon wafer texturing device.

[0027] In a second aspect, the present application provides a silicon wafer production equipment comprising the silicon wafer texturing device according to any one of the above.

[0028] In the above technical solution, the silicon wafer production equipment comprises a series of process equipment from raw material processing to finished silicon wafer, and the silicon wafer texturing device is an important part of the silicon wafer production equipment, mainly used for forming a textured structure on the surface of the silicon wafer, which can improve the light absorption efficiency of the silicon wafer and the photoelectric conversion efficiency of the battery.

[0029] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings.

[0031] Figure 1 is one of the structural schematic diagrams of the silicon wafer texturing device provided by the embodiments of the present application;

[0032] Figure 2 is the second structural schematic diagram of the silicon wafer texturing device provided by the embodiments of the present application.

[0033] REFERENCE NUMERALS:

[0034] Silicon wafer texturing device 10;

[0035] A mechanical arm beam 110;

[0036] A clamping assembly 120;

[0037] An induction device 130;

[0038] A spraying assembly 140, a bracket 141, a water pipe 142, and a spray head 143;

[0039] A support seat 150;

[0040] A first direction X, a second direction Y, and a third direction Z. DETAILED DESCRIPTION

[0041] Embodiments of the present application are described in detail below with reference to the accompanying drawings, in which the same or similar notations used throughout the drawings and the specification denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary only, and are used only to explain the present application, and cannot be understood as limiting the present application.

[0042] The present application aims to at least solve the technical problem of crystalline accumulation on the mechanical arm in the related art. To this end, the present application proposes a silicon wafer texturing device and a silicon wafer production equipment, which can reduce the failure frequency of the mechanical arm and improve the production efficiency and yield of the silicon wafer.

[0043] Reference is made below to Figure 1 and Figure 2 A silicon wafer texturing device 10 according to an embodiment of the present application is described.

[0044] As shown in Figure 1 , the silicon wafer texturing device 10 includes a mechanical arm beam 110, a clamping assembly 120, an induction device 130, and a spraying assembly 140, wherein the clamping assembly 120 is mounted on the mechanical arm beam 110 for clamping a flower basket, the induction device 130 is mounted on the clamping assembly 120 for detecting whether the flower basket carries a silicon wafer, the spraying assembly 140 is used for cleaning the induction device 130, and the spraying assembly 140 is mounted on the mechanical arm beam 110.

[0045] The mechanical arm beam 110 serves as the main support structure of the entire device, is responsible for supporting and moving other key components, and can maintain high precision and high stability during operation. The mechanical arm beam 110 is located at the top of the device and can drive the clamping assembly 120 and other devices such as the flower basket to move horizontally.

[0046] The clamping assembly 120 is mounted on the mechanical arm beam 110 and is used for clamping and fixing the flower basket. The clamping assembly 120 is transferred between different workstations by the movement of the mechanical arm beam 110. The flower basket is usually used to load silicon wafers to be processed, and the flower basket can keep the silicon wafers stable during transportation and processing, reducing the risk of damage to the silicon wafers.

[0047] The inductive device 130 is installed on the clamping assembly 120, and can detect whether the flower basket carries the silicon wafer through weight induction, optical detection or other sensor technologies, so as to improve the accuracy and safety of subsequent processing, and when the flower basket carries the silicon wafer, the silicon wafer processing flow can be carried out, and when the flower basket is empty, the flower basket is controlled to hover.

[0048] The spraying assembly 140 is installed on the mechanical arm beam 110 and located above the inductive device 130, and is mainly used for cleaning the inductive device 130 to remove the crystal attached to the inductive device 130, so that the inductive device 130 can still maintain high sensitivity and accuracy after long-term use, thereby improving the efficiency of the silicon wafer processing. When the crystal is accumulated, it will block the inductive device 130, causing the device to not work correctly. In addition, the spraying assembly 140 can also be used for preliminary cleaning or pretreatment of the silicon wafer in some cases.

[0049] The spraying assembly 140 mainly uses water or alcohol and other cleaning liquids to clean the surface of the inductive device 130, and can be equipped with pressure control, flow control and cleaning liquid circulation system functions, and by adjusting the type of cleaning liquid, spraying pressure and flow and other factors, the cleaning effect is optimized, and the damage to the inductive device 130 and the silicon wafer is reduced.

[0050] In actual work process, the silicon wafer is first placed in the flower basket, and then the flower basket is clamped by the clamping assembly 120. When the inductive device 130 detects the presence of the silicon wafer in the flower basket, the mechanical arm beam 110 drives the clamping assembly 120 to move to the etching station for etching treatment of the silicon wafer. At a specific step, the spraying assembly 140 is started to clean the inductive device 130 to remove the crystal attached to the inductive device 130. After the silicon wafer processing is completed, the mechanical arm beam 110 drives the clamping assembly 120 to move to the unloading station to take out the silicon wafer from the flower basket.

[0051] In the production process of solar cells, the silicon wafer needs to be cleaned and etched. Most of the etching processes are alkali etching. Alkali and silicon wafer generate relatively uniform pyramids under certain conditions, thereby reducing reflection and improving the absorption of incident light. The inventor finds that in the related art, sodium hydroxide is usually used as the alkali solution, but sodium silicate is generated after sodium hydroxide reacts with the silicon wafer. The sodium silicate accumulates into crystal after cooling, which interferes with the inductor on the mechanical arm, causing the mechanical arm to easily malfunction during the etching process, thereby affecting the production efficiency and yield of the silicon wafer, and there is room for improvement.

[0052] Based on the above considerations, in order to solve the problem of crystallization accumulation on the mechanical arm in the related art, the inventor has designed a silicon wafer texturing device 10. In the silicon wafer texturing device 10 of this structure, the spraying assembly 140 is arranged above the induction device 130, which can solve the problem of crystallization accumulation on the mechanical arm, which causes the mechanical arm to easily malfunction during the texturing process.

[0053] According to the silicon wafer texturing device 10 provided by the embodiment of the present application, through the cooperative work of the mechanical arm beam 110, the clamping assembly 120, the induction device 130 and the spraying assembly 140, the texturing process of the silicon wafer can be completed, and the stability of each component during the silicon wafer texturing process can be maintained, the number of equipment failures can be reduced, and thus the efficiency and yield of the silicon wafer texturing can be improved.

[0054] In some embodiments, as shown in Figure 2 The spraying assembly 140 is located above the induction device 130, wherein the spraying assembly 140 includes a bracket 141, a water pipe 142 and a spray head 143, the spray head 143 is located at the end of the water pipe 142, and the bracket 141 fixes the water pipe 142.

[0055] The position of the spraying assembly 140 is above the induction device 130, and the spraying assembly 140 can directly clean the induction device 130 during operation to maintain the cleanliness and sensitivity of the surface of the induction device 130. The bracket 141 is a support structure of the spraying assembly 140, which is installed on the support seat 150 and is used to fix the water pipe 142 and the spray head 143, thereby improving the stability and accuracy of the spraying assembly 140 during operation. The bracket 141 is usually designed to be strong and durable, and can withstand the weight of the water pipe 142 and the spray head 143 and the vibration and impact during operation.

[0056] The water pipe 142 is a pipeline for conveying cleaning liquid in the spraying assembly 140, and is responsible for conveying the cleaning liquid from the liquid storage tank or other supply source to the spray head 143. One end of the water pipe 142 is connected with the spray head 143, and the other end is installed on the mechanical arm beam 110 and arranged inside the mechanical arm beam 110. At the same time, the water pipe 142 has good corrosion resistance and high pressure resistance, so that the cleaning liquid will not be contaminated or leaked during conveying. The diameter and length of the water pipe 142 can also be designed according to the flow and pressure of the cleaning liquid, so that the cleaning effect is optimal.

[0057] The spray head 143 is located at the end of the water pipe 142 and is the part of the spray assembly 140 that directly cleans the inductive device 130. The spray head 143 is responsible for spraying cleaning liquid at a certain pressure and flow rate onto the surface of the inductive device 130 to achieve cleaning effect. The shape, size and number of spray holes of the spray head 143 are designed according to the properties of the cleaning liquid, the cleaning area and the cleaning requirements. At the same time, the spray head 143 has good corrosion resistance and wear resistance to maintain stable cleaning effect during long-term use.

[0058] It can be understood that through the cooperation of the bracket 141, the water pipe 142 and the spray head 143, accurate cleaning of the inductive device 130 can be achieved, the cleanliness and sensitivity of the inductive device 130 can be maintained, and the cleaning efficiency and yield can be improved.

[0059] In some embodiments, the silicon wafer texturing device 10 further comprises functional tanks and water tanks, which are alternately distributed along the first direction X.

[0060] The functional tank is the core part of the silicon wafer texturing device 10 and is used to perform specific texturing process steps, including using specific chemical solutions to etch, oxidize or other chemical reactions on the silicon wafer to form the required texture structure on the surface of the silicon wafer. The texture structure can increase the light trapping ability of the silicon wafer, thereby improving the photoelectric conversion efficiency of the solar cell. The number and type of functional tanks depend on the specific texturing process requirements.

[0061] For example, the functional tank can include an acid tank and an alkali tank, which are important components of the functional tank and play different roles in the silicon wafer texturing process.

[0062] The acid tank is mainly used to remove the damage layer and metal impurities on the surface of the silicon wafer. During the production of the silicon wafer, the surface of the silicon wafer may be mechanically damaged or contaminated, which will affect the subsequent photolithography, diffusion and other process steps. By using the acid tank for chemical cleaning, the damage layer and contaminants can be effectively removed, making the surface of the silicon wafer smoother and cleaner.

[0063] The alkali tank is mainly used to form the texture structure on the surface of the silicon wafer. When the silicon wafer is immersed in an alkaline solution, a chemical reaction occurs on its surface, causing silicon atoms to be dissolved and forming a small concave-convex structure, i.e. the texture. This texture structure can increase the roughness of the silicon wafer surface, thereby enhancing the light scattering and absorption ability of the silicon wafer. In addition, the texture structure can also reduce light reflection, allowing more light to enter the interior of the silicon wafer and be converted into electrical energy.

[0064] In the process of wafer texturing, the order and conditions of acid tank and alkali tank need to be determined according to the specific process requirements and wafer types, such as acid tank treatment first for cleaning the wafer surface, and alkali tank treatment later for forming the textured structure.

[0065] Unlike functional tanks, water tanks are used to provide cleaning and transition between functional tanks. When the wafer is transferred from one functional tank to another, it will first pass through the water tank for cleaning to remove the residual chemical solution or impurities in the previous functional tank, so that the wafer can stably receive treatment in the subsequent functional tank.

[0066] The functional tanks and water tanks are alternately distributed along the first direction X, the functional tanks include acid tanks and alkali tanks, and the acid tanks, water tanks, alkali tanks and water tanks are sequentially distributed, wherein the first direction X is the moving direction of the mechanical arm beam 110. This kind of alternating distribution helps the wafer to be transmitted and processed between different functional tanks and water tanks. As the mechanical arm beam 110 moves along the first direction X, the wafer first enters the acid tank for cleaning, then enters the water tank to remove the acidic treatment solution on the wafer surface, then enters the alkali tank for cleaning, and then enters the water tank to remove the alkaline treatment solution on the wafer surface. This layout helps to reduce the waiting time and processing time of the wafer during transmission, thereby improving the production capacity and efficiency of the entire texturing device.

[0067] It can be understood that the functional tanks include acid tanks and alkali tanks, and the acid tanks and alkali tanks are alternately distributed with the water tanks along the first direction X, while the acid tanks, alkali tanks and water tanks each play a different role and together complete the cleaning of the wafer surface and the formation of the textured structure. This processing process can improve the photoelectric conversion efficiency of the solar cell.

[0068] In some embodiments, the wafer texturing device 10 further comprises a driving mechanism for driving the mechanical arm beam 110 to move along the first direction X, and the mechanical arm beam 110 is arranged to hover above the functional tank or water tank when moving above the functional tank or water tank.

[0069] The driving mechanism is the power source in the wafer texturing device 10, which provides the necessary force and motion control, and is responsible for driving the mechanical arm beam 110 to move stably along the first direction X. The driving mechanism also has precise position control capability to accurately hover above the functional tank or water tank when the mechanical arm beam 110 moves above the functional tank or water tank.

[0070] For example, the driving mechanism can adopt various types such as motor, air cylinder or hydraulic cylinder, etc., depending on the design requirements and working environment of the device.

[0071] When the mechanical arm beam 110 moves above the functional tank or the water tank in the first direction X, the driving mechanism will slow down and gradually stop moving, so that the mechanical arm beam 110 is kept in a stable hovering position, and then the mechanical arm beam 110 moves downward in the second direction Y, so that the silicon wafer enters the corresponding functional tank or the water tank, and after cleaning, the mechanical arm beam 110 moves upward in the second direction Y to return to the hovering position.

[0072] The hovering function helps the mechanical arm beam 110 to accurately transfer and position between the functional tank and the water tank, thereby reducing the damage or misplacement of the silicon wafer during processing, and at the same time, the hovering function can also improve the processing efficiency and accuracy of the whole device.

[0073] It can be understood that the driving mechanism is responsible for driving the mechanical arm beam 110 to move in a specific direction and controlling the hovering of the mechanical arm beam 110 above the functional tank or the water tank, and the hovering function helps to stabilize the processing of the silicon wafer and also improves the productivity and efficiency of the silicon wafer texturing device 10.

[0074] In some embodiments, the spraying assembly 140 is arranged to spray when the mechanical arm beam 110 is located above the water tank.

[0075] For example, the cleaning liquid can be water, and when the mechanical arm beam 110 is located above the water tank, the spraying assembly 140 can clean the inductive device 130 and the silicon wafer at the same time, and also will not pollute the water tank.

[0076] The spraying assembly 140 is designed to start spraying when the mechanical arm beam 110 moves above the water tank, so that the silicon wafer can be cleaned in the water tank before being transferred from one functional tank to another functional tank, and can also be further cleaned by the spraying assembly 140.

[0077] The water tank is mainly used for preliminary removal of residual chemical solution or impurities on the silicon wafer, such as acidic treatment liquid or alkaline treatment liquid, and the spraying assembly 140 can clean the inductive device 130 and the silicon wafer at the same time, and when the spraying assembly 140 is turned on when the mechanical arm beam 110 is located above the water tank, the silicon wafer can not enter the water tank, which reduces the influence on the silicon wafer due to the pollution of the water tank, and also realizes efficient cleaning of the silicon wafer, reduces the waiting time and processing time of the silicon wafer during processing, and thereby improves the productivity and efficiency of the silicon wafer texturing device 10.

[0078] It can be understood that the spraying assembly 140 is arranged to spray when the mechanical arm beam 110 is located above the water tank, which can combine the cleaning effects of the water tank and the spraying assembly 140 to realize efficient cleaning of the silicon wafer, and provide strong guarantee for the overall performance and efficiency of the silicon wafer texturing device 10.

[0079] In some embodiments, the mechanical arm beam 110 moves in the second direction Y to drive the flower basket to enter or exit the functional tank or the water tank.

[0080] The clamping assembly 120 is mounted on the mechanical arm beam 110 for clamping the flower basket loaded with silicon wafers, and when the mechanical arm beam 110 moves along the second direction Y, the clamping assembly 120 drives the flower basket to move together, thereby realizing the operation of the flower basket in and out of the functional tank or water tank.

[0081] The mechanical arm beam 110 moves along the second direction Y, wherein the second direction Y is a vertical direction perpendicular to the first direction X. When the mechanical arm beam 110 moves along the first direction X to above the functional tank or water tank, the driving mechanism will slow down and gradually stop moving, so that the mechanical arm beam 110 is kept in a stable hovering position, and at this time the hovering position is above the functional tank or water tank. Then the mechanical arm beam 110 moves downward along the second direction Y, so that the silicon wafers enter the corresponding functional tank or water tank, and after cleaning, the mechanical arm beam 110 moves upward along the second direction Y to return to the hovering position.

[0082] Through the movement of the mechanical arm beam 110 along the second direction Y, the silicon wafers can be continuously transported and processed between different functional tanks and water tanks, which can reduce the waiting time and processing time of the silicon wafers in the processing process, and improve the production capacity and efficiency of the silicon wafer texturing device 10.

[0083] It can be understood that the movement of the mechanical arm beam 110 along the second direction Y to drive the flower basket in and out of the functional tank or water tank can improve the processing efficiency and quality of the silicon wafers, and also enhance the flexibility and scalability of the silicon wafer texturing device 10.

[0084] In some embodiments, as shown in Figure 1 and Figure 2 The silicon wafer texturing device 10 further comprises a support seat 150 for connecting the mechanical arm beam 110 and the clamping assembly 120.

[0085] The support seat 150 is a bridge between the mechanical arm beam 110 and the clamping assembly 120, which is responsible for firmly connecting the mechanical arm beam 110 and the clamping assembly 120 together to form a stable overall structure, thereby ensuring the stability and safety of the silicon wafers during transportation and processing, which helps to reduce damage or misalignment of the silicon wafers due to vibration or shaking, and improves the yield of the silicon wafer texturing device 10.

[0086] It can be understood that through the stable connection and support of the support seat 150 between the mechanical arm beam 110 and the clamping assembly 120, the stability and reliability of the entire device can be improved, and the scalability and flexibility can be enhanced.

[0087] In some embodiments, as shown in Figure 1 A plurality of support seats 150 are uniformly distributed along the third direction Z.

[0088] Multiple support bases 150 are evenly distributed along the third direction Z, where the third direction Z is the length direction of the robotic arm beam 110. The even distribution of multiple support bases 150 can ensure that the robotic arm beam 110 is subjected to uniform force in the length direction, reducing deformation or damage caused by excessive local force. At the same time, this design also helps to improve the stability and accuracy of the silicon wafer during the transmission process.

[0089] The support base 150 is used to fix the clamping assembly 120 on the crossbeam 110 of the robotic arm, which helps to reduce silicon wafer damage or misalignment caused by vibration or shaking, improves the yield of silicon wafer texturing device 10, and the even distribution of multiple support bases 150 can also process multiple sets of silicon wafers at one time, which helps to improve the transmission efficiency.

[0090] In actual operation, silicon wafers are loaded into a basket and fixed to the robotic arm beam 110 by a clamping assembly 120. A sensing device 130 detects whether the basket is carrying silicon wafers to ensure the smooth progress of subsequent processing. A drive mechanism drives the robotic arm beam 110 to move along the first direction X, sequentially transferring the silicon wafers to various functional slots and water tanks. In the functional slots, the silicon wafers undergo specific texturing processes. After each functional slot, the silicon wafers are cleaned in a water tank to remove residual chemical solutions or impurities. A spraying assembly 140 cleans the sensing device 130 or the silicon wafers when necessary to ensure their cleanliness and sensitivity. After processing, the silicon wafers are unloaded from the basket and ready for subsequent applications or tests.

[0091] Understandably, the multiple support seats 150 are evenly distributed along the length of the robotic arm beam 110, which can enhance the stability and load-bearing capacity of the robotic arm beam 110, improve the stability and accuracy of silicon wafers during transmission and processing, and thus improve the yield and efficiency of the silicon wafer texturing device 10.

[0092] In some embodiments, such as Figure 2 As shown, multiple clamping components 120 are mounted on the support base 150, and the multiple clamping components 120 are evenly distributed along the first direction X.

[0093] Each support 150 is equipped with multiple clamping components 120, and the multiple clamping components 120 are evenly distributed along the first direction X. This can reduce mutual interference and collision of silicon wafers during the transmission process while carrying more silicon wafers, thereby improving the capacity and production efficiency of the silicon wafer texturing device 10.

[0094] The main function of the clamping assembly 120 is to clamp and fix the wafer basket containing the silicon wafers, reducing the risk of movement or falling during transportation and processing. The uniform distribution of the clamping assembly 120 helps to accurately position the silicon wafers during transportation and processing, reducing the risk of uneven processing or damage due to positional deviation, and improving the accuracy and reliability of the silicon wafer texturing device 10.

[0095] It can be understood that the plurality of clamping assemblies 120 are installed on the support seat 150 and uniformly distributed along the first direction X, which can improve the yield and efficiency of the silicon wafer texturing device 10.

[0096] The embodiments of the present application also provide a silicon wafer production equipment, which includes the silicon wafer texturing device 10 according to any one of the above.

[0097] The silicon wafer production equipment includes a series of process equipment from raw material processing to finished silicon wafers, and the silicon wafer texturing device 10 is an important part of the silicon wafer production equipment, mainly used to form a textured structure on the surface of the silicon wafer to improve the light absorption efficiency of the silicon wafer and the photoelectric conversion efficiency of the battery.

[0098] The silicon wafer texturing device 10 is composed of a mechanical arm beam 110, a driving assembly, a support seat 150, a clamping assembly 120, a wafer basket, a sensing device 130, a spraying assembly 140, a functional groove, and a water tank, etc. The driving assembly is used to drive the movement of the mechanical arm beam 110 and other components connected to the mechanical arm beam 110. The clamping assembly 120 is used to clamp the wafer basket. The wafer basket is used to contain the silicon wafers. The sensing device 130 is used to detect whether the wafer basket carries the silicon wafers. The support seat 150 is used to fix the clamping assembly 120 to the mechanical arm beam 110. The functional groove is used to form a textured structure on the surface of the silicon wafer through a chemical reaction. The spraying assembly 140 is used to clean the sensing device 130 and the silicon wafers.

[0099] The basic principle of silicon wafer texturing is to use an alkali solution to etch the silicon wafer anisotropically, thereby forming a pyramid-shaped textured structure on the surface of the silicon wafer. During this process, factors such as the concentration and temperature of the alkali solution and the crystal direction of the silicon wafer will affect the texturing effect. By accurately controlling these factors, a uniform and dense textured structure can be obtained.

[0100] In actual work process, the silicon wafer is loaded into the flower basket and fixed on the mechanical arm beam 110 through the clamping assembly 120, the inductive device 130 detects whether the flower basket carries the silicon wafer, to ensure the smooth progress of the subsequent processing process, the driving mechanism drives the mechanical arm beam 110 to move along the first direction X, and the silicon wafer is sequentially transmitted to each functional groove and water tank, in the functional groove, the silicon wafer receives specific texturing process, after each functional groove, the silicon wafer passes through the water tank for cleaning to remove residual chemical solution or impurities, the spraying assembly 140 cleans the inductive device 130 or the silicon wafer when necessary, to ensure its cleanliness and sensitivity, after the processing is completed, the silicon wafer is unloaded from the flower basket and prepared for subsequent application or test.

[0101] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the description and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0102] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0103] In the description of the present application, "first feature" and "second feature" can include one or more features.

[0104] In the description of the present application, "a plurality of" means two or more.

[0105] In the description of the present application, the first feature "above" or "below" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them.

[0106] In the description of the application, above, over and on are used to indicate that the first feature is above, over or on the second feature, either directly or obliquely, or simply that the first feature is higher than the second feature.

[0107] In the description of the application, references to "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples" means that a particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The appearances of the phrases above in various places in the specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0108] Although embodiments of this application have been shown and described, it is to be understood that various modifications, substitutions, combinations, and variations can be made thereto by those of ordinary skill in the art without departing from the spirit and scope of the present application, which is defined by the following claims and their equivalents.

Claims

1. A silicon wafer texturing apparatus, characterized in that, The device comprises: a mechanical arm beam; a clamping assembly mounted on the mechanical arm beam for clamping a wafer basket; a sensing device mounted on the clamping assembly for detecting whether the wafer basket carries a silicon wafer; a spraying assembly for cleaning the sensing device, the spraying assembly being mounted on the mechanical arm beam.

2. The silicon wafer texturing apparatus of claim 1, wherein The spraying assembly is located above the sensing device.

3. The silicon wafer texturing apparatus of claim 2, wherein The spraying assembly comprises a bracket, a water pipe and a spray head, the spray head being located at the end of the water pipe, and the bracket fixing the water pipe.

4. The silicon wafer texturing apparatus of claim 1, wherein The device further comprises: functional grooves and water grooves, the functional grooves and the water grooves being alternately distributed along a first direction.

5. The silicon wafer texturing apparatus of claim 4, wherein The device further comprises: a driving mechanism for driving the mechanical arm beam to move along the first direction, the mechanical arm beam being arranged to hover above the functional grooves or the water grooves when moving above the functional grooves or the water grooves.

6. The silicon wafer texturing apparatus of claim 5, wherein When the spraying assembly sprays, the mechanical arm beam is located above the water grooves.

7. The silicon wafer texturing apparatus of claim 5, wherein The mechanical arm beam moves along a second direction to drive the wafer basket to enter or exit the functional grooves or the water grooves.

8. The silicon wafer texturing apparatus of claim 1, wherein The device further comprises: supporting seats for connecting the mechanical arm beam and the clamping assembly.

9. The silicon wafer texturing apparatus of claim 8, wherein, A plurality of the supporting seats are uniformly distributed along a third direction.

10. The silicon wafer texturing apparatus of claim 9, wherein, A plurality of the clamping assemblies are mounted on the supporting seats, and a plurality of the clamping assemblies are uniformly distributed along the first direction.

11. A silicon wafer production apparatus characterized by comprising: The device comprises: a silicon wafer texturing device according to any one of claims 1-10.

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