Apparatus for manufacturing display device

Abstract

An apparatus for manufacturing a display device includes: a chamber including a first region, a second region, and a third region; a first deposition mask disposed in the first region; a second deposition mask disposed in the second region; a deposition unit disposed in the third region; and a base configured to reciprocate among the first region, the second region, and the third region.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0020901, filed on February 14, 2024, and all benefits derived therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments relate to apparatus and methods for manufacturing a display device, wherein the display device may include a light-emitting diode. Background Technology

[0004] Display devices visually display data. They can also provide images using light-emitting diodes (LEDs). The applications and structures of display devices are diverse; structures that can be bent from a flat state to specific angles have been developed, and various designs are being explored to improve the quality of display devices.

[0005] A display device may include multiple pixels in a patterned manner to realize an image. In this case, multiple layers, including an emissive layer, may be included in the multiple pixels in a patterned manner. Depending on the type of layer, such layers may be arranged on a substrate in different patterns. Utility Model Content

[0006] A thin-film encapsulation layer can be disposed on multiple layers on a substrate of a display device. The thin-film encapsulation layer protects these multiple layers and prevents dust, moisture, and other contaminants from penetrating them. The thin-film encapsulation layer can have a multilayer structure, comprising an inorganic film containing inorganic materials and an organic film containing organic materials. The organic or inorganic film of the thin-film encapsulation layer can be formed by depositing organic or inorganic materials onto the substrate in a chamber. In this case, after forming the inorganic film, it may be necessary to remove the substrate from the inorganic film deposition chamber and insert it into the organic film deposition chamber to form the organic film.

[0007] Additional features will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0008] In one embodiment of this disclosure, an apparatus for manufacturing a display device includes: a chamber comprising a first region, a second region, and a third region; a first deposition mask disposed in the first region; a second deposition mask disposed in the second region; a deposition unit disposed in the third region; and a base configured to reciprocate between the first region, the second region, and the third region.

[0009] In an embodiment, the first area, the second area, and the third area can be arranged along a linear path or a circular arc path, the third area can be disposed between the first area and the second area, and the first deposition mask can be an inorganic film deposition mask, and the second deposition mask can be an organic film deposition mask.

[0010] In an embodiment, the apparatus can further include a first alignment unit disposed in the first area and a second alignment unit disposed in the second area.

[0011] In an embodiment, at least one of the first alignment unit and the second alignment unit can include a mask moving part configured to raise and lower a mask and a substrate moving part configured to raise and lower a substrate.

[0012] In an embodiment, the mask moving part and the substrate moving part can be configured to elongate and contract in a predetermined direction.

[0013] In an embodiment, the apparatus can further include a first mask holding unit disposed in the first area and facing the first alignment unit and a second mask holding unit disposed in the second area and facing the second alignment unit.

[0014] In an embodiment, at least one of the first mask holding unit and the second mask holding unit can include a plurality of mask holders that are bent and rotatable.

[0015] In an embodiment, the deposition unit and at least one of the first mask holding unit and the second mask holding unit can be disposed on the same surface of the chamber.

[0016] In an embodiment, a first opening can be defined in the first deposition mask, a second opening can be defined in the second deposition mask, and the first opening and the second opening can have different sizes from each other, respectively.

[0017] In an embodiment, the apparatus can further include a buffer plate attached to at least one of opposite sides of the base.

[0018] In an embodiment of the disclosure, a method of manufacturing a display device includes: combining a substrate and an inorganic film deposition mask with each other on a base in a first area of a chamber; depositing a first inorganic film on the substrate by a deposition unit and the inorganic film deposition mask in a third area of the chamber; combining the substrate and an organic film deposition mask with each other on the base in a second area of the chamber; and depositing an organic film on the first inorganic film by the deposition unit and the organic film deposition mask in the third area of the chamber.

[0019] In an embodiment, the combining the substrate and the inorganic film deposition mask can include at least one of: bringing the inorganic film deposition mask close to the substrate; and aligning the substrate and the inorganic film deposition mask to each other.

[0020] In an embodiment, the combining the substrate and the organic film deposition mask can include at least one of: bringing the organic film deposition mask close to the substrate; and aligning the substrate and the organic film deposition mask to each other.

[0021] In an embodiment, the method can further include at least one of: moving the susceptor, the substrate, and the inorganic film deposition mask as one unit from the first area to the third area; and moving the susceptor, the substrate, and the organic film deposition mask as one unit from the second area to the third area.

[0022] In an embodiment, the method can further include at least one of: separating the inorganic film deposition mask from the substrate; and separating the organic film deposition mask from the substrate.

[0023] In an embodiment, the method can further include at least one of: holding the inorganic film deposition mask on a first mask holding unit provided on one surface of the chamber; and holding the organic film deposition mask on a second mask holding unit provided on the one surface of the chamber.

[0024] In an embodiment, the deposition unit and at least one of the first mask holding unit and the second mask holding unit can be disposed on the same surface of the chamber.

[0025] In an embodiment, the method can further include: recombining the substrate and the inorganic film deposition mask to each other on the susceptor in the first area of the chamber; and depositing a second inorganic film on the organic film by the deposition unit and the inorganic film deposition mask in the third area of the chamber.

[0026] In an embodiment, the method can further include inserting the substrate into the chamber.

[0027] In an embodiment, the third area can be disposed between the first area and the second area. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other features and advantages of exemplary embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 A cross-sectional view of an embodiment of an apparatus for manufacturing a display device;

[0030] Figure 2A and Figure 2B A plan view of an embodiment of an apparatus for manufacturing a display device;

[0031] Figure 3A and Figure 3B A plan view of an embodiment of an apparatus for manufacturing a display device;

[0032] Figure 4A and Figure 4B A plan view of one embodiment of a first deposition mask, a second deposition mask, a first mask holding unit, and a second mask holding unit;

[0033] Figure 5 For along Figure 4A A cross-sectional view of the first mask holding unit intercepted by line V-V';

[0034] Figure 6A , Figure 6B , Figure 6C , Figure 6D , Figure 6E , Figure 6F , Figure 6G , Figure 6H , Figure 6I , Figure 6J , Figure 6K , Figure 6L and Figure 6M A cross-sectional view of an embodiment of a method for manufacturing a display device;

[0035] Figure 7 A plan view of an embodiment of a display device manufactured by equipment for manufacturing display devices; and

[0036] Figure 8 This is a cross-sectional view of an embodiment of a display device manufactured by equipment for manufacturing a display device. Detailed Implementation

[0037] Reference will now be made in detail embodiments, example embodiments of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the illustrated embodiments can have different forms and should not be construed as limited to the description set forth herein. Accordingly, the embodiments are described herein with the understanding that the embodiments are for illustration only. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0038] Since the present disclosure allows various changes and numerous embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. The effects and features of the present disclosure and methods of achieving the same will be apparent by referring to embodiments described below in detail along with accompanying drawings. However, the present disclosure can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein.

[0039] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and in the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions thereof are omitted.

[0040] In the following embodiments, although terms such as "first" and "second" are used to describe various elements, the elements are not limited by the terms. The terms are used only to distinguish one element from another.

[0041] In the following embodiments, an expression used in the singular encompasses an expression in the plural, unless it has a clearly different meaning in the context.

[0042] In the following embodiments, terms such as "include," "comprise," and "have" are used to explicitly indicate that there is the stated feature or element, but do not exclude the addition of one or more other features or elements.

[0043] In the following embodiments, when a layer, region, or element is referred to as "on" another layer, region, or element, it can be directly or indirectly on the other layer, region, or element. That is, for example, there can be an intervening layer, region, or element.

[0044] For ease of description, the sizes of the elements in the drawings can be exaggerated. For example, the sizes and thicknesses of the elements in any illustrated drawing are arbitrarily shown for ease of description, and the following disclosure is not limited thereto.

[0045] When the embodiments can be variously implemented, the process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or can be performed in an order opposite to the described sequence.

[0046] As used herein, the expression "A and / or B" means A, B, or A and B. In addition, the expression "at least one of A and B" means A, B, or A and B.

[0047] The x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0048] Figure 1 is a plan view of one embodiment of an apparatus 10 for manufacturing a display device. Figure 2A and Figure 2B is a plan view of one embodiment of an apparatus 10 for manufacturing a display device. Figure 2A and Figure 2B The same apparatus 10 for manufacturing a display device is shown, but the state in which the moving unit 12 has moved to different positions is shown, respectively.

[0049] Referring to Figure 1 , Figure 2A and Figure 2B , the apparatus 10 for manufacturing a display device can include a chamber 11, a moving unit 12, a first alignment unit 13, a second alignment unit 14, a first mask holding unit 15, a second mask holding unit 16, a first deposition mask 17, a second deposition mask 18, and a deposition unit 19.

[0050] The chamber 11 can have a space defined therein, and a portion of the chamber 11 can be open. A gate valve 111 can be installed in the open portion of the chamber 11. The open portion of the chamber 11 can be opened or closed according to the operation of the gate valve 111. In Figure 1 In the chamber 11, a side (hereinafter, a left side) adjacent to the first alignment unit 13 is open, and the gate valve 111 is installed in the open side, but the present disclosure is not limited thereto. In another embodiment, a side (hereinafter, a right side) adjacent to the second alignment unit 14 of the chamber 11 can be open, and the gate valve 111 can be installed in the open side. A substrate, for example, a display substrate D can be inserted into or taken out of the chamber 11 through the gate valve 111 or the open portion of the chamber 11.

[0051] The chamber 11 can include a first region Z1, a second region Z2, and a third region Z3. In an embodiment, the first region Z1, the second region Z2, and the third region Z3 are arranged along a linear path. In an embodiment, the third region Z3 can be disposed between the first region Z1 and the second region Z2.

[0052] The moving unit 12 can be disposed in the chamber 11 and can perform translational motion in the chamber 11. The moving unit 12 can move left or right in the chamber 11 and can move freely between the first region Z1, the second region Z2, and the third region Z3. In an embodiment, compared to the state in, for example, Figure 2A Figure 2B A state in which the moving unit 12 has moved left such that the moving unit 12 is disposed relatively on the left side is shown. In an embodiment, the apparatus 10 for manufacturing a display device can include an element capable of moving the moving unit 12, such as a mechanical arm (not shown) or a moving rail (not shown).

[0053] The moving unit 12 can include a base 121, a first buffer plate 122, and a second buffer plate 123. The base 121 can provide a space in which the display substrate D can be disposed and can support the display substrate D. In other words, the display substrate D can be disposed on the base 121. In an embodiment, the base 121 can support and heat the display substrate D at the same time. To this end, the base 121 can include a heating element therein.

[0054] The first buffer plate 122 and the second buffer plate 123 can be respectively arranged on opposite sides of the base 121. In an embodiment, the first buffer plate 122 and the second buffer plate 123 can be coupled to the base 121. In an embodiment, the base 121, the first buffer plate 122, and the second buffer plate 123 can move as one when the moving unit 12 moves. In an embodiment, the first buffer plate 122 and the second buffer plate 123 can be substantially identical to each other and can be symmetrically arranged with respect to the base 121. In an embodiment, the first buffer plate 122 can be disposed to the left side of the base 121 and the second buffer plate 123 can be disposed to the right side of the base 121. In another embodiment, the first buffer plate 122 can be disposed to the right side of the base 121 and the second buffer plate 123 can be disposed to the left side of the base 121. The first buffer plate 122 and the second buffer plate 123 can prevent or reduce deposition material facing the outside of the display substrate D among deposition material sprayed during a deposition process from reaching another element (for example, the first alignment unit 13 or the second alignment unit 14) disposed below the moving unit 12. In an embodiment, referring to Figure 2A It can be seen that, for example, when the display substrate D and the base 121 overlap the deposition unit 19, the first buffer plate 122 covers a portion of the first alignment unit 13 and the second buffer plate 123 covers a portion of the second alignment unit 14.

[0055] The first alignment unit 13 can be disposed in the first region Z1 of the chamber 11. The first alignment unit 13 can be disposed on one surface of the chamber 11 (for example, the lower surface of the chamber 11). In an embodiment, as Figure 1 ​As shown in FIG. 1, a portion of the first alignment unit 13 can protrude to the outside of the chamber 11, and an upper surface of the first alignment unit 13 can be disposed on the same plane as an inner surface of the chamber 11. In an embodiment, a portion of the first alignment unit 13 can protrude to the inside of the chamber 11. In another embodiment, the first alignment unit 13 can be entirely disposed in the chamber 11.

[0056] The first alignment unit 13 can include a first aligner 131, a first substrate moving portion 132, and a first mask moving portion 133. The first aligner 131 of the first alignment unit 13 can be fixed in the chamber 11. The first substrate moving portion 132 can be raised and lowered, and can be combined with the display substrate D so that the first substrate moving portion 132 can raise and lower the display substrate D. In an embodiment, the first substrate moving portion 132 can be elongated and shortened. In an embodiment, the first substrate moving portion 132 can include any suitable linear actuator. The first mask moving portion 133 can be raised and lowered, and can be combined with the first deposition mask 17 so that the first mask moving portion 133 can raise and lower the first deposition mask 17. In an embodiment, the first mask moving portion 133 can be elongated and shortened. In an embodiment, the first mask moving portion 133 can include any suitable linear actuator.

[0057] The first mask moving portion 133 and the first substrate moving portion 132 can be coupled to the first aligner 131. In an embodiment, a plurality of first mask moving portions 133 can be provided, and the plurality of first mask moving portions 133 can be disposed adjacent to respective corner portions of the first aligner 131. In an embodiment, a plurality of first substrate moving portions 132 can be provided, and the plurality of first substrate moving portions 132 can be disposed relatively far from respective corner portions of the first aligner 131 as compared to the first mask moving portion 133. In other words, the first substrate moving portion 132 can be disposed relatively close to a center of the first aligner 131 as compared to the first mask moving portion 133. In other words, the first mask moving portion 133 can be disposed between the corner portions of the first aligner 131 and the first substrate moving portion 132. In another embodiment, a plurality of first mask moving portions 133 and a plurality of first substrate moving portions 132 can be provided, and the plurality of first mask moving portions 133 and the plurality of first substrate moving portions 132 can be disposed adjacent to respective edges (or corner portions) of the first aligner 131.

[0058] The first alignment unit 13 can align the display substrate D and the first deposition mask 17 with each other. For this purpose, the first aligner 131 of the first alignment unit 13 may include a visual portion (not shown) that identifies alignment marks provided on the display substrate D and / or the first deposition mask 17. In one embodiment, after the first substrate moving portion 132 is combined with the display substrate D and the first mask moving portion 133 is combined with the first deposition mask 17, the visual portion (not shown) of the first aligner 131 can capture the alignment marks on the display substrate D and the first deposition mask 17. Thereafter, the first substrate moving portion 132 can move the display substrate D, and the first mask moving portion 133 can move the first deposition mask 17, such that the alignment marks on the display substrate D and the first deposition mask 17 are aligned with each other. In one embodiment, the first substrate moving portion 132 may include any suitable element capable of moving the display substrate D or moving it with the display substrate D. In one embodiment, the first mask moving portion 133 may include any suitable element capable of moving the first deposition mask 17 or moving it with the first deposition mask 17.

[0059] The second alignment unit 14 may be disposed in the second region Z2 of the chamber 11. The second alignment unit 14 may be disposed on a surface of the chamber 11 (e.g., the lower surface of the chamber 11). In one embodiment, as... Figure 1 As shown, a portion of the second alignment unit 14 may protrude to the outside of the chamber 11, and the upper surface of the second alignment unit 14 may be disposed on the same plane as the inner surface of the chamber 11. In one embodiment, a portion of the second alignment unit 14 may protrude into the interior of the chamber 11. In another embodiment, the second alignment unit 14 may be entirely disposed within the chamber 11.

[0060] The second alignment unit 14 may include a second aligner 141, a second substrate moving portion 142, and a second mask moving portion 143. The second aligner 141 of the second alignment unit 14 may be fixed in the chamber 11. The second substrate moving portion 142 may rise and fall and may be combined with the display substrate D. In one embodiment, the second substrate moving portion 142 may extend and shorten. In one embodiment, the second substrate moving portion 142 may include any suitable linear actuator. The second mask moving portion 143 may rise and fall and may be combined with the second deposition mask 18. In one embodiment, the second mask moving portion 143 may extend and shorten. In one embodiment, the second mask moving portion 143 may include any suitable linear actuator.

[0061] The second mask moving part 143 and the second substrate moving part 142 can be coupled to the second aligner 141. In an embodiment, a plurality of second mask moving parts 143 can be provided, and the plurality of second mask moving parts 143 can be disposed adjacent to respective corner portions of the second aligner 141. In an embodiment, a plurality of second substrate moving parts 142 can be provided, and the plurality of second substrate moving parts 142 can be disposed relatively far from respective corner portions of the second aligner 141, as compared with the second mask moving parts 143. In other words, the second substrate moving parts 142 can be disposed relatively close to a center of the second aligner 141, as compared with the second mask moving parts 143. In other words, the second mask moving parts 143 can be disposed between the corner portions of the second aligner 141 and the second substrate moving parts 142. In another embodiment, a plurality of second mask moving parts 143 and a plurality of second substrate moving parts 142 can be provided, and the plurality of second mask moving parts 143 and the plurality of second substrate moving parts 142 can be disposed adjacent to respective edges (or corner portions) of the second aligner 141.

[0062] The second alignment unit 14 can align the display substrate D and the second deposition mask 18 with each other. To this end, the second aligner 141 of the second alignment unit 14 can include a vision part (not shown) that recognizes alignment marks provided on the display substrate D and / or the second deposition mask 18. In an embodiment, after the second substrate moving part 142 is combined with the display substrate D and the second mask moving part 143 is combined with the second deposition mask 18, the vision part (not shown) of the second aligner 141 can photograph the alignment marks of the display substrate D and the alignment marks of the second deposition mask 18. Thereafter, the second substrate moving part 142 can move the display substrate D, and the second mask moving part 143 can move the second deposition mask 18, such that the alignment marks of the display substrate D and the alignment marks of the second deposition mask 18 are aligned with each other. In an embodiment, the second substrate moving part 142 can include any suitable element capable of moving the display substrate D or moving together with the display substrate D.

[0063] The first mask holding unit 15 can be disposed in the first region Z1 of the chamber 11. The first mask holding unit 15 can be disposed to face the first alignment unit 13. In an embodiment, the first mask holding unit 15 can be disposed on a surface of the chamber 11 opposite to a surface of the chamber 11 on which the first alignment unit 13 is disposed. In an embodiment, for example, the first alignment unit 13 can be disposed on a lower surface of an inner space of the chamber 11, and the first mask holding unit 15 can be disposed on an upper surface of the inner space of the chamber 11 to face the first alignment unit 13. Accordingly, at least a portion of the first mask holding unit 15 can overlap the first alignment unit 13 in a plan view. The first mask holding unit 15 can be combined with the first deposition mask 17 to hold the first deposition mask 17 at a predetermined position. In an embodiment, the first mask holding unit 15 can hold the first deposition mask 17 such that the first deposition mask 17 is disposed, for example, above (or in the +z direction with respect to) the moving unit 12 and the display substrate D.

[0064] The second mask holding unit 16 can be disposed in the second region Z2 of the chamber 11. The second mask holding unit 16 can be disposed to face the second alignment unit 14. In an embodiment, the second mask holding unit 16 can be disposed on a surface of the chamber 11 opposite to a surface of the chamber 11 on which the second alignment unit 14 is disposed. In an embodiment, for example, the second alignment unit 14 can be disposed on a lower surface of an inner space of the chamber 11, and the second mask holding unit 16 can be disposed on an upper surface of the inner space of the chamber 11 to face the second alignment unit 14. Accordingly, at least a portion of the second mask holding unit 16 can overlap the second alignment unit 14 in a plan view. The second mask holding unit 16 can be combined with the second deposition mask 18 to hold the second deposition mask 18 at a predetermined position. In an embodiment, the second mask holding unit 16 can hold the second deposition mask 18 such that the second deposition mask 18 is disposed, for example, above (or in the +z direction with respect to) the moving unit 12 and the display substrate D.

[0065] The first deposition mask 17 can be disposed in the first region Z1. The first deposition mask 17 can be disposed in the third region Z3 during a deposition process. The first deposition mask 17 can overlap the first alignment unit 13 (e.g., the first mask moving portion 133). The first deposition mask 17 can be held by the first mask holding unit 15. The first deposition mask 17 can move to various positions in the chamber 11 other than a position at which the first deposition mask 17 is held by the first mask holding unit 15. In an embodiment, the first deposition mask 17 can be an inorganic film deposition mask. In an embodiment, a central portion of the first deposition mask 17 can be open.

[0066] The second deposition mask 18 can be disposed in the second region Z2. The second deposition mask 18 can be disposed in the third region Z3 during a deposition process. The second deposition mask 18 can overlap the second alignment unit 14 (e.g., the second mask moving part 143). The second deposition mask 18 can be held by the second mask holding unit 16. The second deposition mask 18 can move to various positions in the chamber 11 except for a position where the second deposition mask 18 is held by the second mask holding unit 16. In an embodiment, the second deposition mask 18 can be an organic film deposition mask. In an embodiment, a central portion of the second deposition mask 18 can be open.

[0067] The deposition unit 19 can be disposed in the third region Z3 of the chamber 11. In an embodiment, the deposition unit 19 can be disposed between the first mask holding unit 15 and the second mask holding unit 16. The deposition unit 19 can be disposed on one surface of the chamber 11. In an embodiment, the deposition unit 19 can be disposed on an upper surface of the inner space of the chamber 11. In an embodiment, for example, the deposition unit 19, the first mask holding unit 15, and the second mask holding unit 16 can be arranged on the same inner surface of the chamber 11. The deposition unit 19 can store a deposition material therein, or can receive a deposition material from the outside. In an embodiment, the deposition unit 19 can apply heat to a deposition material to evaporate or sublimate the deposition material. In an embodiment, the deposition unit 19 can be used for both deposition of an inorganic deposition material and deposition of an organic deposition material.

[0068] Figure 3A and Figure 3B is a plan view of an embodiment of the apparatus 10 for manufacturing a display device. Figure 3A and Figure 3B shows the same apparatus 10 for manufacturing a display device, but shows states in which the moving unit 12 has moved to different positions, respectively.

[0069] Although other features of the illustrated embodiments are the same as those of the embodiments described above with reference to FIGS. 1 to 8, Figure 1 , Figure 2A and Figure 2B there can be differences in the shape of the chamber 11 and the arrangement of each element. Hereinafter, such differences are mainly described.

[0070] Reference is made to Figure 3A and Figure 3BThe chamber 11 of the apparatus 10 for manufacturing a display device can have a substantially circular ring shape extending along a circular trajectory. In an embodiment, for example, the inner space of the chamber 11 defined by the wall of the chamber 11 can be a circular ring-shaped space defined by rotating around one rotation axis CNT, and the outer space of the chamber 11 can be disposed around the rotation axis CNT. In another embodiment, for example, the inner space of the chamber 11 can be a circular space defined by rotating around one axis, and the rotation axis CNT can also be disposed in the inner space of the chamber 11.

[0071] The chamber 11 can include a first area Z1, a second area Z2, a third area Z3, and a fourth area Z4. In an embodiment, the first area Z1, the second area Z2, the third area Z3, and the fourth area Z4 are arranged along a circular arc path. In an embodiment, the first area Z1 can be disposed in a portion of the chamber 11 in about a twelve o'clock direction, the fourth area Z4 can be disposed in a portion of the chamber 11 in about a three o'clock direction, the second area Z2 can be disposed in a portion of the chamber 11 in about a six o'clock direction, and the third area Z3 can be disposed in a portion of the chamber 11 in about a nine o'clock direction. In other words, the first area Z1 can be disposed in a portion of the chamber 11 in about a twelve o'clock direction, and the fourth area Z4, the second area Z2, and the third area Z3 can be positioned in order in a clockwise direction. In an embodiment, the chamber 11 can have a circular structure that can move in a clockwise or counterclockwise direction in one of the areas and return to the starting point. In an embodiment, the areas of the first area to the fourth area Z1, Z2, Z3, and Z4 can be substantially the same.

[0072] A portion of the chamber 11 can be open, and a gate valve 111 can be installed in the open portion. In an embodiment, the open portion of the chamber 11 and the gate valve 111 can be located in the fourth area Z4. In an embodiment, the display substrate D can be inserted into or taken out of the chamber 11 through the open portion of the chamber 11 or the gate valve 111. Accordingly, in the illustrated embodiment, the display substrate D can be understood to be inserted into or taken out of the chamber 11 in the fourth area Z4.

[0073] The first alignment unit 13 and the first mask holding unit 15 can be arranged in the first region Z1. Accordingly, in an embodiment, the first alignment unit 13 and the first mask holding unit 15 can be understood to be arranged in a portion of the chamber 11 in about twelve o’clock direction. The second alignment unit 14 and the second mask holding unit 16 can be arranged in the second region Z2. Accordingly, in an embodiment, the second alignment unit 14 and the second mask holding unit 16 can be understood to be arranged in a portion of the chamber 11 in about six o’clock direction. The deposition unit 19 can be provided in the third region Z3. Accordingly, in an embodiment, the deposition unit 19 can be understood to be provided in a portion of the chamber 11 in about nine o’clock direction.

[0074] The mobile unit 12 can be mobile in the chamber 11. In an embodiment, the mobile unit 12 can be mobile along a circular trajectory having a constant radius around the rotation axis CNT. Accordingly, the mobile unit 12 can be freely mobile between the first region to the fourth region Z1, Z2, Z3 and Z4. Figure 3A A situation is shown in which the mobile unit 12 is provided in the third region Z3, Figure 3B A situation is shown in which the mobile unit 12 is provided in the fourth region Z4.

[0075] Figure 4A And Figure 4B A plan view of an embodiment of the first deposition mask 17 and the second deposition mask 18 and the first mask holding unit 15 and the second mask holding unit 16. Figure 4A And Figure 4B A situation is shown in which the same first mask holding unit 15 and the second mask holding unit 16 are in different positions.

[0076] With reference to Figure 4A , a central portion of each of the first deposition mask 17 and the second deposition mask 18 can be open. In an embodiment, for example, a first opening 17-1 can be defined in the first deposition mask 17 and a second opening 18-1 can be defined in the second deposition mask 18. In an embodiment, the overall dimensions of the first deposition mask 17 and the second deposition mask 18 can be substantially the same as each other, respectively, and the dimensions of the first opening 17-1 and the second opening 18-1 can be different from each other, respectively. In other words, the overall dimensions of the first deposition mask 17 and the second deposition mask 18 can be substantially the same as each other, and the width 17-t of the first deposition mask 17 and the width 18-t of the second deposition mask 18 can be different from each other. In an embodiment, the width 17-t of the first deposition mask 17 can be smaller than the width 18-t of the second deposition mask 18, and the first opening 17-1 of the first deposition mask 17 can be larger than the second opening 18-1 of the second deposition mask 18. Accordingly, the first deposition mask 17 and the second deposition mask 18 can be used for depositing layers having different areas.

[0077] The first mask holding unit 15 can be disposed in the -z direction with respect to the first deposition mask 17, and can support and hold the first deposition mask 17. The first mask holding unit 15 can include a plurality of sections. In an embodiment, the sections can be disposed to overlap with respective edges of the first deposition mask 17. In an embodiment, the respective sections of the first mask holding unit 15 can be arranged, for example, in about twelve o'clock, three o'clock, six o'clock, and nine o'clock directions of the first deposition mask 17. A portion of each section of the first mask holding unit 15 can overlap with the first deposition mask 17.

[0078] The second mask holding unit 16 can be disposed in the -z direction with respect to the second deposition mask 18, and can support and hold the second deposition mask 18. The second mask holding unit 16 can include a plurality of sections. In an embodiment, the sections can be arranged to overlap with respective edges of the second deposition mask 18. In an embodiment, the respective sections of the second mask holding unit 16 can be arranged, for example, in about twelve o'clock, three o'clock, six o'clock, and nine o'clock directions of the second deposition mask 18. A portion of each section of the second mask holding unit 16 can overlap with the second deposition mask 18.

[0079] In an embodiment, each section of the first mask holding unit 15 can be rotated about the first axis AX1 provided therein. In an embodiment, each section of the second mask holding unit 16 can be rotated about the second axis AX2 provided therein. Together with reference to Figure 4A and Figure 4B , each section of the first mask holding unit 15 can be rotated about the first axis AX1 by a predetermined angle (e.g., 90 degrees). Similarly, each section of the second mask holding unit 16 can be rotated about the second axis AX2 by a predetermined angle (e.g., 90 degrees). Each section of each of the first mask holding unit 15 and the second mask holding unit 16 can be rotated (e.g., in a counterclockwise direction) from a state shown in Figure 4A to a state shown in Figure 4B , and can release the first deposition mask 17 or the second deposition mask 18 supported and held by the section. In addition, each section of each of the first mask holding unit 15 and the second mask holding unit 16 can be rotated (e.g., in a clockwise direction) from a state shown in Figure 4B to a state shown in Figure 4AThe first mask holding unit 15 and the second mask holding unit 16 can rotate in a predetermined rotational direction when the first deposition mask 17 or the second deposition mask 18 is released and when the first deposition mask 17 or the second deposition mask 18 is supported and held. For example, each segment of each of the first mask holding unit 15 and the second mask holding unit 16 can rotate in a clockwise direction when the first deposition mask 17 or the second deposition mask 18 is released, and can rotate in a counterclockwise direction when the first deposition mask 17 or the second deposition mask 18 is supported and held. However, the disclosure is not limited to such a predetermined rotational direction. In another embodiment, each segment of each of the first mask holding unit 15 and the second mask holding unit 16 can rotate in a clockwise direction when the first deposition mask 17 or the second deposition mask 18 is released, and can rotate in a counterclockwise direction when the first deposition mask 17 or the second deposition mask 18 is supported and held.

[0080] Figure 5 A cross-sectional view of the first mask holding unit 15 taken along a line V-V' of FIG. 1 is illustrated in FIG. 2. In the following, although described based on one of the plurality of segments of the first mask holding unit 15, the features described below can be equally applied to the other segments of the first mask holding unit 15, and further applied to the second mask holding unit 16 and its segments. Figure 4A

[0081] Referring to FIG. 3, Figure 5 , one segment of the first mask holding unit 15 can include a mask holder 151, a sealing portion 152, and a rotating portion 153.

[0082] The outside 11-1 and the inside 11-2 of the chamber 11 can be separated from each other by a wall 11-W of the chamber 11. The mask holder 151 can be disposed in the inside 11-2 of the chamber 11, and can be in direct contact with and support the first deposition mask 17. The mask holder 151 can be connected to the sealing portion 152. The mask holder 151 can be bent. The sealing portion 152 can be fixed to the wall 11-W of the chamber 11, and can penetrate the wall 11-W of the chamber 11. The sealing portion 152 can tightly seal the outside 11-1 and the inside 11-2 of the chamber 11 to prevent fluid communication therebetween. The rotating portion 153 can be disposed in the outside 11-1 of the chamber 11, and can be connected to the sealing portion 152.

[0083] ​The rotating part 153 can include any element capable of generating rotation. In an embodiment, for example, the rotating part 153 can include a member such as a pneumatic rotary cylinder or a rotary actuator to generate rotational motion about a predetermined axis. In an embodiment, the rotating part 153 can generate rotational motion about the first axis AX1. The sealing part 152 can include any element capable of transmitting the rotational motion generated by the rotating part 153 to the mask holder 151. In an embodiment, for example, the sealing part 152 can include a magnetic fluid seal or the like to transmit the rotational motion generated by the rotating part 153 connected to one side of the sealing part 152 to the mask holder 151 connected to the opposite side of the sealing part 152. As a result, the sealing part 152 can seal the inside 11-2 of the chamber 11 while transmitting the rotational motion generated in the outside 11-1 of the chamber 11 to the inside 11-2 of the chamber 11. Accordingly, the rotational motion about the first axis AX1 generated by the rotating part 153 can be transmitted to the mask holder 151 through the sealing part 152, and the mask holder 151 can rotate about the first axis AX1. Through the rotational motion of the mask holder 151 about the first axis AX1, the segments of the first mask holding unit 15 can be converted to the states shown in FIGS. 1A to 1C, respectively. Figure 4A and Figure 4B

[0084] Figure 6A to Figure 6M A cross-sectional view of an embodiment of a process for a method of manufacturing a display device.

[0085] Referring to Figure 6A In a zeroth operation S0, the display substrate D can be inserted into the chamber 11. In an embodiment, the gate valve 111 can be opened, and the display substrate D can be inserted into the chamber 11 by moving a separate member (for example, a mechanical arm) of the display substrate D. In an embodiment, the moving unit 12 can be disposed in the first region Z1, and the display substrate D can be disposed in the first region Z1 after being inserted into the chamber 11. In an embodiment, after the display substrate D is inserted into the chamber 11, the gate valve 111 can be closed. In an embodiment, the first deposition mask 17 and the second deposition mask 18 can be held by the first mask holding unit 15 and the second mask holding unit 16, respectively.

[0086] Referring to Figure 6B and Figure 6C In a first operation S1, the first deposition mask 17 and the display substrate D can be aligned and combined with each other.

[0087] Referring to Figure 6B ​After the mobile unit 12 and the display substrate D are positioned in the first area Z1, the first alignment unit 13 can operate to align the display substrate D and the first deposition mask 17 with each other. In an embodiment, the first mask moving portion 133 of the first alignment unit 13 can be elongated in the +z direction to pick up the first deposition mask 17, and the first substrate moving portion 132 of the first alignment unit 13 can be elongated in the +z direction to pick up the display substrate D. In an embodiment, the first aligner 131 can photograph alignment marks provided on the display substrate D and the first deposition mask 17, respectively. In an embodiment, the first mask moving portion 133 can adjust the position of the first deposition mask 17, and the first substrate moving portion 132 can adjust the position of the display substrate D, similar to the manner described above, thereby aligning the first deposition mask 17 and the display substrate D with each other. In an embodiment, the alignment marks can be used as a standard for aligning the first deposition mask 17 and the display substrate D with each other.

[0088] Referring to Figure 6C , the first deposition mask 17 and the display substrate D can be brought close to each other. In an embodiment, after the first deposition mask 17 and the display substrate D are aligned with each other, the first substrate moving portion 132 can be shortened in the z direction to lower the display substrate D and place the display substrate D on the base 121. In this case, the display substrate D can directly contact a surface (e.g., an upper surface) of the base 121. In an embodiment, the first mask moving portion 133 can be shortened in the z direction to lower the first deposition mask 17 and place the first deposition mask 17 on the display substrate D. In this case, the first deposition mask 17 can directly contact a surface (e.g., an upper surface) of the display substrate D. In an embodiment, a magnetic force can be applied to the first deposition mask 17 in the -z direction by a magnetic force portion (not shown) provided in the chamber 11, to bring the first deposition mask 17 closer to the display substrate D. Accordingly, the first deposition mask 17 and the display substrate D can be combined with each other on the base 121.

[0089] Thereafter, the first deposition mask 17 and the display substrate D can be moved to the third area Z3 together with the mobile unit 12. In other words, the mobile unit 12, the first deposition mask 17, and the display substrate D can be moved as one to the third area Z3.

[0090] Referring to Figure 6DIn the second operation S2, an operation of depositing an inorganic film can be performed. In an embodiment, before the deposition is performed, the pressure in the chamber 11 can be set to a vacuum or a pressure similar to a vacuum by a pressure regulator (not shown) provided in the apparatus 10 for manufacturing a display device. In an embodiment, chemical vapor deposition (CVD) can be used in the second operation S2. In this case, the deposition unit 19 can operate to diffuse a deposition material in a gaseous state or a vapor state toward the first deposition mask 17 and the display substrate D. In an embodiment, the deposition material can include an inorganic material. Thereafter, or substantially simultaneously, the susceptor 121 can be heated by a heat source provided in the susceptor 121, and the display substrate D in contact with the susceptor 121 can also be heated. In this case, a portion of a surface of the display substrate D overlapping the first openings 17-1 (see Figure 4A ) of the first deposition mask 17 can contact the deposition material. The deposition material can cause a chemical reaction with or on the surface of the display substrate D that has been heated, and a film can be formed on the display substrate D. In an embodiment, the film can be a first inorganic film. In this regard, the first deposition mask 17 can provide a deposition area that is the same as or similar to a predetermined deposition area through the first openings 17-1 (see Figure 4A ). In an embodiment, in order to form a thicker first inorganic film, the moving unit 12, and the first deposition mask 17 and the display substrate D combined with each other on the moving unit 12 can reciprocate in two directions (e.g., left and right) as the deposition material continues to diffuse in the deposition unit 19.

[0091] Thereafter, the first deposition mask 17 and the display substrate D can be moved to the first area Z1 together with the moving unit 12. In other words, the moving unit 12, the first deposition mask 17, and the display substrate D can be moved as one to the first area Z1. In this regard, the first inorganic film can be formed on the display substrate D.

[0092] Referring to Figure 6E , the first deposition mask 17 can be separated from the display substrate D. For example, in an embodiment, the first mask moving portion 133 of the first alignment unit 13 can operate to separate the first deposition mask 17 from the display substrate D. In an embodiment, for example, while the display substrate D is held on the susceptor 121, the first mask moving portion 133 can be elongated to move the first deposition mask 17 in the +z direction. In an embodiment, the first mask moving portion 133 can be further elongated to dispose (e.g., seat) the first deposition mask 17 on the first mask holding unit 15. The process of disposing (e.g., seating) the first deposition mask 17 on the first mask holding unit 15 can be the same as the process described above with reference to Figure 4A , Figure 4B , and Figure 5The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17. The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17 while the first substrate moving portion 132 is elongated in the +z direction to pick up the display substrate D. The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17 while the first substrate moving portion 132 is elongated in the +z direction to pick up the display substrate D and the first alignment unit 131 is operated to align the first deposition mask 17 and the display substrate D with each other. The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17 while the first substrate moving portion 132 is elongated in the +z direction to pick up the display substrate D and the first alignment unit 131 is operated to align the first deposition mask 17 and the display substrate D with each other, and the first deposition mask 17 and the display substrate D are moved to the first region Zl. The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17 while the first substrate moving portion 132 is elongated in the +z direction to pick up the display substrate D and the first alignment unit 131 is operated to align the first deposition mask 17 and the display substrate D with each other, and the first deposition mask 17 and the display substrate D are moved to the first region Zl, and the first deposition mask 17 and the display substrate D are combined with each other on the base 121. The first mask moving portion 133 can be elongated in the +z direction to pick up the first deposition mask 17 while the first substrate moving portion 132 is elongated in the +z direction to pick up the display substrate D and the first alignment unit 131 is operated to align the first deposition mask 17 and the display substrate D with each other, and the first deposition mask 17 and the display substrate D are moved to the first region Zl, and the first deposition mask 17 and the display substrate D are combined with each other on the base 121, and the first deposition mask 17 and the display substrate D are aligned with each other.

[0093] Thereafter, the display substrate D can be moved to the second region Z2 together with the moving unit 12. In other words, the moving unit 12 and the display substrate D can be moved as one to the second region Z2. In this regard, the first inorganic film can be formed on the display substrate D.

[0094] Reference is made to Figure 6F and Figure 6G In the third operation S3, the second deposition mask 18 and the display substrate D can be aligned and combined with each other.

[0095] Reference is made to Figure 6F After the moving unit 12 and the display substrate D are positioned in the second region Z2, the second alignment unit 14 can be operated to align the display substrate D and the second deposition mask 18 with each other. In an embodiment, the second mask moving portion 143 of the second alignment unit 14 can be elongated in the +z direction to pick up the second deposition mask 18, and the second substrate moving portion 142 of the second alignment unit 14 can be elongated in the +z direction to pick up the display substrate D. In an embodiment, the second aligner 141 can photograph alignment marks respectively provided on the display substrate D and the second deposition mask 18. In an embodiment, the second mask moving portion 143 can adjust the position of the second deposition mask 18 and the second substrate moving portion 142 can adjust the position of the display substrate D, similar to the manner described above, thereby aligning the second deposition mask 18 and the display substrate D with each other. In an embodiment, the alignment marks can be used as a standard to align the second deposition mask 18 and the display substrate D with each other.

[0096] Reference is made to Figure 6G The second deposition mask 18 and the display substrate D can be brought close to each other. In an embodiment, after the second deposition mask 18 and the display substrate D are aligned with each other, the second substrate moving portion 142 can be shortened in the z direction to lower the display substrate D and to further place the display substrate D on the base 121. In this case, the display substrate D can directly contact a surface (e.g., an upper surface) of the base 121. In an embodiment, the second mask moving portion 143 can be shortened in the z direction to lower the second deposition mask 18 and to further place the second deposition mask 18 on the display substrate D. In this case, the second deposition mask 18 can directly contact a surface (e.g., an upper surface) of the display substrate D. In an embodiment, by a magnetic force portion (not shown) provided in the chamber 11, a magnetic force can be applied to the second deposition mask 18 in the -z direction to bring the second deposition mask 18 closer to the display substrate D. Accordingly, the second deposition mask 18 and the display substrate D can be combined with each other on the base 121.

[0097] Thereafter, the second deposition mask 18 and the display substrate D can be moved to the third region Z3 together with the moving unit 12. In other words, the moving unit 12, the second deposition mask 18, and the display substrate D can be moved as one to the third region Z3. In this regard, the first inorganic film can be formed on the display substrate D.

[0098] Reference Figure 6H In the fourth operation S4, an operation of depositing an organic film can be performed. In an embodiment, before the deposition is performed, the pressure in the chamber 11 can be set to a vacuum or a pressure similar to a vacuum by a pressure regulator (not shown) provided in the apparatus 10 for manufacturing a display device. In an embodiment, CVD can be used in the fourth operation S4. In this case, the deposition unit 19 can operate to diffuse a deposition material in a gaseous state or a vapor state toward the second deposition mask 18 and the display substrate D. In an embodiment, the deposition material can include an organic material. Thereafter, or substantially simultaneously, the susceptor 121 can be heated by a heat source provided in the susceptor 121, and the display substrate D in contact with the susceptor 121 can also be heated. In this case, a portion of a surface of the display substrate D overlapping the second openings 18-1 (see Figure 4A ) of the second deposition mask 18 can contact the deposition material. The deposition material can cause a chemical reaction with or on the surface of the display substrate D that has been heated, and a film can be formed on the display substrate D. In an embodiment, the film can be a first organic film. In an embodiment, the first organic film can be formed on the first inorganic film. In this regard, the second deposition mask 18 can provide the same or similar deposition region as the predetermined deposition region through the second openings 18-1 (see Figure 4A ). In an embodiment, in order to form a thicker first organic film, the moving unit 12, and the second deposition mask 18 and the display substrate D combined with each other on the moving unit 12 can reciprocate in two directions (e.g., left and right) as the deposition material continues to diffuse in the deposition unit 19.

[0099] Thereafter, the second deposition mask 18 and the display substrate D can be moved to the second region Z2 together with the moving unit 12. In other words, the moving unit 12, the second deposition mask 18, and the display substrate D can be moved as one to the second region Z2. In this regard, the first inorganic film and the first organic film can be formed on the display substrate D.

[0100] Reference Figure 6IThe second deposition mask 18 can be separated from the display substrate D. In an embodiment, the second mask moving portion 143 of the second alignment unit 14 can operate to separate the second deposition mask 18 from the display substrate D. In one embodiment, for example, when the display substrate D is held on the base 121, the second mask moving portion 143 can be elongated to move the second deposition mask 18 in the +z direction. In an embodiment, the second mask moving portion 143 can be further elongated to dispose (e.g., seat) the second deposition mask 18 on the second mask holding unit 16. The process of disposing (e.g., seating) the second deposition mask 18 on the second mask holding unit 16 is the same as described above with reference to Figure 4A 、 Figure 4B and Figure 5 Thereafter, the second mask moving portion 143 can be shortened in the z direction to return to the initial position.

[0101] Thereafter, the display substrate D can be moved with the moving unit 12 back to the first region Z1. In other words, the moving unit 12 and the display substrate D can be moved as one to the first region Z1. In this regard, the first inorganic film and the first organic film can be formed on the display substrate D.

[0102] Referring to Figure 6J , in the fifth operation S5, the first deposition mask 17 and the display substrate D can be aligned and combined with each other. The process of aligning and combining the first deposition mask 17 and the display substrate D with each other can be substantially the same as described above with reference to Figure 6B and Figure 6C In this regard, the first inorganic film and the first organic film can be formed on the display substrate D.

[0103] Thereafter, the first deposition mask 17 and the display substrate D can be moved with the moving unit 12 to the third region Z3. In other words, the moving unit 12, the first deposition mask 17, and the display substrate D can be moved as one to the third region Z3. In this regard, the first inorganic film and the first organic film can be formed on the display substrate D.

[0104] Referring to Figure 6K , in the sixth operation S6, an operation of depositing an inorganic film can be performed. The operation of forming the inorganic film can be substantially the same as described above with reference to Figure 6D In this regard, the first inorganic film and the first organic film can be formed on the display substrate D. The second inorganic film can be formed on the first organic film by the sixth operation S6.

[0105] Thereafter, the first deposition mask 17 and the display substrate D can be moved to the first region Z1 together with the moving unit 12. In other words, the moving unit 12, the first deposition mask 17, and the display substrate D can be moved as one to the first region Z1. In this regard, the first inorganic film, the first organic film, and the second inorganic film can be formed on the display substrate D.

[0106] Referring to Figure 6L , the first deposition mask 17 can be separated from the display substrate D. The process of separating the first deposition mask 17 from the display substrate D can be substantially the same as described above with reference to Figure 6E .

[0107] Referring to Figure 6M , in the seventh operation S7, the display substrate D can be taken out of the chamber 11. In an embodiment, the gate valve 111 can be opened, and the display substrate D can be taken out of the chamber 11 by a separate member (e.g., a mechanical arm) that moves the display substrate D. In this regard, the first inorganic film, the first organic film, and the second inorganic film can be sequentially arranged on the display substrate D.

[0108] Figure 6A to Figure 6M The process of forming two inorganic films and one organic film is exemplified, but the present disclosure is not limited thereto. In another embodiment, some of the processes described above can be repeatedly performed to form M inorganic films (where M is a natural number of 1 or more) and / or N organic films (where N is a natural number of 1 or more).

[0109] Figure 7 is a plan view of an embodiment of a portion of a display device 20 manufactured by the apparatus 10 for manufacturing a display device. Figure 8 is a cross-sectional view of an embodiment of a portion of a display device 20 manufactured by the apparatus 10 for manufacturing a display device.

[0110] Referring to Figure 7 and Figure 8 , the display device 20 can include a display area DA defined on the substrate 21 and a non-display area NDA outside the display area DA. Light emitting devices LED can be disposed in the display area DA, and a power wiring (not shown) can be disposed in the non-display area NDA. In addition, a pad portion (not shown) can be disposed in the non-display area NDA. A plurality of deposition material patterns can be arranged in the display area DA.

[0111] The display device 20 can include a display substrate D and a thin film encapsulation layer TFE disposed on the display substrate D. The display substrate D can include the substrate 21, a thin film transistor TFT, a via layer 28, and a light emitting device LED.

[0112] The substrate 21 can include or consist of a plastic material or a metallic material. In addition, the substrate 21 can include or consist of polyimide. A thin film transistor TFT can be provided on the substrate 21, a via layer 28 can be provided to cover the thin film transistor TFT, and a light emitting device LED can be provided on the via layer 28.

[0113] A buffer layer 22 including or consisting of an organic compound and / or an inorganic compound can be further provided on the upper surface of the substrate 21, and the buffer layer 22 can include SiO x (where x ≥ 1) and / or SiN x (where x ≥ 1) or consist of SiO x (where x ≥ 1) and / or SiN x (where x ≥ 1).

[0114] After the active layer 23 provided in a predetermined pattern is provided on the buffer layer 22, the active layer 23 can be buried by a gate insulating layer 24. The active layer 23 can have a source region and a drain region, and can further include a channel region therebetween. The active layer 23 can be formed to include or consist of various materials. In an embodiment, the active layer 23 can include or consist of an inorganic semiconductor material such as amorphous silicon or crystalline silicon. In another embodiment, the active layer 23 can include or consist of an oxide semiconductor. In another embodiment, the active layer 23 can include or consist of an organic semiconductor material. However, for convenience of description, hereinafter, a case in which the active layer 23 includes or consists of amorphous silicon will be mainly described in detail.

[0115] The active layer 23 can be formed by forming an amorphous silicon film on the buffer layer 22, crystallizing the amorphous silicon film to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. The source region and the drain region of the active layer 23 can be doped with impurities according to the type of the thin film transistor such as a driving thin film transistor or a switching thin film transistor.

[0116] A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 burying the gate electrode 25 can be provided on the upper surface of the gate insulating layer 24. After a contact hole is defined in the interlayer insulating layer 26 and the gate insulating layer 24, a source electrode 271 and a drain electrode 272 can be disposed on the interlayer insulating layer 26 to contact the source region and the drain region of the active layer 23, respectively.

[0117] The via layer 28 can be provided on the thin film transistor TFT, and a pixel electrode 301 of the light emitting device LED can be disposed on the via layer 28. The via layer 28 can include a first via layer 281 that buries the source electrode 271 and the drain electrode 272, and a second via layer 282 on the first via layer 281. The via layer 28 (e.g., the first via layer 281 and the second via layer 282) can include or consist of inorganic materials and / or organic materials. The via layer 28 can be formed as a planarization film such that its upper surface is flat regardless of the curvature of the film thereunder, or can be curved along the curvature of the film thereunder.

[0118] A via can be defined in the first via layer 281, and at least a portion of the contact metal CM can be provided in the via of the first via layer 281. A via can also be defined in the second via layer 282, and a portion of the pixel electrode 301 can be provided in the via of the second via layer 282. The pixel electrode 301 can contact the drain electrode 272 of the thin film transistor TFT through the via defined in the via layer 28. In an embodiment, for example, the contact metal CM can contact the drain electrode 272 through the via defined in the first via layer 281, and the pixel electrode 301 can contact the contact metal CM through the via defined in the second via layer 282, such that the pixel electrode 301 is connected to the drain electrode 272.

[0119] After the pixel electrode 301 is provided on the via layer 28, the pixel defining film 29 can include or consist of organic materials and / or inorganic materials to cover the pixel electrode 301 and the via layer 28, and can be open to expose a portion of the pixel electrode 301.

[0120] The intermediate layer 302 and the counter electrode 303 can be disposed on the pixel electrode 301. In an embodiment, the counter electrode 303 can be provided on the intermediate layer 302 and the pixel defining film 29. The pixel electrode 301 can serve as an anode, and the counter electrode 303 can serve as a cathode. However, the polarity of the pixel electrode 301 and the counter electrode 303 can be reversed. The pixel electrode 301 and the counter electrode 303 can be insulated from each other by the intermediate layer 302, and different polarity voltages can be applied to the intermediate layer 302 to allow light to be emitted from the organic emission layer.

[0121] The intermediate layer 302 can include an organic emission layer. In another alternative example, the intermediate layer 302 can include an organic emission layer, and can further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The illustrated embodiment is not limited thereto, and the intermediate layer 302 can include an organic emission layer, and can further include various other functional layers (not shown).

[0122] One unit pixel can be composed of a plurality of sub-pixels, and the plurality of sub-pixels can emit light of various colors. In an embodiment, for example, the plurality of sub-pixels can include sub-pixels that respectively emit red light, green light, and blue light, and can include sub-pixels (not shown) that respectively emit red light, green light, blue light, and white light. The sub-pixel as described above can include one intermediate layer 302.

[0123] The thin film encapsulation layer TFE can be provided to cover the light emitting device LED. The thin film encapsulation layer TFE can include a plurality of inorganic layers or can include inorganic layers and organic layers. The inorganic layer of the thin film encapsulation layer TFE can be a single layer film or a stacked film including a metal oxide or a metal nitride. In an embodiment, for example, the inorganic layer can include any one of SiN x , Al2O3, SiO2, and TiO2. The organic layer of the thin film encapsulation layer TFE can include or consist of a polymer, and can be a single layer film or a stacked film including or consisting of any one of, for example, polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, and polyacrylate. In an embodiment, the uppermost layer of the thin film encapsulation layer TFE exposed to the outside can be formed as an inorganic layer to prevent moisture from penetrating into the light emitting device LED.

[0124] The thin film encapsulation layer TFE can be formed by the apparatus 10 for manufacturing a display device described above. In an embodiment, for example, the thin film encapsulation layer TFE can include a first inorganic encapsulation layer 311 covering the counter electrode 303, an organic encapsulation layer 312 on the first inorganic encapsulation layer 311, and a second inorganic encapsulation layer 313 on the organic encapsulation layer 312. In this case, the first inorganic film, the first organic film, and the second inorganic film described above with reference to Figure 6A to Figure 6M the first inorganic film, the first organic film, and the second inorganic film described above with reference to

[0125] According to embodiments, an apparatus and a method for manufacturing a display device can be provided in which an inorganic film and an organic film of a thin film encapsulation layer can be formed in one chamber.

[0126] Accordingly, since a chamber for forming an inorganic film and a chamber for forming an organic film need not be separately provided, the number of facilities and the cost incurred can be reduced.

[0127] In addition, since an inorganic film and an organic film can be formed in a single chamber without the need to move a substrate between a chamber for forming an inorganic film and a chamber for forming an organic film, the manufacturing time can also be shortened.

[0128] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable to other similar features or aspects in other embodiments. While embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims.

Claims

1. An apparatus for manufacturing a display device, characterized by comprising: The apparatus includes: a chamber including a first area, a second area, and a third area; a first deposition mask disposed in the first area; a second deposition mask disposed in the second area; a deposition unit disposed in the third area; and a susceptor configured to reciprocate between the first area, the second area, and the third area.

2. The apparatus of claim 1, wherein, The first area, the second area, and the third area are arranged along a linear path or a circular arc path, the third area is disposed between the first area and the second area, and The first deposition mask is an inorganic film deposition mask, and the second deposition mask is an organic film deposition mask.

3. The apparatus of claim 1, wherein, The apparatus further includes: a first alignment unit disposed in the first area; and a second alignment unit disposed in the second area.

4. The apparatus of claim 3, wherein, At least one of the first alignment unit and the second alignment unit includes: a mask moving part configured to raise and lower a mask; and a substrate moving part configured to raise and lower a substrate.

5. The apparatus of claim 4, wherein, The mask moving part and the substrate moving part are configured to elongate and contract in a predetermined direction.

6. The apparatus of claim 3, wherein, The apparatus further includes: a first mask holding unit disposed in the first area and facing the first alignment unit; and a second mask holding unit disposed in the second area and facing the second alignment unit.

7. The apparatus of claim 6, wherein, At least one of the first mask holding unit and the second mask holding unit includes a plurality of mask holders that are bent and rotatable.

8. The apparatus of claim 6, wherein, The deposition unit is arranged on the same surface of the chamber as at least one of the first mask holding unit and the second mask holding unit.

9. The apparatus of claim 1, wherein, A first opening is defined in the first deposition mask, a second opening is defined in the second deposition mask, and The first opening and the second opening respectively have different sizes from each other.

10. The apparatus of claim 1, wherein, The apparatus further includes a buffer plate attached to at least one of opposite sides of the susceptor.

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