Chip packaging structure

Abstract

The embodiment of the utility model provides a chip packaging structure, and relates to the technical field of chip packaging, the chip packaging structure comprises a substrate, a chip, a heat radiation cover and a plastic packaging body, the substrate is provided with a first grounding pad and a second grounding pad; the chip is mounted on the substrate; the heat dissipation cover is arranged on the substrate and attached to the back face of the chip. The plastic package body is arranged on the substrate and wraps the heat dissipation cover. Wherein the edge of the heat dissipation cover is provided with a pin bending part, the pin bending part is bent towards the direction far away from the substrate from the edge of the heat dissipation cover, the space between the pin bending part and the substrate is filled with the plastic package body, the edge of the heat dissipation cover is connected to the first grounding bonding pad, and the pin bending part is electrically connected to the second grounding bonding pad. Compared with the prior art, the electric connection performance between the heat dissipation cover and the substrate can be improved, the electrostatic discharge performance and the electrostatic shielding effect of the packaging structure are ensured, meanwhile, the welding combination stability is improved, the structure is stable, and desoldering is not prone to occurring.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, specifically, a kind of chip packaging structure. BACKGROUND

[0002] With the rapid development of semiconductor industry, SIP system-in-package adopts FC-BGA package product, which provides higher density I / O layout using flip chip bump. In actual packaging, heat dissipation and electrostatic shielding are usually achieved by mounting heat dissipation cover. The traditional heat dissipation cover realizes pin welding with the substrate by using conductive silver paste. However, the conductive silver paste has non-conductive filler, which leads to large resistance value and affects the electrostatic shielding and discharge performance. In addition, in the prior art, the conductive silver paste and the pad welding performance cannot form an intermetallic compound layer with the pin metal due to the non-conductive filler welding deposition, which leads to a decrease in welding bonding performance. SUMMARY

[0003] The utility model aims to provide a kind of chip packaging structure, which can improve the electrical connection performance between heat dissipation cover and substrate, ensure the electrostatic discharge performance and electrostatic shielding effect of packaging structure, and improve the welding bonding stability, with stable structure and less risk of soldering.

[0004] The embodiments of the utility model can be implemented as follows:

[0005] In a first aspect, the utility model provides a kind of chip packaging structure, comprising:

[0006] A substrate is provided with a first ground pad and a second ground pad;

[0007] A chip is mounted on the substrate;

[0008] A heat dissipation cover is arranged on the substrate and is attached to the back of the chip;

[0009] A plastic package is arranged on the substrate and covers the outside of the heat dissipation cover;

[0010] Wherein, the edge of the heat dissipation cover is provided with a pin bending part, the pin bending part is bent from the edge of the heat dissipation cover towards the direction away from the substrate, the plastic package is filled between the pin bending part and the substrate, the edge of the heat dissipation cover is connected to the first ground pad, and the pin bending part is electrically connected to the second ground pad.

[0011] In an optional embodiment, the second ground pad is arranged apart from the first ground pad and located on the side of the first ground pad away from the chip.

[0012] In an optional embodiment, a connecting wire is arranged on the pin bending part, and the connecting wire is connected to the second ground pad.

[0013] In an optional embodiment, at least one first groove is arranged on a side of the pin bending part close to the substrate, and the plastic package extends into the first groove.

[0014] In an optional embodiment, the pin bending part comprises a bending segment and a straight segment, one end of the bending segment is connected to an edge of the heat dissipation cover, the straight segment is connected to the other end of the bending segment, the first groove is arranged on a side of the straight segment close to the substrate, and the connecting wire is arranged on the straight segment.

[0015] In an optional embodiment, at least one second groove is arranged on a side of the bending segment close to the substrate, and the second groove is arranged at intervals with the first groove.

[0016] In an optional embodiment, the first groove and the second groove have the same depth.

[0017] In an optional embodiment, the chip is flip-chip mounted on the substrate, a front surface of the chip is provided with a solder bump, the substrate is provided with a connecting pad, and the solder bump is correspondingly soldered on the connecting pad.

[0018] In an optional embodiment, a heat dissipation layer is arranged between an inner side surface of the heat dissipation cover and a back surface of the chip.

[0019] In an optional embodiment, a filling glue layer is further arranged between the chip and the substrate, and the filling glue layer covers outside the solder bump.

[0020] The chip packaging structure provided by the embodiment of the utility model has the beneficial effects that:

[0021] The chip packaging structure provided in this embodiment of the present invention includes a first ground pad and a second ground pad on a substrate. A chip is mounted on the substrate, and a heat sink is disposed on the substrate and attached to the back of the chip. A molding compound is disposed on the substrate and covers the heat sink. The edge of the heat sink has a lead bending portion that bends away from the substrate. The molding compound fills the space between the lead bending portion and the substrate. The edge of the heat sink is connected to the first ground pad, and the lead bending portion is electrically connected to the second ground pad. Compared to existing technologies, the chip packaging structure provided in this embodiment of the present invention, by additionally designing the second ground pad and the lead bending portion, and ensuring the lead bending portion is electrically connected to the second ground pad, improves the electrical connection performance between the heat sink and the substrate, ensuring the electrostatic discharge performance and electrostatic shielding effect of the packaging structure. Furthermore, the molding compound fills the space between the lead bending portion and the substrate, resulting in better bonding between the heat sink, the molding compound, and the substrate, thereby improving the stability of the solder joint, making the structure stable and less prone to desoldering. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a cross-sectional view of the chip packaging structure provided in this embodiment;

[0024] Figure 2 for Figure 1 A partially enlarged schematic diagram of section II;

[0025] Figure 3 This is a top view of the chip packaging structure provided in this embodiment;

[0026] Figures 4 to 8 This is a process flow diagram of the method for fabricating the chip packaging structure provided in this embodiment.

[0027] Icons: 100 - Chip package structure; 110 - Substrate; 111 - First ground pad; 113 - Second ground pad; 115 - Connecting pad; 117 - Solder ball; 130 - Chip; 131 - Solder bump; 133 - Thermal adhesive layer; 135 - Filler adhesive layer; 150 - Heat sink; 170 - Molded package; 190 - Lead bend; 191 - Connecting wire; 193 - First groove; 195 - Second groove; 197 - Bending section; 199 - Straight section. Detailed Implementation

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0030] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0031] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application.

[0032] In addition, if the terms "first", "second" and the like are used only to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] As disclosed in the background art, the prior art uses a method of attaching a heat dissipation cover for heat dissipation and electrostatic shielding, and the conventional heat dissipation cover uses conductive silver paste for heat dissipation cover pin welding, and the conductive silver paste has non-conductive fillers, which causes the resistance value to be large, affecting the electrostatic shielding and electrostatic discharge performance.

[0034] In addition, in the prior art, the structure between the conductive silver paste and the solder pad is deposited by non-conductive fillers, so that the heat dissipation cover cannot form an intermetallic compound layer with the pin metal, resulting in a decrease in the welding bonding performance, and further causing the welding structure to be unstable and prone to welding failure.

[0035] To solve the above problems, the utility model embodiment provides a kind of novel chip packaging structure, the basic structure and working principle of the chip packaging structure are introduced in detail below.It should be noted that the features in the embodiments of the utility model can be combined with each other without conflict.

[0036] Referring to Figures 1 to 3 The utility model embodiment provides a kind of chip packaging structure 100, which can improve the electrical connection performance between the heat dissipation cover 150 and the substrate 110, ensure the electrostatic discharge performance and electrostatic shielding effect of the packaging structure, and improve the welding combination stability, with stable structure and not easy to be de-soldered.

[0037] The utility model embodiment provides a kind of chip packaging structure 100, including substrate 110, chip 130, heat dissipation cover 150 and plastic package body 170, and first ground pad 111 and second ground pad 113 are provided on substrate 110;Chip 130 is attached on substrate 110;Heat dissipation cover 150 is set on substrate 110, and is attached on the back of chip 130;Plastic package body 170 is set on substrate 110, and is covered in heat dissipation cover 150 outside;Wherein, the edge of heat dissipation cover 150 is provided with pin bending part 190, pin bending part 190 is bent from the edge of heat dissipation cover 150 towards the direction away from substrate 110, plastic package body 170 is filled between pin bending part 190 and substrate 110, the edge of heat dissipation cover 150 is connected to first ground pad 111, and pin bending part is electrically connected to second ground pad 113.

[0038] It is worth noting that the chip packaging structure 100 provided by the utility model embodiment can improve the electrical connection performance between the heat dissipation cover 150 and the substrate 110 by additionally designing the second ground pad 113 and the pin bending part 190, and the pin bending part 190 is electrically connected to the second ground pad 113, so as to ensure the electrostatic discharge performance and electrostatic shielding effect of the packaging structure, and the plastic package body 170 can be filled between the pin bending part 190 and the substrate 110, so that the combination between the heat dissipation cover 150, the plastic package body 170 and the substrate 110 is better, and the welding combination stability is improved, with stable structure and not easy to be de-soldered.

[0039] It should be noted that the basic structure of the heat dissipation cover 150 is consistent with the conventional heat dissipation cover 150, which includes a center bearing part and an edge support part formed integrally, the center bearing part can be circular and attached to the back of the chip 130, and the edge support part is located at the edge of the center bearing part and bent downward relative to the center bearing part and connected to the first connection pad 115 on the substrate 110.

[0040] In some embodiments, the second ground pad 113 is arranged apart from the first ground pad 111 and is located on a side of the first ground pad 111 away from the chip 130. Specifically, the second ground pad 113 can be four, and the four second ground pads 113 are arranged at the four top corners of the edge foot portion and are located on the peripheral side opposite the first ground pad 111, so that the pin bending portion can be arranged close to the second ground pad 113 to facilitate electrical connection therebetween.

[0041] In some embodiments, a connecting wire 191 is arranged on the pin bending portion and is connected to the second ground pad 113. Specifically, the connecting wire 191 can be formed by wire bonding on the pin bending portion to be connected to the second ground pad 113. By arranging the connecting wire 191, the electrical connection between the pin bending portion and the second ground pad 113 can be better achieved, and the grounding effect is better, thereby improving the electrostatic shielding and electrostatic discharge performance of the heat dissipation cover 150. At the same time, the connecting wire 191 can reduce the grounding resistance and improve the electrostatic discharge performance.

[0042] Of course, in other preferred embodiments of the present application, the pin bending portion can also be electrically connected to the second ground pad 113 by a conductive metal column. The form of electrical connection between the pin bending portion and the second ground pad 113 is not specifically limited herein.

[0043] In some embodiments, at least one first groove 193 is arranged on a side of the pin bending portion 190 close to the substrate 110, and the plastic package 170 extends into the first groove 193. Specifically, the first groove 193 can be two, and the two first grooves 193 are arranged adjacent to each other. When the plastic package 170 is formed, the plastic sealing material can extend and fill into the first groove 193. By arranging the first groove 193, the bonding performance between the pin bending portion 190 and the plastic package 170 can be greatly improved, so that the plastic package 170, the substrate 110 and the heat dissipation cover 150 can be better combined into one body, so that the stability of the welding structure is enhanced and the welding stability is improved.

[0044] In some embodiments, the pin bending portion 190 includes a bending segment 197 and a straight segment 199, one end of the bending segment 197 is connected to the edge of the heat dissipation cover 150, the straight segment 199 is connected to the other end of the bending segment 197, the first groove 193 is arranged on a side of the straight segment 199 close to the substrate 110, and the connecting wire 191 is arranged on the straight segment 199. Specifically, the bending segment 197 and the straight segment 199 are integrally formed, the straight segment 199 is parallel to the substrate 110, and the bending segment 197 is bent upward from the substrate 110. By arranging the straight segment 199, the wire bonding process can be better achieved, and the connecting wire 191 can be conveniently connected to the straight segment 199.

[0045] In some embodiments, the bending section 197 is further provided with at least one second groove 195 on the side close to the substrate 110, and the second groove 195 is spaced from the first groove 193. Specifically, the second groove 195 can be two, and the plastic sealing material can be filled into the second groove 195, so as to further improve the combination between the plastic sealing body 170 and the pin bending part 190.

[0046] In some embodiments, the first groove 193 and the second groove 195 have the same depth. Specifically, the first groove 193 and the second groove 195 have the same depth, so that they can be formed at the same time when grooving, thereby simplifying the process steps. The bending section 197 and the straight section 199 can be formed by grooving and then bending.

[0047] In some embodiments, the chip 130 is flip-chip mounted on the substrate 110, the front surface of the chip 130 is provided with a solder bump 131, the substrate 110 is provided with a connection pad 115, and the solder bump 131 is soldered on the connection pad 115. Specifically, the chip 130 is designed in a flip-chip manner, which can provide a higher density of I / O layout.

[0048] In some embodiments, a heat dissipation layer is arranged between the inner side surface of the heat dissipation cover 150 and the back surface of the chip 130. Specifically, the back surface of the chip 130 is provided with a heat dissipation layer, which can be sintered silver paste or high-heat-dissipation epoxy resin, etc.

[0049] In some embodiments, a filling glue layer 135 is further arranged between the chip 130 and the substrate 110, and the filling glue layer 135 covers the outside of the solder bump 131. The filling glue layer 135 can be formed by a dispensing process, which can effectively protect the bottom solder structure. The side of the substrate 110 away from the chip 130 is further provided with a tin ball 117, and the tin ball 117 is used to realize electrical connection and signal transmission with an external circuit board.

[0050] The embodiment of the utility model further provides a preparation method of the chip packaging structure 100, which is used for preparing the aforementioned chip packaging structure 100. The preparation method comprises the following steps:

[0051] Step one: referring to Figure 4 , a substrate 110 is taken, the chip 130 is mounted by a flip-chip manner, the solder bump 131 of the chip 130 is soldered with the connection pad 115 by a reflow soldering manner (the bump is fixed with the pad by a reflow soldering manner), the filling glue layer 135 at the bottom is formed at the bottom of the flip-chip soldering structure by a dispensing process, plays a filling protection role, and finally the filling glue layer 135 is fixed by a baking manner.

[0052] Step two: referring to Figure 5A heat dissipation glue layer 133 is coated on the back of the chip 130, the heat dissipation glue layer 133 can be a high heat dissipation glue layer 133, sintered silver paste or high heat dissipation epoxy resin, etc., then a heat dissipation cover 150 is attached, the edge of the heat dissipation cover 150 is fixed on the first ground pad 111 through conductive glue, then the heat dissipation cover 150 is fixed through baking. The heat dissipation cover 150 can be prepared in advance with a pin bending part 190, a first groove 193 and a second groove 195.

[0053] Step three: refer to Figure 6 The pin bending part 190 of the heat dissipation cover 150 is wired, the pin bending part 190 of the heat dissipation cover 150 is grounded through the connecting wire 191, and is specifically connected to the second ground pad 113, so that the electrical performance is improved, and the grounding resistance is reduced, so that the grounding performance is improved.

[0054] Step four: refer to Figure 7 The plastic package body 170 is formed again by using the plastic package process, and the plastic package body 170 fills the bottom area of the heat dissipation cover 150.

[0055] Step five: refer to Figure 8 The tin ball 117 is formed on the back of the substrate 110 by using the ball planting process, and then the product is cut into a single product by using the cutting process.

[0056] In summary, the chip packaging structure 100 provided in the embodiment of the utility model, the first ground pad 111 and the second ground pad 113 are designed on the substrate 110, the chip 130 is attached on the substrate 110, the heat dissipation cover 150 is arranged on the substrate 110 and attached to the back of the chip 130, and the plastic package body 170 is arranged on the substrate 110 and covers the heat dissipation cover 150. Wherein, the edge of the heat dissipation cover 150 is provided with the pin bending part 190, the pin bending part 190 is bent from the edge of the heat dissipation cover 150 to the direction away from the substrate 110, the plastic package body 170 is filled between the pin bending part 190 and the substrate 110, the edge of the heat dissipation cover 150 is connected to the first ground pad 111, and the pin bending part is electrically connected to the second ground pad 113. Compared with the prior art, the chip packaging structure 100 provided in the embodiment of the utility model, by additionally designing the second ground pad 113 and the pin bending part 190, and the pin bending part 190 is electrically connected to the second ground pad 113, so that the electrical connection performance between the heat dissipation cover 150 and the substrate 110 can be improved, the electrical performance and the electrostatic shielding effect of the packaging structure are guaranteed, the plastic package body 170 can be filled between the pin bending part 190 and the substrate 110, the combination between the heat dissipation cover 150, the plastic package body 170 and the substrate 110 is better, and then the welding combination stability is improved, the structure is stable, and the welding is not easy.

[0057] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A chip package structure, characterized by, The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure.

2. The chip package structure of claim 1, wherein, The application relates to a chip package structure.

3. The chip package structure of claim 2, wherein, The application relates to a chip package structure.

4. The chip package structure of claim 3, wherein, The application relates to a chip package structure.

5. The chip package structure of claim 4, wherein, The application relates to a chip package structure.

6. The chip package structure of claim 5, wherein, The application relates to a chip package structure.

7. The chip package structure of claim 6, wherein, The application relates to a chip package structure.

8. The chip package structure of any one of claims 1-7, wherein, The application relates to a chip package structure.

9. The chip package structure of claim 8, wherein, The application relates to a chip package structure.

10. The chip package structure of claim 8, wherein, The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. The application relates to a chip package structure. 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