Alumina high-temperature co-fired ceramic with double-layer cover plate

By using a double-layer cover plate structure and parallel sealing technology, the packaging problem of irregularly shaped cover plates in traditional packaging processes has been solved, achieving a low-cost and high-efficiency packaging process.

CN223859668UActive Publication Date: 2026-01-30安徽鸿安信电子科技有限公司
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Patent Information

Application Number
CN202423102635.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2026-01-30
Estimated Expiration
2034-12-16

AI Technical Summary

Technical Problem

Traditional high-temperature co-fired ceramic packaging technology cannot meet the packaging requirements of irregularly shaped covers, resulting in high raw material costs, complex packaging processes, and the risk of device failure.

Method used

It adopts a double-layer cover structure, in which the lower cover retains its irregular shape and is embedded in the partition wall and fixed with conductive adhesive, while the upper cover has a regular shape and is encapsulated by parallel sealing, which reduces the encapsulation temperature and process difficulty.

Benefits of technology

It reduces packaging costs and process complexity, improves packaging efficiency, reduces the risk of device failure, and is suitable for mass production.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the technical scheme, the aluminum oxide high-temperature co-fired ceramic with the double-layer cover plate comprises a ceramic substrate, an enclosure frame is welded to the upper surface of the ceramic substrate, the height of an internal partition wall of the enclosure frame is reduced, the height of an outer frame of the enclosure frame is increased, and a step table is formed. The shape of an internal partition wall of the enclosure frame can be designed in various shapes according to actual tube shell radio frequency requirements and internal component distribution, an outer frame of the enclosure frame is always kept in a regular shape, a lower-layer cover plate is bonded in the outer frame of the enclosure frame, and an upper-layer cover plate is welded to the upper surface of the outer frame of the enclosure frame in parallel in a sealing mode. According to the utility model, the original special-shaped cover plate can be divided into two parts through the stepped special-shaped enclosure frame, the lower-layer cover plate retains the special-shaped characteristic to be embedded into the partition wall and is fixed by conductive adhesive and the like, and the upper-layer cover plate is a cover plate with a regular appearance and can be packaged by adopting parallel seal welding, so that the cost of the parallel seal welding is lower than that of gold-tin welding; and the process difficulty is lower.
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Description

TECHNICAL FIELD

[0001] The utility model relates to high temperature co-fired ceramic technical field, concretely is an alumina high temperature co-fired ceramic of double -deck cover plate. BACKGROUND

[0002] High temperature co-fired ceramic is the laminated together of unsintered flow cast ceramic material, and the integrated ceramic of multilayer circuit is made through high temperature sintering (usually greater than 1200 DEG C). High printing resolution, one-time sintering, dielectric layer thickness controllable, smooth surface, the number of stacking layer is unlimited, and the thermal expansion coefficient is matched with silicon semiconductor.

[0003] But the traditional band partition wall special-shaped frame needs corresponding special-shaped cover plate, and the traditional parallel seal welding can only package the cover plate of regular shape, and cannot meet the packaging requirement of the cover plate, so it is necessary to use the custom shape of gold tin solder, thereby causing the increase of raw material cost, and the packaging process of gold tin welding needs high temperature environment, if the cover plate and the special-shaped weir are welded by the gold tin welding mode, the solder preforming operation needs to be carried out in advance, and the high temperature of 300 DEG C needs to be reached during the welding, the generation efficiency is reduced, the batch production difficulty is increased, and the packaging process difficulty is increased, and the internal device of the tube shell has high temperature resistance requirement, and there is a risk of failure. UTILITY MODEL CONTENT

[0004] In view of the defects in the prior art, the utility model aims at providing an alumina high temperature co-fired ceramic with double-layer cover plate.

[0005] In order to realize the above-mentioned purpose, the utility model is technical scheme as follows:

[0006] An alumina high temperature co-fired ceramic with double-layer cover plate, comprising a ceramic substrate, a frame is welded on the upper surface of the ceramic substrate, the height of the inner partition wall of the frame is reduced, and the height of the outer frame of the frame is increased to form a stepped platform, the shape of the inner partition wall of the frame can be designed in various shapes according to the actual tube shell radio frequency requirement and the distribution of internal components, and the outer frame of the frame always maintains a regular shape, a lower cover plate is bonded in the outer frame of the frame, and an upper cover plate is parallelly welded on the upper surface of the outer frame of the frame.

[0007] Preferably, the upper cover plate is provided with a regular shape, and a regular-shaped boss is arranged in the middle of the bottom surface of the upper cover plate.

[0008] Preferably, the lower cover plate is provided with a regular shape, and the outer dimension of the lower cover plate is smaller than that of the upper cover plate.

[0009] Preferably, an irregular-shaped boss is arranged in the middle of the bottom surface of the lower cover plate, and the shape of the boss corresponds to the shape of the inner partition wall of the frame.

[0010] Preferably, the boss in the middle of the upper cover plate abuts against the lower cover plate.

[0011] Preferably, the boss of the upper cover plate is not less than three fourths of the size of the lower cover plate.

[0012] Preferably, the frame is made of 4J29 material.

[0013] Preferably, the upper cover plate and the lower cover plate are made of 4J42 material.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The utility model discloses a step-shaped special-shaped frame can divide the original special-shaped cover plate into two, the lower cover plate retains the special-shaped feature and is embedded into the partition wall, is fixed by using conductive glue etc., and the upper cover plate is the cover plate with regular shape, can adopt parallel seal welding and enclose, and the cost of parallel seal welding is lower than gold tin welding, and the process difficulty is lower, and the high-temperature resistance requirement of the device in the pipe shell is also more relaxed in the packaging process, is suitable for mass production. BRIEF DESCRIPTION OF DRAWINGS

[0016] The disclosed content of the utility model is explained with reference to the drawings. It should be understood that the drawings are only for the purpose of illustration, and are not intended to limit the protection scope of the utility model, and in the drawings, same reference signs are used to refer to same parts. Among them:

[0017] Figure 1 It is the whole structure schematic diagram of the utility model;

[0018] Figure 2 It is the structure schematic of the frame of the utility model Figure One ;

[0019] Figure 3 It is the structure schematic diagram of the upper cover plate of the utility model;

[0020] Figure 4 It is the structure schematic diagram of the lower cover plate of the utility model;

[0021] Figure 5 It is the structure schematic of the frame of the utility model Figure Two .

[0022] Marking in the drawing: 1, ceramic substrate;2, frame;3, upper cover plate;4, lower cover plate. DETAILED DESCRIPTION

[0023] It is easy to understand that according to the technical scheme of the utility model, a plurality of structure modes and implementation modes which can be replaced with each other can be proposed by the general skilled in the art without changing the utility model's essential spirit. Therefore, the following specific embodiments and drawings are only exemplary description of the technical scheme of the utility model, and should not be regarded as the whole of the utility model or regarded as the limitation or restriction of the utility model's technical scheme.

[0024] As shown in Figure 1 , the utility model discloses an alumina high-temperature co-fired ceramic of double-layer cover plate, which comprises a ceramic substrate 1, and the main material of the ceramic substrate 1 is alumina, is prepared by adopting traditional multilayer superposition high co-firing process, realizes the electrical connection characteristics and the appearance of the tube shell substrate through the operations such as punching, filling, printing and superposition, and a surrounding frame 2 is welded on the upper surface of the ceramic substrate 1 by silver copper welding or gold tin welding, the surrounding frame 2 is made of 4J29 material, as shown in Figure 5 , the inner partition wall of the surrounding frame 2 is lowered in height, and the outer frame of the surrounding frame 2 is increased in height, a height difference is generated through the design, a ladder effect is achieved, the shape of the inner partition wall of the surrounding frame 2 can be designed in various shapes according to the actual tube shell radio frequency needs and the distribution of internal components, and the outer frame of the surrounding frame 2 always maintains a regular shape, and a certain width is ensured to facilitate subsequent parallel sealing.

[0025] As shown in Figure 2 , a lower cover plate 4 is bonded in the outer frame of the surrounding frame 2, and an upper cover plate 3 is parallel sealed on the upper surface of the outer frame of the surrounding frame 2, the upper cover plate 3 is provided in a regular shape, and as shown in Figure 3 , a regular-shaped boss is arranged at the middle of the bottom surface of the upper cover plate 3, the lower cover plate 4 is provided in a regular shape, and the outer dimension of the lower cover plate 4 is smaller than that of the upper cover plate 3, so that the lower cover plate 4 can be embedded in the outer frame of the surrounding frame 2, as shown in Figure 4 , an irregular-shaped boss is arranged at the middle of the bottom surface of the lower cover plate 4, and the shape of the boss corresponds to the shape of the inner partition wall of the surrounding frame 2, so that the lower cover plate 4 retains the irregular shape, the original irregular cover plate is divided into two parts by the stepped irregular surrounding frame 2, the lower cover plate 4 retains the irregular shape to be embedded in the partition wall and is fixed by using conductive glue, and the upper cover plate 3 is a cover plate with a regular shape and can be packaged by parallel sealing, the cost of parallel sealing is lower than that of gold tin welding, the process difficulty is lower, the high-temperature resistance requirement for the internal components of the tube shell is relatively loose during the packaging process, and mass production is suitable.

[0026] The upper cover plate 3 and the lower cover plate 4 are both provided as plate bodies made of 4J42 material, the boss in the middle of the upper cover plate 3 abuts against the lower cover plate 4, thereby improving the stability of the lower cover plate 4, the size of the boss of the upper cover plate 3 is not less than three fourths of the size of the lower cover plate 4, and the stability of the lower cover plate 4 is further improved through sufficient contact area.

[0027] In use, the frame 2 is first welded and fixed on the ceramic substrate 1 through a brazing process, after the internal components of the tube shell are installed, the lower cover plate 4 is first embedded in the frame 2 and is fixed through conductive glue, then the upper cover plate 3 is buckled on the lower cover plate 4, parallel sealing process is carried out, and the ceramic packaging process is completed.

[0028] The double-layer cover plate and the special-shaped frame 2 are used for assembly, the conductive glue is used for bonding the lower cover plate 4 and the irregular frame 2 in the interior, the space isolation in the interior is ensured, then the upper cover plate 3 is used for assembly on the top through relatively fast and simple parallel sealing, the temperature in the whole process is not more than 200 DEG C, the temperature resistance requirement of the internal components of the tube shell is effectively reduced, the internal component failure caused by high temperature of gold-tin welding is avoided, and the parallel sealing is a very mature, simple and efficient sealing form, and the packaging efficiency can be effectively improved.

[0029] The technical range of the utility model is not limited to the content in the above description, and the above embodiment can be variously deformed and modified by those skilled in the art without departing from the technical thought of the utility model, and these deformations and modifications should all belong to the protection range of the utility model.

Claims

1. An aluminum oxide high temperature co-fired ceramic dual layer cap, characterized by: The application relates to a ceramic substrate (1) with a surrounding frame (2) welded on the upper surface of the ceramic substrate (1), the inner partition wall of the surrounding frame (2) is lowered in height, the outer frame of the surrounding frame (2) is increased in height to form a stepped platform, the shape of the inner partition wall of the surrounding frame (2) can be designed in various shapes according to the actual tube shell radio frequency requirement and the distribution of internal components, the outer frame of the surrounding frame (2) always keeps a regular shape, a lower cover plate (4) is bonded in the outer frame of the surrounding frame (2), and an upper cover plate (3) is parallelly sealed and welded on the upper surface of the outer frame of the surrounding frame (2).

2. The aluminum oxide HTCC according to claim 1, characterized in that: The upper cover plate (3) is provided with a regular-shaped boss in the middle of the bottom surface.

3. The aluminum oxide HTCC of a dual-layered coverlay according to claim 2, wherein: The lower cover plate (4) is provided with a regular shape, and the outer dimension of the lower cover plate (4) is smaller than that of the upper cover plate (3).

4. The aluminum oxide HTCC according to claim 3, characterized in that: The lower cover plate (4) is provided with an irregular-shaped boss in the middle of the bottom surface, and the shape of the boss corresponds to the shape of the inner partition wall of the surrounding frame (2).

5. The aluminum oxide HTCC according to claim 4, characterized in that: The boss in the middle of the upper cover plate (3) is in abutment with the lower cover plate (4).

6. The aluminum oxide HTCC according to claim 5, characterized in that: The size of the boss of the upper cover plate (3) is not less than three fourths of the outer dimension of the lower cover plate (4).

7. The aluminum oxide HTCC of claim 1, wherein: The surrounding frame (2) is made of a frame body of 4J29 material.

8. The aluminum oxide HTCC according to claim 7, characterized in that: The upper cover plate (3) and the lower cover plate (4) are made of plate bodies of 4J42 material.