Photoelectric conversion assembly based on fuzz button

Abstract

The utility model belongs to the technical field of electronic components, and particularly relates to a photovoltaic conversion assembly based on fuzz buttons, which comprises a lower shell, and the lower shell is assembled with an external component through screw locking; the AWG assembly, the PD chip and numerical control attenuator assembly, the low-temperature co-fired ceramic substrate and the fuzz button high and low frequency module are assembled in the lower shell and electrically connected in sequence, and the low-temperature co-fired ceramic substrate and the fuzz button high and low frequency module are vertically arranged in the vertical direction; the low-temperature co-fired ceramic substrate is of a multi-layer structure, and a bonding pad on the bottom layer of the low-temperature co-fired ceramic substrate is vertically connected with a fuzz button contact piece in the fuzz button high and low frequency module. According to the photovoltaic conversion assembly based on the fuzz button in the technical scheme, the fuzz button contact piece is connected with the low-temperature co-fired ceramic substrate of the multi-layer structure to transmit electric signals, elastic vertical contact is achieved on the basis that reliable signal transmission is guaranteed, and the requirements for transmission reliability and high integration are met; and the requirement of long-term reliable use is met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electronic components technical field especially relates to a photoelectric conversion assembly based on wool button. BACKGROUND

[0002] Photoelectric conversion assembly is the device that utilizes photoelectric effect, converts optical signal into electric signal output, is one of core electronic devices in optical communication system.

[0003] In recent years, in order to meet the demand of miniaturization, integrated integration of military electronic equipment, the module in photoelectric conversion assembly needs to reduce the volume while providing high reliability and high quality transmission. In order to realize high integration, CN118259410A is prepared by opening the electrical connection unit and the optical connection unit on the carrier plate, reduces the process of sealing the light array on the optical chip, to solve the problem that the existing photoelectric co-encapsulation structure is not compact enough, basically realizes vertical interconnection. And the vertical wireless light-emitting module proposed by CN114397734A is more integrated, the printed board and the light active device are packaged in the shell and connected together by gold wire bonding, and the product is welded with the printed board during use, which can realize signal transmission. Although the scheme can simplify the optical path structure and reduce the cost, the welding installation method adopted is complex to disassemble and damage the system components, and cannot realize long-term reliable use.

[0004] In view of the above problems, a photoelectric conversion assembly based on wool button is designed. UTILITY MODEL CONTENTS

[0005] The utility model proposes the following technical scheme in view of the problems in the prior art:

[0006] A photoelectric conversion assembly based on wool button, comprising:

[0007] A lower shell is assembled with external components by screw locking;

[0008] An AWG assembly, a PD chip and a digital control attenuator assembly, a low-temperature co-fired ceramic substrate and a wool button high-low frequency module are assembled in the lower shell and are electrically connected in sequence, and the low-temperature co-fired ceramic substrate and the wool button high-low frequency module are vertically arranged in the up-down direction.

[0009] The low-temperature co-fired ceramic substrate is provided as a multilayer structure, the microstrip line of the surface layer of the low-temperature co-fired ceramic substrate is matched with the PD chip and the digital control attenuator assembly, and the solder pad of the bottom layer of the low-temperature co-fired ceramic substrate is vertically interconnected with the wool button contact piece in the wool button high-low frequency module.

[0010] As a preferred embodiment of the above technical scheme, the lower shell is provided with a pipe body, and one end of the AWG assembly penetrates the pipe body.

[0011] As the preferred of the above technical solution, the PD chip and the digital attenuator assembly and the low-temperature co-fired ceramic substrate are matched with two groups, and the lower shell is provided with a partition plate, and the two groups of the PD chip and the digital attenuator assembly and the two groups of the low-temperature co-fired ceramic substrate are assembled on both sides of the partition plate.

[0012] As the preferred of the above technical solution, the lower shell is provided with a groove, and the low-temperature co-fired ceramic substrate is assembled in the groove.

[0013] As the preferred of the above technical solution, the lower shell is provided with an isolation cavity, and the hair button high-low frequency module is assembled in the isolation cavity.

[0014] The lower shell is provided with a through hole penetrating the groove and the isolation cavity.

[0015] As the preferred of the above technical solution, the hair button high-low frequency module is provided with a hair button radio frequency channel and a ground channel arranged circumferentially outside the hair button radio frequency channel.

[0016] As the preferred of the above technical solution, the ground channel corresponding to one hair button radio frequency channel is provided with eight.

[0017] As the preferred of the above technical solution, the lower shell is matched with an upper cover, and a sealing ring is arranged between the lower shell and the upper cover.

[0018] The AWG assembly, the PD chip and the digital attenuator assembly and the low-temperature co-fired ceramic substrate are packaged between the lower shell and the upper cover.

[0019] The beneficial effects of the utility model are as follows:

[0020] The photoelectric conversion assembly based on the hair button in the technical solution uses the mode that the hair button contact is connected with the low-temperature co-fired ceramic substrate with a multilayer structure to transmit electrical signals, realizes elastic vertical contact on the basis of ensuring reliable signal transmission, takes into account the transmission reliability and the demand of high integration, and meets the requirement of long-term reliable use. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 An explosion schematic view of the photoelectric conversion assembly based on the hair button in embodiment 1 is shown.

[0022] Figure 2 An explosion schematic view of the hair button high-low frequency module is shown. Figure 1 A partial structure explosion schematic view in embodiment 1 is shown.

[0023] Figure 3 A first perspective structure schematic view of the lower shell in embodiment 1 is shown.

[0024] Figure 4 Fig. 2 shows a second perspective view of the lower housing in Example 1.

[0025] Figure 5 Fig. 3 shows a position distribution diagram of the AWG assembly, the PD chip and the digital attenuator assembly, the low-temperature co-fired ceramic substrate, and the pogo pin high-low frequency module in Example 1.

[0026] Figure 6 Fig. 4 shows a structure diagram of the pogo pin high-low frequency module in Example 1.

[0027] Fig. 5 shows a position distribution diagram of the AWG assembly, the PD chip and the digital attenuator assembly, the low-temperature co-fired ceramic substrate, and the pogo pin high-low frequency module in Example 2. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in conjunction with the embodiments.

[0029] Example 1

[0030] As shown in Figs. 1 and 2, a pogo pin-based photoelectric conversion assembly comprises: Figure 1 Figure 2 Figure 5

[0031] The lower housing 4 is assembled with external components by screw locking;

[0032] The AWG assembly 1, the PD chip and the digital attenuator assembly 2, the low-temperature co-fired ceramic substrate 3, and the pogo pin high-low frequency module 5 are assembled inside the lower housing 4 and are electrically connected in sequence, and the low-temperature co-fired ceramic substrate 3 and the pogo pin high-low frequency module 5 are arranged vertically in the up-down direction;

[0033] The low-temperature co-fired ceramic substrate 3 is provided as a multi-layer structure, the microstrip line of the surface layer of the low-temperature co-fired ceramic substrate 3 is matched with the PD chip and the digital attenuator assembly 2, and the solder pad of the bottom layer of the low-temperature co-fired ceramic substrate 3 is vertically interconnected with the pogo pin contact in the pogo pin high-low frequency module 5.

[0034] The pogo pin-based photoelectric conversion assembly in the technical scheme is specifically a interconnection system between the pogo pin contact and the low-temperature co-fired ceramic substrate in the photoelectric conversion system, the optical signal is converted into an electrical signal by the AWG assembly 1, the electrical signal is processed by the PD chip and the digital attenuator assembly 2 and then delivered to the low-temperature co-fired ceramic substrate 3, and the low-temperature co-fired ceramic substrate 3 with a multi-layer structure is vertically transmitted to the pogo pin high-low frequency module 5 at the bottom layer to form a reliable vertical solderless interconnection. ​​​

[0035] The low-temperature co-fired ceramic substrate 3 and the pin high-low frequency module 5 are arranged vertically in the up-down direction, the low-temperature co-fired ceramic substrate 3 is provided as a multi-layer structure, the surface layer is provided with a microstrip line matched with the PD chip and the digital attenuator assembly 2, and the bottom layer is provided with a solder pad vertically interconnected with a pin contact in the pin high-low frequency module 5, so that the electrical signal can be vertically transmitted in a limited space, and the high integration requirement is realized.

[0036] The photoelectric conversion assembly based on the pin in the technical solution transmits the electrical signal by connecting the pin contact with the low-temperature co-fired ceramic substrate with a multi-layer structure, realizes the elastic vertical contact on the basis of ensuring the reliable transmission of the signal, takes into account the transmission reliability and the high integration requirement, and meets the long-term reliable use requirement.

[0037] To solve the assembly problem of the AWG assembly 1, the PD chip and the digital attenuator assembly 2, the low-temperature co-fired ceramic substrate 3 and the pin high-low frequency module 5 in the lower shell 4, as shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , the lower shell 4 is provided with a pipe body 43, one end of the AWG assembly 1 penetrates the pipe body 43, and the optical signal enters the AWG assembly 1 from the pipe opening of the pipe body 43.

[0038] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 5 , the PD chip and the digital attenuator assembly 2 and the low-temperature co-fired ceramic substrate 3 are both matched with two groups, the lower shell 4 is provided with a partition plate 44, and the two groups of PD chip and digital attenuator assembly 2 and the two groups of low-temperature co-fired ceramic substrate 3 are assembled on both sides of the partition plate 44, so as to avoid mutual interference between the two groups of PD chip and digital attenuator assembly 2 and the two groups of low-temperature co-fired ceramic substrate 3.

[0039] As shown in Figure 3 , a groove 41 is arranged in the lower shell 4, and the low-temperature co-fired ceramic substrate 3 is assembled in the groove 41 to limit the position of the low-temperature co-fired ceramic substrate 3 and improve the stability of the low-temperature co-fired ceramic substrate 3 in the lower shell 4.

[0040] As shown in Figure 4 , the lower shell 4 is provided with an isolation cavity 42, and the pin high-low frequency module 5 is assembled in the isolation cavity 42 to realize stable assembly of the pin high-low frequency module 5, and the low-temperature co-fired ceramic substrate 3 and the pin high-low frequency module 5 are vertically arranged in the up-down direction while being isolated and assembled, the lower shell 4 is provided with a through hole penetrating the groove 41 and the isolation cavity 42, and the pin contact penetrates the through hole and is interconnected with the solder-free signal of the low-temperature co-fired ceramic substrate 3.

[0041] AsFigure 6 As shown, the hair button high-frequency and low-frequency module 5 is provided with hair button radio frequency channels 51 and ground channels 52 arranged circumferentially outside the hair button radio frequency channels 51; the hair button contact in the hair button radio frequency channel 51 realizes the solderless signal interconnection between the PCB and the low-temperature co-fired ceramic substrate 3, and the arrangement of the ground channel 52 ensures the isolation degree between the hair button radio frequency channels 51 while realizing the solderless signal interconnection.

[0042] In order to ensure the reliability of the radio frequency signal grounding, Figure 6 As shown, the ground channel 52 corresponding to one hair button radio frequency channel 51 is provided with eight.

[0043] As shown, Figure 1 As shown, the hair button photoelectric conversion assembly further comprises an upper cover 6 matched with the lower shell 4, the AWG assembly 1, the PD chip, the digital control attenuator assembly 2 and the low-temperature co-fired ceramic substrate 3 are encapsulated between the lower shell 4 and the upper cover 6 to form an airtight component, and a sealing ring is arranged between the lower shell 4 and the upper cover 6 to realize high airtightness and solve the requirement of airtightness in the prior art. The arrangement of the sealing ring improves the environmental resistance of the hair button contact and the mating PCB pad.

[0044] The hair button photoelectric conversion assembly in the technical scheme uses the hair button contact to transmit the electrical signal, which can realize the elastic vertical contact on the basis of ensuring the reliable transmission of the signal, and meets the requirements of transmission reliability, integration and high airtightness.

[0045] The above embodiments are only used to illustrate the technical scheme of the present application, and not to limit it.

Claims

1. A photoelectric conversion module based on a hair button, characterized by, include: The lower housing (4) is assembled with external components by screws; The AWG assembly (1), PD chip and digitally controlled attenuator assembly (2), low temperature co-fired ceramic substrate (3) and button high and low frequency module (5) are assembled inside the lower housing (4) and electrically connected in sequence. The low temperature co-fired ceramic substrate (3) and button high and low frequency module (5) are arranged vertically in the up and down direction. The low-temperature co-fired ceramic substrate (3) is configured as a multilayer structure. The microstrip line on the surface of the low-temperature co-fired ceramic substrate (3) is matched with the PD chip and the numerically controlled attenuator assembly (2). The pads on the bottom layer of the low-temperature co-fired ceramic substrate (3) are vertically interconnected with the button contacts in the button high and low frequency module (5).

2. The photovoltaic conversion assembly based on a hair button according to claim 1, characterized in that, The lower housing (4) is provided with a tube (43) through it, and one end of the AWG assembly (1) passes through the tube (43).

3. The photovoltaic conversion assembly based on a hair button according to claim 1, characterized in that, The PD chip and digitally controlled attenuator assembly (2) and the low-temperature co-fired ceramic substrate (3) are each matched with two sets. A partition (44) is provided in the lower housing (4). The two sets of the PD chip and digitally controlled attenuator assembly (2) and the two sets of the low-temperature co-fired ceramic substrate (3) are respectively assembled on both sides of the partition (44).

4. The photovoltaic conversion assembly based on a hair button according to claim 1, characterized in that, A groove (41) is provided in the lower housing (4), and the low-temperature co-fired ceramic substrate (3) is assembled in the groove (41).

5. A photoelectric conversion assembly based on a hair button according to claim 4, characterized in that, The bottom of the lower housing (4) is provided with an isolation cavity (42), and the high and low frequency module (5) of the hair button is assembled in the isolation cavity (42); The lower housing (4) is provided with a through hole for the through groove (41) and the isolation cavity (42).

6. The pincushion-based photoelectric conversion module according to claim 1, wherein The button high and low frequency module (5) is provided with a button radio frequency channel (51) and a grounding channel (52) arranged circumferentially outside the button radio frequency channel (51).

7. A photoelectric conversion assembly based on a hair button according to claim 6, characterized in that, The grounding channels (52) corresponding to one of the tumbler radio frequency channels (51) are set to eight.

8. The pincushion-based photoelectric conversion module according to claim 1, wherein It also includes an upper cover (6) that matches the lower housing (4), and a sealing ring is provided between the lower housing (4) and the upper cover (6); the AWG assembly (1), the PD chip and the numerically controlled attenuator assembly (2) and the low-temperature co-fired ceramic substrate (3) are encapsulated between the lower housing (4) and the upper cover (6).

Images