Etching liquid recovery device and wafer etching equipment
By installing an etching solution recovery device with a coaxial baffle in the wafer etching equipment, the problem of etching solution splashing is solved, ensuring complete recovery of the etching solution and improving product quality.
Patent Information
- Application Number
- CN202520140307.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-21
AI Technical Summary
In existing wafer etching equipment, the etching solution is prone to splashing onto the outside of the recycling device during the recycling process, causing equipment contamination and affecting product quality.
Design an etching solution recovery device, including first and second recovery covers, and coaxial first and second baffles, the second baffle being higher than the first baffle, forming a recovery hole and a liquid collection chamber to prevent etching solution from splashing.
It achieves complete recovery of etching solution, avoids equipment contamination, and improves product yield.
Smart Images
Figure CN223862522U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically, it relates to an etching solution recovery device and a wafer etching equipment. Background Technology
[0002] The current trend in wafer etching processes is gradually moving towards single-wafer processing to meet the diverse needs of products. In existing technologies, wafer etching equipment etches by spraying etching solution onto the wafer surface. The wafer rotates on a rotary table, and after the etching solution is injected onto the wafer, the rotary table rotates the wafer. The etching solution sprayed onto the wafer is then recovered and discharged through a surrounding recycling device. However, in existing wafer etching equipment, the wafer is placed at a relatively high height, while the recycling device is at a relatively low height. This causes etching solution to splash outside the recycling device during operation, making complete recovery impossible and contaminating the etching equipment cavity, thus affecting product quality. Utility Model Content
[0003] In view of the shortcomings of the prior art described above, this utility model provides an etching solution recovery device and a wafer etching equipment. The etching solution recovery device includes a first recovery cover and a second recovery cover, with the second recovery cover surrounding the first recovery cover and forming a collection chamber for recovering the etching solution between them. A first baffle and a second baffle are coaxially arranged on the top of the second recovery cover, with the second baffle located outside the first baffle. The height of the second baffle is greater than the height of the first baffle, and a recovery hole is provided between them, communicating with the collection chamber to recover the etching solution. By incorporating the first and second baffles in the etching solution recovery device, this utility model can prevent etching solution from splashing onto the outside of the recovery device during operation, thereby achieving complete recovery of the etching solution, preventing etching solution contamination of the etching equipment cavity, and effectively improving product yield.
[0004] To achieve the above and other related objectives, this utility model provides an etching solution recovery device, comprising:
[0005] A first recovery hood, the first recovery hood having a first opening at the top;
[0006] The second recovery hood is located outside the first recovery hood and is coaxially arranged with the first recovery hood. The top of the second recovery hood has a second opening, which is located above the first opening. A liquid collection chamber is formed between the second recovery hood and the first recovery hood.
[0007] A first baffle is vertically disposed on the top of the second recycling hood and surrounds the second opening;
[0008] The second baffle is vertically disposed on the top of the second recycling hood and located outside the first baffle, and is coaxially disposed with the first baffle. The height of the second baffle is greater than the height of the first baffle.
[0009] The second recovery cover has multiple recovery holes at the top, which are located between the first baffle and the second baffle, and the recovery holes are in communication with the liquid collection chamber.
[0010] Optionally, the first opening is the same size as the second opening.
[0011] Optionally, the first baffle is a cylindrical shell structure with a diameter equal to that of the second opening.
[0012] Optionally, the second baffle is a C-shaped cylindrical shell structure with a third opening on its side wall.
[0013] Optionally, the width of the third opening is between 17cm and 23cm.
[0014] Optionally, the height of the first baffle is between 8mm and 12mm.
[0015] Optionally, the height of the second baffle is between 20mm and 30mm.
[0016] Optionally, the plurality of recycling holes are arranged in a ring at uniform intervals between the first baffle and the second baffle, and the diameter of the recycling holes is less than or equal to the distance between the first baffle and the second baffle.
[0017] Optionally, the diameter of the recycling hole is between 8 mm and 12 mm.
[0018] This utility model also provides a wafer etching apparatus, including a support stage and an etching solution recovery device as described in any of the above claims, wherein the support stage is located inside the first recovery hood, and the height of the support stage is lower than the height of the first opening.
[0019] The etching solution recovery device and wafer etching equipment provided by this utility model have at least the following beneficial effects:
[0020] The etching solution recovery device provided by this utility model includes a first recovery cover and a second recovery cover. The second recovery cover surrounds the first recovery cover, and a collection chamber for recovering etching solution is formed between the two. A first baffle and a second baffle are coaxially arranged on the top of the second recovery cover. The second baffle is located outside the first baffle, and its height is greater than that of the first baffle. A recovery hole is provided between the two baffles, communicating with the collection chamber to recover the etching solution. By incorporating the first and second baffles in the etching solution recovery device, this utility model prevents etching solution from splashing onto the outside of the recovery device during operation, thereby achieving complete recovery of the etching solution, preventing etching solution contamination of the etching equipment cavity, and effectively improving product yield.
[0021] The wafer etching equipment provided by this utility model includes the above-mentioned etching solution recovery device, and therefore has the same beneficial effects as described above. Attached Figure Description
[0022] Figure 1 The image shown is a front view of the etching solution recovery device provided in Embodiment 1.
[0023] Figure 2 The image shown is a top view of the etching solution recovery device provided in Embodiment 1.
[0024] Component designation explanation
[0025] 1. First recovery hood
[0026] 2 Second recovery hood
[0027] 3 First baffle
[0028] 4 Second baffle
[0029] 5. Liquid collection chamber
[0030] 6 Recycling port
[0031] 7. Supporting platform
[0032] 101 First sidewall
[0033] 102 First Top Surface
[0034] 103 Second sidewall
[0035] 104 Second Top Surface
[0036] 100 First Opening
[0037] 200 Second opening
[0038] 300 Third opening Detailed Implementation
[0039] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0040] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.
[0041] Example 1
[0042] This embodiment provides an etching solution recovery device, such as... Figure 1 and Figure 2 As shown, it includes a first recycling hood 1 and a second recycling hood 2, and the top of the second recycling hood 2 is provided with a first baffle 3 and a second baffle 4.
[0043] like Figure 1 As shown, the first recovery hood 1 includes a first sidewall 101 and a first top surface 102. The first sidewall 101 is arranged perpendicular to the horizontal plane and forms a cylindrical cavity; the angle between the first top surface 102 and the first sidewall 101 is an obtuse angle, that is, the first top surface 102 is an inclined surface. This design can guide the liquid above it, so that the etching liquid flows into the liquid collection cavity 5 along the inclined first top surface 102, making the liquid recovery process smoother.
[0044] As an example, the first top surface 102 has a first opening 100. The size of the first opening 100 is designed according to the size of the support platform 7 placed inside the first recycling hood 1, and there is no limitation here. Specifically, the size of the first opening 100 must be larger than the size of the support platform 7.
[0045] like Figure 1 As shown, the second recycling hood 2 includes a second sidewall 103 and a second top surface 104. The second sidewall 103 is arranged perpendicular to the horizontal plane, and the angle between the second top surface 104 and the second sidewall 103 is an obtuse angle, that is, the part where the second top surface 104 and the second sidewall 103 are connected is an inclined surface.
[0046] As an example, the second recovery cover 2 is located outside the first recovery cover 1 and is coaxially arranged with the first recovery cover 1. A collection chamber 5 for recovering etching fluid is formed between the second recovery cover 2 and the first recovery cover 1.
[0047] As an example, the second top surface 104 has a second opening 200, which is located above the first opening 100, and the first opening 100 and the second opening 200 are the same size.
[0048] like Figure 1 As shown, the portion of the second top surface 104 near the second opening 200 is a plane, and the first baffle 3 is vertically disposed on this plane, combined with... Figure 2 As shown, the first baffle 3 is arranged around the second opening 200. The first baffle 3 can prevent the etching liquid from splashing to the outside of the recovery device to a certain extent, and avoid the etching liquid from contaminating the etching equipment cavity. As an example, the first baffle 3 is a cylindrical shell structure, and its diameter is equal to the diameter of the second opening 200; the height of the first baffle 3 is between 8mm and 12mm, preferably 10mm.
[0049] As an example, the first baffle 3 is made of an acid and alkali resistant material to prevent it from being corroded by splashed etching solution. In this embodiment, the first baffle 3 is made of polytetrafluoroethylene (PTFE).
[0050] like Figure 1 As shown, the second baffle 4 is vertically disposed on the planar portion of the second top surface 104, and the second baffle 4 is located outside the first baffle 3, and is coaxially disposed with the first baffle 3. Combined with... Figure 2 As shown, the second baffle is a C-shaped cylindrical shell structure with a third opening 300 on its side wall. At the start or end of the operation, the third opening 300 facilitates the placement or removal of the wafer by the robotic arm. As an example, the width of the third opening 300 is between 17cm and 23cm, preferably 20cm.
[0051] As an example, the height of the second baffle 4 is greater than the height of the first baffle 3, and the height of the second baffle 4 is between 20mm and 30mm. The second baffle 4 can further prevent the etching solution from splashing to the outside of the recovery device, ensuring complete recovery of the etching solution and avoiding contamination of the etching equipment cavity by the etching solution.
[0052] As an example, the second baffle 4 is made of an acid and alkali resistant material to prevent it from being corroded by splashed etching solution. In this embodiment, the second baffle 4 is made of polytetrafluoroethylene (PTFE).
[0053] like Figure 2 As shown, the second top surface 104 also has a plurality of recovery holes 6. The plurality of recovery holes 6 are located between the first baffle 3 and the second baffle 4 and are arranged in a ring with uniform intervals. The recovery holes 6 are connected to the liquid collection chamber 5. The etching liquid splashed between the first baffle 3 and the second baffle 4 flows into the liquid collection chamber 5 through the recovery holes 6, thereby realizing the recovery of the etching liquid.
[0054] As an example, the diameter of the recovery hole 6 is less than or equal to the distance between the first baffle 3 and the second baffle 4. In this embodiment, the diameter of the recovery hole 6 is between 8 mm and 12 mm, preferably 10 mm.
[0055] The etching solution recovery device provided in this embodiment includes a first recovery cover and a second recovery cover. The second recovery cover surrounds the first recovery cover, and a collection chamber for recovering the etching solution is formed between the two. A first baffle and a second baffle are coaxially arranged on the top of the second recovery cover. The second baffle is located outside the first baffle, and its height is greater than that of the first baffle. A recovery hole is provided between the two baffles, communicating with the collection chamber to recover the etching solution. By incorporating the first and second baffles in the etching solution recovery device, this embodiment prevents etching solution from splashing onto the outside of the recovery device during operation, thereby achieving complete recovery of the etching solution, preventing etching solution contamination of the etching equipment cavity, and effectively improving product yield.
[0056] Example 2
[0057] This embodiment provides a wafer etching apparatus, referring to... Figure 1 and Figure 2 As shown, it includes a support platform 7 and an etching solution recovery device.
[0058] As an example, the etching solution recovery device is the etching solution recovery device provided in Embodiment 1, which includes a first recovery cover 1 and a second recovery cover 2. The top of the second recovery cover 2 is provided with a first baffle 3 and a second baffle 4. The specific structure of the etching solution recovery device can be referred to the description of Embodiment 1, and will not be repeated here.
[0059] As an example, the support platform 7 is located inside the first recovery shroud 1 to support the wafer, and the height of the support platform 7 is lower than the height of the first opening 100 to avoid the etching solution splashing to the outside of the recovery device during the operation.
[0060] As an example, in order to achieve wafer rotation, the support stage 7 is a rotatable support stage that can rotate in the horizontal plane about its central axis.
[0061] As an example, in order to inject the etching solution onto the wafer, an etching solution injection pipe (not shown in the figure) is also provided above the support stage 7. The etching solution injected into the wafer by the etching solution injection pipe is recovered to the collection chamber 5 under the action of centrifugal force when the wafer rotates. The second baffle 4 can prevent the etching solution from splashing to the outside of the recovery device, ensuring that the etching solution is completely recovered.
[0062] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. An etching solution recovery apparatus characterized by comprising: The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device.
2. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
3. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
4. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
5. The etchant recovery apparatus according to claim 4, wherein The application relates to an etching liquid recovery device.
6. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
7. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
8. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
9. The etchant recovery apparatus according to claim 1, wherein The application relates to an etching liquid recovery device.
10. A wafer etching apparatus, characterized by comprising: The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates to an etching liquid recovery device. The application relates