Special grinding wheel for thinning back of silicon wafer

Abstract

The utility model discloses a special grinding wheel for thinning the back of a silicon wafer. The special grinding wheel comprises a grinding wheel device body base and a placement workbench arranged at the upper end of the grinding wheel device body base. A middle connecting adsorption disc is arranged in the middle of the placing adsorption pad, a built-in telescopic connecting body is arranged in the middle of the outer connecting column body, a stirring adjusting column is connected with the built-in telescopic connecting body through a rotating shaft, and the stirring adjusting column is rotated so that the built-in telescopic connecting body can be stretched to exhaust air in the position of the middle connecting adsorption disc; the silicon wafer placed on the placing adsorption pad can be only attached to the placing adsorption pad under the action of pressure after being adsorbed, the silicon wafer can be stably limited in an adsorption mode after being improved, friction can be increased through the placing adsorption pad, position deviation of the silicon wafer is effectively avoided, and the service life of the silicon wafer is prolonged. And the operation is simple and quick, so that the use practicability of the special grinding wheel for thinning the back of the silicon wafer can be effectively improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a special grinding wheel for back-side thinning of silicon wafers. Background Technology

[0002] Silicon wafers are the basic material for semiconductor chips. During semiconductor manufacturing, the back side of silicon wafers needs to be thinned to meet chip packaging and performance requirements. Specialized grinding wheels for back side thinning of silicon wafers are key tools used in this process. They thin the back side of the silicon wafer to a specified thickness through grinding, and this is a front-end process in semiconductor manufacturing.

[0003] The development of specialized grinding wheels for backside thinning of silicon wafers involves the fields of materials science and engineering. It requires the development of new grinding wheel materials and binders suitable for silicon wafer grinding, and the improvement of the grinding wheel's wear resistance, self-sharpening properties and grinding performance, in order to meet the high hardness and high precision requirements in the silicon wafer thinning process.

[0004] Cup-shaped diamond grinding wheels are a type of grinding wheel commonly used for back-side thinning of silicon wafers. Their working surfaces have inner and outer circles. When using them, the center line of the inner and outer circles needs to be adjusted to a suitable position in order to grind the wafer. Special grinding wheels for back-side thinning of silicon wafers are suitable for the rough grinding stage and can quickly remove most of the material on the back side of the wafer, thereby rapidly reducing the wafer thickness.

[0005] However, when using special grinding wheels for back-side thinning of silicon wafers to constrain the silicon wafers, they are usually clamped or placed directly. Clamping can easily affect the processing effect, while direct placement is prone to misalignment.

[0006] This invention addresses the aforementioned problems by providing a special grinding wheel for back-side thinning of silicon wafers, which facilitates stable placement. Utility Model Content

[0007] The purpose of this invention is to provide a special grinding wheel for back-side thinning of silicon wafers, in order to solve the problem that the special grinding wheel for back-side thinning of silicon wafers mentioned in the background art usually uses clamping or direct placement when restricting silicon wafers. Clamping can easily affect the processing effect, while direct placement is prone to displacement.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a special grinding wheel for back-side thinning of silicon wafers, including a grinding wheel device base and a placement worktable provided at the upper end of the grinding wheel device base;

[0009] An adsorption pad is positioned at the top of the placement workbench, and a centrally connected adsorption plate is positioned in the middle of the adsorption pad. An external connecting column is positioned on the side of the placement workbench, and an internal telescopic connector is positioned in the middle of the external connecting column. An adjusting column is positioned on the side of the internal telescopic connector. The adjusting column is connected to the internal telescopic connector via a rotating shaft and is rotatably connected to the external connecting column via a thread. Rotating the adjusting column allows the internal telescopic connector to extend and evacuate air from the centrally connected adsorption plate. The silicon wafer placed on the adsorption pad can adhere tightly to the adsorption pad under pressure after adsorption.

[0010] Preferably, a side connecting support rod is provided on the upper side of the workbench near the corner, and a grinding wheel device top layer is provided at the top of the side connecting support rod.

[0011] Preferably, a drive connecting cylinder is provided at the middle position of the top layer of the grinding wheel device, and a connecting sleeve assembly is connected to the bottom position of the drive connecting cylinder.

[0012] Preferably, a drive motor is provided at the middle position of the connecting sleeve assembly, and a motor connecting drive shaft is provided at the bottom middle position of the drive motor.

[0013] Preferably, a grinding cup-shaped grinding wheel is provided at the bottom of the motor-connected drive shaft, and the grinding cup-shaped grinding wheel is installed and connected to the motor-connected drive shaft by a sleeve and screws.

[0014] Preferably, a status indicator light is provided on the upper side of the top layer of the grinding wheel device near the right end, and the status indicator light is provided with red, green and yellow lights.

[0015] Preferably, an operation control console is provided at the front side of the base of the grinding wheel device, and the operation control console is provided with control buttons and a data display screen.

[0016] Preferably, a bottom support foot is provided at the bottom of the base of the grinding wheel device, and the bottom support foot is rotatably connected to the bottom of the base of the grinding wheel device near the corner via a threaded column.

[0017] Compared with the prior art, this utility model provides a special grinding wheel for back-side thinning of silicon wafers, which has the following beneficial effects:

[0018] In a silicon wafer back-thinning grinding wheel, an adsorption pad is positioned at the top of the worktable, a centrally located adsorption plate is positioned in the middle of the adsorption pad, an outer connecting column is positioned on the side of the worktable, an inner telescopic connector is positioned in the middle of the outer connecting column, and an adjusting column is positioned on the side of the inner telescopic connector. The adjusting column is connected to the inner telescopic connector via a rotating shaft and is rotatably connected to the outer connecting column via a thread. Rotating the adjusting column allows the inner telescopic connector to stretch and evacuate air from the centrally located adsorption plate. The silicon wafer placed on the adsorption pad adheres tightly to the adsorption pad under pressure after adsorption. This improved design allows for stable confinement of the silicon wafer through adsorption, while the adsorption pad increases friction, effectively preventing the silicon wafer from shifting position. The operation is simple and quick, thus significantly improving the practicality of the silicon wafer back-thinning grinding wheel. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the special grinding wheel for thinning the back of silicon wafers according to this utility model.

[0020] Figure 2 This is a top view of the base of the silicon wafer back-thinning grinding wheel device of this utility model.

[0021] Figure 3 This is an enlarged structural diagram of the silicon wafer backside thinning special grinding wheel at position A of this utility model.

[0022] In the diagram: 1. Base of the grinding wheel device; 2. Side connecting support rod; 3. Top layer of the grinding wheel device; 4. Drive connecting cylinder; 5. Connecting sleeve assembly; 6. Drive motor; 7. Motor connecting drive shaft; 8. Grinding cup-shaped grinding wheel; 9. Operation control console; 10. Placement worktable; 11. Bottom support foot; 12. Status indicator light; 13. Placement of adsorption pad; 14. Centrally placed adsorption plate; 15. External connecting column; 16. Adjustment column; 17. Internal telescopic connector. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-3As shown, a special grinding wheel for back thinning of silicon wafers includes a grinding wheel device base 1 and a placement worktable 10 provided at the upper end of the grinding wheel device base 1.

[0025] An adsorption pad 13 is positioned at the top of the workbench 10. A centrally located adsorption plate 14 is positioned in the middle of the adsorption pad 13. An external connecting column 15 is positioned on the side of the workbench 10. An internal telescopic connector 17 is positioned in the middle of the external connecting column 15. An adjusting column 16 is positioned on the side of the internal telescopic connector 17. The adjusting column 16 is connected to the internal telescopic connector 17 via a pivot shaft and is rotatably connected to the external connecting column 15 via a thread. Moving the adjusting column 16 allows the built-in telescopic connector 17 to stretch and evacuate the air from the centrally located adsorption plate 14. The silicon wafer placed on the adsorption pad 13 can adhere to the adsorption pad 13 under pressure after adsorption. With the improvement of this utility model, the silicon wafer can be stably restricted by adsorption. At the same time, the adsorption pad 13 can increase friction, effectively preventing the silicon wafer from shifting position. The operation is simple and quick, thus effectively improving the practicality of the special grinding wheel for thinning the back of the silicon wafer.

[0026] like Figure 1 As shown, a side connecting support rod 2 is provided on the upper side of the workbench 10 near the corner. A grinding wheel device top layer 3 is provided at the top of the side connecting support rod 2. A drive connecting cylinder 4 is provided in the middle of the grinding wheel device top layer 3. A connecting sleeve assembly 5 is connected to the bottom of the drive connecting cylinder 4. A drive motor 6 is provided in the middle of the connecting sleeve assembly 5. A motor connecting drive shaft 7 is provided at the bottom middle of the drive motor 6. A grinding cup-shaped grinding wheel 8 is provided at the bottom of the motor connecting drive shaft 7. The grinding cup-shaped grinding wheel 8 is installed and connected to the motor connecting drive shaft 7 by a sleeve and screws. During operation, the drive connecting cylinder 4 drives the connecting sleeve assembly 5 to drive the drive motor 6 to rise and fall to a specified height. When the grinding cup-shaped grinding wheel 8 contacts the back of the silicon wafer, the drive motor 6 drives the grinding cup-shaped grinding wheel 8 to rotate and grind the back of the silicon wafer. After grinding is completed, the drive motor 6 stops rotating, and then the drive connecting cylinder 4 drives the grinding cup-shaped grinding wheel 8 to rise and return to its original position.

[0027] like Figure 1 As shown, a status indicator light 12 is provided on the upper side of the top layer 3 of the grinding wheel device, near the right end. The status indicator light 12 has three colors of lights: red, green, and yellow. The three colors of the status indicator light 12 represent abnormal, normal, and standby states, respectively. Users can more easily know the working status of the special grinding wheel for back thinning of silicon wafers through the status indicator light 12.

[0028] like Figure 1 As shown, an operation control console 9 is provided at the front of the base 1 of the grinding wheel device. The operation control console 9 is equipped with control buttons and a data display screen. The operator can use the operation control console 9 to set the parameters of the special grinding wheel for back thinning of silicon wafers, so as to make corresponding adjustments to achieve the desired effect.

[0029] like Figure 1 As shown, a bottom support foot 11 is provided at the bottom of the grinding wheel device base 1. The bottom support foot 11 is rotatably connected to the bottom of the grinding wheel device base 1 near the corner via a threaded column. The bottom support foot 11 can keep the grinding wheel device base 1 at a certain height from the placement surface. Its setting can reduce the moisture erosion at the lower position and enhance the placement stability of the grinding wheel device base 1.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A special grinding wheel for back-side thinning of silicon wafers, comprising a grinding wheel device base (1) and a placement worktable (10) provided at the upper end of the grinding wheel device base (1); Its features are: An adsorption pad (13) is provided at the upper end of the placement workbench (10). A centrally connected adsorption plate (14) is provided at the middle of the adsorption pad (13). An external connecting column (15) is provided at the side of the placement workbench (10). An internal telescopic connector (17) is provided at the middle of the external connecting column (15). An actuating adjustment column (16) is provided at the side of the internal telescopic connector (17). The actuating adjustment column (16) is connected to the internal telescopic connector (17) via a rotating shaft. The actuating adjustment column (16) is rotatably connected to the external connecting column (15) via a thread. Rotating the actuating adjustment column (16) can stretch the internal telescopic connector (17) to evacuate the air at the position of the centrally connected adsorption plate (14). The silicon wafer placed on the adsorption pad (13) can adhere to the adsorption pad (13) under pressure after adsorption.

2. The silicon wafer back-side thinning grinding wheel according to claim 1, characterized in that: A side connecting support rod (2) is provided on the upper side of the workbench (10) near the corner, and a grinding wheel device top layer (3) is provided at the top of the side connecting support rod (2).

3. The silicon wafer back-side thinning grinding wheel according to claim 2, characterized in that: A drive connecting cylinder (4) is provided at the middle position of the top layer (3) of the grinding wheel device, and a connecting sleeve assembly (5) is connected to the bottom position of the drive connecting cylinder (4).

4. The silicon wafer back-side thinning grinding wheel according to claim 3, characterized in that: A drive motor (6) is provided at the middle position of the connecting sleeve assembly (5), and a motor connecting drive shaft (7) is provided at the bottom middle position of the drive motor (6).

5. A special grinding wheel for back-side thinning of silicon wafers according to claim 4, characterized in that: A grinding cup-shaped grinding wheel (8) is provided at the bottom of the motor connecting drive shaft (7). The grinding cup-shaped grinding wheel (8) is connected to the motor connecting drive shaft (7) by sleeve and screw.

6. The silicon wafer back-side thinning grinding wheel according to claim 1, characterized in that: A status indicator light (12) is provided on the upper side of the top layer (3) of the grinding wheel device near the right end. The status indicator light (12) is provided with red, green and yellow lights.

7. A special grinding wheel for back-side thinning of silicon wafers according to claim 1, characterized in that: An operation control console (9) is provided at the front side of the base (1) of the grinding wheel device, and the operation control console (9) is provided with control buttons and a data display screen.

8. A special grinding wheel for back-side thinning of silicon wafers according to claim 1, characterized in that: The bottom of the grinding wheel device base (1) is provided with a bottom support foot (11), which is rotatably connected to the bottom of the grinding wheel device base (1) near the corner by a threaded column.

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