Manual electronic cart for wafer box

Abstract

The embodiment of the utility model discloses a wafer box manual electronic cart which comprises a cart frame body, at least one horizontally-arranged bearing layer is arranged on the cart frame body, at least one bearing groove is formed in each bearing layer, and the bearing grooves are constructed to be of a concave containing structure matched with the bottom of a wafer box; each bearing groove is correspondingly provided with one sensor assembly, each sensor assembly comprises a first sensor and a second sensor which are arranged on the two sides of the bearing groove respectively, the first sensor is configured to detect the occupied state of the corresponding bearing groove, and the second sensor is configured to identify information of the wafer box in the bearing groove. According to the embodiment of the invention, the traceability of the wafer box in the carrying process is realized.

Description

Technical Field

[0001] This application relates to the field of wafer transport equipment technology, specifically to a wafer box manual electronic trolley. Background Technology

[0002] In semiconductor manufacturing, wafer storage and handling are of paramount importance, and manual electronic wafer trolleys are key equipment. However, traditional trolleys have significant problems: In terms of load-bearing structure, the load-bearing surface is mostly flat, which cannot fit the bottom of the wafer box, leading to inaccurate wafer box positioning, easy shaking and displacement during handling, increasing the risk of collisions and potentially damaging the internal wafers. Regarding information management, the lack of sensor components makes it difficult for staff to know the wafer box's occupancy status in real time, making inventory and retrieval time-consuming and labor-intensive, and hindering the rapid identification of critical information, thus affecting production traceability. Utility Model Content

[0003] This application aims to solve at least one technical problem existing in the prior art. To this end, embodiments of this application provide a wafer cassette artificial electronic trolley. The objective of this application can be achieved through the following technical solutions:

[0004] This application provides a wafer cassette electronic trolley, the wafer cassette electronic trolley comprising:

[0005] The main body of the frame is provided with at least one horizontally arranged load-bearing layer, and each load-bearing layer is provided with at least one load-bearing groove. The load-bearing groove is constructed as a concave receiving structure adapted to the bottom of the wafer box.

[0006] The sensor assembly includes a set of sensor assemblies for each carrier slot. Each set of sensor assemblies includes a first sensor and a second sensor located on both sides of the carrier slot. The first sensor is configured to detect the occupancy status of the corresponding carrier slot, and the second sensor is configured to identify the information of the wafer cell in the carrier slot.

[0007] Optionally, the bottom contour of the carrier groove is adapted to the shape of the bottom of the wafer box, and the groove wall of the carrier groove narrows from the groove opening to the groove bottom, forming a guide funnel structure.

[0008] Optionally, the load-bearing layer includes a load-bearing platform and side baffles, the side baffles surrounding the load-bearing platform to form the boundary of the load-bearing groove;

[0009] The side guard is provided with a sensor mounting cavity, and the first sensor and the second sensor are located in the sensor mounting cavity;

[0010] The side guard is provided with a first clearance hole, corresponding to the sensing path of the first sensor; and a second clearance hole, corresponding to the sensing path of the second sensor.

[0011] Optionally, multiple bearing grooves are spaced apart on the same bearing layer surface, and adjacent bearing grooves are separated by upwardly extending isolation ribs. The groove wall of the bearing groove is formed by the side wall of the isolation rib and the inner side wall of the side baffle.

[0012] Optionally, the side guard includes two sets of first-type side guards and two sets of second-type side guards. The two sets of first-type side guards are arranged parallel to each other on both sides of the long side of the bearing platform, and the two sets of second-type side guards are arranged parallel to each other on both sides of the short side of the bearing platform. The first-type side guards and the bearing platform are integrally die-cast, and the second-type side guards are detachably fixed to the ends of the first-type side guards and the bearing platform.

[0013] Optionally, both sets of first-type side panels are provided with sensor mounting cavities, and the first sensor and the second sensor are respectively located in the sensor mounting cavities of the two sets of first-type side panels.

[0014] Optionally, an interactive control box is integrated into the front facade of the vehicle frame. The interactive control box includes:

[0015] The touch screen displays the real-time status and quantity statistics of the wafer cells in each carrier slot;

[0016] The power management module is electrically connected to the battery pack mounted on the vehicle frame.

[0017] The signal processing unit establishes data communication connections with each sensor component.

[0018] Optionally, the frame body includes:

[0019] Chassis frame;

[0020] Four omnidirectional brake wheels are symmetrically installed at the four corners below the chassis frame;

[0021] Four support columns are symmetrically installed at the four corners above the chassis frame and are elastically connected to the chassis frame through shock absorbers;

[0022] The load-bearing layer is fixedly installed on the support column.

[0023] Optionally, each support column is fitted with an annular buffer at its bottom, with the outer side of the annular buffer protruding from the outer contour of the frame body.

[0024] Optionally, a battery compartment is provided between the bottom load-bearing layer and the chassis frame, and a removable battery pack is installed in the battery compartment, which is configured to power the sensor assembly.

[0025] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects:

[0026] The design of the support layer and support slots in the main frame of the trolley ensures stable placement of wafer cassettes, reducing shaking during handling and protecting the wafers inside from damage. The sensor components enable real-time monitoring of the support slot occupancy status and wafer cassette information, allowing staff to promptly understand the status of the wafer cassettes on the manual electronic trolley and improving the efficiency and accuracy of handling management. Attached Figure Description

[0027] The present application will be further described below with reference to the accompanying drawings.

[0028] Figure 1 This is a schematic diagram of the structure of the artificial electronic trolley in one embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the structure of the bearing layer in one embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10. Main frame; 11. Chassis frame; 12. Universal brake wheel; 13. Support column; 14. Handle; 20. Load-bearing layer; 21. Load-bearing platform; 22. Side guard; 221. Type I side guard; 222. Type II side guard; 223. Sensor mounting cavity; 23. Load-bearing groove; 24. Isolation rib; 30. First sensor; 31. Second sensor; 40. Guardrail; 50. Interactive control box; 51. Touch screen; 60. Shock absorber; 70. Annular buffer; 80. Battery compartment; 100. Wafer box. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Please see Figure 1 and Figure 2 As shown, in some embodiments, this application provides a wafer cassette artificial electronic trolley, which includes a frame body 10 and a sensor assembly.

[0034] The frame body 10 is the basic support structure of the entire manual electronic trolley, made of sturdy metal materials such as aluminum alloy or steel to ensure sufficient strength and stability. The frame body 10 has at least one horizontally arranged load-bearing layer 20, which means that the number of load-bearing layers 20 can be flexibly set according to actual usage scenarios and needs. One layer is suitable for situations with small handling volumes, while multiple layers can significantly improve handling efficiency. Each load-bearing layer 20 is provided with at least one load-bearing groove 23, and the number of load-bearing grooves 23 can also be adjusted as needed. The load-bearing groove 23 is constructed as a concave receiving structure adapted to the bottom of the wafer cassette 100. Its shape and size are precisely designed to fit tightly against the bottom of the wafer cassette 100, providing a stable placement platform for the wafer cassette 100 and effectively preventing the wafer cassette 100 from shaking or shifting during handling.

[0035] Each carrier slot 23 is equipped with a corresponding set of sensor components. This one-to-one correspondence ensures accurate monitoring of the status and information of the wafer cassette 100 within each carrier slot 23. Each set of sensor components includes a first sensor 30 and a second sensor 31 located on opposite sides of the carrier slot 23. The first sensor 30 is configured to detect the occupancy status of the corresponding carrier slot 23. It can be an infrared sensor or a proximity sensor. When a wafer cassette 100 is placed in the carrier slot 23, the first sensor 30 can quickly sense it and transmit the signal to the subsequent control unit, thereby monitoring the usage status of the carrier slot 23 in real time. The second sensor 31 is configured to identify information about the wafer cassette 100 within the carrier slot 23. For example, it can be a radio frequency identification (RFID) sensor. By reading the electronic tag on the wafer cassette 100, it can obtain information such as the model, batch, and relevant parameters of the internal wafers of the wafer cassette 100, facilitating management and traceability during the production process.

[0036] The design of the support layer 20 and support groove 23 in the main frame 10 ensures stable placement of the wafer cassette 100, reducing shaking during handling and protecting the wafers inside from damage. The sensor assembly enables real-time monitoring of the occupancy status of the support groove 23 and information about the wafer cassette 100, allowing staff to promptly understand the status of the wafer cassette 100 on the manual electronic trolley and improving the efficiency and accuracy of handling management.

[0037] Please see Figure 1 and Figure 2As shown, in some embodiments, the bottom contour of the support groove 23 is adapted to the bottom shape of the wafer cassette 100. The groove wall of the support groove 23 narrows from the groove opening to the bottom, forming a guide funnel structure. The shape of the bottom of the support groove 23 is precisely designed according to the common bottom shape of the wafer cassette 100 to ensure a perfect fit and further enhance the stability of placement. The narrowing slope design of the groove wall plays a guiding role when placing the wafer cassette 100. Even if the placement position is slightly deviated, the wafer cassette 100 can fall smoothly into the support groove 23, and the position is automatically corrected during the falling process, reducing the alignment time during placement, improving handling efficiency, and enhancing the convenience and accuracy of placement.

[0038] Please see Figure 1 As shown, in some embodiments, to improve the safety of the wafer cassette 100 during handling, each support layer 20 is equipped with a guardrail 40. The guardrail 40 is made of stainless steel tubing or other metal materials and is securely installed on the frame body 10 using welding or bolt connections. Its height and spacing are designed according to relevant safety standards, which can effectively prevent the wafer cassette 100 from accidentally falling from the support layer 20, providing reliable safety protection for the transportation of the wafer cassette 100.

[0039] Considering the convenience of actual handling operations, a guardrail 40 is not installed on one side of the load-bearing layer 20. This design aims to facilitate the handling of the wafer cassette 100 by operators from this side, ensuring safety while also taking into account the efficiency of the operation process, avoiding any obstruction to the handling work due to the installation of the guardrail 40, and achieving a balance between safety and convenience.

[0040] Please see Figure 1 and Figure 2As shown, in some embodiments, the support layer 20 includes a support platform 21 and a side baffle 22. The support platform 21 provides a horizontal support surface for the wafer cassette 100 and is made of a flat material with a certain strength, such as high-strength engineering plastic or metal plate. When only one support groove 23 is provided on the same surface of the support layer 20, the side baffle 22 surrounds the support platform 21 to form the boundary of the support groove 23, which restricts the position of the wafer cassette 100 and prevents the wafer cassette 100 from moving out of the support groove 23. A sensor mounting cavity 223 is provided inside the side baffle 22. The first sensor 30 and the second sensor 31 are located in the sensor mounting cavity 223. This design protects the sensors and enables them to accurately monitor the situation inside the support groove 23. A first clearance hole is provided on the side baffle 22, corresponding to the sensing path of the first sensor 30; and a second clearance hole is provided, corresponding to the sensing path of the second sensor 31. The design of the clearance holes ensures that the sensor's sensing signal is not blocked by the side baffle 22, ensuring that the sensor can work normally. The support platform 21 and side baffle 22 of the support layer 20 work together to provide a stable placement space for the wafer cassette 100. The design of the sensor mounting cavity 223 and the clearance hole protects the sensor while ensuring its normal operation, thus guaranteeing the accuracy of monitoring the status and information of the wafer cassette 100 within the support groove 23.

[0041] Please see Figure 2 As shown, in some embodiments, multiple carrier grooves 23 are spaced apart on the surface of the same carrier layer 20, and adjacent carrier grooves 23 are separated by upwardly extending isolation ribs 24. The arrangement of multiple carrier grooves 23 increases the number of wafer cassettes 100 that can be handled by the manual electronic trolley at one time, improving handling efficiency. The groove wall of the carrier groove 23 is formed by the side wall of the isolation rib 24 and the inner side wall of the side baffle 22. The design of multiple carrier grooves 23 improves handling efficiency, and the arrangement of the isolation ribs 24 prevents mutual collisions between wafer cassettes 100, protecting the wafer cassettes 100 and the wafers inside.

[0042] In some embodiments, the side baffle 22 includes two sets of first-type side baffles 221 and two sets of second-type side baffles 222. The two sets of first-type side baffles 221 are arranged parallel to each other on both sides of the long side of the support platform 21, and the two sets of second-type side baffles 222 are arranged parallel to each other on both sides of the short side of the support platform 21. This layout comprehensively restricts the displacement of the wafer cassette 100 on the support platform 21. The first-type side baffles 221 are integrally die-cast with the support platform 21, ensuring the integrity and stability of the structure and improving the overall structural strength. The second-type side baffles 222 are detachably fixed to the ends of the first-type side baffles 221 and the support platform 21, and can be connected by bolts or slots, facilitating replacement or disassembly when the side baffles 22 are damaged or the layout of the support layer 20 needs to be adjusted.

[0043] Please see Figure 2As shown, in some embodiments, both the first type of side baffle 221 and the second type of side baffle 222 are formed by bending a plate-like structure. The two sets of first type of side baffles 221 are bent to form a sensor mounting cavity 223, and the first sensor 30 and the second sensor 31 are symmetrically installed within the sensor mounting cavities 223 of the two sets of first type of side baffles 221. Since the first type of side baffles 221 are located on both sides of the long side of the support platform 21, the space along the long side is relatively ample, which is more conducive to sensor layout and signal transmission. For example, when using an RFID sensor, the layout along the long side allows the sensor to better receive signals from the electronic tag of the wafer cell 100, reducing signal interference and improving the accuracy of information identification.

[0044] Please see Figure 1 As shown, in some embodiments, an interactive control box 50 is integrated on the front facade of the frame body 10. The interactive control box 50 includes a touch screen display 51, a power management module (not shown), and a signal processing unit (not shown). The touch screen display 51 displays the real-time position status of the wafer cells 100 in each carrier slot 23. Through an intuitive graphical interface, such as green indicating a wafer cell 100 in place and red indicating an empty slot, as well as quantity statistics, it is convenient for staff to quickly understand the status of the wafer cells 100 on the trolley. The power management module is electrically connected to the battery pack on the frame body 10 and is responsible for managing the charging and discharging process of the battery, monitoring the battery level, and issuing a timely reminder on the touch screen display 51 when the battery level is lower than a set threshold. The signal processing unit undertakes the core task of data transmission and processing. It establishes a stable data communication connection with each sensor component and receives signals transmitted by the sensors in real time. These signals include various data such as the occupancy status of the carrier slot 23 and information about the wafer cells 100. The signal processing unit performs in-depth analysis, processing, and conversion on the received signals, transforming them into a recognizable information format. Part of the signal is transmitted to the touch screen 51 for display, enabling staff to monitor the status of the manual electronic trolley in real time. The other part is transmitted to the factory's central control system, which automatically counts the number of wafer boxes 100 on the manual electronic trolley and related information, thereby achieving centralized and intelligent management of the wafer handling process in the entire production process and improving production efficiency and management accuracy.

[0045] Please see Figure 1As shown, in some embodiments, the main frame 10 consists of a chassis frame 11, four omnidirectional brake wheels 12, and four support columns 13. The chassis frame 11, as the basic structure, is made of high-strength metal material, providing stable support for the entire trolley. The four omnidirectional brake wheels 12 are symmetrically installed at the four lower corners of the chassis frame 11. The omnidirectional brake wheels 12 can rotate 360°, facilitating flexible steering of the trolley in different environments, and can also be locked when needed to prevent the trolley from sliding. The four support columns 13 are vertically positioned at the four upper corners of the chassis frame 11, and each support column 13 is elastically connected to the chassis frame 11 via shock absorbers 60. The support columns 13 are made of metal and have sufficient strength to support the load-bearing layer 20. The shock absorbers 60 use rubber or spring damping devices to effectively buffer vibrations caused by road bumps during transport. The load-bearing layer 20 is fixedly installed on the support columns 13 by welding, bolting, or other methods.

[0046] Please see Figure 1 As shown, in some embodiments, annular buffer members 70 are fitted at the bottom of each support column 13. The annular buffer members 70 are made of materials with good cushioning properties, such as rubber. The outer side of the annular buffer member 70 protrudes from the outer contour surface of the frame body 10, and the protrusion is generally 2-10 cm. When the manual electronic trolley collides with other objects, the annular buffer member 70 first contacts the external object and absorbs the collision energy through its own elastic deformation, reducing the impact force on the frame body 10 and the wafer cell 100 on the load-bearing layer 20.

[0047] Please see Figure 1 As shown, in some embodiments, a battery compartment 80 is provided between the bottommost support layer 20 and the chassis frame 11. The battery compartment 80 is made of metal and has a certain degree of protection. A removable battery pack (not shown) is installed inside the battery compartment 80. The battery pack is connected to the battery compartment 80 via slots, plugs, etc., facilitating replacement when the battery power is low. The battery pack supplies power to the sensor components and related power units within the interactive control box 50. After being powered, the sensor components operate normally, continuously monitoring the status information of the wafer cassette 100 and transmitting it to the interactive control box 50. The various power units within the interactive control box 50 process, analyze, and display data under battery power, helping staff obtain information accurately and in real time, achieving efficient handling management.

[0048] Please see Figure 1 As shown, in some embodiments, the frame body 10 also includes a handle 14 located at the top of its front facade. The handle 14 is made of an ergonomically designed material (such as metal, rubber, or plastic) with a non-slip texture on the surface. The handle 14 is fixed to the frame body 10 by welding or bolting, and its position is designed for easy gripping by the operator, facilitating the push and pull of the manual electronic trolley.

[0049] The foregoing has provided a detailed description of one embodiment of this application, but the description is merely a preferred embodiment and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

[0050] It should be noted that the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Descriptions in this application regarding directions such as "left," "right," "left side," "right side," "upper part," "lower part," "top," and "bottom" are defined based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, not to indicate or imply that the described structure must be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0051] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

Claims

1. A wafer cassette artificial electronic trolley, characterized in that, The artificial electronic trolley includes: The frame body has at least one horizontally arranged load-bearing layer, and each load-bearing layer is provided with at least one load-bearing groove, the load-bearing groove being constructed as a concave receiving structure adapted to the bottom of the wafer cassette; The sensor assembly includes a set of sensor assemblies for each of the carrier slots. Each set of sensor assemblies includes a first sensor and a second sensor disposed on both sides of the carrier slot. The first sensor is configured to detect the occupancy status of the corresponding carrier slot, and the second sensor is configured to identify information of the wafer cell in the carrier slot.

2. The artificial electronic trolley according to claim 1, characterized in that, The bottom contour of the carrier groove is adapted to the shape of the bottom of the wafer box, and the groove wall of the carrier groove narrows from the groove opening to the groove bottom, forming a guide funnel structure.

3. The artificial electronic trolley according to claim 1, characterized in that, The bearing layer includes a bearing platform and side baffles, the side baffles surrounding the bearing platform to form the boundary of the bearing groove; The side baffle is provided with a sensor mounting cavity, and the first sensor and the second sensor are disposed in the sensor mounting cavity; The side guard is provided with a first clearance hole, which corresponds to the sensing path of the first sensor. And a second clearance hole, corresponding to the sensing path of the second sensor.

4. The artificial electronic trolley according to claim 3, characterized in that, Multiple bearing grooves are spaced apart on the same surface of the bearing layer. Adjacent bearing grooves are separated by upwardly extending isolation ribs. The groove wall of the bearing groove is formed by the side wall of the isolation rib and the inner side wall of the side baffle.

5. The artificial electronic trolley according to claim 3, characterized in that, The side baffle includes two sets of first-type side baffles and two sets of second-type side baffles. The two sets of first-type side baffles are arranged parallel to each other on both sides of the long side of the bearing platform, and the two sets of second-type side baffles are arranged parallel to each other on both sides of the short side of the bearing platform. The first-type side baffles and the bearing platform are integrally die-cast, and the second-type side baffles are detachably fixed to the ends of the first-type side baffles and the bearing platform.

6. The artificial electronic trolley according to claim 5, characterized in that, Both sets of the first type of side guards are provided with the sensor mounting cavity, and the first sensor and the second sensor are respectively disposed in the sensor mounting cavity of the two sets of the first type of side guards.

7. The artificial electronic trolley according to claim 1, characterized in that, The front side facade of the vehicle frame body integrates an interactive control box, which includes: The touch screen displays the real-time status and quantity statistics of the wafer cells in each carrier slot; The power management module is electrically connected to the battery pack mounted on the vehicle frame body; The signal processing unit establishes a data communication connection with each of the sensor components.

8. The artificial electronic trolley according to any one of claims 1-7, characterized in that, The main body of the vehicle frame includes: Chassis frame; Four omnidirectional brake wheels are symmetrically installed at the four corners below the chassis frame; Four support columns are symmetrically installed at the four corners above the chassis frame and are elastically connected to the chassis frame through shock absorbers; The load-bearing layer is fixedly installed on the support column.

9. The artificial electronic trolley according to claim 8, characterized in that, Each of the support columns is fitted with an annular buffer at its bottom, and the outer side of the annular buffer protrudes from the outer contour surface of the main body of the frame.

10. The artificial electronic trolley according to claim 9, characterized in that, A battery compartment is provided between the bottommost load-bearing layer and the chassis frame. A removable battery pack is installed in the battery compartment and is configured to power the sensor assembly.

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