Wafer electroplating conductive seat cooling device

Abstract

The utility model provides a wafer electroplating conductive seat cooling device which comprises an electroplating main tank body, the outer side wall of the electroplating main tank body is connected with an external water cooling box through a bolt, an M-shaped socket is installed in the external water cooling box through a bolt, a water inlet end and a water outlet end are formed in the external water cooling box, and the M-shaped socket is connected with the M-shaped socket through a bolt. The outer side wall of the water inlet end is connected with a cooling water inlet pipeline assembly, and the outer side wall of the water outlet end is connected with a cooling water outlet pipeline assembly. By arranging the external water cooling box, the whole water cooling system is changed from the inside of the tank to the outside of the tank, so that the maintenance and the socket replacement are easy; by arranging the external water cooling box and the flow speed adjusting valve, cooling water flow can be visually adjusted in the water inlet end and can slowly drip, and water resources are saved; and through the arrangement of the first overflow opening and the second overflow opening, the double-overflow ingenious design protects electroplating liquid medicine, and the electroplating effect is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment, and in particular to a cooling device for a conductive substrate in wafer electroplating. Background Technology

[0002] During wafer electroplating, the electrodes and sockets generate heat due to the electrical current required for metallization on the workpiece surface. To ensure the safety and stability of the electroplating process, real-time heat dissipation is essential to avoid process defects and environmental risks caused by high temperatures. Figure 1 In existing heat dissipation solutions, wafer electroplating equipment typically employs an inner sub-tank within the main electroplating tank. M-shaped conductive sockets are installed in this inner sub-tank, and process cooling water is injected into it to carry away the heat generated by the M-shaped sockets and electrodes immersed within the tank. However, this existing solution has several drawbacks.

[0003] First, the structure of the electroplating main tank plus the inner sub-tank is relatively complex, which increases the risk of leakage.

[0004] Secondly, as the current increases, the heat generated also increases, requiring a larger cooling water flow rate to remove the heat. However, in actual operation, cooling water often overflows into the electroplating tank. This not only reduces the concentration of the electroplating solution, affecting the wafer electroplating effect, but may also contaminate the entire electroplating solution, especially the precious metal electroplating solution, resulting in a loss of product yield and material waste. Therefore, a wafer electroplating conductive base cooling device is urgently needed. Utility Model Content

[0005] To address the problems of complex structure, poor welding of the electroplating tank electrode water cooling system, increased risk of leakage, and easy overflow of cooling water into the electroplating tank in the existing technology, this utility model provides a wafer electroplating conductive seat cooling device.

[0006] The wafer electroplating conductive seat cooling device provided by this utility model adopts the following technical solution:

[0007] A wafer electroplating conductive seat cooling device includes an electroplating main tank body. An external water-cooling box is bolted to the outer wall of the electroplating main tank body. An M-shaped socket is bolted to the inside of the external water-cooling box. An inlet end and an outlet end are formed inside the external water-cooling box. A cooling water inlet pipe assembly is connected to the outer wall of the inlet end, and a cooling water outlet pipe assembly is connected to the outer wall of the outlet end.

[0008] Furthermore, the cooling water inlet pipeline assembly includes an L-shaped ferrule connector and a flow rate regulating valve. The input end of the flow rate regulating valve is connected to an external water supply system, and the output end of the flow rate regulating valve is connected to one end of the L-shaped ferrule connector via a pipeline. The other end of the L-shaped ferrule connector is connected to the outer wall of the inlet end via a pipeline.

[0009] Furthermore, the cooling water outlet pipeline assembly includes a drain pipe, a tee connector, and a flange. A through hole is provided at the bottom of the outlet end, and a drain pipe is fixedly connected in the through hole. A tee connector is provided on the lower side of the drain pipe. The drain pipe and the tee connector are suspended and sleeved, and the outer diameter of the drain pipe is smaller than the inner diameter of the tee connector. The position where the drain pipe and the tee connector are suspended and sleeved forms an overflow port. The tee connector is welded to the outer wall of the electroplating main tank body. One end of the flange is fixedly connected to the lower end of the tee connector, and the other end of the flange is connected to the external drain pipe.

[0010] Furthermore, an overflow port 2 is provided on the outer wall of the water outlet.

[0011] Furthermore, the outer diameter of the drain pipe is 16mm, and the inner diameter of the tee connector is 19mm.

[0012] Furthermore, the M-shaped socket has a multi-piece structure.

[0013] In summary, the beneficial effects of this utility model are as follows:

[0014] This invention relocates the entire water cooling system from inside the plating tank to outside by using an external water-cooling box. This facilitates maintenance, repairs, and socket replacement. The external water-cooling box is CNC machined in one piece, eliminating welding and leakage risks. It optimizes the electroplating tank structure, making welding easy and reliable, and eliminating the risk of leakage. The external water-cooling box, cooling water inlet pipe assembly, and cooling water outlet pipe assembly optimize the overall water cooling system and facilitate assembly. The external water-cooling box and flow rate regulating valve allow for direct and adjustable cooling water flow at the inlet, enabling slow dripping and saving water resources. The clever double overflow design (overflow outlet 1 and outlet 2) protects the electroplating chemicals and ensures optimal electroplating results. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the prior art internal sub-slot structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 3 This utility model Figure 2 Enlarged schematic diagram of structure A in the middle;

[0018] Figure 4This is a cross-sectional schematic diagram of the cooling water outlet pipe assembly of this utility model;

[0019] Figure 5 This is a schematic diagram of the external water-cooling box structure of this utility model.

[0020] As shown in the figure: 1-Electroplating main tank body, 2-External water cooling box, 3-M-shaped socket, 4-Water inlet, 5-Water outlet, 6-Flow rate regulating valve, 7-L-shaped compression fitting, 8-Drain pipe, 9-T-connector, 10-U-ring, 12-Overflow port one, 13-Overflow port two, 14-Wafer rack, 15-Wafer rack electrode. Detailed Implementation

[0021] The following is in conjunction with the appendix Figure 2 - Appendix Figure 5 The present invention will be further described in detail below:

[0022] This utility model discloses a wafer electroplating conductive base cooling device, such as... Figure 1 , Figure 5 As shown, this utility model discloses a wafer electroplating conductive seat cooling device, including an electroplating main tank body 1. An external water-cooling box 2 is bolted to the outer wall of the electroplating main tank body 1. An M-shaped socket 3 is bolted to the inside of the external water-cooling box 2. The external water-cooling box 2 has an inlet end 4 and an outlet end 5. A cooling water inlet pipe assembly is connected to the outer wall of the inlet end 4, and a cooling water outlet pipe assembly is connected to the outer wall of the outlet end 5. In this embodiment, the specific structure of the external water-cooling box 2 is as follows: Figure 5 As shown, the external water-cooling box 2 is C-shaped, with one end being the water inlet 4 and the other end being the water outlet 5. An M-shaped socket 3 for connecting to the wafer mount electrode 15 is bolted to the middle. Compared to existing technologies, the structure of the main electroplating tank 1 has been modified, eliminating the inner sub-tank structure and designing the external water-cooling box 2, which is installed on the rear side of the main electroplating tank 1. The wafer mount 14 has also been modified, with the wafer mount electrode 15 moved from the front to the rear side. The M-shaped socket 3 is installed in the external water-cooling box 2, and during operation, the wafer mount electrode 15 is inserted into the M-shaped socket 3. The external water-cooling box 2 is CNC machined in one piece, eliminating welding and leakage risks. It optimizes the electroplating tank structure, making welding easy and reliable, and eliminating the risk of electroplating tank leakage. By setting the external water-cooling box 2, the entire water cooling system is moved from inside the tank to outside, facilitating maintenance, such as socket replacement. By setting up an external water-cooling box 2, a cooling water inlet pipe assembly, and a cooling water outlet pipe assembly, the overall water-cooling system is optimized and easy to assemble. Preferably, the M-shaped socket 3 has a multi-piece structure.

[0023] like Figure 3 , Figure 5As shown, the cooling water inlet pipeline assembly includes an L-shaped compression fitting 7 and a flow rate regulating valve 6. The input end of the flow rate regulating valve 6 is connected to an external water supply system, and the output end of the flow rate regulating valve 6 is connected to one end of the L-shaped compression fitting 7 via a pipeline. The other end of the L-shaped compression fitting 7 is connected to the outer wall of the inlet end 4 via a pipeline. In this embodiment, the cooling water inlet pipeline assembly is used, and the flow rate regulating valve 6 is used to adjust the cooling water flow. The cooling water enters the external water-cooling box 2 through the L-shaped compression fitting 7, and the water flow can be adjusted to a very small amount, in the form of a slow drip. The cooling water in the external water-cooling box 2 performs immersion cooling on the wafer mounting electrode 15 and the M-shaped socket 3.

[0024] like Figure 4 , Figure 5 As shown, the cooling water outlet pipeline assembly includes a drain pipe 8, a tee connector 9, and a bushing 10. A through hole is provided at the bottom of the outlet end 5, and the drain pipe 8 is fixedly connected within this hole. A tee connector 9 is provided on the lower side of the drain pipe 8. The drain pipe 8 and the tee connector 9 are suspended and sleeved together, with the outer diameter of the drain pipe 8 being smaller than the inner diameter of the tee connector 9. The position where the drain pipe 8 and the tee connector 9 are suspended and sleeved together forms an overflow port 12. The tee connector 9 is welded to the outer wall of the electroplating main tank body 1. One end of the bushing 10 is fixedly connected to the lower end of the tee connector 9, and the other end of the bushing 10 is connected to the external drain pipe. An overflow port 2 13 is provided on the outer wall of the outlet end 5. In this embodiment, after water cooling is completed, the water drips through the drain pipe 8 below the external water cooling box 2 into the tee connector 9 welded to the wall of the electroplating main tank body 1, and finally through the bushing 10 into the external drain pipeline, completing the entire water cooling process. To prevent accidental closure or airtight blockage of the drainage pipe, cooling water overflows from the upper surface of the external water-cooling box 2 into the electroplating tank. Two overflow ports are specially designed for double protection. The outer diameter of the drainage pipe 8 is 16mm, and the inner diameter of the tee connector 9 is 19mm. The two are suspended and not in direct contact, so airtight blockage will not occur. Even if the drainage pipe 8 and the tee connector 9 are accidentally pressed together due to possible assembly and welding errors, if the cooling water cannot drain, it will flow out of the overflow port 13 of the external water-cooling box 2 and into the outside of the electroplating tank, without affecting the electroplating solution or the electroplating effect.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. The various components mentioned in this utility model are common technologies in the existing field. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer electroplating conductive base cooling device, comprising an electroplating main tank body (1), characterized in that: The outer wall of the electroplating main tank body (1) is connected to an external water-cooled box (2) by bolts. An M-shaped socket (3) is installed inside the external water-cooled box (2) by bolts. An inlet end (4) and an outlet end (5) are formed inside the external water-cooled box (2). A cooling water inlet pipe assembly is connected to the outer wall of the inlet end (4), and a cooling water outlet pipe assembly is connected to the outer wall of the outlet end (5).

2. The wafer electroplating conductive base cooling device according to claim 1, characterized in that: The cooling water inlet pipeline assembly includes an L-shaped compression fitting (7) and a flow rate regulating valve (6). The input end of the flow rate regulating valve (6) is connected to an external water supply system, and the output end of the flow rate regulating valve (6) is connected to one end of the L-shaped compression fitting (7) through a pipeline. The other end of the L-shaped compression fitting (7) is connected to the outer wall of the inlet end (4) through a pipeline.

3. The wafer electroplating conductive base cooling device according to claim 2, characterized in that: The cooling water outlet pipeline assembly includes a drain pipe (8), a tee connector (9), and a flange (10). The bottom of the outlet end (5) is provided with a through hole, in which the drain pipe (8) is fixedly connected. A tee connector (9) is provided on the lower side of the drain pipe (8). The drain pipe (8) and the tee connector (9) are suspended and sleeved together, and the outer diameter of the drain pipe (8) is smaller than the inner diameter of the tee connector (9). The position where the drain pipe (8) and the tee connector (9) are suspended and sleeved together forms an overflow port (12). The tee connector (9) is welded to the outer wall of the electroplating main tank body (1). One end of the flange (10) is fixedly connected to the lower end of the tee connector (9), and the other end of the flange (10) is connected to the external drain pipe.

4. The wafer electroplating conductive base cooling device according to claim 3, characterized in that: An overflow port 2 (13) is provided on the outer wall of the water outlet (5).

5. A wafer electroplating conductive base cooling device according to claim 3, characterized in that: The outer diameter of the drain pipe (8) is 16 mm, and the inner diameter of the tee connector (9) is 19 mm.

6. The wafer electroplating conductive base cooling device according to claim 1, characterized in that: The M-shaped socket (3) has a multi-piece structure.

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