Radio frequency chip shielding type aging clamp

Abstract

The utility model provides a radio frequency chip shielding type aging clamp which comprises a main body assembly which comprises a clamp base, a Rogers high-frequency PCBA board, an FR4 digital circuit board, four limiting bolts and a heating assembly. Eight mounting parts are arranged on the FR4 digital circuit board, and a common terminal and a chip terminal are mounted on the upper surface of the FR4 digital circuit board. According to the utility model, the FR4 digital circuit board is used as a power supply part, the Rogers high-frequency PCBA board is used as a local high-frequency circuit design, and the Rogers high-frequency PCBA board is mounted at the mounting part of the FR4 digital circuit board, so that high-frequency signal transmission can be carried out, the problem that the FR4 digital circuit board cannot meet high-frequency transmission is solved, and the cost is saved at the same time.

Description

Technical Field

[0001] This utility model relates to an aging fixture, specifically a radio frequency chip shielded aging fixture, belonging to the field of chip test fixture technology. Background Technology

[0002] Due to the development of highly integrated processes, the requirements for the size and weight of integrated circuits are becoming increasingly stringent. Highly integrated radio frequency (RF) circuits are widely used because of their small size and light weight. The original modular RF transceiver components are now fabricated into BGA-packaged RF chips using semiconductor technology. These RF chips require power-on aging, and some require power-on signal aging. Since BGA-packaged RF chips lack traditional mechanical coaxial interfaces, aging fixtures are needed for aging. Because RF chips generate a significant amount of heat, fixtures are required to assist in heat dissipation of the die, and the temperature of the fixture's heatsink needs to be monitored to ensure the BGA RF chip operates within the required process temperature range. This is currently the mainstream development trend for BGA RF chips, but it also brings the following problems:

[0003] 1. The fixture uses a plastic pin plate that is not thermally conductive, making it impossible to monitor the temperature at the bottom of the chip, which does not meet the process requirements;

[0004] 2. The fixture uses a plastic pin plate, and a single probe can only provide conductivity, which does not meet the 50-ohm RF transmission requirement;

[0005] 3. The chip's RF port is not matched with 50 ohms, resulting in poor VSWR and large signal reflection, which can cause the chip die to burn out.

[0006] 4. Poor fixture isolation can lead to chip signal input / output coupling, abnormal aging current, failure to function properly, and may even damage the product.

[0007] To address this, a shielded aging fixture for radio frequency chips is proposed. Utility Model Content

[0008] In view of this, the present invention provides a radio frequency chip shielded aging fixture to solve or alleviate the technical problems existing in the prior art, and at least provides a beneficial option.

[0009] The technical solution of this utility model embodiment is implemented as follows: a radio frequency chip shielded aging fixture includes a main body assembly, the main body assembly including a fixture base, a Rogers high-frequency PCBA board, an FR4 digital circuit board, four limit bolts and a heating assembly;

[0010] The FR4 digital circuit board has eight mounting parts. The upper surface of the FR4 digital circuit board is equipped with common terminals and chip terminals. Temperature sensors are installed on the mounting parts. Four positioning holes are symmetrically opened inside the mounting parts.

[0011] The dimensions of the Rogers high-frequency PCBA board are adapted to the dimensions of the mounting part, and the upper surface of the Rogers high-frequency PCBA board is provided with clearance holes and four through holes;

[0012] The heating component is installed inside the fixture base, the four limiting bolts are symmetrically installed on the lower surface of the fixture base, and a clamping module is installed on the upper surface of the fixture base.

[0013] More preferably, the heating assembly includes a heating plate, a shielding cavity, mounting holes, and an RF coaxial pin plate;

[0014] The radio frequency coaxial pin plate is installed inside the heating plate, the shielding cavity is symmetrically opened on the lower surface of the heating plate, and the mounting hole is opened on the lower surface of the heating plate.

[0015] More preferably, a chip fixture is mounted on the upper surface of the fixture base, and the heating plate is mounted on the lower surface of the chip fixture.

[0016] More preferably, the Rogers high-frequency PCBA board is located between the heating plate and the FR4 digital circuit board.

[0017] More preferably, both the FR4 digital circuit board and the Rogers high-frequency PCBA board are mounted on the lower surface of the fixture base by the limiting bolts.

[0018] More preferably, the position of the temperature sensor corresponds to the position of the clearance hole and the mounting hole, and the position of the through hole and the positioning hole corresponds to the position of the limiting bolt.

[0019] More preferably, the heating assembly includes a mounting base, a heating base, and connecting terminals;

[0020] The heating base is mounted on the upper surface of the mounting base, and the connecting terminal is mounted on the upper surface of the heating base.

[0021] More preferably, the mounting base is mounted on the lower surface of the fixture base, and the heating base is attached to the lower surface of the chip fixture.

[0022] The present invention has the following advantages due to the adoption of the above technical solution:

[0023] I. This utility model uses an FR4 digital circuit board as the power supply section and a Rogers high-frequency PCBA board for local high-frequency circuit design. The Rogers high-frequency PCBA board is installed at the mounting position of the FR4 digital circuit board, which can transmit high-frequency signals, solve the problem that the FR4 digital circuit board cannot meet the high-frequency transmission requirements, and save costs at the same time.

[0024] II. This utility model sets up common terminals and chip terminals on the FR4 digital circuit board. The chip terminals bring out all chip control points, and customers can connect them arbitrarily using jumpers according to the chip definition. By setting up a temperature sensor, the aging temperature can be monitored, thereby ensuring that the RF chip operates in a stable state that meets the process requirements.

[0025] Third, by adding a shielding cavity, the radio frequency microstrip line of this utility model is covered by a metal cavity. After the fixture is installed, the radio frequency microstrip of the Rogers high-frequency PCBA board at the bottom is placed in a sealed cavity, which can improve the isolation of the system radio frequency signal and thus ensure that the high-power chip works in a stable state during aging and will not generate self-excitation signals.

[0026] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a structural diagram of the present invention;

[0029] Figure 2 This is a structural diagram of the clamp base of this utility model;

[0030] Figure 3 This is a structural diagram of the heating plate of this utility model;

[0031] Figure 4 This is a structural diagram of the FR4 digital circuit board of this utility model;

[0032] Figure 5 This utility model Figure 4 Enlarged view of area A in the image;

[0033] Figure 6 This is a structural diagram of the Rogers high-frequency PCBA board of this utility model;

[0034] Figure 7 This is a schematic diagram showing the connection between the clamp base and the mounting base of this utility model;

[0035] Figure 8 This is a structural diagram of the heating base of this utility model.

[0036] Reference numerals: 101, Main component; 11, Fixture base; 12, Rogers high-frequency PCBA board; 13, FR4 digital circuit board; 14, Chip fixture; 15, Limiting bolt; 16, Clamping module; 201, Heating component; 21, Heating plate; 22, Shielding cavity; 23, Mounting hole; 25, RF coaxial pin plate; 26, Mounting base; 27, Heating base; 28, Connecting terminal; 121, Through hole; 123, Clearance hole; 131, Common terminal; 132, Chip terminal; 133, Positioning hole; 134, Temperature sensor; 135, Mounting part. Detailed Implementation

[0037] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0038] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0039] Example 1

[0040] like Figures 1-6 As shown, this utility model embodiment provides a radio frequency chip shielded aging fixture, including a main body component 101. The main body component 101 includes a fixture base 11, a Rogers high-frequency PCBA board 12, an FR4 digital circuit board 13, four limit bolts 15 and a heating component 201.

[0041] The FR4 digital circuit board 13 has eight mounting parts 135. The upper surface of the FR4 digital circuit board 13 has a common terminal 131 and a chip terminal 132. A temperature sensor 134 is mounted on the mounting part 135. Four positioning holes 133 are symmetrically opened inside the mounting part 135.

[0042] By setting a common terminal 131 and a chip terminal 132 on the FR4 digital circuit board 13, the chip terminal 132 brings out all the chip control points, and customers can connect them arbitrarily using jumpers according to the chip definition;

[0043] The dimensions of the Rogers high-frequency PCBA board 12 are adapted to the dimensions of the mounting part 135. The upper surface of the Rogers high-frequency PCBA board 12 is provided with clearance holes 123 and four through holes 121.

[0044] The heating component 201 is installed inside the clamp base 11, and four limit bolts 15 are symmetrically installed on the lower surface of the clamp base 11. The clamping module 16 is installed on the upper surface of the clamp base 11.

[0045] The FR4 digital circuit board 13 is used as the power supply section, and the Rogers high-frequency PCBA board 12 is used for local high-frequency circuit design. The Rogers high-frequency PCBA board 12 is installed at the mounting part 135 of the FR4 digital circuit board 13, which can transmit high-frequency signals, solve the problem that the FR4 digital circuit board 13 cannot meet the high-frequency transmission requirements, and save costs.

[0046] In Embodiment 1, the heating assembly 201 includes a heating plate 21, a shielding cavity 22, a mounting hole 23, and an RF coaxial pin plate 25;

[0047] The radio frequency coaxial pin plate 25 is installed inside the heating plate 21, the shielding cavity 22 is symmetrically opened on the lower surface of the heating plate 21, and the mounting hole 23 is opened on the lower surface of the heating plate 21.

[0048] By adding a shielding cavity 22, the RF microstrip line is covered by a metal cavity. After the fixture is installed, the RF microstrip of the Rogers high-frequency PCBA board 12 at the bottom is placed in a sealed cavity, which can improve the isolation of the system's RF signal and thus ensure that the high-power chip operates in a stable state during aging without generating self-oscillation signals.

[0049] In Embodiment 1, a chip fixture 14 is mounted on the upper surface of the fixture base 11, and a heating plate 21 is mounted on the lower surface of the chip fixture 14. The chip can be heated and aged by the heating plate 21.

[0050] In Embodiment 1, Rogers high-frequency PCBA board 12 is located between heating plate 21 and FR4 digital circuit board 13. Both FR4 digital circuit board 13 and Rogers high-frequency PCBA board 12 are mounted on the lower surface of fixture base 11 by limiting bolts 15.

[0051] The position of the temperature sensor 134 corresponds to the position of the clearance hole 123 and the mounting hole 23, and the position of the through hole 121 and the positioning hole 133 corresponds to the position of the limit bolt 15. By setting the temperature sensor 134, the aging temperature can be monitored, thereby ensuring that the RF chip operates in a stable state that meets the process requirements.

[0052] Example 2

[0053] like Figures 7-8 As shown, the heating assembly 201 includes a mounting base 26, a heating base 27, and a connection terminal 28;

[0054] Heating base 27 is mounted on the upper surface of mounting base 26, and connecting terminal 28 is mounted on the upper surface of heating base 27;

[0055] Mounting base 26 is mounted on the lower surface of fixture base 11, and heating base 27 is attached to the lower surface of chip fixture 14;

[0056] The heating base 27 can be powered through the connection terminal 28, and the chip in the fixture base 11 can be heated and aged through the heating base 27.

[0057] In operation, the Rogers high-frequency PCBA board 12 and the fixture base 11 are sequentially installed on the FR4 digital circuit board 13. The limiting bolt 15 is passed through the positioning hole 133 and the through hole 121 to fix the fixture base 11. Then, the RF chip is placed in the chip fixture 14, and the clamping module 16 is covered. The heating plate 21 is controlled to work. At this time, aging test can be performed. During the test, the shielding cavity 22 can improve the isolation of the system's RF signal, thereby ensuring that the high-power chip works in a stable state during aging and will not generate self-excitation signals.

[0058] At the same time, it greatly reduces the cost of the aging system. This patent discloses the use of FR4 ordinary board material and Rogers high frequency board material to reduce the investment in aging of radio frequency chips. At the same time, it uses the combination of PCB gold-plated surface and the metal cavity of radio frequency aging fixture to form an independent shielded cavity, improves isolation and solves the self-oscillation problem. It uses the jumper mode of aging PCBA common terminal and chip power supply control port to realize universal aging of radio frequency chip universal shell, improve the utilization rate of aging system and reduce cost investment, all of which are within the scope of protection of this patent.

[0059] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A radio frequency chip shielded aging fixture, comprising a main body component (101), characterized in that: The main component (101) includes a clamp base (11), a Rogers high-frequency PCBA board (12), an FR4 digital circuit board (13), four limit bolts (15) and a heating component (201). The FR4 digital circuit board (13) is provided with eight mounting parts (135). The upper surface of the FR4 digital circuit board (13) is provided with a common terminal (131) and a chip terminal (132). A temperature sensor (134) is installed on the mounting part (135). Four positioning holes (133) are symmetrically opened inside the mounting part (135). The dimensions of the Rogers high-frequency PCBA board (12) are adapted to the dimensions of the mounting part (135), and the upper surface of the Rogers high-frequency PCBA board (12) is provided with clearance holes (123) and four through holes (121). The heating component (201) is installed inside the clamp base (11), and the four limiting bolts (15) are symmetrically installed on the lower surface of the clamp base (11). A clamping module (16) is installed on the upper surface of the clamp base (11).

2. The radio frequency chip shielded aging fixture according to claim 1, characterized in that: The heating assembly (201) includes a heating plate (21), a shielding cavity (22), a mounting hole (23), and an RF coaxial pin plate (25). The radio frequency coaxial pin plate (25) is installed inside the heating plate (21), the shielding cavity (22) is symmetrically opened on the lower surface of the heating plate (21), and the mounting hole (23) is opened on the lower surface of the heating plate (21).

3. The radio frequency chip shielded aging fixture according to claim 2, characterized in that: The upper surface of the fixture base (11) is equipped with a chip fixture (14), and the heating plate (21) is installed on the lower surface of the chip fixture (14).

4. The radio frequency chip shielded aging fixture according to claim 3, characterized in that: The Rogers high-frequency PCBA board (12) is located between the heating plate (21) and the FR4 digital circuit board (13).

5. The radio frequency chip shielded aging fixture according to claim 4, characterized in that: The FR4 digital circuit board (13) and the Rogers high-frequency PCBA board (12) are both mounted on the lower surface of the fixture base (11) by the limiting bolts (15).

6. The radio frequency chip shielded aging fixture according to claim 5, characterized in that: The position of the temperature sensor (134) corresponds to the position of the clearance hole (123) and the mounting hole (23), and the position of the through hole (121) and the positioning hole (133) corresponds to the position of the limiting bolt (15).

7. The radio frequency chip shielded aging fixture according to claim 3, characterized in that: The heating assembly (201) includes a mounting base (26), a heating base (27), and a connecting terminal (28); The heating base (27) is mounted on the upper surface of the mounting base (26), and the connecting terminal (28) is mounted on the upper surface of the heating base (27).

8. The radio frequency chip shielded aging fixture according to claim 7, characterized in that: The mounting base (26) is mounted on the lower surface of the fixture base (11), and the heating base (27) is attached to the lower surface of the chip fixture (14).

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